Retainer, polishing head assembly and polishing equipment

Abstract

The utility model provides a retainer, a polishing head assembly and a polishing device, the retainer comprises a back film, the retainer further comprises a support and a driving unit, the driving unit is installed on the support, the driving end of the driving unit is connected with the back film, and a wafer placing position is formed between the back film and the bottom of the support. The driving unit can drive the back film to move relative to the bottom of the support in the normal direction of the back film. The polishing head assembly is provided with the retainer, the polishing equipment comprises the polishing head assembly, the retainer can be suitable for different wafer thicknesses, the production cost can be reduced, and the production efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, and particularly to a retainer, a polishing head assembly provided with the retainer, and a polishing device including the polishing head assembly as described above. Background Art

[0002] When a wafer is polished, it needs to be grasped by a retainer. The existing retainer mainly adopts an integrally formed manufacturing method, that is, the back film and the fixing ring of the retainer are integrally fixed structures, and the height of the card slot formed between the back film and the fixing ring is fixed. When the retainer is produced, it is designed and manufactured into a corresponding specification according to the thickness of the wafers on the market. When the retainer is used, a retainer with a corresponding card slot height is selected according to the thickness of the wafer to be processed, and the retainer is installed on the polishing head of the polishing device. Subsequently, the retainer grasps the wafer. When grasping, the polishing head adsorbs the back surface of the wafer through the holes on the back film of the retainer and fixes the wafer in the card slot. Subsequently, the polishing head moves the wafer to the polishing pad, and changes the air suction through the holes on the back film to blowing. By controlling the gas flow rate, the back film pressure is controlled, and then the pressure of the wafer cup part is controlled, so that the wafer is stably maintained in the back film control area under the retention of the retainer.

[0003] However, due to different manufacturing processes, the thicknesses of wafers are also different. Therefore, the existing retainer design greatly limits the thickness requirements of wafers, thus restricting the possibility of process development. In addition, the card slot design of the existing retainer only allows the floating range of the wafer thickness to be within ±50 μm. If there are more wafer thickness selections, more retainers need to be purchased, and the retainer needs to be frequently replaced during the production process, reducing the production efficiency and increasing the production cost. Summary of the Invention

[0004] In order to solve the above problems, the main object of the utility model is to provide a retainer applicable to different wafer thicknesses.

[0005] Another object of the utility model is to provide a polishing head assembly provided with the above retainer.

[0006] Still another object of the utility model is to provide a polishing device provided with the above polishing head assembly.

[0007] In order to achieve the main object of the utility model, the utility model provides a retainer, including a back film. Wherein, the retainer further includes a bracket and a driving unit. The driving unit is installed on the bracket, the driving end of the driving unit is connected to the back film, a wafer placement position is formed between the back film and the bottom of the bracket, and the driving unit can drive the back film to move relative to the bottom of the bracket in the normal direction of the back film.

[0008] As can be seen from the above, by adding a bracket and a driving unit, the bracket can be docked with the polishing head, and the driving unit can control the movement of the back film and the back film on the back film relative to the bottom of the bracket, thereby adjusting the height of the wafer placement position, so that the holder can be applicable to wafers of different thicknesses, expanding the applicable range of the holder, enhancing the practicability of the holder, and being beneficial to improving production efficiency.

[0009] A further solution is that the driving unit includes a plurality of first driving modules, the plurality of first driving modules are distributed around the back film, the first driving modules are installed on the bracket, and the back film is connected to the driving end of the first driving module.

[0010] As can be seen from the above, setting the driving unit as a plurality of first driving modules and distributing them around the back film can better reduce the overall weight of the driving unit, reduce the load on the polishing head docked with the holder, and thus be more conducive to the polishing head to operate and control the movement of the holder and the wafer, ensuring the processing accuracy of the wafer.

