Chemical nickel plating wastewater pretreatment device

Abstract

The utility model provides a chemical nickel-plating wastewater pretreatment device which is characterized by comprising a dosing mixing area, an electrolytic reaction area and a backflow area, the dosing mixing area comprises a dosing mixing pool, a water inlet pipe and a circulating water inlet pipe; the electrolytic reaction area comprises an electrolytic reaction tank, a reverse pole direct-current power supply, a reaction polar plate and an overflow weir; the backflow area comprises a mixed flow pool, a water outlet pipe and a circulating water outlet pipe. The chemical nickel-plating wastewater treatment device not only effectively solves the problem of chemical nickel-plating wastewater treatment, but also promotes green and sustainable development of the electroplating industry through technical innovation, and provides solid technical support for industry transformation and upgrading.

Description

Technical Field

[0001] The utility model relates to a wastewater pretreatment device, and more specifically, a chemical nickel plating wastewater pretreatment device. Background Art

[0002] Chemical nickel plating wastewater, as a complex electroplating wastewater system, is characterized by being rich in hypophosphite, phosphite and heavy metal nickel, and doped with various organic complexing agents such as potassium sodium tartrate, citric acid, etc. These complexing agents are easy to form stable complexes with nickel ions, and traditional chemical breaking of complexes and precipitation technologies are difficult to effectively remove. Direct discharge of such wastewater will seriously endanger the water environment. At present, for the treatment of chemical nickel plating wastewater, although advanced oxidation technology combined with other methods is widely used, many challenges still remain: for example, Patent CN108609810A adopts a combined process of advanced oxidation and coagulation precipitation, with a cumbersome process and a long time-consuming; in another patent CN215288368U, the regulating tank and the Fenton system are independently arranged, occupying a large space and having poor space adaptability; Patent CN214829207U generates waste gas due to aeration stirring, causing secondary pollution and increasing equipment costs; although the staggered layout of the anode and cathode plates in Patent CN215102171U has been optimized, the anode consumes quickly and the maintenance and replacement are complex.

[0003] In view of this, the utility model aims to break through the above technical limitations. Through the integrated design concept, multiple treatment units are highly integrated into a compact device, significantly reducing the floor area, improving the space utilization efficiency, and facilitating flexible deployment in a limited space. At the same time, the plate layout is optimized to be arranged in sequence. Compared with the staggered arrangement, the installation and disassembly processes are greatly simplified, facilitating daily maintenance and rapid replacement. In addition, for the homogeneous treatment of wastewater, an innovative technology combining internal baffle and hydraulic circulation stirring is adopted, without additional mechanical or aeration equipment, which not only accelerates the reaction process, but also significantly reduces energy consumption, noise and waste gas emissions, further controlling the equipment investment cost. To sum up, the utility model not only effectively solves the problem of chemical nickel plating wastewater treatment, but also promotes the green and sustainable development of the electroplating industry through technological innovation, providing a solid technical support for the transformation and upgrading of the industry. Summary of the Invention

[0004] To solve the above technical problems, the utility model provides a chemical nickel plating wastewater pretreatment device, adopting the following technical solutions:

[0005] A chemical nickel plating wastewater pretreatment device, characterized in that it includes a chemical addition and mixing area, an electrolysis reaction area and a reflux area; the chemical addition and mixing area includes a chemical addition and mixing tank, a water inlet pipe and a circulating water inlet pipe; the electrolysis reaction area includes an electrolysis reaction tank, a reverse-polarity DC power supply, reaction plates and an overflow weir; the reflux area includes a mixing tank, a water outlet pipe and a circulating water outlet pipe.

[0006] Further, a first chemical addition pipe, a second chemical addition pipe and an on-line pH meter are provided in the chemical addition mixing tank.

[0007] Further, a water inlet valve is provided on the water inlet pipe, a circulation pump, a first maintenance valve and a second maintenance valve are provided on the circulating water inlet pipe, and a water outlet valve is provided on the water outlet pipe.

[0008] Further, the reverse-polarity DC power supply is connected to the reaction electrode plate.

