Finishing disc cleaning mechanism, finishing device and polishing equipment

Abstract

The utility model provides a dressing disc cleaning mechanism, dressing device and polishing equipment, the dressing disc cleaning mechanism comprises a cleaning tank and a cleaning unit, the cleaning tank is provided with a cleaning cavity, an opening and a liquid outlet, the opening and the liquid outlet are respectively communicated with the cleaning cavity, the opening is located at the top of the cleaning tank, and the liquid outlet is located at the bottom of the cleaning tank. The cleaning unit comprises a nozzle and a liquid supply pipe, the nozzle is located in the cleaning cavity and faces the opening, and one end of the liquid supply pipe is in butt joint with the nozzle. The finishing device is provided with the finishing disc cleaning mechanism, the polishing equipment is provided with the finishing device, and the finishing disc cleaning mechanism has the advantages of being good in cleaning effect and not influencing the polishing effect.

Description

Technical Field

[0001] The utility model relates to the technical field of chemical mechanical polishing, and specifically, to a dressing disk cleaning mechanism, a dressing device provided with the dressing disk cleaning mechanism, and a polishing equipment provided with the dressing device. Background Art

[0002] During the process of processing semiconductors using the chemical mechanical polishing (CMP) process, a dressing device is often used to dress the polishing pad to restore the performance of the polishing pad, keep the polishing pad at the initial grinding rate, and at the same time remove the residual particles and / or reaction by-products on the polishing pad to improve the polishing efficiency and surface shape quality of the polishing pad. As Figure 1 shown, the dressing device 91 includes a dressing disk 911, a swing arm 912, and a rotation driving mechanism 913. The dressing disk 911 is connected to the first end of the swing arm 912, and the second end of the swing arm 912 is connected to the rotation driving mechanism 913, so that the rotation driving mechanism 913 can drive the swing arm 912 to swing, and further move the dressing disk 911 between the center and the edge of the polishing pad 92 to dress the polishing pad 92. When the dressing disk 911 dresses the polishing pad 92, particles and / or reaction by-products are also likely to adhere to the dressing disk 911, thereby reducing the dressing ability of the dressing disk 911 for the polishing pad 92, resulting in the grooves or holes on the surface of the polishing pad 92 being easily blocked by particles, reaction by-products, polishing slurry, etc., and further weakening the polishing performance of the polishing pad 92. Moreover, when the particles and / or reaction by-products adhered to the dressing disk 911 fall onto the polishing pad 92, it will also increase the risk of scratching the surface of the part to be polished.

[0003] In response to this, as Figure 2 shown, an existing technology is to add a lifting driving mechanism to the dressing device, so that the lifting driving mechanism can drive the dressing disk 93, the swing arm, and the rotation driving mechanism, etc. to move on the surface of the polishing pad 94, and at the same time add a nozzle 95 to the polishing equipment to clean the dressing disk 93, thereby removing the particles, reaction by-products, etc. adhered to the dressing disk 93; combined with Figure 3, when it is necessary to clean the dressing disk 93, the dressing disk 93 is driven by the lifting drive mechanism and the rotary drive mechanism to move above the edge of the polishing pad 94 and separate from the polishing pad 94. Subsequently, a cleaning liquid (such as water) is sprayed onto the bottom (i.e., the working part) of the dressing disk 93 through the nozzle 95 to clean the bottom of the dressing disk 93, thereby removing the particles and reaction by-products adhered to the dressing disk 93. However, the deficiency of this technology is that during the cleaning process of the dressing disk 93 by the nozzle 95, the cleaning liquid sprayed onto the bottom of the dressing disk 93 is likely to splash back onto the polishing pad 94, increasing the risk of scratching the surface of the part to be polished and clogging the polishing pad 94; at the same time, the cleaning liquid remaining on the polishing pad 94 will also dilute the polishing slurry sprayed onto the polishing pad 94 to a certain extent, thereby affecting the polishing efficiency and polishing effect of the polishing pad 94 on the part to be polished. Summary of the Invention

[0004] The main object of the present utility model is to provide a dressing disk cleaning mechanism with good cleaning effect and not affecting the polishing effect.

[0005] Another object of the present utility model is to provide a dressing device provided with the above dressing disk cleaning mechanism.

[0006] Still another object of the present utility model is to provide a polishing equipment provided with the above dressing device.