[0011] A preferred solution is that the first driving module includes a linear cylinder; the bracket has a first air passage and a second air passage, the first air passage is docked with the first air port of the linear cylinder, and the second air passage is docked with the second air port of the linear cylinder.

[0012] As can be seen from the above, since the polishing head generates positive air pressure or negative air pressure at the air holes of the back film through air pressure control, therefore, setting the first driving module as a linear cylinder can share the same air source with the polishing head, thereby reducing the types and quantities of driving sources of the polishing equipment provided with this holder, simplifying the structural complexity and control difficulty of the polishing equipment, and being more conducive to the optimized design of the polishing equipment.

[0013] A further solution is that the linear cylinder is a double-slider rodless cylinder, the double-slider rodless cylinder includes two first sliders, the two first sliders can move synchronously or asynchronously in the normal direction, a first fixture is provided on the first slider, and a first clamping position is formed between the first fixtures on the two first sliders, and the back film is detachably installed in the first clamping position; or the linear cylinder is a first single-slider rodless cylinder, the second slider of the first single-slider rodless cylinder is fixedly connected to the back film, or the linear cylinder is a first rod cylinder, the piston rod of the first rod cylinder is fixedly connected to the back film; or the linear cylinder is a second single-slider rodless cylinder, a first finger cylinder is provided on the third slider of the second single-slider rodless cylinder, a second fixture is provided on the fingers of the first finger cylinder, and a second clamping position is formed between the second fixtures on the two first fingers, and the back film is detachably installed in the second clamping position, or the linear cylinder is a second rod cylinder, a second finger cylinder is provided on the piston rod of the second rod cylinder, a third fixture is provided on the fingers of the second finger cylinder, and a third clamping position is formed between the third fixtures on the two second fingers, and the back film is detachably installed in the third clamping position.

[0014] As can be seen from the above, the back film can be set to be non-removably connected to the driving end of the linear cylinder as required; of course, the back film can also be removably connected to the driving end of the linear cylinder for the replacement and maintenance of the back film.

[0015] Another preferred solution is that the first driving module includes a linear electric cylinder or a linear module; the linear electric cylinder or the linear module includes two fourth sliders, and the two fourth sliders can move synchronously or asynchronously in the normal direction. A fourth fixture is provided on the fourth slider, and a fourth clamping position is formed between the fourth fixtures on the two fourth sliders. The back film is detachably installed in the fourth clamping position; or the linear electric cylinder or the linear module includes a fifth slider, and the fifth slider can move in the normal direction, and the fifth slider is fixedly connected to the back film; or the first driving module further includes an electric gripper, and fifth fixtures are provided on both finger parts of the electric gripper, and a fifth clamping position is formed between the fifth fixtures on the two finger parts. The back film is detachably installed in the fifth clamping position.

[0016] As can be seen from the above, using a linear electric cylinder or a linear module as the first driving module can better prevent the air leakage risk that may exist when using a linear cylinder as the first driving module, thereby better ensuring the reliability and stability of the first driving module in driving the back film; and, the back film can also be set to be detachably or non-detachably connected to the driving end of the linear electric cylinder or the linear module as required.

[0017] A further solution is that a second driving module is provided on at least part of the driving end of the first driving module, or two or more second driving modules are provided on the bracket; the second driving module is located between the back film and the bottom of the bracket, and the driving end of the second driving module can move in a first direction, and the first direction is perpendicular to the normal direction; a sixth clamping position is formed between the driving end of each second driving module and the back film, or a seventh clamping position is formed among the driving end of each second driving module, the back film and the driving end of the first driving module.

[0018] As can be seen from the above, the setting of the second driving module enables the holder to also clamp wafers of different sizes, increasing the practicability of the holder and expanding the applicable range of the holder.

[0019] A further solution is that air holes are provided on the back film, and the air holes penetrate the back film in the normal direction of the back film.

[0020] As can be seen from the above, by providing air holes on the back film, the polishing head assembly can generate an adsorption negative pressure through the air holes on the back film to reliably adsorb and fix the wafer.

