Chip bump self-checking mechanism

Abstract

The utility model relates to the technical field of chip self-checking equipment, in particular to a chip bump self-checking mechanism. According to the technical scheme, the device comprises a base, and a set of sliding rails are fixedly arranged on the upper surface of the base; the detection table is arranged on the sliding rail in a sliding mode, and a positioning assembly used for positioning chips of different models and sizes at the same time is fixedly arranged on the upper surface of the detection table; the supporting frame is fixedly arranged on the upper surface of the base and used for supporting, a first air cylinder is fixedly installed at the upper end of the supporting frame, and the output end of the first air cylinder penetrates through the supporting frame and extends to be connected with a supporting plate; the self-inspection module is fixedly arranged on the bottom surface of the supporting plate and is used for self-inspection of chip bumps; and the microscope is arranged on one side of the supporting plate and is used for conveniently observing the chip. According to the utility model, chips with different specifications and sizes can be positioned at the same time, and the chips can be transmitted for self-inspection, so that the self-inspection efficiency of the chips is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip self-checking equipment, in particular to a chip bump self-checking mechanism. Background Art

[0002] Chip bumps are the connection points between the chip and the substrate in BGA packaging technology. BGA packaging technology is a high-density packaging technology used to package the chip on the substrate. Chip bumps are usually made of metal materials such as copper, tin or gold, and they are connected to the metal pins or pads on the substrate by soldering. The number and arrangement of chip bumps depend on the function and packaging requirements of the chip. After the soldering of the chip bumps is completed, self-checking can check whether the connection between the chip bumps and the substrate is good, and whether there are soldering defects such as false soldering, short circuit or open circuit, etc. If soldering defects are found, they can be repaired or replaced in time to avoid failures during use.

[0003] The existing chip bump self-checking mechanism positions and transports the chip by setting a sliding positioning seat at the bottom, so as to improve the detection efficiency. However, due to the different specifications and sizes of the chips, different adjustments and adaptations are required for the positioning seat, resulting in that the positioning seat cannot quickly and accurately adapt to chips of different specifications. During the self-checking process of the chip, it can only be positioned and transported for self-checking one by one, which will reduce the efficiency of chip bump self-checking.

[0004] Therefore, the utility model proposes a chip bump self-checking mechanism. Content of the Utility Model

[0005] The purpose of the utility model is to solve the problem that the positioning seat set at the bottom of the chip bump self-checking machine in the background art is not convenient for positioning and transporting chips with different specifications and sizes, and can only be transported for self-checking one by one, thus reducing the chip self-checking efficiency, and to propose a chip bump self-checking mechanism.

[0006] The technical solution of the utility model: A chip bump self-checking mechanism, comprising: a base, on the upper surface of which a group of slide rails are fixedly arranged; a detection table slidably arranged on the slide rails, on the upper surface of which a positioning component for simultaneously positioning chips of different models and sizes is fixedly arranged; a support frame fixedly arranged on the upper surface of the base for support, at the upper end of which a first cylinder is fixedly installed, and the output end of the first cylinder penetrates through the support frame and extends to be connected with a support plate; a self-checking component fixedly arranged on the bottom surface of the support plate for self-checking chip bumps; and a microscope arranged on one side of the support plate for conveniently observing the chip.

[0007] Optionally, the positioning component includes a loading platform. A plurality of placement grooves are formed on the upper surface of the loading platform. Two sliding grooves are formed on one side of the loading platform. A plurality of guide grooves are respectively formed inside the sliding grooves. Guide rods are respectively movably arranged inside the sliding grooves. One end of each guide rod is fixedly connected to a handle. A plurality of guide blocks are fixedly sleeved on the outer wall of each guide rod, and the guide blocks are slidably arranged in the guide grooves. A first spring is sleeved on the outer wall of each guide rod. One end of the first spring is fixedly connected to the inner wall of the sliding groove, and the other end of the first spring is fixedly connected to the guide block. A fixed sleeve is fixedly sleeved on the outer wall of each guide rod. A connecting rod is fixedly arranged on the outer wall of the fixed sleeve. A smooth rod passes through the upper end of the connecting rod movably. A limiting ring is fixedly sleeved on the outer wall of the smooth rod. A second spring is sleeved on the outer wall of the smooth rod. One end of the second spring is fixedly connected to the inner wall of the sliding groove, and the other end of the second spring is fixedly connected to the limiting ring. One end of the smooth rod is fixedly connected to a positioning block, and the positioning block is located inside the placement groove.