[0007] To achieve the main object of the present utility model, the present utility model provides a dressing disk cleaning mechanism, which includes a cleaning tank and a cleaning unit. The cleaning tank has a cleaning chamber, an opening and a drainage port. The opening and the drainage port are respectively communicated with the cleaning chamber. The opening is located at the top of the cleaning tank, and the drainage port is located at the bottom of the cleaning tank. The cleaning unit includes a nozzle and a liquid supply pipe. The nozzle is located in the cleaning chamber and is arranged facing the opening. One end of the liquid supply pipe is docked with the nozzle.

[0008] As can be seen from the above, by setting the cleaning tank and cleaning the nozzle in the cleaning chamber of the cleaning tank, when the nozzle sprays the cleaning liquid onto the dressing disk, the cleaning liquid will fall back into the cleaning chamber under the cooperation of the dressing disk and the cleaning tank, thereby preventing the cleaning liquid, particles, reaction by-products, etc. from splashing onto the polishing pad, avoiding scratching the surface of the part to be polished and clogging the polishing pad, and at the same time, it can also avoid the polishing slurry sprayed onto the polishing pad from being diluted, ensuring the polishing efficiency and polishing effect of the polishing pad; the drainage port is used for timely discharging the cleaning waste liquid generated during the cleaning process to avoid the overflow of the cleaning waste liquid from the cleaning tank; in addition, when the dressing disk is in an idle (non-operating) state, the nozzle can also periodically spray the cleaning liquid onto the dressing disk to moisturize the working part of the dressing disk.

[0009] A preferred solution is that the dressing disk cleaning mechanism further includes a liquid inlet pipe, and the liquid inlet pipe is communicated with the cleaning chamber.

[0010] As can be seen from the above, before the nozzle cleans the dressing disk, the liquid inlet pipe can first introduce cleaning liquid into the cleaning cavity to soak the dressing disk for a preset duration, so as to preliminarily remove the relatively easy-to-remove particles and / or reaction by-products adhered to the dressing disk; after soaking the dressing disk for the preset duration, the cleaning waste liquid in the cleaning cavity is discharged through the drain port; then the nozzle is used to clean the dressing disk.

[0011] A further solution is that the side wall of the cleaning tank is provided with a liquid inlet connected to the cleaning cavity, and one end of the liquid inlet pipe is docked with the liquid inlet; a part of the liquid supply pipe penetrates through the tank wall of the cleaning tank and extends into the cleaning cavity; the dressing disk cleaning mechanism further includes a drain pipe, and one end of the drain pipe is docked with the drain port.

[0012] As can be seen from the above, this design makes the layout of the liquid inlet pipe and the liquid supply pipe more optimized and reasonable, so as to avoid the liquid inlet pipe, the liquid supply pipe, etc. entering the cleaning cavity from the opening, thereby preventing the liquid inlet pipe, the liquid supply pipe, etc. from obstructing the opening for the dressing disk to enter and exit, and avoiding damage to the liquid inlet pipe, the liquid supply pipe, and the dressing disk; setting the drain pipe facilitates the directional discharge of the cleaning waste liquid.

[0013] An even further solution is that the liquid inlet pipe can inject cleaning liquid into the cleaning tank to soak at least a part of the dressing disk extending into the cleaning cavity from the opening; and / or the nozzle flushes at least a part of the dressing disk extending into the cleaning cavity.

[0014] An even further solution is that the flushing duration of the nozzle is between 20 seconds and 60 seconds; and / or the soaking duration of the dressing disk in the cleaning cavity is between 20 seconds and 60 seconds.

[0015] As can be seen from the above, soaking the dressing disk for a preset duration before the nozzle cleans the dressing disk can preliminarily remove the relatively easy-to-remove particles and / or reaction by-products adhered to the dressing disk, shorten the cleaning time of the nozzle for the dressing disk, so as to reduce the impact of the cleaning liquid on the dressing disk, thereby extending the service life of the cleaning disk to a certain extent; and through the design of the flushing duration, it can not only ensure reliable cleaning of the dressing disk by the nozzle, prevent particles and / or reaction by-products from remaining on the dressing disk, but also ensure the overall cleaning efficiency of the dressing disk cleaning mechanism.

[0016] Another preferred solution is that a baffle is formed around the opening of the cleaning tank, and the baffle extends outward from the cleaning cavity and towards the center line of the cleaning tank.

[0017] As can be seen from the above, setting the baffle can further prevent the cleaning liquid, particles, reaction by-products, etc. from splashing outside the cleaning tank when the nozzle cleans the dressing disk.

