Aluminum boat for atomic layer deposition
By designing installation components that can adjust the spacing between the toothed rods and brackets in the aluminum boat, the problem that existing aluminum boats cannot be compatible with silicon wafers of different sizes is solved, and efficient processing of multi-specimen silicon wafers is achieved, reducing production costs.
Patent Information
- Application Number
- CN202422374924.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-26
- Publication Date
- 2025-07-04
- Estimated Expiration
- 2034-09-26
AI Technical Summary
The existing aluminum boats are not compatible with silicon wafers of different sizes, resulting in frequent replacement of vehicles in the production line, increasing production costs.
An aluminum boat is designed, including a first side plate and a second side plate, and is equipped with multiple toothed rods and a support rods. The spacing between adjacent toothed rods or support rods is adjusted by mounting components to meet the limit requirements of silicon wafers of different sizes.
It achieves rapid adaptation of silicon wafers of different sizes, reduces production costs, improves production efficiency and silicon wafer processing quality.
Smart Images
Figure CN223061080U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of the photovoltaic industry, and particularly relates to an aluminum boat for atomic layer deposition. Background Art
[0002] Currently, the surface passivation process of photovoltaic cells basically uses atomic layer deposition of aluminum oxide film. An atomic layer deposition device is a method that can deposit a single substance layer by layer in the form of a single atomic layer on the surface of a substrate. By alternately pulsing gaseous precursors TMA and H2O into the reaction chamber, and chemically adsorbing and reacting on the deposition substrate to generate a deposition film AL2O3. With the development of the photovoltaic industry, the production capacity requirements are getting higher and higher, the size of silicon wafers is getting larger, and the product sizes required by different customers are also different. The production workshop needs to frequently switch to produce products of different size specifications according to customer needs, which places higher and higher requirements on the compatibility of carriers.
[0003] In the related art, the aluminum boat has only one set of hole positions for installing tooth bars, and can only fixedly load silicon wafers of a single size, and cannot be compatible with loading silicon wafers of different sizes. When the production line switches to produce silicon wafers of different sizes, it is necessary to replace the carrier aluminum boat, which increases the production cost. Utility Model Content
[0004] In order to facilitate the production of silicon wafers of different specifications and sizes and reduce the cost of using carriers, this application provides an aluminum boat for atomic layer deposition.
[0005] The aluminum boat for atomic layer deposition provided by this application adopts the following technical solution:
[0006] An aluminum boat for atomic layer deposition includes a first side plate and a second side plate. A plurality of tooth bars and support bars for placing silicon wafers are installed between the first side plate and the second side plate. The support bars are located below the tooth bars. Installation components for conveniently adjusting the distance between adjacent tooth bars or support bars are provided at the ends of the tooth bars and support bars. The tooth bars and support bars are respectively fixedly installed on the first side plate and the second side plate through the installation components.
[0007] By adopting the above technical solution, the distance between two adjacent tooth bars or support bars can be quickly adjusted through the installation components, so as to meet the limitation of silicon wafers of different sizes, meet the processing and production of silicon wafers of different sizes, and reduce the production cost.
[0008] Optionally, the installation assembly includes a plurality of installation slots spacedly formed on the first side plate and the second side plate. The plurality of installation slots are respectively formed along the length and width directions of the first side plate and the second side plate, and the installation slots on the first side plate and the second side plate are arranged oppositely. Both ends of the rack are inserted into the installation slots, and a plurality of threaded holes communicating with the installation slots are further formed on the first side plate and the second side plate. The axis of the threaded hole and the axis of the rack are located on the same straight line. The installation assembly further includes screws, and the screws pass through the threaded holes and are fixedly connected to the ends of the rack.
[0009] By adopting the above technical solution, when installing the rack, both ends of the rack are respectively inserted into the installation slots of the first side plate and the second side plate. By inserting the installation slots at different positions, the distance between two adjacent racks can be adjusted. After being fixed by screws, it can meet the limitation of wafers with different widths and lengths.