[0008] Optionally, the self-checking component includes a fixed block. An installation groove is formed on the bottom surface of the fixed block. A pressure sensor is fixedly arranged on the inner wall of the installation groove. A first laser emitter is fixedly arranged on one side of the inner wall of the installation groove. A first laser receiver is fixedly arranged on the opposite side of the first laser emitter. A second laser emitter is fixedly arranged on the other side of the inner wall of the installation groove. A second laser receiver is fixedly arranged on the opposite side of the second laser emitter.

[0009] Optionally, one end of the support frame is rotatably provided with a threaded rod. A clamping block is threadedly sleeved on the outer wall of the threaded rod. The clamping block is movably clamped with the support frame. One side of the clamping block is fixedly connected to a connecting piece. One end of the connecting piece is fixedly connected to the microscope.

[0010] Optionally, a chute is formed on the upper surface of the slide rail. A group of sliders are respectively slidably arranged inside the chute. The upper ends of the sliders are fixedly connected to the bottom surface of the detection table.

[0011] Optionally, a groove is formed on the upper surface of the base. A second cylinder is fixedly installed inside the groove. One side of the bottom surface of the detection table is fixedly installed with a connecting block, and the connecting block is fixedly connected to the output end of the chute.

[0012] Optionally, a guiding groove is formed on one side of the support frame. A guiding block is slidably arranged inside the guiding groove. One end of the guiding block is fixedly connected to the support plate.

[0013] Optionally, the chute, the slider, the guiding groove and the guiding block are respectively arranged in a "convex" shape structure.

[0014] Compared with the prior art, the utility model has the following beneficial technical effects:

[0015] By manually pulling the handle in the present utility model, the handle drives the guide rod to horizontally move in the guide groove at the same time. The guide groove drives the guide block to push the first spring to contract. At the same time, the guide groove drives the optical rod to horizontally move through the fixed sleeve and the connecting rod. The optical rod drives the positioning block to horizontally slide on the loading platform, so as to be able to position chips with different specifications and sizes at the same time, thereby improving the efficiency of chip self-checking;

[0016] Furthermore, in the present utility model, the first air cylinder pushes the self-checking component to move vertically downward, so that the installation groove is sleeved on the outer wall of the loading platform, and the first laser emitter and the second laser emitter emit rays in the X direction and the Y direction on the horizontal plane to scan the chip bump plane. Then, the first laser receiver and the second laser receiver receive the rays in the x direction and the Y direction, so as to conveniently detect the stability of the chip bump connection and form coordinate points, accurately position the unstable points, facilitate the processing of the unstable bumps of the chip connection, and eliminate the need for manual detection, thereby improving the efficiency and accuracy of chip bump self-checking;

[0017] Even further, in the present utility model, through the first air cylinder, the fixed block and the pressure sensor, the output end of the first air cylinder drives the fixed block to move vertically downward, and the fixed block drives the pressure sensor to move vertically downward to closely adhere to the upper surface of the chip bump, so as to quickly detect whether the chip bump is missing, thereby further improving the detection efficiency of the chip bump. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A structural schematic diagram of a chip bump self-checking mechanism of the present utility model is given;

[0019] Figure 2 The present utility model is given Figure 1 The internal sectional structural schematic diagram in;

[0020] Figure 3 The present utility model is given Figure 1 The internal sectional structural schematic diagram of the positioning component in;

[0021] Figure 4 The present utility model is given Figure 3 The partial structural schematic diagram of the positioning component in.

