Electroplating device convenient to adjust and used for circuit board processing

Abstract

The utility model relates to the technical field of electroplating equipment, in particular to a circuit board processing electroplating device convenient to adjust, which comprises electroplating equipment, an adjusting structure is arranged on the surface of the electroplating equipment, the adjusting structure comprises two fixing blocks, the surfaces of the two fixing blocks are both fixedly connected with the electroplating equipment, and the adjusting structure is arranged on the surface of the electroplating equipment. A lifting frame is slidably connected to the surface of the fixing block, a connecting block is fixedly installed on the surface of the lifting frame, limiting rods are fixedly inserted into the connecting block, a supporting frame is fixedly installed at the lower ends of the two limiting rods, and a plurality of supporting grooves are evenly formed in the surface of the supporting frame; the arc surfaces of the two limiting rods are slidably sleeved with a clamping plate, and two grooves are formed in the surface of the clamping plate. According to the utility model, the defects in the prior art that the complexity of the production process is increased and the production efficiency is reduced due to the fact that fixing frames with different sizes need to be replaced when circuit boards with different sizes are electroplated by working personnel are overcome.

Description

Technical Field

[0001] The utility model relates to the technical field of electroplating equipment, in particular to an electroplating device for circuit board processing which is convenient to adjust. Background Technique

[0002] Electroplating equipment is a device used to deposit a metal layer on the surface of an object through an electrochemical method. Electroplating is widely used to improve the performance of products, such as anti-corrosion, improving conductivity, and enhancing appearance. Electroplating equipment is often used in the processing of circuit boards.

[0003] In view of the above and related existing technologies, the inventor believes that the following defects often exist: when using electroplating equipment to process circuit boards, different sizes of circuit boards require different sizes of fixing frames. This makes it necessary for workers to replace different sizes of fixing frames when electroplating circuit boards of different sizes, increasing the complexity of the production process and thus reducing the production efficiency.

[0004] Therefore, the utility model provides an electroplating device for circuit board processing which is convenient to adjust. Content of the Utility Model

[0005] The purpose of the utility model is to solve the defect that when workers electroplate circuit boards of different sizes in the prior art, they need to replace different sizes of fixing frames, which increases the complexity of the production process and thus reduces the production efficiency, and to propose an electroplating device for circuit board processing which is convenient to adjust.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme: an electroplating device for circuit board processing which is convenient to adjust, including electroplating equipment, an adjusting structure is arranged on the surface of the electroplating equipment. The adjusting structure includes two fixing blocks, the surfaces of both fixing blocks are fixedly connected to the electroplating equipment, a lifting frame is slidably connected to the surface of the fixing block, a connecting block is fixedly installed on the surface of the lifting frame, a limiting rod is fixedly inserted into the connecting block, a supporting frame is fixedly installed at the lower ends of both limiting rods, a plurality of supporting grooves are evenly formed on the surface of the supporting frame, a clamping plate is slidably sleeved on the arc surface of both limiting rods, two grooves are formed on the surface of the clamping plate, and a mounting plate is slidably sleeved on the arc surface of the limiting rod, and a plug pin is threadedly connected to the mounting plate.

[0007] The effect achieved by the above components is that by setting the adjusting structure, circuit boards of different sizes can be limited, thus facilitating workers to electroplate circuit boards of different sizes using the electroplating equipment.

[0008] Preferably, springs are sleeved on the arc surfaces of both limiting rods, and both ends of the springs are fixedly connected to the connecting block and the mounting plate respectively.

[0009] The effects achieved by the above components are as follows: The spring drives the mounting plate to slide downward by means of elastic force. While the mounting plate slides, it drives the clamping plate to slide, achieving the effect of driving the clamping plate to slide.

[0010] Preferably, a clamping pin is threadedly connected inside each of the two lifting frames, and an auxiliary block is fixedly installed on the surface of the clamping pin.

[0011] The effects achieved by the above components are as follows: Rotate the auxiliary block. While the auxiliary block rotates, it drives the clamping pin to rotate. The clamping pin moves in the direction close to the fixed block by means of the thread. After the clamping pin moves a certain distance, the surface of the clamping pin presses against the fixed block. At this time, the fixed block and the lifting frame are fixed, achieving the effect of fixing the lifting frame and the fixed block.