[0010] Optionally, the installation assembly further includes a plurality of fixing slots spacedly formed on the first side plate and the second side plate in the length direction. Both ends of the support rod are inserted into the fixing slots, the threaded holes communicate with the fixing slots, and the screws pass through the threaded holes and are inserted into the support rod.
[0011] By adopting the above technical solution, the support rod is located below the wafer and plays a role in supporting the wafer. By inserting the support rod at different positions of the fixing slots, the support for wafers with different lengths can be satisfied.
[0012] Optionally, a plurality of engaging teeth are fixedly arranged on the side walls of the rack and the support rod. The plurality of engaging teeth are spacedly arranged along the length direction of the rack or the support rod, and the wafer is inserted between adjacent engaging teeth.
[0013] By adopting the above technical solution, when installing the wafer, the engaging teeth limit the wafer, so that a certain interval is maintained between the wafers, thereby ensuring the production quality of the wafers.
[0014] Optionally, the installation assembly includes a plurality of through holes formed through the first side plate and the second side plate. The plurality of through holes are spacedly arranged along the length and width directions of the first side plate and the second side plate. The ends of the rack pass through the through holes and extend out of the first side plate and the second side plate. Insertion holes are formed on the side walls of the rack near the ends. The installation assembly further includes insertion rods. When the rack extends out of the first side plate or the second side plate, the insertion rods are inserted into the insertion holes and the insertion rods abut against the sides of the first side plate and the second side plate away from each other.
[0015] By adopting the above technical solution, when adjusting the position of the rack, both ends of the rack respectively pass through and extend out of the first side plate and the second side plate. The parts of the rack extending out of the first side plate and the second side plate are fixedly installed quickly through the insertion of the insertion rods and the insertion holes.
[0016] Optionally, the insertion rods are each provided with an inclined surface that is gradually inclined from the side away from the first side plate or the second side plate towards the side close to the first side plate or the second side plate.
[0017] By adopting the above technical solution, the inclined surface of the insertion rod further improves the stability when the insertion rod is inserted into the insertion hole.
[0018] Optionally, a positioning block is further fixed on the side wall of the toothed rod. The positioning block is located on the side of the toothed rod close to the insertion hole. Positioning grooves are also formed on the side of the first side plate and the second side plate that are close to each other. The positioning block is inserted into the positioning groove.
[0019] By adopting the above technical solution, in order to further improve the connection efficiency between the toothed rod and the first side plate and the second side plate, when the toothed rod penetrates through the first side plate and the second side plate, the positioning block is inserted into the positioning groove, thereby facilitating the rapid insertion of the insertion rod and further ensuring the connection stability between the toothed rod and the first side plate and the second side plate.
[0020] Optionally, when the silicon wafer is placed between two adjacent toothed rods, the vertical projections of the support rod and the toothed rod do not coincide.
[0021] By adopting the above technical solution, when the silicon wafer is processed and produced, the support rod and the toothed rod jointly limit the silicon wafer, reducing the shaking of the silicon wafer.
[0022] In summary, the present application includes at least one of the following beneficial technical effects:
[0023] 1. Through the installation component, the distance between two adjacent toothed rods or support rods can be quickly adjusted, so as to meet the limitation of silicon wafers of different sizes, meet the processing and production of silicon wafers of different dimensions, and reduce production costs;
[0024] 2. The support rod is located under the silicon wafer and plays a role in supporting the silicon wafer. By inserting the support rod into the fixing grooves at different positions, the support of silicon wafers of different lengths can be satisfied;
[0025] 3. When installing the silicon wafer, the engaging teeth limit the silicon wafer, keeping a certain interval between the silicon wafers, thereby ensuring the production quality of the silicon wafers. Description of the Drawings
[0026] Figure 1 is a schematic structural diagram of the first side plate, the second side plate, the toothed rod and the support rod in Embodiment 1 of the present application.