[0021] Another preferred solution is that the back film is made of a hydrophilic material.

[0022] As can be seen from the above, the back film can adsorb and fix the wafer through its own material, thus simplifying the structure of the holder.

[0023] To achieve another object of the present utility model, the present utility model provides a polishing head assembly, including a polishing head. Among them, the polishing head assembly further includes the above-mentioned retainer, and the polishing head is docked with the bracket.

[0024] As can be seen from the above, by providing the above-mentioned retainer, the polishing head assembly can be applied to wafers of different thicknesses, reducing the production cost and being beneficial to improving the production efficiency.

[0025] To achieve yet another object of the present utility model, the present utility model provides a polishing device having a polishing chamber, and a polishing member is provided in the polishing chamber. Among them, it further includes the above-mentioned polishing head assembly; the polishing head can control the retainer to move to the polishing member.

[0026] As can be seen from the above, for the polishing device provided with the above-mentioned polishing head assembly, when processing wafers of different thicknesses, it only needs to adjust the height of the wafer placement position through the driving unit to adapt to the thickness of the current wafer, so there is no need to frequently replace the retainer, which preferably improves the production efficiency, and there is no need to purchase a large number of retainers of different specifications, effectively reducing the production cost. Description of the Drawings

[0027] Figure 1 is a schematic structural diagram of the first embodiment of the polishing head assembly of the present utility model.

[0028] Figure 2 is a schematic structural diagram of the back film and the retainer of the first embodiment of the polishing head assembly of the present utility model.

[0029] Figure 3 is a schematic structural diagram of the bracket and the driving unit of the first embodiment of the polishing head assembly of the present utility model.

[0030] Figure 4 is a schematic structural diagram of the polishing head of the first embodiment of the polishing head assembly of the present utility model.

[0031] Figure 5 is a schematic structural diagram of the bracket and the driving unit of the second embodiment of the polishing head assembly of the present utility model.

[0032] Figure 6 is a schematic structural diagram of the tenth embodiment of the polishing head assembly of the present utility model.

[0033] The present utility model will be further described below in conjunction with the drawings and embodiments. Detailed Embodiments

[0034] The First Embodiment of the Polishing Head Assembly

[0035] Refer to Figure 1, the polishing head assembly 100 includes a retainer 1 and a polishing head 2. The retainer 1 and the polishing head 2 are detachably connected. The retainer 1 is used to clamp the wafer, so that the polishing head 2 can grab the wafer through the retainer 1 and move it to the polishing member on the polishing device during polishing for processing the wafer.

[0036] The retainer 1 includes a back film 11, a bracket 13 and a driving unit 14; combined Figure 2 , in this embodiment, air holes 111 are provided on the back film 11. The air holes 111 penetrate the back film 11 in the thickness direction of the back film 11. The setting of the air holes 111 enables the polishing head 2 to form a negative air pressure at the air holes 111 to adsorb the wafer on the back film 11, or enables the polishing head 2 to form a positive air pressure at the air holes 111 to cooperate with the back film 11 to press the wafer against the polishing member with a certain pressure for processing. Among them, the back film 11 has flexibility. It should be noted that, as another alternative solution, in other embodiments, the back film 11 may not be provided with air holes 111, but a hydrophilic back film 11 is used, so that the back film 11 can adsorb and fix the wafer by the hydrophilicity of its own material.

[0037] Preferably, the back film 11 can be integrally formed with a fixing ring 12 having a certain hardness. The fixing ring 12 surrounds and fixes the back film 11, so that the back film 11 is in a straightened state that meets the use requirements, and enables the back film 11 to undergo elastic deformation to a certain extent without affecting the adsorption of the wafer. Of course, the fixing ring 12 can also be designed as a split type with the back film 11, so that the back film 11 is fixedly installed on the fixing ring 12, and the fixing ring 12 surrounds and fixes the back film 11. In addition, the split fixing ring 12 is made of a hard material to support and fix the back film 11, and appropriately, the fixing ring 12 can carry the back film 11 to cooperate with the driving unit 14 for connection.