[0022] REFERENCE SIGNS:

[0023] 1. Base; 2. Slide rail; 3. Detection table;

[0024] 4. Positioning component; 401. Carriage; 402. Placement groove; 403. Sliding groove; 404. Guide groove; 405. Guide rod; 406. Handle; 407. Guide block; 408. First spring; 409. Fixed sleeve; 410. Connecting rod; 411. Optical rod; 412. Limiting ring; 413. Second spring; 414. Positioning block;

[0025] 5. Support frame; 6. First cylinder; 7. Support plate;

[0026] 8. Self-check component; 81. Fixed block; 82. Installation groove; 83. Pressure sensor; 84. First laser emitter; 85. First laser receiver; 86. Second laser emitter; 87. Second laser receiver;

[0027] 9. Microscope; 10. Threaded rod; 11. Clamping block; 12. Connector; 13. Chute; 14. Slide block; 15. Groove; 16. Second cylinder; 17. Connecting block; 18. Guide groove; 19. Guide block. Detailed implementation manners

[0028] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0029] For the convenience of understanding the present invention, the present invention will be described more comprehensively below with reference to the relevant accompanying drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0030] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0031] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this utility model belongs. The terms used in the specification of this utility model herein are for the purpose of describing specific embodiments only and are not intended to limit this utility model. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0032] Embodiment

[0033] As Figure 1 And Figure 2 As shown, a chip bump self-checking mechanism proposed by this utility model includes: a base 1, and a rubber pad is provided at the bottom of the base 1 to make the placement of the base 1 more stable. A set of slide rails 2 are fixedly arranged on the upper surface of the base 1, and the slide rails 2 are symmetrically arranged; a detection table 3 slidably arranged on the slide rails 2 is convenient for guiding the slide rails 2 and making its movement more stable. A positioning component 4 for placing the chip is fixedly arranged on the upper surface of the detection table 3; a support frame 5 fixedly arranged on the upper surface of the base 1 for support, and the support frame 5 is arranged in an "L" shape structure with stable support. A first cylinder 6 is fixedly installed at the upper end of the support frame 5, and the output end of the first cylinder 6 penetrates through the support frame 5 and extends to be connected with a support plate 7; a self-checking component 8 fixedly arranged on the bottom surface of the support plate 7 for automatically detecting the chip bumps, and the self-checking component 8 is located above the positioning component 4; a microscope 9 fixedly installed on one side of the support plate 7 for conveniently observing the chip, and the microscope 9 is located on one side of the self-checking component 8. The microscope 9 is a digital microscope, which can capture the observed object as an image through a digital camera for storage, facilitating the storage of pictures of the problem areas in detecting the chip bumps and facilitating manual verification.

[0034] As Figure 3 And Figure 4As shown, the positioning component 4 includes a stage 401. A plurality of placement grooves 402 are formed on the upper surface of the stage 401, and the plurality of placement grooves 402 are equidistantly arranged. Two sliding grooves 403 are formed on one side of the stage 401. A plurality of guide grooves 404 are respectively formed inside the sliding grooves 403. Guide rods 405 are respectively movably arranged inside the sliding grooves 403. One end of each guide rod 405 is fixedly connected to a handle 406, which is convenient for manual pulling, so as to facilitate the clamping and positioning of the chip. A plurality of guide blocks 407 are fixedly sleeved on the outer wall of the guide rod 405, and the guide blocks 407 are slidably arranged in the guide grooves 404, which is convenient for guiding and positioning the guide blocks 407 and improving the stability of movement. A first spring 408 is sleeved on the outer wall of the guide rod 405. One end of the first spring 408 is fixedly connected to the inner wall of the sliding groove 403, and the other end of the first spring 408 is fixedly connected to the guide block 407, which is convenient for resetting the guide rod 405. A fixed sleeve 409 is fixedly sleeved on the outer wall of the guide rod 405. A connecting rod 410 is fixedly arranged on the outer wall of the fixed sleeve 409. A polished rod 411 movably penetrates through the upper end of the connecting rod 410, and a fixed block is fixedly arranged at one end of the polished rod 411 for limiting the connecting rod 410. A limiting ring 412 is fixedly sleeved on the outer wall of the polished rod 411. A second spring 413 is sleeved on the outer wall of the polished rod 411. One end of the second spring 413 is fixedly connected to the inner wall of the sliding groove 403, and the other end of the second spring 413 is fixedly connected to the limiting ring 412, which can apply a thrust to the chip for positioning. One end of the polished rod 411 is fixedly connected to a positioning block 414, and the positioning block 414 is located inside the placement groove 402. A rubber pad is arranged on one side of the polished rod 411 to avoid scratching the side of the chip, thereby protecting the chip.

