High-adhesion conductive film

Abstract

The utility model provides a high-adhesion conductive thin film, which comprises an optical film layer, and the optical film layer comprises a conductive plating layer, a dyeing plating layer, a transition plating layer and a base material layer which are stacked in sequence, or the optical film layer comprises a conductive plating layer, a dyeing plating layer and a base material layer which are stacked in sequence. According to the high-adhesion conductive film provided by the invention, the interlayer adhesion is improved, so that the stability of the high-adhesion conductive film in subsequent processing and using processes is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive films, and particularly relates to a highly adherent conductive film. Background Art

[0002] At present, the interlayer adhesion in the conductive film is poor, resulting in poor stability of the conductive film during subsequent processing and use, thus affecting the quality stability of the conductive film. Content of the Utility Model

[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a highly adherent conductive film that is conducive to improving the interlayer adhesion, thereby facilitating the increase in the stability of the highly adherent conductive film during subsequent processing and use.

[0004] To solve the above problems, the technical solutions adopted by the utility model are as follows:

[0005] A highly adherent conductive film includes an optical film layer, and the optical film layer includes a conductive coating layer, a dyeing coating layer, a transition coating layer, and a substrate layer stacked in sequence, or the optical film layer includes a conductive coating layer, a dyeing coating layer, and a substrate layer stacked in sequence.

[0006] In some possible implementation manners, the dyeing coating layer is a stainless steel layer.

[0007] In some possible implementation manners, the conductive coating layer is one of an ITO layer, a ZTO layer, a polymer conductive layer, a nano silver conductive layer, or a graphene conductive layer.

[0008] In some possible implementation manners, the substrate layer is one of a polyester substrate layer, a polycarbonate substrate layer, or a polyethylene substrate layer.

[0009] In some possible implementation manners, the optical film layer includes a conductive coating layer, a dyeing coating layer, a transition coating layer, and a substrate layer stacked in sequence. The thickness of the conductive coating layer is 50 - 100 nm, the thickness of the dyeing coating layer is 1 - 10 μm, the thickness of the transition coating layer is 0.1 - 1 μm, and the thickness of the substrate layer is 50 - 200 μm.

[0010] In some possible implementation manners, the optical film layer includes a conductive coating layer, a dyeing coating layer, and a substrate layer stacked in sequence. The thickness of the conductive coating layer is 50 - 100 nm, the thickness of the dyeing coating layer is 1 - 10 μm, and the thickness of the substrate layer is 50 - 200 μm.

[0011] In some possible implementation manners, the transition coating layer is a SIO2 layer. Compared with the prior art, the beneficial effects of the utility model are as follows:

[0012] In the present application, the high-adhesion conductive film includes stacked functional coating layers, thereby improving the adhesion between two adjacent functional layers, which is beneficial to increasing the stability of the high-adhesion conductive film during subsequent processing and use.

[0013] The present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. Description of the Drawings

[0014] Figure 1 It is a schematic structural diagram of an optical film layer provided by an embodiment of the present application;

[0015] Figure 2 It is a schematic structural diagram of an optical film layer provided by another embodiment of the present application.

[0016] Explanation of the reference numerals in the drawings:

[0017] 10, 10' - optical film layer; 11 - conductive coating layer; 12 - dyeing coating layer; 13 - transition coating layer; 14 - substrate layer. Specific Embodiments

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0019] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there can also be an intermediate element. When an element is referred to as "disposed on" another element, it can be disposed on the other element or there can also be an intermediate element.

[0020] Embodiment 1:

[0021] An embodiment of the present application provides a high-adhesion conductive film, and the high-adhesion conductive film includes an optical film layer 10. Referring to Figure 1 , the optical film layer 10 includes a conductive coating layer 11, a dyeing coating layer 12, a transition coating layer 13, and a substrate layer 14 stacked in sequence. Specifically, during preparation, the transition coating layer 13 can be plated on the substrate layer 14, the dyeing coating layer 12 can be plated on the transition coating layer 13, and the conductive coating layer 11 can be plated on the dyeing coating layer 12.

[0022] In some embodiments, the dyed coating layer 12 is a stainless steel layer, so that the color system of the highly adherent conductive thin film can be controlled within the gray color system, which is beneficial to reducing the transmittance of the highly adherent conductive thin film to visible light, infrared rays and ultraviolet rays. Exemplarily, the stainless steel layer can be formed by physical vapor deposition, for example, by vacuum ion plating.

[0023] In some embodiments, the transition coating layer 13 is a SIO2 layer, which is beneficial to further increasing the adhesion between the stainless steel layer and the substrate layer 14. Exemplarily, the SIO2 layer can be formed by physical vapor deposition or chemical vapor deposition.

[0024] In some embodiments, the substrate layer 14 is one of a polyester substrate layer, a polycarbonate substrate layer or a polyethylene substrate layer.