[0018] A further solution is that the dressing disc cleaning mechanism further includes a first lifting drive unit. The drive end of the first lifting drive unit is connected to the cleaning tank, and the first lifting drive unit can drive the cleaning tank to move in the height direction of the cleaning tank.

[0019] As can be seen from the above, this design enables the first lifting drive unit to drive the cleaning tank towards the dressing disc, so as to simplify the structure of the dressing device or improve the cleaning efficiency of the dressing disc.

[0020] To achieve another object of the present invention, the present invention provides a dressing device, including a dressing disc, a swing arm and a drive mechanism. The first end of the swing arm is connected to the dressing disc, and the drive end of the drive mechanism is connected to the second end of the swing arm. Among them, the dressing device further includes the above-mentioned dressing disc cleaning mechanism, and the drive mechanism can drive the dressing disc to move to the opening through the swing arm.

[0021] As can be seen from the above, the dressing device provided with the above-mentioned dressing disc cleaning mechanism can prevent the cleaning liquid, particles and / or reaction by-products adhered to the dressing disc from splashing onto the polishing pad when cleaning the dressing disc, thereby avoiding scratching the surface of the part to be polished and blocking the polishing pad, and avoiding dilution of the polishing slurry sprayed onto the polishing pad, ensuring the polishing efficiency and polishing effect of the polishing pad; and when the dressing disc is in an idle (non-operating) state, the nozzle can also periodically spray the cleaning liquid onto the dressing disc to moisturize the working part of the dressing disc.

[0022] A further solution is that the dressing device further includes a first rotation drive unit. The first rotation drive unit is connected between the dressing disc and the first end of the swing arm, and the first rotation drive unit can drive the dressing disc to rotate around its own first rotation axis; the drive mechanism includes a second rotation drive unit and a second lifting drive unit. The second rotation drive unit is connected to the second end of the swing arm, and the second rotation drive unit can drive the swing arm to perform a sector-shaped swing. The swing axis of the swing arm is parallel to the first rotation axis, and the second lifting drive unit can drive the second rotation drive unit to move in the height direction of the cleaning tank.

[0023] As can be seen from the above, driving the dressing disc to rotate by the first rotation drive unit enables the nozzle to clean the dressing disc comprehensively; the second rotation drive unit is used to cooperate with the swing arm to drive the dressing disc to move relative to the polishing pad and move between the polishing pad and the cleaning tank; the second lifting drive unit is used to cooperate with the first rotation drive unit to drive the dressing disc towards the cleaning tank, and when the dressing disc cleaning mechanism is provided with a first lifting drive unit, it also further improves the cleaning efficiency of the cleaning disc.

[0024] To achieve another object of the present utility model, the present utility model provides a polishing device, which includes a polishing table and a polishing pad. The polishing table can rotate around its own second rotation axis center, and the polishing pad is installed on the polishing table. Among them, the polishing device further includes the above-mentioned dressing device, and the driving mechanism can drive the dressing disk to move between the center and the edge of the polishing pad through a swing arm.

[0025] As can be seen from the above, by setting the above-mentioned dressing device in the polishing device, when cleaning the dressing disk, it can prevent the cleaning liquid and particles and / or reaction by-products adhered to the dressing disk from splashing onto the polishing pad, thereby avoiding scratches on the surface of the part to be polished and blockage of the polishing pad, and avoiding dilution of the polishing slurry sprayed onto the polishing pad, ensuring the polishing efficiency and polishing effect of the polishing pad; and when the dressing disk is in an idle (non-operating) state, the nozzle can also periodically spray the cleaning liquid onto the dressing disk to moisturize the working part of the dressing disk. Description of the Drawings

[0026] Figure 1 is a schematic structural diagram of the first existing polishing device with some components omitted.

[0027] Figure 2 is a schematic structural diagram of the second existing polishing device with some components omitted for the first time.

[0028] Figure 3 is a schematic structural diagram of the second existing polishing device with some components omitted for the second time.

[0029] Figure 4 is a schematic structural diagram of an embodiment of the dressing device of the present utility model with some components omitted.

[0030] Figure 5 is a schematic structural diagram of the dressing disk cleaning structure of an embodiment of the dressing device of the present utility model.

[0031] Figure 6 is a schematic cross-sectional view of the dressing disk cleaning structure of an embodiment of the dressing device of the present utility model.