[0035] As Figure 2As shown in the figure, the self-checking component 8 includes a fixed block 81, and the upper surface of the fixed block 81 is fixedly connected to the output end of the first cylinder 6, which is convenient for driving it to move vertically up and down. An installation groove 82 is opened on the bottom surface of the fixed block 81, and the area of the installation groove 82 is larger than the area of the positioning component 4, which can completely sleeve the positioning component 4. A pressure sensor 83 is fixedly arranged on the inner wall of the installation groove 82, and the pressure sensor 83 converts the pressure into an electrical signal by receiving the pressure, and then converts the electrical signal into a coordinate signal through a computer, so as to conveniently detect the chip bumps. On one side of the inner wall of the installation groove 82, a first laser emitter 84 is fixedly arranged, and a first laser receiver 85 is fixedly arranged on the opposite side of the first laser emitter 84. On the other side of the inner wall of the installation groove 82, a second laser emitter 86 is fixedly arranged, and a second laser receiver 87 is fixedly arranged on the opposite side of the second laser emitter 86. It can form rays in the X and Y directions through the first laser emitter 84 and the second laser emitter 86 on the horizontal plane, and the first laser emitter 84 and the second laser emitter 86 are not located on the same horizontal plane to avoid mutual influence of the laser reflected by the bumps. Then, the rays are received by the first laser receiver 85 and the second laser receiver 87, and by connecting with the computer, the coordinate points with problems in detecting the chip bumps can be conveniently obtained, thereby improving the accuracy of chip bump detection.

[0036] Further, one end of the support frame 5 is rotatably provided with a threaded rod 10, and a hand-turning cap is fixedly arranged at one end of the threaded rod 10 for facilitating the rotation of the threaded rod 10. A clamping block 11 is threadedly sleeved on the outer wall of the threaded rod 10, and the clamping block 11 is arranged in a "C" shape, which is convenient for the clamping block 11 to be movably clamped with the support frame 5. One side of the clamping block 11 is fixedly connected with a connecting piece 12, and one end of the connecting piece 12 is fixedly connected with the microscope 9, which is convenient for adjusting the horizontal observation position of the microscope 9.

[0037] Secondly, a chute 13 is opened on the upper surface of the slide rail 2, and a group of sliders 14 are respectively slidably arranged inside the chute 13. The upper ends of the sliders 14 are fixedly connected to the bottom surface of the detection table 3, which can guide and limit the detection table 3 and make its movement more stable.

[0038] Furthermore, a groove 15 is opened on the upper surface of the base 1, and a second cylinder 16 is fixedly installed inside the groove 15. One side of the bottom surface of the detection table 3 is fixedly installed with a connecting block 17, and the connecting block 17 is fixedly connected to the output end of the chute 13, which can automatically push the chip for transmission detection and improve the efficiency of chip bump detection.

[0039] In addition, a guiding groove 18 is opened on one side of the support frame 5, and a guiding block 19 is slidably arranged inside the guiding groove 18. One end of the guiding block 19 is fixedly connected to the support plate 7, which is convenient for guiding the support plate 7 and making its movement in the vertical direction more stable.

[0040] Finally, the sliding groove 13, the sliding block 14, the guiding groove 18 and the guiding block 19 are respectively arranged in a "convex" shape structure, and can be clamped with each other, making their connection and sliding more stable.

[0041] The working principle of this embodiment is as follows: manually pull the handle 406, the handle 406 drives the guide rod 405 to horizontally slide in the sliding groove 403, the guide rod 405 drives the guide block 407 to slide in the guide groove 404, the guide block 407 pushes the first spring 408 to contract during the sliding process, and at the same time the guide rod 405 drives the fixed sleeve 409 to horizontally move, the fixed sleeve 409 drives the connecting rod 410 to horizontally move, the connecting rod 410 drives the optical rod 411 to horizontally slide through the fixing block at one end of the optical rod 411, the optical rod 411 drives the positioning block 414 to horizontally slide in the placement groove 402, then place chips of different specifications in the placement groove 402, and after the placement is completed, gently release the handle 406. The elastic force of the first spring 408 pushes the guide block 407 to horizontally move in the guide groove 404, so that the guide block 407 drives the guide rod 405 to reset, the guide rod 405 drives the fixed sleeve 409 to reset, the fixed sleeve 409 pushes the second spring 413 through the connecting rod 410, and the second spring 413 pushes the limiting ring 412 to horizontally move through the elastic force, the limiting ring 412 drives the optical rod 411 to reset, and the optical rod 411 drives the positioning block 414 to clamp and position the chip. When contacting the chip, through the contraction of the second spring 413, the positioning block 414 stably clamps chips of different specifications, avoiding damaging the chip due to excessive pressure.