[0038] Combined Figure 3 , the driving unit 14 is installed on the bracket 13. The driving end of the driving unit 14 is connected to the fixing ring 12. A wafer placement position is formed between the back film 11 and the bottom of the bracket 13. The wafer placement position is used to accommodate and fix the wafer to be processed. The driving unit 14 is used to drive the fixing ring 12 to move relative to the bottom of the bracket 13 in the axial direction of the fixing ring 12 (i.e., the height direction of the bracket 13, the normal direction of the back film 11), so as to adjust the height of the wafer placement position, so that the retainer 1 can be applicable to wafers of different thicknesses, thereby expanding the applicable range of the retainer 1, enhancing the practicability of the retainer 1, and without the need to frequently replace the retainer 1 according to the thickness of the wafer, which is beneficial to improving production efficiency.

[0039] Preferably, the driving unit 14 includes a plurality of first driving modules, which are distributed around the fixed ring 12. The first driving modules are mounted on the bracket 13, and the fixed ring 12 is connected to the driving ends of the first driving modules (i.e., the driving ends of the aforementioned driving unit 14). By setting the driving unit 14 as a plurality of first driving modules and distributing them around the fixed ring 12, the driving unit 14 is designed as a plurality of split modules, which is beneficial to better reducing the overall weight of the driving unit 14, reducing the load on the polishing head 2, and thus more beneficial to the operation and control of the polishing head 2 to move the holder 1 and the wafer, ensuring the processing accuracy of the wafer.

[0040] In this embodiment, the first driving module adopts a linear cylinder. Since the polishing head 2 generates positive or negative air pressure at the air holes 111 of the back film 11 through air pressure control, setting the first driving module as a linear cylinder can share the same air source with the polishing head 2, thereby reducing the types and quantities of driving sources of the polishing equipment provided with the holder 1, simplifying the structural complexity and control difficulty of the polishing equipment, and being more beneficial to the optimized design of the polishing equipment. Preferably, the bracket 13 has a first air passage 131 and a second air passage 132. Among them, the first air passage 131 is docked with the first air port of the linear cylinder, and the second air passage 132 is docked with the second air port of the linear cylinder.

[0041] In this embodiment, the linear cylinder adopts a double-slider rodless cylinder 141. The double-slider rodless cylinder 141 includes a main body 1410 and two first sliders 1411 (i.e., the driving ends of the first driving modules). The main body 1410 extends along the axial direction of the fixed ring 12. The two first sliders 1411 are slidably mounted on the main body 1410, and the two first sliders 1411 can move synchronously or asynchronously in the axial direction of the fixed ring 12; that is, one of the two first sliders 1411 can move relative to the other slider alone, or the two sliders can move towards or away from each other simultaneously, or the two sliders can move synchronously while maintaining a certain distance, etc. Among them, it should be noted that the double-slider rodless cylinder 141 is a pneumatic component that can be purchased on the existing market and is a pneumatic component well-known to those skilled in the art. Therefore, the specific working principle of the double-slider rodless cylinder 141 will not be explained in detail here. A first clamp 1412 is provided on each of the first sliders 1411, and a first clamping position is formed between the first clamps 1412 on the two first sliders 1411. The fixed ring 12 is detachably mounted in the first clamping position. Through this design, the fixed ring 12 and the first driving module are detachably connected, facilitating the replacement and maintenance of the back film 11.

[0042] Combined with Figure 4, a first engaging portion 23 is provided on the polishing head 2. Correspondingly, a second engaging portion 133 is provided on the bracket 13. When the polishing head 2 and the bracket 13 are assembled, the first engaging portion 23 is docked with the second engaging portion 133 so that the bracket 13 is fixed on the polishing head 2.