[0012] Preferably, two limit pads are fixedly installed on the surface of the electroplating equipment, and the surface of the limit pad abuts against the clamping pin.

[0013] The effects achieved by the above components are as follows: The limit pad can prevent the clamping pin from abutting against the electroplating equipment, facilitating the staff to rotate the clamping pin.

[0014] Preferably, a shielding structure is provided on the surface of the electroplating equipment. The shielding structure includes a limit frame, the surface of the limit frame is fixedly connected to the electroplating equipment, a connecting frame is slidably connected to the surface of the limit frame, and an acrylic plate is fixedly installed inside the connecting frame.

[0015] The effects achieved by the above components are as follows: By providing the shielding structure, when using the electroplating equipment to electroplate the circuit board, the electroplating solution can be shielded so that the electroplating solution will not splash onto the staff.

[0016] Preferably, a clamping pad is fixedly installed on the surface of the connecting frame. The clamping pad is an elastic pad, and a fixing plate is slidably connected to the surface of the clamping pad. The surface of the fixing plate is fixedly connected to the electroplating equipment.

[0017] The effects achieved by the above components are as follows: The clamping pad can squeeze the connecting frame by means of elastic force, achieving the effect of improving the stability of the connecting frame.

[0018] Preferably, two round rods are fixedly inserted inside the electroplating equipment, and two connecting holes are formed on the surface of the connecting frame. The size of the connecting holes is adapted to the size of the round rods.

[0019] The effects achieved by the above components are as follows: By means of the connecting holes, the connecting frame can be hung on the round rods, achieving the effect of storing the connecting frame and the acrylic plate.

[0020] In summary:

[0021] 1. In the present utility model, when electroplating circuit boards of different sizes, the circuit boards of different sizes are fixed between the support grooves of the support frame and the grooves on the clamping plate. At this time, the circuit boards can be electroplated. By setting the adjustment structure, circuit boards of different sizes can be limited in position, thus facilitating the staff to use the electroplating equipment to electroplate circuit boards of different sizes.

[0022] 2. In the present utility model, when the electroplating equipment needs to be used, first, the connecting frame is sleeved on the limiting frame. At this time, the cushion on the connecting frame squeezes the fixing plate by elastic force. At this time, the connecting frame is limited on the limiting frame. At this time, the connecting frame and the acrylic plate can block the sputtered electroplating solution. By setting the shielding structure, when using the electroplating equipment to electroplate the circuit board, the electroplating solution can be blocked so that the electroplating solution will not splash on the staff. Description of the Drawings

[0023] Figure 1 is a three-dimensional structural schematic diagram of the present utility model;

[0024] Figure 2 of the present utility model Figure 1 is an enlarged view of part A;

[0025] Figure 3 of the present utility model Figure 1 is a side view structural schematic diagram;

[0026] Figure 4 of the present utility model Figure 3 is an enlarged view of part B;

[0027] Figure 5 of the present utility model Figure 3 is an enlarged view of part C.

[0028] Legend: 1. Electroplating equipment; 2. Adjustment structure; 201. Support frame; 202. Support groove; 203. Clamping plate; 204. Groove; 205. Connecting block; 206. Lifting frame; 207. Limiting rod; 208. Spring; 209. Mounting plate; 210. Plug pin; 211. Fixed block; 212. Limiting pad; 213. Locking pin; 214. Auxiliary block; 3. Shielding structure; 31. Connecting frame; 32. Acrylic plate; 33. Limiting frame; 34. Cushion; 35. Fixing plate; 36. Round rod; 37. Connecting hole. Detailed Embodiment

[0029] Refer to Figure 1As shown in the figure, the present utility model provides a technical solution: an electroplating device for circuit board processing that is convenient to adjust, including an electroplating device 1. An adjustment structure 2 is provided on the surface of the electroplating device 1. By setting the adjustment structure 2, circuit boards of different sizes can be limited, facilitating the staff to use the electroplating device 1 to electroplate circuit boards of different sizes. A shielding structure 3 is provided on the surface of the electroplating device 1. By setting the shielding structure 3, when using the electroplating device 1 to electroplate a circuit board, the electroplating solution can be shielded, preventing the electroplating solution from splashing onto the staff.