[0032] Figure 7 is a schematic structural diagram of an embodiment of the polishing device of the present utility model with some components omitted. The present utility model will be further described below with reference to the drawings and embodiments. Detailed Embodiments

[0033] Embodiment of the Dressing Device

[0034] Referring to Figure 4 , the dressing device 100 includes a dressing disk cleaning mechanism 1, a dressing disk 2, a swing arm 3, a driving mechanism 4, and a first rotation driving unit.

[0035] The dressing disk cleaning mechanism 1 is used to clean the dressing disk 2, prevent microcrystals such as particles and / or reaction by-products from adhering to the dressing disk 2, avoid damage to the surface of the polished part (such as a wafer) caused by the particles and / or reaction by-products, ensure the cleanliness of the working part 21 of the dressing disk 2, slow down the passivation of the dressing disk 2, and at least extend the service life of the dressing disk 2 by 30%. Combined with Figure 5 and Figure 6 , the dressing disk cleaning mechanism 1 includes a cleaning tank 11, a cleaning unit 12, a drain pipe 13 and a liquid inlet pipe 14.

[0036] The cleaning tank 11 has a cleaning chamber 111, an opening, a drain port 112 and a liquid inlet port 113. The opening is formed at the top of the cleaning tank 11 and is in communication with the cleaning chamber 111 to facilitate the dressing disk 2 to enter and exit the cleaning tank 11. The drain port 112 is formed at the bottom of the cleaning tank 11 and is in communication with the cleaning chamber 111. The drain port 112 is used to drain the cleaning waste liquid in the cleaning chamber 111 out of the cleaning chamber 111; wherein, one end of the drain pipe 13 is hermetically docked with the drain port 112 to guide the cleaning waste liquid discharged through the drain port 112 to a designated position for recovery or discharge.

[0037] The liquid inlet port 113 is preferably formed on the side wall of the cleaning tank 11. More preferably, the liquid inlet port 113 is arranged close to the top of the cleaning tank 11; the liquid inlet port 113 is in communication with the cleaning chamber 111. Among them, the first end of the liquid inlet pipe 14 is hermetically docked with the liquid inlet port 113, and the second end of the liquid inlet pipe 14 is connected to a liquid supply device, so that the liquid supply device can inject cleaning liquid into the cleaning chamber 111 through the liquid inlet pipe 14. Through the position design of the liquid inlet port 113, the layout of the liquid inlet pipe 14 can be optimized to avoid the liquid inlet pipe 14 entering the cleaning chamber 111 from the opening of the cleaning tank 11, thereby preventing the liquid inlet pipe 14 from obstructing the dressing disk 2 from entering and exiting the opening, and preventing damage to the liquid inlet pipe 14 and the dressing disk 2 due to mutual friction between the two. In addition, by configuring the liquid inlet pipe 14, before the cleaning unit 12 cleans the dressing disk 2, cleaning liquid can be injected into the cleaning chamber 111 through the liquid inlet pipe 14, and at least a part of the dressing disk 2 can be immersed in the cleaning liquid for a preset time (preferably between 20 seconds and 60 seconds) to initially remove the relatively easy-to-remove particles and / or reaction by-products adhered to the dressing disk 2, thereby appropriately shortening the cleaning time of the cleaning unit 12 for the dressing disk 2, reducing the impact of the cleaning liquid on the dressing disk 2, playing a certain protective role for the cleaning disk, and thus extending the service life of the cleaning disk to a certain extent.

[0038] The cleaning unit 12 includes a nozzle 121 and a liquid supply pipe 122. The nozzle 121 is disposed in the cleaning chamber 111 and is arranged facing the opening of the cleaning tank 11. When the dressing disk 2 is located at the opening or enters the cleaning chamber 111, the flushing range of the nozzle 121 for the working part 21 of the dressing disk 2 is approximately the radius area of the dressing disk 2. Preferably, the cleaning liquid ejected from the nozzle 121 is in a planar shape. When the plane intersects with the dressing disk 2 ideally, the intersection line of the two is approximately a radius of the dressing disk 2.