[0027] Figure 2 is a cross-sectional view of the first side plate, the second side plate and the installation component in Embodiment 1 of the present application.
[0028] Figure 3It is a cross-sectional view of the first side plate, the second side plate and the mounting assembly of Embodiment 2 of the present application.
[0029] Explanation of reference numerals: 1, first side plate; 2, second side plate; 3, rack; 31, jack; 4, support rod; 5, mounting assembly; 51, mounting groove; 52, threaded hole; 53, screw; 54, fixing groove; 55, engaging tooth; 56, through hole; 57, insertion rod; 58, positioning block; 59, positioning groove; 6, silicon wafer. Detailed implementation manners
[0030] The following is a further detailed description of the present application in conjunction with the Figure 1 - Figure 3 accompanying drawings.
[0031] An embodiment of the present application discloses an aluminum boat for atomic layer deposition.
[0032] Embodiment 1
[0033] Referring to Figure 1 , an aluminum boat for atomic layer deposition includes a vertically arranged first side plate 1 and a second side plate 2, the first side plate 1 and the second side plate 2 are parallel to each other, a plurality of mutually parallel racks 3 and support rods 4 are vertically installed between the first side plate 1 and the second side plate 2, and the support rod 4 is located below the rack 3. Mounting assemblies 5 are provided at both ends of the support rod 4 and the rack 3. The support rod 4 and the rack 3 are fixedly connected to the first side plate 1 and the second side plate 2 through the mounting assemblies 5. A silicon wafer 6 is placed between two adjacent racks 3. The mounting assembly 5 can quickly adjust the distance between two adjacent racks 3 or support rods 4 so as to meet the production of silicon wafers 6 of different sizes.
[0034] Referring to Figure 2 , the mounting assembly 5 includes a plurality of mounting grooves 51 respectively opened on the first side plate 1 and the second side plate 2, and the mounting grooves 51 on the first side plate 1 and the second side plate 2 are arranged oppositely. The plurality of mounting grooves 51 are respectively spaced along the length direction and the width direction of the first side plate 1 and the second side plate 2. The two ends of the rack 3 are inserted into the mounting grooves 51, so that the rack 3 is vertically installed between the first side plate 1 and the second side plate 2. By changing the insertion position of the rack 3 on the first side plate 1 and the second side plate 2, the distance between the racks 3 can be quickly adjusted.
[0035] The mounting assembly 5 further includes a plurality of threaded holes 52 which are opened through the first side plate 1 and the second side plate 2, and the number of the threaded holes 52 is the same as that of the mounting grooves 51 and they are in communication with each other. The axis of the threaded hole 52 is perpendicular to the first side plate 1 or the second side plate 2. The mounting assembly 5 further includes a plurality of screws 53. After the end of the rack 3 is inserted into the mounting groove 51, the screw 53 passes through the threaded hole 52 and is fixedly connected to the end of the rack 3, so that the rack 3 is quickly fixed between the first side plate 1 and the second side plate 2.
[0036] The mounting assembly 5 further includes a plurality of fixing grooves 54 formed in the first side plate 1 and the second side plate 2. The plurality of fixing grooves 54 are spaced apart along the length direction of the first side plate 1, and the fixing grooves 54 are all located below the mounting groove 51. The number of fixing grooves 54 on the first side plate 1 and the second side plate 2 is the same and they are oppositely formed. Both ends of the support rod 4 are inserted into the fixing grooves 54. By changing the insertion position of the support rod 4, the distance between the support rods 4 can be quickly adjusted. The threaded holes 52 on the first side plate 1 and the second side plate 2 communicate with the fixing grooves 54. When the support rod 4 is inserted into the fixing grooves 54 of the first side plate 1 and the second side plate 2, the screw 53 passes through the threaded hole 52 and is fixed to the end of the support rod 4, realizing the quick fixation of the support rod 4.