[0030] Next, specifically describe the specific settings and functions of its adjustment structure 2 and shielding structure 3.

[0031] Refer to Figure 3 and Figure 4 As shown in the figure, in this implementation: The adjustment structure 2 includes two fixed blocks 211. The surfaces of the two fixed blocks 211 are fixedly connected to the electroplating device 1. A lifting frame 206 is slidably connected to the surface of the fixed block 211. A connecting block 205 is fixedly installed on the surface of the lifting frame 206. A limiting rod 207 is fixedly inserted into the connecting block 205. A support frame 201 is fixedly installed at the lower ends of the two limiting rods 207. A number of support grooves 202 are evenly formed on the surface of the support frame 201. A clamping plate 203 is slidably sleeved on the arc surface of the two limiting rods 207. Two grooves 204 are formed on the surface of the clamping plate 203. An installation plate 209 is slidably sleeved on the arc surface of the limiting rod 207. A plug pin 210 is threadedly connected inside the installation plate 209. Springs 208 are sleeved on the arc surfaces of the two limiting rods 207. The two ends of the spring 208 are respectively fixedly connected to the connecting block 205 and the installation plate 209. The spring 208 drives the installation plate 209 to slide downward by means of elastic force. While the installation plate 209 slides, it drives the clamping plate 203 to slide, achieving the effect of driving the clamping plate 203 to slide. A clamping pin 213 is threadedly connected inside each of the two lifting frames 206. An auxiliary block 214 is fixedly installed on the surface of the clamping pin 213. By rotating the auxiliary block 214, the clamping pin 213 rotates while the auxiliary block 214 rotates. The clamping pin 213 moves in the direction close to the fixed block 211 by means of the thread. After the clamping pin 213 moves a certain distance, the surface of the clamping pin 213 presses against the fixed block 211. At this time, the fixed block 211 and the lifting frame 206 are fixed, achieving the effect of fixing the lifting frame 206 and the fixed block 211. Two limiting pads 212 are fixedly installed on the surface of the electroplating device 1. The surface of the limiting pad 212 abuts against the clamping pin 213. The limiting pad 212 can prevent the clamping pin 213 from abutting against the electroplating device 1, facilitating the staff to rotate the clamping pin 213.

[0032] Refer to Figure 2 and Figure 5As shown in the figure, specifically, the shielding structure 3 includes a limit frame 33. The surface of the limit frame 33 is fixedly connected to the electroplating device 1. A connecting frame 31 is slidably connected to the surface of the limit frame 33. An acrylic plate 32 is fixedly installed inside the connecting frame 31. A cushion pad 34 is fixedly installed on the surface of the connecting frame 31. The cushion pad 34 is an elastic pad. A fixing plate 35 is slidably connected to the surface of the cushion pad 34. The surface of the fixing plate 35 is fixedly connected to the electroplating device 1. The cushion pad 34 can squeeze the connecting frame 31 by means of elastic force, achieving the effect of improving the stability of the connecting frame 31. Two round rods 36 are fixedly inserted inside the electroplating device 1. Two connecting holes 37 are formed on the surface of the connecting frame 31. The size of the connecting hole 37 is adapted to the size of the round rod 36. The connecting frame 31 can be hung on the round rod 36 by means of the connecting hole 37, achieving the effect of storing the connecting frame 31 and the acrylic plate 32.