[0039] The first end of the liquid supply pipe 122 is docked with the nozzle 121, and the second end of the liquid supply pipe 122 is connected to a liquid supply device, so that the liquid supply device can pump high-pressure cleaning liquid to the nozzle 121 through the liquid supply pipe 122, and then the high-pressure cleaning liquid ejected from the nozzle 121 can flush the working part 21 of the dressing disk 2. Preferably, a part of the liquid supply pipe 122 penetrates through the tank wall of the cleaning tank 11 and extends into the cleaning chamber 111. For example, in this embodiment, the liquid supply pipe 122 penetrates the bottom wall of the cleaning tank 11. Of course, in other embodiments, the liquid supply pipe 122 can also penetrate the side wall of the cleaning tank 11. By making the liquid supply pipe 122 penetrate through the tank wall of the cleaning tank 11 and extend into the cleaning chamber 111, the layout of the liquid supply pipe 122 is more optimized and reasonable, so as to avoid the liquid supply pipe 122 entering the cleaning chamber 111 from the opening of the cleaning tank 11, thereby preventing the liquid supply pipe 122 from obstructing the dressing disk 2 from entering and exiting the opening, and preventing damage to the liquid supply pipe 122 and the dressing disk 2 due to mutual friction between the two.

[0040] Preferably, the cleaning liquid injected into the cleaning chamber 111 by the liquid inlet pipe 14 is different from the cleaning liquid ejected from the nozzle 121. For example, the cleaning liquid injected by the liquid inlet pipe is preferably a chemical cleaning agent, while the cleaning liquid ejected from the nozzle 121 is ultrapure water. Of course, as another optional solution, in other embodiments, the cleaning liquid injected into the cleaning chamber 111 by the liquid inlet pipe 14 can also be the same as the cleaning liquid ejected from the nozzle 121.

[0041] In addition, in this embodiment, the number of the cleaning units 12 is preferably two, and the two cleaning units 12 are evenly distributed along the axial direction of the cleaning tank 11. Of course, as another optional solution, in other embodiments, the number of the cleaning units 12 can also be one, or more than three. Further, the flushing duration of the nozzle 121 for the dressing disk 2 is preferably between 20 seconds and 60 seconds, so as to ensure the reliability of the cleaning of the dressing disk 2 by the nozzle 121, prevent particles and / or reaction by-products from remaining on the dressing disk 2, and ensure the overall cleaning efficiency of the dressing disk cleaning mechanism 1.

[0042] In addition, in order to prevent cleaning liquid, particles detached from the dressing disk 2, and / or reaction by-products, etc. from splashing outside the cleaning tank 11 when the nozzle 121 cleans the dressing disk 2, a baffle 114 is formed around the opening of the cleaning tank 11 at the opening. The baffle 114 extends outward from the cleaning chamber 111 and towards the center line of the cleaning tank 11 (i.e., the first rotation axis of the dressing disk 2), such that the baffle 114 is inclined to the first rotation axis of the dressing disk 2, and the extended end of the baffle 114 approaches the first rotation axis of the dressing disk 2.

[0043] The working part 21 of the dressing disk 2 (the part that contacts the polishing pad and grinds the polishing pad) preferably has appropriate diamond abrasive grains, so that the dressing disk 2 can suppress the reduction of the polishing efficiency of the polishing pad after dressing the polishing pad. The dressing disk 2 is connected to the driving end of the first rotation driving unit, such that the first rotation driving unit can drive the dressing disk 2 to rotate around its own first rotation axis, and the first rotation driving unit is connected to the first end of the swing arm 3; wherein, in order to ensure the uniformity of the nozzle 121 for redressing the dressing disk 2, during the flushing and cleaning process of the dressing disk 2, the rotation speed of the dressing disk 2 driven by the first rotation driving unit is preferably between 15 revolutions per minute and 25 revolutions per minute. More preferably, during the flushing and cleaning process of the dressing disk 2, the rotation speed of the dressing disk 2 is 20 revolutions per minute.

[0044] The second end of the swing arm 3 is connected to the driving mechanism 4, such that the driving mechanism 4 can drive the swing arm 3 to drive the dressing disk 2 to move between the polishing pad and the cleaning tank 11, and can drive the swing arm 3 to perform a sector-shaped swing relative to the polishing pad, so that the dressing disk 2 moves between the center and the edge of the polishing pad. Preferably, the driving mechanism 4 includes a second rotation driving unit 541 and a second lifting driving unit 42. The second rotation driving unit 541 is connected to the second end of the swing arm 3, such that the second rotation driving unit 541 can drive the swing arm 3 to drive the dressing disk 2 to perform a sector-shaped swing; wherein, the swing axis of the swing arm 3 is parallel to the first rotation axis. The second lifting driving unit 42 is used to drive the second rotation driving unit 541, the swing arm 3, and the dressing disk 2 to move in the height direction of the cleaning tank 11, so as to control the contact or separation between the dressing disk 2 and the polishing pad, and can control the dressing disk 2 to enter or exit the opening of the cleaning tank 11.