[0043] In addition, in order to better match and dock the polishing head 2 with the retainer 1, a third air passage 21 and a fourth air passage 22 are provided on the polishing head 2. When the polishing head 2 is docked with the bracket 13 of the retainer 1, the third air passage 21 is automatically docked with the first air passage 131, and the fourth air passage 22 is automatically docked with the second air passage 132. Furthermore, the air source supplying air to the polishing head 2 supplies air to the linear cylinder at the same time, and there is no need for the user to additionally dock the air passage between the air source and the linear cylinder, improving the convenience of using the retainer 1.

[0044] The following briefly describes the usage process of the polishing head assembly 100:

[0045] After inputting the thickness of the wafer to be processed into the polishing equipment provided with the polishing head assembly 100, the polishing equipment controls the driving unit 14 of the retainer 1 of the polishing head assembly 100 to work, so that each first driving module of the driving unit 14 clamps the fixing ring 12 and moves axially along the fixing ring 12 to a set position, so that the height of the wafer placement position is adapted to the thickness of the wafer to be processed.

[0046] After completing the height adjustment of the wafer placement position, the wafer is loaded into the wafer placement position. Subsequently, the polishing head 2 forms a negative air pressure at the air holes 111 of the back film 11 to adsorb and fix the wafer in the wafer mounting position.

[0047] When processing the wafer, the polishing head assembly 100 transfers the wafer to the polishing piece. Subsequently, the polishing head 2 forms a positive air pressure at the air holes 111 of the back film 11 to press the wafer against the polishing piece with a certain pressure for grinding and processing.

[0048] After completing the processing of the wafer, the polishing head assembly 100 may not drive the processed wafer to move to prepare for grasping the next wafer to be processed. Of course, as another alternative, after completing the processing of the wafer, the polishing head assembly 100 may also drive the processed wafer to move to a designated position for storage.

[0049] In summary, through the design of the retainer 1, the polishing head assembly 100 can be applied to wafers of different thicknesses, reducing the production cost and being beneficial to improving the production efficiency.

[0050] Second Embodiment of the Polishing Head Assembly

[0051] Refer to Figure 5, the difference between this embodiment and the first embodiment of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment:

[0052] The linear cylinder is the first single-slider rodless cylinder 31. The second slider 311 of the first single-slider rodless cylinder 31 is fixedly connected to the fixed ring 312. The second slider 311 can move in the normal direction of the fixed ring 312, thereby adjusting the height of the wafer placement position. It can be seen that the fixed ring 312 can be set to be non-detachably connected to the driving end (i.e., the second slider 311) of the linear cylinder as needed.

[0053] The third embodiment of the polishing head assembly

[0054] The difference between this embodiment and the second embodiment of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment:

[0055] The linear cylinder is the second single-slider rodless cylinder. A first finger cylinder is provided on the third slider of the second single-slider rodless cylinder. A second fixture is provided on the fingers of the first finger cylinder. A second clamping position is formed between the second fixtures on the two first fingers. The fixed ring is detachably installed in the second clamping position; the second single-slider rodless cylinder can drive the fixed ring to move in the normal direction through the third slider and the first finger cylinder, thereby adjusting the height of the wafer placement position.

[0056] The fourth embodiment of the polishing head assembly

[0057] The difference between this embodiment and the second embodiment of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment, the first single-slider rodless cylinder is replaced by a first rod cylinder. The piston rod of the first rod cylinder is parallel to the normal direction of the fixed ring, and the piston rod of the first rod cylinder is fixedly connected to the fixed ring to drive the fixed ring to move in the normal direction of the fixed ring, thereby adjusting the height of the wafer placement position.