[0037] A plurality of engaging teeth 55 are fixedly spaced along the length directions of the rack bar 3 and the support rod 4. When placing the silicon wafer 6, the side and bottom edges of the silicon wafer 6 are inserted into the spaces between the engaging teeth 55, so that adjacent silicon wafers 6 do not contact and shake each other, ensuring the stability of processing. And when the silicon wafer 6 is inserted into the first side plate 1 and the second side plate 2, the projection of the support rod 4 in the vertical direction does not coincide with the rack bar 3, so that the silicon wafer 6 is located between two adjacent rack bars 3, and the support rod 4 plays a supporting role for the silicon wafer 6.
[0038] The implementation principle of Embodiment 1 is: when atomic layer deposition needs to be performed on silicon wafers 6 of different sizes, by changing the insertion positions of the rack bar 3 and the support rod 4, the positions of the rack bar 3 and the support rod 4 are adjusted, so as to limit the silicon wafer 6, and the rack bar 3 and the support rod 4 are fixed on the first side plate 1 and the second side plate 2 by the screw 53, ensuring the stability of installation and the convenience of disassembly.
[0039] Embodiment 2
[0040] Referring to Figure 3 , the difference between this embodiment and Embodiment 1 is that, in order to further improve the installation efficiency of the rack bar 3 and the support rod 4 on the first side plate 1 and the second side plate 2, the mounting assembly 5 includes through holes 56 formed through the first side plate 1 and the second side plate 2. The number of through holes 56 is multiple, and the multiple through holes 56 are spaced apart along the length directions of the first side plate 1 and the second side plate 2 and are opposite to each other one by one. Both ends of the rack bar 3 and the support rod 4 can penetrate and extend out of the through holes 56. Taking the connection method of the rack bar 3 as an example, the connection method of the support rod 4 with the first side plate 1 and the second side plate 2 is the same as that of the rack bar 3, and this embodiment will not be elaborated here.
[0041] The portions of the rack bar 3 extending out of the first side plate 1 and the second side are both provided with insertion holes 31 penetrating therethrough. The axis of the insertion hole 31 is perpendicular to the length direction of the rack bar 3. Insertion rods 57 are inserted into the insertion holes 31. The insertion rods 57 are vertically inserted into the insertion holes 31 so that the insertion rods 57 abut against the sides of the first side plate 1 and the second side plate 2 that are away from each other. On the length direction of the insertion rods 57, there are inclined surfaces that are gradually inclined from the side away from the first side plate 1 or the second side plate 2 towards the side close to the first side plate 1 or the second side plate 2, so that the cross-section of the insertion rods 57 is frustum-shaped, and thus the insertion rods 57 can be tightly inserted into the insertion holes 31.
[0042] In order to further improve the connection stability between the rack bar 3 and the first side plate 1 and the second side plate 2, two positioning blocks 58 are fixed on the side wall of each rack bar 3. The two positioning blocks 58 are respectively located on the side of the rack bar 3 close to the insertion holes 31. The mounting assembly 5 further includes a plurality of positioning grooves 59 formed on the first side plate 1 and the second side plate 2. The number of the positioning grooves 59 is the same as that of the through holes 56 and they are arranged to communicate with each other. When the positioning blocks 58 are inserted into the positioning grooves 59, the two ends of the rack bar 3 extend out of the through holes 56, and then the insertion rods 57 are inserted into the insertion holes 31, thereby improving the connection stability between the rack bar 3 and the first side plate 1 and the second side plate 2.
[0043] The implementation principle of Embodiment 2 is as follows: When it is necessary to adjust the distance between the rack bars 3 to meet the production of silicon wafers 6 of different sizes, it can be achieved by adjusting the insertion positions of the rack bars 3 and the support rods 4 between the first side plate 1 and the second side plate 2. When the rack bars 3 are installed on the first side plate 1 and the second side plate 2, the positioning blocks 58 are fitted into the positioning grooves 59. At this time, the two ends of the rack bars 3 extend out of the first side plate 1 and the second side plate 2, and then the insertion rods 57 are inserted into the insertion holes 31 to achieve the rapid fixation of the rack bars 3.
