Pressure equalizing type air pressure crimping device

Abstract

The utility model belongs to the technical field of semiconductor packaging, and particularly relates to a pressure equalizing type air pressure crimping device, which comprises a pressure head unit, a driving unit and an upper die holder, the pressure head unit comprises a plurality of sub-pressure heads, and the working surfaces of the plurality of sub-pressure heads are spliced to form a pressure applying surface for applying pressure to a chip; the driving unit comprises a piston arranged in a sliding mode and a pressing rod arranged between the piston and the sub-pressing head and used for pressing the sub-pressing head downwards. A plurality of piston holes allowing the piston to slide and an air cavity communicated with the piston holes and used for driving the piston in the piston holes to move downwards during ventilation are formed in the upper die base. According to the utility model, the pressure head unit is split to form the plurality of sub-pressure heads, the working surfaces of the plurality of sub-pressure heads are spliced to form the pressure applying surface for applying pressure to the chip, and the pressure applying surface is split, so that the problem that the integral pressure applying surface of the integral pressure head is large in area and cannot apply pressure to the chip is solved. And the phenomenon that the pressing pressure of the integral pressing surface is not uniform due to the unevenness of the membrane material is avoided, and the packaging quality of the chip is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor packaging, and particularly relates to an equalizing air pressure pressing device. Background Art

[0002] When packaging a chip, the chip is usually placed on a carrier, and then a film material is covered on the chip to form a plastic sealing layer. A sintering cavity is formed under the film material, and the chip is located inside the sintering cavity. Then, the carrier is placed above a lower mold, and an upper mold is arranged above the film material. A pressing head in the upper mold moves downward and presses on the chip through the plastic sealing layer. The pressing head in the prior art is of an integral structure. Due to the existence of the plastic sealing layer, the surface of the chip is uneven, and the pressure is uneven when the integral pressing head presses down, affecting the consistency of the chip quality. Summary of the Utility Model

[0003] The technical problem to be solved by the utility model is: to solve the problem that the pressing head in the prior art is of an integral structure, and due to the existence of the plastic sealing layer, the surface of the chip is uneven, and the pressure is uneven when the integral pressing head presses down, affecting the consistency of the chip quality. Now, an equalizing air pressure pressing device is provided.

[0004] The technical solution adopted by the utility model to solve its technical problem is: an equalizing air pressure pressing device, comprising:

[0005] A pressing head unit, including a plurality of sub-pressing heads. The lower surface of each sub-pressing head is a working surface, and the working surfaces of the plurality of sub-pressing heads are combined to form a pressing surface for pressing the chip;

[0006] A driving unit, having a plurality of them, and each driving unit includes a piston slidably arranged and a pressing rod arranged between the piston and the sub-pressing head and used for pressing down the sub-pressing head;

[0007] And an upper mold base for installing the pressing head unit and the driving unit, which is internally provided with a plurality of piston holes for the piston to slide and an air cavity communicated with the plurality of piston holes and used for driving the piston in the piston hole to move downward when ventilated. Two adjacent piston holes are distributed in a vertically staggered manner.

[0008] Further, the upper mold base includes a cover plate, a first intermediate plate, a second intermediate plate and a bottom plate which are sequentially connected from top to bottom. Two adjacent piston holes are divided into an upper piston hole a and a lower piston hole b;

[0009] The cover plate and the first intermediate plate enclose to form the above-mentioned air cavity and the upper piston hole a, and the first intermediate plate and the second intermediate plate enclose to form the above-mentioned lower piston hole b.

[0010] Further, a heat insulation plate is arranged between the bottom plate and the second intermediate plate, and sliding grooves for the pressing rod to slide are arranged in the heat insulation plate and the second intermediate plate.

[0011] Further, a first seal is sleeved outside the piston, and a first seal cavity for installing the first seal is formed by enclosing between the cover plate and the first intermediate plate or between the first intermediate plate and the second intermediate plate.

[0012] Further, a second seal cavity is formed by enclosing between the cover plate and the first intermediate plate. The second seal cavity is located outside the air cavity, and a second seal is installed in the second seal cavity.