[0045] Preferably, as in this embodiment, the dressing disk cleaning mechanism 1 further includes a first lifting drive unit 15. The drive end of the first lifting drive unit 15 is connected to the cleaning tank 11. The first lifting drive unit 15 is used to drive the cleaning tank 11 to move relative to the dressing disk 2 in the height direction of the cleaning tank 11, so as to shorten the time for the dressing disk 2 to enter and exit the cleaning tank 11 and improve the cleaning efficiency of the dressing disk 2. Of course, in other embodiments, when the first lifting drive unit 15 is provided in the dressing disk cleaning mechanism 1, the second lifting drive unit 42 of the drive mechanism 4 of the dresser can be cancelled, that is, only the first lifting drive unit 15 drives the cleaning tank 11 to move relative to the dressing disk 2 in the height direction of the cleaning tank 11 to make the dressing disk 2 enter and exit the cleaning tank 11, thereby simplifying the structure of the dressing device 100. In yet another embodiment, only the second lifting drive unit 42 can be provided without providing the first lifting drive unit 15.

[0046] The working process of the dressing device 100 is briefly described as follows:

[0047] When the dressing disk 2 finishes dressing and grinding the polishing pad, the drive mechanism 4 controls the dressing disk 2 to move into the cleaning tank 11, and with the cooperation of the first lifting drive unit 15, the dressing disk 2 enters the cleaning tank 11.

[0048] Next, the liquid supply device injects cleaning liquid into the cleaning chamber 111 of the cleaning tank 11 through the liquid inlet pipe 14 to at least soak and clean the working part 21 of the cleaning disk. The soaking and cleaning time is between 20 seconds and 60 seconds.

[0049] Next, the cleaning waste liquid after soaking and cleaning is discharged from the cleaning tank 11 through the drain pipe 13. Subsequently, the liquid supply device pumps high-pressure cleaning liquid to the nozzle 121 to rinse the dressing disk 2 to remove residual particles, reaction by-products, polishing slurry, etc. on the dressing disk 2. The rinsing time is between 20 seconds and 60 seconds. Among them, to ensure the uniformity of rinsing, during the rinsing and cleaning process of the dressing disk 2, the first rotation drive unit drives the dressing disk 2 to rotate at a speed of 20 revolutions per minute. During the rinsing and cleaning process, the drain pipe 13 preferably discharges the cleaning waste liquid formed in the cleaning chamber 111 in real time.

[0050] When the rinsing of the dressing disk 2 is completed, if the dressing disk 2 is stationary in the cleaning tank 11 (that is, when the dressing disk 2 is in an idle state), the nozzle 121 sprays liquid to keep the working part 21 of the dressing disk 2 moist at a preset interval time.

[0051] In summary, by providing the cleaning tank 11 and arranging the nozzle 121 in the cleaning chamber 111 of the cleaning tank 11 for cleaning, when the nozzle 121 sprays the cleaning liquid onto the dressing disk 2, the cleaning liquid will fall back into the cleaning chamber 111 under the cooperation of the dressing disk and the cleaning tank 11, thereby preventing the cleaning liquid, particles, reaction by-products, etc. from splashing onto the polishing pad, so as to avoid scratching the surface of the part to be polished and blocking of the polishing pad. At the same time, it can also prevent the polishing slurry sprayed onto the polishing pad from being diluted, ensuring the polishing efficiency and polishing effect of the polishing pad; in addition, when the dressing disk 2 is in an idle (non-operating) state, the nozzle 121 can also periodically spray the cleaning liquid onto the dressing disk 2 to moisturize the working part 21 of the dressing disk 2.