[0009] Further, a partition is provided at the center of the mixing tank. The upper part of the partition is connected to the top of the mixing tank, and the distance between the bottom of the partition and the bottom of the mixing tank is 100-150 mm; the hole formed between the partition and the bottom of the mixing tank is the second flow-through hole.

[0010] Further, a first flow-through hole is provided between the chemical addition mixing tank and the electrolytic reaction tank.

[0011] Compared with the prior art, the advantages of the present utility model are as follows:

[0012] (1) The electrode materials adopted by the present device are widely available, effectively reducing the material cost. At the same time, the optimized design of the connection mode between the electrode plate and the power supply reduces the fault occurrence points, improves the stability and durability of the equipment, reduces the difficulty and cost of later maintenance, and reflects good economy and practical stability;

[0013] (2) The internal structure of the present device is carefully designed, combined with an efficient circulating stirring system, ensuring the uniformity and efficiency of wastewater treatment, effectively avoiding the problem of secondary pollution that may occur in the traditional treatment process, and reducing the negative impact on the environment. This design concept highlights the principle of equal emphasis on environmental protection and efficiency, ensuring that the wastewater treatment process is both efficient and environmentally friendly;

[0014] (3) The present device realizes automatic and intelligent control, with a user-friendly operation interface, simple and easy to operate, greatly reducing the need and cost of manual operation, and at the same time improving the accuracy and stability of wastewater treatment. This intelligent control method not only improves the work efficiency, but also ensures the consistency and reliability of the treatment results;

[0015] (4) The present device has a short reaction cycle and high wastewater treatment capacity, can quickly respond to treatment requirements, demonstrating its flexibility and efficiency in the field of wastewater treatment. In addition, the present device is also easy to combine with other wastewater treatment technologies, providing a more extensive and diverse solution for the comprehensive treatment of wastewater, demonstrating its strong compatibility and expandability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic structural diagram of the present utility model.

[0017] Among them, 1 is the chemical addition and mixing area, 2 is the electrolytic reaction area, 3 is the reflux area, 4 is the chemical addition and mixing tank, 5 is the water inlet pipe, 6 is the circulating water inlet pipe, 7 is the electrolytic reaction tank, 8 is the inverted-polarity DC power supply, 9 is the reaction electrode plate, 10 is the overflow weir, 11 is the mixing tank, 12 is the water outlet pipe, 13 is the circulating water outlet pipe, 14 is the first chemical addition pipe, 15 is the second chemical addition pipe, 16 is the on-line pH meter, 17 is the water inlet valve, 18 is the circulating pump, 19 is the first maintenance valve, 20 is the second maintenance valve, 21 is the water outlet valve, 22 is the partition plate, 23 is the second flow-through hole, and 24 is the first flow-through hole. Specific embodiments

[0018] The present invention will be further described and explained below in conjunction with the accompanying drawings and specific embodiments.

[0019] As Figure 1 shown, a chemical nickel plating wastewater pretreatment device provided by the present invention includes a chemical addition and mixing area 1, an electrolytic reaction area 2, a reflux area 3, a chemical addition and mixing tank 4, a water inlet pipe 5, a circulating water inlet pipe 6, an electrolytic reaction tank 7, an inverted-polarity DC power supply 8, a reaction electrode plate 9, an overflow weir 10, a mixing tank 11, a water outlet pipe 12, a circulating water outlet pipe 13, a first chemical addition pipe 14, a second chemical addition pipe 15, an on-line pH meter 16, a water inlet valve 17, a circulating pump 18, a first maintenance valve 19, a second maintenance valve 20, a water outlet valve 21, a partition plate 22, a second flow-through hole 23, and a first flow-through hole 24.

[0020] The device includes a chemical addition and mixing area 1, an electrolytic reaction area 2, and a reflux area 3; the chemical addition and mixing area 1 includes a chemical addition and mixing tank 4, a water inlet pipe 5, and a circulating water inlet pipe 6; the electrolytic reaction area includes an electrolytic reaction tank 7, an inverted-polarity DC power supply 8, a reaction electrode plate 9, and an overflow weir 10; the reflux area 3 includes a mixing tank 11, a water outlet pipe 12, and a circulating water outlet pipe 13.