[0025] In some embodiments, the conductive coating layer 11 is one of an ITO (abbreviation for indium tin oxide) layer, a ZTO (abbreviation for zinc tin oxide) layer, a polymer conductive layer, a nano silver conductive layer or a graphene conductive layer, which is beneficial to improving the conductive performance of the highly adherent conductive thin film. Exemplarily, the conductive coating layer can be plated by electron beam evaporation, physical vapor deposition, sputtering deposition or physical vapor deposition.

[0026] In some embodiments, the thickness of the conductive coating layer 11 is 50 - 100 nm, the thickness of the dyed coating layer 12 is 1 - 10 μm, the thickness of the transition coating layer 13 is 0.1 - 1 μm, and the thickness of the substrate layer 14 is 50 - 200 μm. Specifically, the thickness of the substrate layer 14 can be 150 - 200 μm. At this time, the visible light transmittance of the optical film layer 10 is less than 70%, the infrared transmittance of the optical film layer 10 is less than 70%, and the ultraviolet transmittance of the optical film layer 10 is less than 50%. Correspondingly, the haze value of the optical film layer 10 ≤ 2.0%. In some embodiments, the thickness of the substrate layer 14 can be 50 - 100 μm. At this time, the visible light transmittance of the optical film layer 10 is less than 60%, the infrared transmittance of the optical film layer 10 is less than 60%, and the ultraviolet transmittance of the optical film layer 10 is less than 60%. Correspondingly, the haze value of the optical film layer 10 ≤ 1.8%. In some embodiments, the thickness of the substrate layer 14 can be 10 - 50 μm. At this time, the visible light transmittance of the optical film layer 10 is less than 50%, the infrared transmittance of the optical film layer 10 is less than 50%, and the ultraviolet transmittance of the optical film layer 10 is less than 70%. Correspondingly, the haze value of the optical film layer 10 ≤ 1.5%. The wavelength of visible light is 400 - 760 nm, the wavelength of ultraviolet rays is 320 - 420 nm, and the wavelength of infrared rays is 0.76 - 1000 μm.

[0027] The above optical properties can be measured by an LS183 optical transmittance measuring instrument.

[0028] The ratio of the transmittance of the optical film layer 10 provided in the embodiment of the present application to visible light (wavelength: 400 - 760 nm) to the transmittance of the optical film layer 10 to ultraviolet light (wavelength: 320 - 420 nm) is 1.0 - 4.0.

[0029] The ratio of the transmittance of the optical film layer 10 to visible light (wavelength: 400 - 760 nm) to the transmittance of the optical film layer 10 to infrared light (wavelength: 950 nm) is 0.9 - 2.0.

[0030] Example 2:

[0031] The difference between the highly adherent conductive film of the present application and the highly adherent conductive film provided in Example 1 is that the optical film layer 10' includes a conductive coating layer 11, a dyeing coating layer 12, and a substrate layer 14 stacked in sequence.

[0032] In this embodiment, the visible light transmittance of the optical film layer 10' is lower than 63%, the infrared light transmittance of the optical film layer 10' is lower than 66%, and the ultraviolet light transmittance of the optical film layer 10' is lower than 50%. The haze value of the optical film layer 10' is 1.5% - 1.6%.

[0033] In the present application, the highly adherent conductive film includes stacked functional coating layers, so as to improve the adhesion between adjacent two functional layers, thereby facilitating the increase of the stability of the highly adherent conductive film during subsequent processing and use.

[0034] Furthermore, through the thickness setting of each functional layer, the transmittance of the optical film layer to visible light, ultraviolet light, and infrared light is significantly reduced to achieve the effects of light shielding and heat insulation.

[0035] The above embodiments are only the preferred embodiments of the present invention, and the scope of protection of the present invention cannot be limited thereby. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention belong to the scope of protection required by the present invention.

Claims

1. A highly adherent conductive film, characterized in that, It includes an optical film layer, and the optical film layer includes a conductive coating layer, a dyeing coating layer, a transition coating layer and a substrate layer which are laminated in sequence. The thickness of the conductive coating layer is 50 - 100 nm, the thickness of the dyeing coating layer is 1 - 10 μm, the thickness of the transition coating layer is 0.1 - 1 μm, and the thickness of the substrate layer is 50 - 200 μm; Or the optical film layer includes a conductive coating layer, a dyeing coating layer and a substrate layer which are laminated in sequence. The thickness of the conductive coating layer is 50 - 100 nm, the thickness of the dyeing coating layer is 1 - 10 μm, and the thickness of the substrate layer is 50 - 200 μm.

2. The highly adherent conductive film according to claim 1, wherein The dyeing coating layer is a stainless steel layer.

3. The highly adherent conductive film according to claim 1, wherein The conductive coating layer is one of an ITO layer, a ZTO layer, a polymer conductive layer, a nano silver conductive layer or a graphene conductive layer.

4. The highly adherent conductive thin film according to claim 1, wherein The substrate layer is one of a polyester substrate layer, a polycarbonate substrate layer or a polyethylene substrate layer.

5. The highly adherent conductive film according to claim 1, wherein, The transition coating layer is an SIO2 layer.

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