[0052] Embodiment of polishing equipment

[0053] Refer to Figure 7 , the polishing equipment includes a polishing table 101, a polishing pad 102, a driver 103, and the dressing device 100 described in the above dressing device embodiment. The polishing table 101 can rotate around its own second rotation axis, and the second rotation axis is parallel to the first rotation axis. The polishing pad 102 is installed on the polishing table 101. The driving end of the driver 103 is connected to the polishing table 101, and the driver 103 is used to drive the polishing table 101 to rotate around the second rotation axis; the driving mechanism 4 of the dressing device 100 can drive its dressing disk 2 to move between the center and the edge of the polishing pad 102 through the swing arm 3 (such as Figure 7 the position of the dressing disk 2 shown by the dotted line in

[0054] In summary, by providing the above dressing device 100 in the polishing equipment, when cleaning the dressing disk 2, it can prevent the cleaning liquid, particles and / or reaction by-products adhered to the dressing disk 2 from splashing onto the polishing pad 102, thereby avoiding scratching the surface of the part to be polished and blocking of the polishing pad 102, and preventing the polishing slurry sprayed onto the polishing pad 102 from being diluted, ensuring the polishing efficiency and polishing effect of the polishing pad 102; and when the dressing disk 2 is in an idle (non-operating) state, the nozzle 121 can also periodically spray the cleaning liquid onto the dressing disk 2 to moisturize the working part 21 of the dressing disk 2.

[0055] Finally, it should be emphasized that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. Trimming disc cleaning mechanism, characterized in that, Comprising: A cleaning tank having a cleaning chamber, an opening, and a drain port. The opening and the drain port are respectively in communication with the cleaning chamber. The opening is located at the top of the cleaning tank, and the drain port is located at the bottom of the cleaning tank. A cleaning unit including a nozzle and a liquid supply pipe. The nozzle is located within the cleaning chamber, the nozzle is disposed towards the opening, and one end of the liquid supply pipe is docked with the nozzle.

2. The dressing disk cleaning mechanism according to claim 1, wherein: The dressing disk cleaning mechanism further includes a liquid inlet pipe in communication with the cleaning chamber.

3. The dressing disk cleaning mechanism according to claim 2, wherein: A liquid inlet is provided on the side wall of the cleaning tank and is in communication with the cleaning chamber. One end of the liquid inlet pipe is docked with the liquid inlet; A part of the liquid supply pipe penetrates through the tank wall of the cleaning tank and extends into the cleaning chamber; The dressing disk cleaning mechanism further includes a drain pipe, and one end of the drain pipe is docked with the drain port.

4. The dressing disk cleaning mechanism according to claim 3, wherein: The liquid inlet pipe can inject a cleaning liquid into the cleaning tank so that the cleaning liquid soaks at least a part of the dressing disk extending into the cleaning chamber from the opening; and / or The nozzle rinses at least a part of the dressing disk extending into the cleaning chamber.

5. The dressing disk cleaning mechanism according to claim 4, wherein: The rinsing duration of the nozzle is between 20 seconds and 60 seconds; and / or The soaking duration of the dressing disk in the cleaning chamber is between 20 seconds and 60 seconds.

6. The dressing disk cleaning mechanism according to claim 1, wherein: A baffle is formed around the opening at the opening of the cleaning tank, and the baffle extends outwards from the cleaning chamber and towards the center line of the cleaning tank.

7. The dressing disk cleaning mechanism according to any one of claims 1 to 6, wherein: The dressing disk cleaning mechanism further includes a first lifting drive unit, and the drive end of the first lifting drive unit is connected to the cleaning tank. The first lifting drive unit can drive the cleaning tank to move in the height direction of the cleaning tank.

8. A dressing device, comprising: A dressing disk; A swing arm, the first end of which is connected to the dressing disk; A drive mechanism, the drive end of which is connected to the second end of the swing arm; Characterized in that: The dressing device further includes the dressing disk cleaning mechanism according to any one of claims 1 to 7, and the drive mechanism can drive the dressing disk to move to the opening through the swing arm.

9. The dressing device according to claim 8, wherein: The dressing device further includes a first rotation drive unit connected between the dressing disk and the first end of the swing arm. The first rotation drive unit can drive the dressing disk to rotate around its own first rotation axis; The drive mechanism includes: A second rotation driving unit, which is connected to the second end of the swing arm, and the second rotation driving unit can drive the swing arm to swing in a sector shape, and the swing axis of the swing arm is parallel to the first rotation axis. A second lifting driving unit, and the second lifting driving unit can drive the second rotation driving unit to move in the height direction of the cleaning tank.

10. A polishing device, comprising: A polishing table, which can rotate around its own second rotation axis; A polishing pad, which is installed on the polishing table; It is characterized in that: The polishing device further comprises a dressing device as claimed in claim 8 or 9, and the driving mechanism can drive the dressing disc to move between the center and the edge of the polishing pad through the swing arm.

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