[0058] The fifth embodiment of the polishing head assembly

[0059] The difference between this embodiment and the fourth embodiment of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment:

[0060] The linear cylinder is the second rod cylinder. A second finger cylinder is provided on the piston rod of the second rod cylinder. A third fixture is provided on the fingers of the second finger cylinder. A third clamping position is formed between the third fixtures on the two second fingers. The fixed ring is detachably installed in the third clamping position; the second rod cylinder can drive the fixed ring to move in the normal direction through the piston rod and the second finger cylinder, thereby adjusting the height of the wafer placement position.

[0061] The sixth embodiment of the polishing head assembly

[0062] The difference between this embodiment and the first embodiment of the polishing head assembly lies in the partial structures of the first driving module, the bracket, and the polishing head. Specifically, in this embodiment:

[0063] The first driving module includes a linear electric cylinder or a linear module. The linear electric cylinder or the linear module includes two fourth sliders. The two fourth sliders can move synchronously or asynchronously in the normal direction. A fourth fixture is provided on the fourth slider. A fourth clamping position is formed between the fourth fixtures on the two fourth sliders. The fixing ring is detachably installed in the fourth clamping position. Among them, the working principle of the linear electric cylinder or the linear module with double fourth sliders is similar to or the same as that of the double-slider rodless cylinder in the first embodiment of the polishing head assembly. The difference is that the linear electric cylinder or the linear module with double fourth sliders is driven by a power supply, while the double-slider rodless cylinder is driven by a gas source. It should be noted that the linear electric cylinder or the linear module with double fourth sliders is also an electric component that can be purchased on the existing market and is an electric component well-known to those skilled in the art. Therefore, the specific working principle of the linear electric cylinder or the linear module with double fourth sliders will not be explained in detail here.

[0064] In addition, in order to adapt to the linear electric cylinder or the linear module used in the first driving module of this embodiment, in this embodiment, the first air passage and the second air passage are cancelled in the bracket, and the third air passage and the fourth air passage are cancelled in the polishing head; and a first electrical interface is provided on the bracket. The first electrical interface is electrically connected to the first driving module. Correspondingly, a second electrical interface is provided on the polishing head. When the polishing head is docked with the bracket, the first electrical interface is docked with the second electrical interface, and the third engaging portion on the bracket (equivalent to the second engaging portion in the first embodiment of the polishing head assembly) is docked with the fourth engaging portion (equivalent to the first engaging portion in the first embodiment of the polishing head assembly).

[0065] It can be seen that the above design enables the first electrical interface to automatically dock with the second electrical interface when the polishing head is docked with the retainer, thereby supplying power to the linear electric cylinder or the linear module, so that there is no need for the user to additionally perform circuit docking on the power supply and the linear cylinder, improving the convenience of using the retainer; and using the linear electric cylinder or the linear module as the first driving module can better prevent the air leakage risk that may exist when using a linear cylinder as the first driving module, thereby better ensuring the reliability and stability of the driving of the fixing ring by the first driving module; and, the fixing ring can also be set to be detachably or non-detachably connected to the driving end of the linear electric cylinder or the linear module according to needs.

[0066] The seventh embodiment of the polishing head assembly

[0067] The difference between this embodiment and the sixth embodiment of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment:

[0068] The linear electric cylinder or linear module has a single slider. That is, in this embodiment, the linear electric cylinder or linear module includes a fifth slider that can move in the normal direction of the fixed ring. The fifth slider is fixedly connected to the fixed ring to adjust the height of the wafer placement position.

[0069] The eighth embodiment of the polishing head assembly

[0070] The difference between this embodiment and the seventh embodiment of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment:

[0071] The first driving module further includes an electric gripper installed on the fifth slider. Fifth fixtures are provided on both fingers of the electric gripper, and a fifth clamping position is formed between the fifth fixtures on the two fingers. The fixed ring is detachably installed in the fifth clamping position.