[0021] The chemical addition and mixing tank 4 is provided with a first chemical addition pipe 14, a second chemical addition pipe 15, and an on-line pH meter 16.

[0022] The water inlet pipe 5 is provided with a water inlet valve 17, the circulating water inlet pipe 6 is provided with a circulating pump 18, a first maintenance valve 19, and a second maintenance valve 20, and the water outlet pipe 12 is provided with a water outlet valve 21.

[0023] The inverted-polarity DC power supply 8 is connected to the reaction electrode plate 9.

[0024] A partition plate 22 is provided at the center of the mixing tank 11. The upper part of the partition plate 22 is connected to the top of the mixing tank 11, and the distance from the bottom of the partition plate 22 to the bottom of the mixing tank 11 is 100 - 150 mm; the hole formed between the partition plate 22 and the bottom of the mixing tank 11 is the second flow-through hole 23.

[0025] A first flow-through hole 24 is provided between the chemical dosing mixing tank 4 and the electrolytic reaction tank 7.

[0026] The working principle of this device is as follows: The electroless nickel plating wastewater enters the chemical dosing mixing tank in the chemical dosing mixing area through the water inlet pipe. Sulfuric acid or hydrochloric acid solution enters the chemical dosing mixing tank through the first chemical dosing pipe. The on-line pH meter controls the pH of the chemical dosing mixing tank to be 3 - 3.5. Hydrogen peroxide enters the chemical dosing mixing tank through the second chemical dosing pipe, and an oxidation reaction occurs in the chemical dosing mixing tank. The wastewater after the reaction in the chemical dosing mixing tank enters the electrolytic reaction tank in the electrolytic reaction area through the first flow-through hole, and an electrolytic oxidation reaction occurs. The effluent from the electrolytic reaction tank enters the overflow weir. The effluent from the overflow weir enters the mixing tank in the reflux area. Under the action of the partition plate, the effluent undergoes a baffle reaction through the second flow-through hole. A part of the effluent from the mixing tank is refluxed to the chemical dosing mixing tank through the circulating outlet pipe, and the other part of the effluent is discharged out of the system through the outlet pipe. Embodiment

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0028] As Figure 1 shown, a pretreatment device for electroless nickel plating wastewater is developed using the above technical solution in this project, and the treatment object is electroless nickel plating wastewater.

[0029] This device includes a chemical dosing mixing area 1, an electrolytic reaction area 2, and a reflux area 3; the chemical dosing mixing area 1 includes a chemical dosing mixing tank 4, a water inlet pipe 5, and a circulating water inlet pipe 6; the electrolytic reaction area includes an electrolytic reaction tank 7, a reverse-polarity DC power supply 8, reaction plates 9, and an overflow weir 10; the reflux area 3 includes a mixing tank 11, an outlet pipe 12, and a circulating outlet pipe 13.

[0030] A first chemical dosing pipe 14, a second chemical dosing pipe 15, and an on-line pH meter 16 are provided in the chemical dosing mixing tank 4.

[0031] An inlet valve 17 is provided on the water inlet pipe 5, a circulating pump 18, a first maintenance valve 19, and a second maintenance valve 20 are provided on the circulating water inlet pipe 6, and an outlet valve 21 is provided on the outlet pipe 12.

[0032] The reverse-polarity DC power supply 8 is connected to the reaction plates 9.

[0033] A partition plate 22 is provided at the center of the mixing tank 11. The upper part of the partition plate 22 is connected to the top of the mixing tank 11, and the distance between the bottom of the partition plate 22 and the bottom of the mixing tank 11 is 100 - 150 mm; the hole formed between the partition plate 22 and the bottom of the mixing tank 11 is the second flow-through hole 23.

[0034] A first flow-through hole 24 is provided between the chemical dosing mixing tank 4 and the electrolytic reaction tank 7.

[0035] The pilot test was carried out using the device of this invention. The total nickel concentration in the electroless nickel plating wastewater was 150 - 160 mg / L, the total phosphorus concentration was 375 - 385 mg / L, and the orthophosphate concentration was 8 - 15 mg / L. After the wastewater was treated, the water quality was as shown in Table 1. The pH of the wastewater was adjusted to 10.5 - 11 with a 15% lime solution by mass, allowed to stand and filtered, and the water quality of the supernatant was measured as shown in Table 2.