[0033] Working principle: When electroplating circuit boards of different sizes, first slide the clamping plate 203 upward. After the clamping plate 203 slides to the required height, stop sliding the clamping plate 203. Then place the circuit board on the support groove 202 of the support frame 201, and then release the clamping plate 203. At this time, the spring 208 drives the mounting plate 209 to slide downward by means of elastic force. While the mounting plate 209 slides, it drives the clamping plate 203 to slide. After the clamping plate 203 slides a certain distance, the groove 204 on the clamping plate 203 comes into contact with the circuit board. Then rotate the bolt 210. The bolt 210 moves in the direction close to the limit rod 207 by means of the thread. After the bolt 210 moves a certain distance, the surface of the bolt 210 squeezes the limit rod 207. At this time, the clamping plate 203 and the limit rod 207 are fixed, and the circuit board is also fixed. Then place the lifting frame 206 at the required height. Then rotate the auxiliary block 214. While the auxiliary block 214 rotates, it drives the locking pin 213 to rotate. The locking pin 213 moves in the direction close to the fixed block 211 by means of the thread. After the locking pin 213 moves a certain distance, the surface of the locking pin 213 squeezes the fixed block 211. At this time, the fixed block 211 and the lifting frame 206 are fixed. At this time, the circuit board is located in the electroplating solution, and at this time, the circuit board can be electroplated. By setting the adjustment structure 2, circuit boards of different sizes can be limited, so as to facilitate the staff to use the electroplating device 1 to electroplate circuit boards of different sizes.

[0034] When the electroplating device 1 needs to be used, first put the connecting frame 31 on the limit frame 33. At this time, the cushion pad 34 on the connecting frame 31 squeezes the fixing plate 35 by means of elastic force. At this time, the connecting frame 31 is limited on the limit frame 33. At this time, the connecting frame 31 and the acrylic plate 32 can shield the sputtered electroplating solution. By setting the shielding structure 3, when using the electroplating device 1 to electroplate the circuit board, the electroplating solution can be shielded so that the electroplating solution will not splash on the staff.

[0035] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

Claims

1. An electroplating device for circuit board processing that is convenient to adjust, comprising an electroplating equipment (1), characterized in that: The surface of the electroplating device (1) is provided with an adjusting structure (2). The adjusting structure (2) includes two fixing blocks (211). The surfaces of the two fixing blocks (211) are fixedly connected to the electroplating device (1). A lifting frame (206) is slidably connected to the surface of the fixing block (211). A connecting block (205) is fixedly installed on the surface of the lifting frame (206). A limiting rod (207) is fixedly inserted into the connecting block (205). The lower ends of the two limiting rods (207) are fixedly installed with a support frame (201). A plurality of support grooves (202) are evenly formed on the surface of the support frame (201). A clamping plate (203) is slidably sleeved on the arc surface of the two limiting rods (207). Two grooves (204) are formed on the surface of the clamping plate (203). An installation plate (209) is slidably sleeved on the arc surface of the limiting rod (207). A plug pin (210) is threadedly connected to the installation plate (209).

2. The electroplating device for circuit board processing that is conveniently adjustable according to claim 1, wherein: Springs (208) are sleeved on the arc surfaces of the two limiting rods (207). The two ends of the springs (208) are fixedly connected to the connecting block (205) and the installation plate (209) respectively.

3. The electroplating device for circuit board processing that is conveniently adjustable according to claim 1, wherein: Two clamping pins (213) are threadedly connected to the interiors of the two lifting frames (206). An auxiliary block (214) is fixedly installed on the surface of the clamping pin (213).

4. The electroplating device for circuit board processing that is conveniently adjustable according to claim 3, characterized in that: Two limiting pads (212) are fixedly installed on the surface of the electroplating device (1). The surface of the limiting pad (212) abuts against the clamping pin (213).

5. The electroplating device for circuit board processing that is conveniently adjustable according to claim 1, characterized in that: The surface of the electroplating device (1) is provided with a shielding structure (3). The shielding structure (3) includes a limiting frame (33). The surface of the limiting frame (33) is fixedly connected to the electroplating device (1). A connecting frame (31) is slidably connected to the surface of the limiting frame (33). An acrylic plate (32) is fixedly installed in the connecting frame (31).

6. The electroplating device for circuit board processing that is conveniently adjustable according to claim 5, characterized in that: A clamping pad (34) is fixedly installed on the surface of the connecting frame (31). The clamping pad (34) is an elastic pad. A fixing plate (35) is slidably connected to the surface of the clamping pad (34). The surface of the fixing plate (35) is fixedly connected to the electroplating device (1).

7. The electroplating device for circuit board processing that is conveniently adjustable according to claim 5, characterized in that: Two round rods (36) are fixedly inserted into the electroplating device (1). Two connecting holes (37) are formed on the surface of the connecting frame (31). The size of the connecting hole (37) is adapted to the size of the round rod (36).

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