[0042] After that, start the second cylinder 16. The output end of the second cylinder 16 drives the connecting block 17 to horizontally slide in the groove 15. The connecting block 17 drives the detection table 3 to horizontally move. The detection table 3 drives the bottom sliding block 14 to move in the groove 15, making the horizontal movement of the detection table 3 more stable. At the same time, the detection table 3 drives the positioning assembly 4 to horizontally move, and the positioning assembly 4 drives the chip in the guide groove 404 to horizontally move to directly below the installation groove 82, eliminating the need for manual transmission and detection, and reducing the labor intensity of manual detection.

[0043] Further, start the first cylinder 6. The output end of the first cylinder 6 drives the support plate 7 to move vertically downward. The support plate 7 drives the guide block 19 to slide vertically downward in the guide groove 18, improving the stability of the vertical downward movement of the support plate 7. At the same time, the support plate 7 drives the fixed block 81 to move vertically downward. During the vertical downward movement of the fixed block 81, start the first laser emitter 84 and the second laser emitter 86 simultaneously, so that the first laser emitter 84 and the second laser emitter 86 emit rays in the X direction and Y direction on the horizontal plane. During the vertical downward movement of the fixed block 81, the X-direction ray emitted by the first laser emitter 84 first contacts the bump on the chip surface. When there is an unstable connection of a bump higher than other bumps, it will block the X-direction ray emitted by the first laser emitter 84, causing the first laser receiver 85 to be unable to receive the X-direction ray, thereby obtaining the X-direction coordinate on the horizontal plane.

[0044] Furthermore, during the continuous vertical downward movement of the fixed block 81, make the Y-direction ray emitted by the second laser emitter 86 contact the bump on the chip surface. When there is an unstable connection of a bump higher than other bumps, it also blocks the Y-direction ray emitted by the second laser emitter 86, causing the second laser receiver 87 to be unable to receive the Y-direction ray, thereby obtaining the Y-direction coordinate on the horizontal plane, and simultaneously obtaining the horizontal plane coordinate points of multiple unstable connection points of the chip bumps, which is convenient for processing the unstable connection points of the chip.

[0045] In addition, during the vertical downward movement of the fixed block 81, make the pressure sensor 83 inside the installation groove 82 move vertically downward. The detection bottom surface of the pressure sensor 83 contacts the horizontal plane of the chip bump. Through the test of the contact pressure, it can quickly detect whether there are missing chip bumps of multiple different specifications, thereby improving the rapid detection of the chip coordinates and enhancing the detection efficiency.

[0046] Finally, when there is a problem with the chip bump, start the second cylinder 16 again. The output end of the second cylinder 16 pushes the detection table 3 to move horizontally, so that the chip in the positioning assembly 4 on the detection table 3 moves to directly below the microscope 9. Manually rotate the threaded rod 10 to drive the block 11 to slide horizontally on one side of the support plate 7. The block 11 drives the connecting piece 12 to move horizontally, and the connecting piece 12 drives the microscope 9 to move horizontally, thereby adjusting the observation position of the microscope 9. Then start the first cylinder 6 again. The first cylinder 6 pushes the microscope 9 on the support plate 7 to move vertically downward, thereby converting the accurate position of the chip bump into a picture, which is convenient for manual observation and processing, and improving the detection efficiency and accuracy.

[0047] The above specific embodiments are only several alternative embodiments of the present invention. Based on the technical solution of the present invention and the relevant revelations of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.