[0036] Table 1 Water quality of the equipment effluent

[0037] Name Total Nickel (mg / L) Total Phosphorus (mg / L) Orthophosphate (mg / L) Sample 1 155 378 375 Sample 2 160 380 377 Sample 3 150 375 371

[0038] Table 2 Water quality of the supernatant

[0039] Name Total Nickel (mg / L) Total Phosphorus (mg / L) Orthophosphate (mg / L) Sample 1 0.25 3 0 Sample 2 0.26 3 0 Sample 3 0.25 4 0

[0040] As can be seen from Table 1, after the wastewater was treated by the invention device, the total nickel concentrations of Sample 1, Sample 2, and Sample 3 were 155, 160, and 150 mg / L respectively, the total phosphorus concentrations were 378, 380, and 375 mg / L respectively, and the orthophosphate concentrations were 375, 377, and 371 mg / L respectively, indicating that the vast majority of non-orthophosphate in the wastewater was converted into orthophosphate.

[0041] As can be seen from Table 2, in the supernatant, the total nickel concentrations of Sample 1, Sample 2, and Sample 3 were 0.25, 0.26, and 0.25 mg / L respectively, all less than 0.3 mg / L, indicating that the complexed nickel in the wastewater was converted into ionic nickel, and the total nickel concentration of the effluent met the requirements of the "Discharge Standard of Water Pollutants for Electroplating in Zhejiang Province" (DB33 / 2260 - 2020) (total nickel < 0.3 mg / L); the total phosphorus concentrations were 3, 3, and 4 mg / L respectively, all less than 8 mg / L, and the total phosphorus reached the standard of the "Indirect Discharge Limit of Nitrogen and Phosphorus Pollutants from Industrial Wastewater in Zhejiang Province" (DB33 / 887 - 2013) (total phosphorus < 8 mg / L).

[0042] In summary, the invention device has an obvious pretreatment effect on electroless nickel wastewater, can convert non-orthophosphate in the wastewater into orthophosphate, and convert complexed nickel in the wastewater into ionic nickel. After the effluent of the device is simply treated by lime precipitation, the total nickel and total phosphorus can meet the discharge requirements.

[0043] The above-described embodiments are only used to illustrate one implementation manner of the present utility model, rather than limiting it. It should be noted that those of ordinary skill in the art can modify the technical solutions recorded in the above embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present utility model.

Claims

1. A chemical nickel plating wastewater pretreatment device, characterized in that, It includes a chemical dosing and mixing area, an electrolytic reaction area and a reflux area; the chemical dosing and mixing area includes a chemical dosing and mixing tank, a water inlet pipe and a circulating water inlet pipe; the electrolytic reaction area includes an electrolytic reaction tank, a reverse-polarity DC power supply, reaction plates and an overflow weir; the reflux area includes a mixing tank, a water outlet pipe and a circulating water outlet pipe.

2. The chemical nickel plating wastewater pretreatment device according to claim 1, wherein, A first chemical dosing pipe, a second chemical dosing pipe and an on-line pH meter are provided in the chemical dosing and mixing tank.

3. The chemical nickel plating wastewater pretreatment device according to claim 1, wherein, A water inlet valve is provided on the water inlet pipe, a circulating pump, a first maintenance valve and a second maintenance valve are provided on the circulating water inlet pipe, and a water outlet valve is provided on the water outlet pipe.

4. The chemical nickel plating wastewater pretreatment device according to claim 1, characterized in that, The reverse-polarity DC power supply is connected to the reaction plates.

5. The chemical nickel plating wastewater pretreatment device according to claim 1, wherein, A partition is provided at the center of the mixing tank. The upper part of the partition is connected to the top of the mixing tank. The distance from the bottom of the partition to the bottom of the mixing tank is 100 - 150 mm; the hole formed between the partition and the bottom of the mixing tank is the second flow-through hole.

6. The chemical nickel plating wastewater pretreatment device according to claim 1, wherein A first flow-through hole is provided between the chemical dosing and mixing tank and the electrolytic reaction tank.

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