[0044] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.
Claims
1. An aluminum boat for atomic layer deposition, comprising a first side plate (1) and a second side plate (2), characterized in that: A plurality of toothed rods (3) and support rods (4) for placing silicon wafers (6) are installed between the first side plate (1) and the second side plate (2). The support rods (4) are located below the toothed rods (3). Installation components (5) for facilitating the adjustment of the distance between adjacent toothed rods (3) or support rods (4) are provided at the ends of the toothed rods (3) and the support rods (4). The toothed rods (3) and the support rods (4) are respectively fixedly installed on the first side plate (1) and the second side plate (2) through the installation components (5).
2. The aluminum boat for atomic layer deposition according to claim 1, wherein: The installation component (5) includes a plurality of installation grooves (51) spacedly formed on the first side plate (1) and the second side plate (2). The plurality of installation grooves (51) are respectively formed along the length and width directions of the first side plate (1) and the second side plate (2), and the installation grooves (51) on the first side plate (1) and the second side plate (2) are oppositely arranged. Both ends of the toothed rod (3) are inserted into the installation grooves (51). A plurality of threaded holes (52) communicating with the installation grooves (51) are further formed on the first side plate (1) and the second side plate (2). The axis of the threaded hole (52) and the axis of the toothed rod (3) are located on the same straight line. The installation component (5) further includes screws (53). The screws (53) pass through the threaded holes (52) and are fixedly connected to the ends of the toothed rod (3).
3. The aluminum boat for atomic layer deposition according to claim 2, wherein: The installation component (5) further includes a plurality of fixing grooves (54) spacedly formed on the first side plate (1) and the second side plate (2) in the length direction. The ends of the support rods (4) are respectively inserted into the fixing grooves (54). The threaded holes (52) communicate with the fixing grooves (54). The screws (53) pass through the threaded holes (52) and are inserted into the support rods (4).
4. The aluminum boat for atomic layer deposition according to claim 3, characterized in that: A plurality of locking teeth (55) are fixedly arranged on the side walls of the toothed rod (3) and the support rod (4). The plurality of locking teeth (55) are spacedly arranged along the length direction of the toothed rod (3) or the support rod (4). The silicon wafers (6) are inserted between adjacent locking teeth (55).
5. The aluminum boat for atomic layer deposition according to claim 1, wherein: The installation component (5) includes a plurality of through holes (56) formed through the first side plate (1) and the second side plate (2). The plurality of through holes (56) are spacedly formed along the length and width directions of the first side plate (1) and the second side plate (2). The ends of the toothed rod (3) pass through the first side plate (1) and the second side plate (2) through the through holes (56). Plug holes (31) are formed on the side walls of the toothed rod (3) near the ends. The installation component (5) further includes plug rods (57). When the toothed rod (3) passes through and extends out of the first side plate (1) or the second side plate (2), the plug rods (57) are inserted into the plug holes (31) and the plug rods (57) abut against the sides of the first side plate (1) and the second side plate (2) away from each other.
6. The aluminum boat for atomic layer deposition according to claim 5, characterized in that: The plug rods (57) are each provided with an inclined surface that gradually inclines from the side away from the first side plate (1) or the second side plate (2) to the side close to the first side plate (1) or the second side plate (2).
7. The aluminum boat for atomic layer deposition according to claim 5, characterized in that: A positioning block (58) is further fixed to the side wall of the toothed rod (3). The positioning block (58) is located on the side of the toothed rod (3) close to the jack (31). Positioning grooves (59) are further formed on the sides of the first side plate (1) and the second side plate (2) close to each other. The positioning block (58) is inserted into the positioning groove (59).
8. The aluminum boat for atomic layer deposition according to claim 1, wherein: When the silicon wafer (6) is placed between two adjacent toothed rods (3), the projection of the support rod (4) and the toothed rod (3) in the vertical direction does not coincide.