[0072] The ninth embodiment of the polishing head assembly

[0073] The difference between this embodiment and the fourth and seventh embodiments of the polishing head assembly lies in the structure of the first driving module. Specifically, in this embodiment:

[0074] The first driving module includes two driving sources distributed along the height direction of the bracket. The driving source can be a linear cylinder or a linear electric cylinder. Among them, the moving direction of the driving end (such as the piston rod) of the driving source is parallel to the height direction of the bracket, and the two driving sources of the same first driving module are arranged symmetrically in the height direction of the bracket. A clamping block is provided on the driving end of the driving source, and the two driving sources of the same first driving module can drive the two clamping blocks to move towards or away from each other, and the two driving sources of the same first driving module can drive the two clamping blocks to move up or down synchronously in the height direction of the bracket.

[0075] The tenth embodiment of the polishing head assembly

[0076] As Figure 6 shown, the difference between this embodiment and the first to ninth embodiments of the polishing head assembly is that, in this embodiment:

[0077] A second driving module 42 is provided on at least part of the driving end 41 of the first driving module. The second driving module is located between the back film 43 and the bottom of the bracket. The driving end 421 of the second driving module 42 can move in a first direction, and the first direction is perpendicular to the normal direction of the back film 43.

[0078] The second driving module 42 is preferably a linear cylinder, a linear electric cylinder, etc. Among them, the above-mentioned first direction refers to the axial direction of the piston rod (i.e., the driving end 421) of the linear cylinder or linear electric cylinder. In addition, a protective sleeve or a protective cushion block is preferably provided on the driving end 421 to prevent the driving end 421 from damaging the wafer 45 when applying pressure to the wafer 45.

[0079] In this embodiment, a sixth clamping position is formed between the driving end of each second driving module and the back film, and this sixth clamping position is used to fix the wafer 45. Of course, in other embodiments, a seventh clamping position can also be formed among the driving end of the second driving module, the back film and the driving end of the first driving module. At this time, the center line of the wafer 45 generally does not overlap with the center line of the back film, that is, the wafer 45 and the back film are in an offset state.

[0080] By setting the second driving module, the retainer can also clamp wafers 45 of different sizes, increasing the practicality of the retainer and expanding the applicable range of the retainer.

[0081] Among them, when the back film is fixed and clamped by two sliders (or clamping blocks), a finger cylinder or an electric gripper, the second driving module is arranged on the slider (or clamping block) on the lower side of the back film, the finger of the finger cylinder on the lower side of the back film or the gripper of the electric gripper on the lower side of the back film; when the back film is directly fixed on the driving end of the first driving module, the second driving module is installed on the driving end of the first driving module and is located on the lower side of the back film.

[0082] The eleventh embodiment of the polishing head assembly

[0083] The difference between this embodiment and the tenth embodiment of the polishing head assembly lies in the installation position of the second driving module. Specifically, in this embodiment:

[0084] The second driving module is arranged on the bracket. In this embodiment, after the first driving module drives the back film and the wafer thereon to move to the set position, the second driving module further fixes the wafer through its driving end.

[0085] The embodiment of the polishing equipment

[0086] The polishing equipment has a polishing chamber, and a polishing piece is arranged in the polishing chamber. The polishing equipment includes the polishing head assembly described in any one of the first to eighth embodiments of the above-mentioned polishing head assembly; the polishing head can control the retainer to move to the polishing piece to process the wafer grabbed by the polishing head assembly.

[0087] It can be seen that for the polishing equipment provided with the above-mentioned polishing head assembly, when processing wafers of different thicknesses, it only needs to adjust the height of the wafer placement position through the driving unit to adapt to the current thickness of the wafer, so there is no need to frequently replace the retainer, which preferably improves the production efficiency, and there is no need to purchase a large number of retainers of different specifications, effectively reducing the production cost.