Claims

1. A chip bump self-checking mechanism, characterized in that Including: A base (1), on the upper surface of which a set of slide rails (2) are fixedly arranged; A detection table (3) slidably arranged on the slide rails (2), on the upper surface of which a positioning component (4) for simultaneously positioning chips of different models and sizes is fixedly arranged; A support frame (5) fixedly arranged on the upper surface of the base (1) for support, at the upper end of which a first cylinder (6) is fixedly installed, and the output end of the first cylinder (6) penetrates through the support frame (5) and extends to be connected with a support plate (7); A self-inspection component (8) fixedly arranged on the bottom surface of the support plate (7) for self-inspecting the bumps of the chips; A microscope (9) arranged on one side of the support plate (7) for facilitating the observation of the chips.

2. The chip bump self-checking mechanism according to claim 1, wherein: The positioning component (4) includes a carrier table (401), on the upper surface of which a plurality of placement grooves (402) are formed, on one side of the carrier table (401) two sliding grooves (403) are formed, in the inner parts of the sliding grooves (403) a plurality of guide grooves (404) are respectively formed, in the inner parts of the sliding grooves (403) guide rods (405) are respectively movably arranged, one end of each guide rod (405) is fixedly connected with a handle (406), a plurality of guide blocks (407) are fixedly sleeved on the outer walls of the guide rods (405), and the guide blocks (407) are slidably arranged in the guide grooves (404), a first spring (408) is sleeved on the outer wall of each guide rod (405), one end of the first spring (408) is fixedly connected with the inner wall of the sliding groove (403), the other end of the first spring (408) is fixedly connected with the guide block (407), a fixed sleeve (409) is fixedly sleeved on the outer wall of each guide rod (405), a connecting rod (410) is fixedly arranged on the outer wall of the fixed sleeve (409), a light rod (411) movably penetrates through the upper end of the connecting rod (410), a limiting ring (412) is fixedly sleeved on the outer wall of the light rod (411), a second spring (413) is sleeved on the outer wall of the light rod (411), one end of the second spring (413) is fixedly connected with the inner wall of the sliding groove (403), the other end of the second spring (413) is fixedly connected with the limiting ring (412), and one end of the light rod (411) is fixedly connected with a positioning block (414), and the positioning block (414) is located inside the placement groove (402).

3. The chip bump self-checking mechanism according to claim 1, wherein: The self-inspection component (8) includes a fixed block (81), on the bottom surface of which an installation groove (82) is formed, on the inner wall of the installation groove (82) a pressure sensor (83) is fixedly arranged, on one side of the inner wall of the installation groove (82) a first laser emitter (84) is fixedly arranged, on the opposite side of the first laser emitter (84) a first laser receiver (85) is fixedly arranged, on the other side of the inner wall of the installation groove (82) a second laser emitter (86) is fixedly arranged, and on the opposite side of the second laser emitter (86) a second laser receiver (87) is fixedly arranged.

4. The chip bump self-checking mechanism according to claim 1, characterized in that: One end of the support frame (5) is rotatably provided with a threaded rod (10). The outer wall of the threaded rod (10) is threadedly sleeved with a clamping block (11). The clamping block (11) is movably clamped with the support frame (5). One side of the clamping block (11) is fixedly connected with a connecting piece (12). One end of the connecting piece (12) is fixedly connected with the microscope (9).

5. The chip bump self-checking mechanism according to claim 1, characterized in that: A sliding groove (13) is formed in the upper surface of the sliding rail (2). A group of sliding blocks (14) are respectively slidably arranged in the sliding groove (13). The upper ends of the sliding blocks (14) are fixedly connected with the bottom surface of the detection table (3).

6. The self-checking mechanism for chip bumps according to claim 1, characterized in that: A groove (15) is formed in the upper surface of the base (1). A second air cylinder (16) is fixedly installed inside the groove (15). One side of the bottom surface of the detection table (3) is fixedly installed with a connecting block (17). The connecting block (17) is fixedly connected with the output end of the sliding groove (13).

7. A chip bump self-checking mechanism according to claim 6, characterized in that: A guiding groove (18) is formed in one side of the support frame (5). A guiding block (19) is slidably arranged inside the guiding groove (18). One end of the guiding block (19) is fixedly connected with the support plate (7).

8. The self-checking mechanism for chip bumps according to claim 7, wherein: The sliding groove (13), the sliding block (14), the guiding groove (18) and the guiding block (19) are respectively arranged in a "convex" shape structure.

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