[0088] Finally, it should be emphasized that the above description is only the preferred embodiment of the present utility model and is not intended to limit the present utility model. For those skilled in the art, the present utility model can have various changes and modifications. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. Retainer, including a back film, characterized in that, The retainer further includes a cage, and the cage includes: A bracket; A driving unit, which is installed on the bracket. The driving end of the driving unit is connected to the back film. A wafer placement position is formed between the back film and the bottom of the bracket. The driving unit can drive the back film to move relative to the bottom of the bracket in the normal direction of the back film.

2. The retainer according to claim 1, wherein: The driving unit includes a plurality of first driving modules, and the plurality of first driving modules are distributed around the back film. The first driving module is installed on the bracket, and the back film is connected to the driving end of the first driving module.

3. The retainer according to claim 2, wherein: The first driving module includes a linear cylinder; The bracket has a first air passage and a second air passage. The first air passage is docked with the first air port of the linear cylinder, and the second air passage is docked with the second air port of the linear cylinder.

4. The retainer according to claim 3, wherein: The linear cylinder is a double-slider rodless cylinder. The double-slider rodless cylinder includes two first sliders, and the two first sliders can move synchronously or asynchronously in the normal direction. A first fixture is provided on the first slider, and a first clamping position is formed between the first fixtures on the two first sliders. The back film is detachably installed in the first clamping position; or The linear cylinder is a first single-slider rodless cylinder, and the second slider of the first single-slider rodless cylinder is fixedly connected to the back film; or The linear cylinder is a first rod cylinder, and the piston rod of the first rod cylinder is fixedly connected to the back film; or The linear cylinder is a second single-slider rodless cylinder. A first finger cylinder is provided on the third slider of the second single-slider rodless cylinder. A second fixture is provided on the finger of the first finger cylinder, and a second clamping position is formed between the second fixtures on the two first fingers. The back film is detachably installed in the second clamping position; or The linear cylinder is a second rod cylinder, and a second finger cylinder is provided on the piston rod of the second rod cylinder. A third fixture is provided on the finger of the second finger cylinder, and a third clamping position is formed between the third fixtures on the two second fingers. The back film is detachably installed in the third clamping position.

5. The retainer according to claim 2, wherein: The first driving module includes a linear electric cylinder or a linear module; The linear electric cylinder or the linear module includes two fourth sliders, and the two fourth sliders can move synchronously or asynchronously in the normal direction. A fourth fixture is provided on the fourth slider, and a fourth clamping position is formed between the fourth fixtures on the two fourth sliders. The back film is detachably installed in the fourth clamping position; or The linear electric cylinder or the linear module includes a fifth slider, and the fifth slider can move in the normal direction. The fifth slider is fixedly connected to the back film; or The first driving module further includes an electric gripper, and fifth fixtures are provided on both finger portions of the electric gripper. A fifth clamping position is formed between the fifth fixtures on the two finger portions, and the back film is detachably mounted in the fifth clamping position.

6. The retainer according to any one of claims 2 to 5, characterized in that: A second driving module is provided on at least part of the driving end of the first driving module, or two or more of the second driving modules are provided on the bracket; The second driving module is located between the bottom of the back film and the bracket, and the driving end of the second driving module can move in a first direction perpendicular to the normal direction; A sixth clamping position is formed between the driving end of each second driving module and the back film, or A seventh clamping position is formed among the driving end of each second driving module, the back film and the driving end of the first driving module.

7. The retainer according to claim 6, characterized in that: The back film is provided with air holes, and the air holes penetrate through the back film in the normal direction of the back film.

8. The retainer according to claim 6, characterized in that: The back film is made of a hydrophilic material.

9. The polishing head assembly includes a polishing head, characterized in that, The polishing head assembly further includes the retainer according to any one of claims 1 to 8, and the polishing head is docked with the bracket.

10. A polishing apparatus, having a polishing chamber, wherein a polishing member is disposed in the polishing chamber, characterized in that, Further included: The polishing head assembly according to claim 9; The polishing head can control the retainer to move to the polishing piece.

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