[0013] Further, there are several pressure rods in the same driving unit. The several pressure rods are distributed vertically, and the bottom of each pressure rod is set as a downward convex arc surface.

[0014] Further, the sub-punch head is in an "I" shape, which includes an upper connecting part, a lower connecting part and a neck located between the two. The bottom plate is provided with a perforation for the neck to pass through. The bottom of the bottom plate expands to form a lower receiving groove for accommodating the lower connecting part, and the bottom of the heat insulation plate is provided with an upper receiving groove for accommodating the upper connecting part.

[0015] Further, several pressure rods are correspondingly arranged at intervals on the same sub-punch head.

[0016] Further, a demolding unit is further included. The demolding unit includes a separating rod that is slidably connected to the upper mold base and passes through the upper mold base downward, an elastic member sleeved outside the separating rod and used to drive the separating rod to move downward, and a separating plate fixed at the bottom of the separating rod and used to press the carrier for placing the chip so that the punch head unit is separated from the chip. The separating plate is provided with a perforation for the punch head unit to pass through, and the bottom plate is provided with a groove for the separating plate to be embedded.

[0017] Further, a sleeve is sleeved outside the pressure rod, and a fixing plate is arranged at the bottom of the upper receiving groove. The fixing plate is provided with a through hole for the pressure rod to pass through.

[0018] The beneficial effect of the present utility model is that the punch head unit of the present utility model is split into multiple sub-punch heads, and the working surfaces of the multiple sub-punch heads are spliced to form a pressing surface for pressing the chip. The pressing surface is a split type, which avoids the phenomenon of uneven downward pressing pressure of the integral pressing surface caused by the large area of the integral pressing surface of the integral punch head and the unevenness generated by the film material, and improves the packaging quality of the chip.

[0019] Other features and advantages of the present application will become clear through the following detailed description of the exemplary embodiments of the present application with reference to the accompanying drawings. Description of the Drawings

[0020] The following further describes the present utility model in conjunction with the drawings and embodiments.

[0021] Figure 1 is the three-dimensional structure diagram of the present utility model;

[0022] Figure 2 is the top view of the present utility model;

[0023] Figure 3 is Figure 2 the sectional view taken along the A-A direction in

[0024] Figure 4 is Figure 2 the sectional view taken along the B-B direction in

[0025] Figure 5 is Figure 2 the sectional view taken along the C-C direction in

[0026] Figure 6 is Figure 3 the sectional view of part D in

[0027] Figure 7 is the structural schematic diagram of the cooperation between the sub-punch and the driving unit;

[0028] In the figure:

[0029] 1. Punch unit; 101. Sub-punch; 1011. Upper connecting part; 1012. Lower connecting part; 1013. Neck;

[0030] 2. Driving unit; 201. Piston; 202. Pressure rod;

[0031] 3. Upper die base; 301. Piston hole; 301a. Upper piston hole; 301b. Lower piston hole; 302. Air cavity; 303. Cover plate; 304. First intermediate plate; 305. Second intermediate plate; 306. Bottom plate; 3061. Perforation; 3062. Lower accommodation groove; 3063. Groove; 307. Heat insulation plate; 3071. Upper accommodation groove; 308. First seal; 309. Second seal; 310. Sleeve; 311. Fixed plate;

[0032] 4. Demoulding unit; 401. Demoulding rod; 402. Elastic member; 403. Demoulding plate. Detailed implementation manners

[0033] Now, the present utility model will be further described in detail with reference to the accompanying drawings. These drawings are all simplified schematic diagrams, only illustrating the basic structure of the present utility model in a schematic manner. Therefore, they only show the components related to the present utility model. Directions and references (such as up, down, left, right, etc.) can only be used to assist in the description of the features in the drawings. Therefore, the following detailed implementation manners are not adopted in a restrictive sense, and the scope of the claimed subject matter is only defined by the appended claims and their equivalent forms.

[0034] As Figure 1 and Figure 2As shown, a pressure equalizing pneumatic crimping device is used to apply pressure to a chip on a vehicle. A film material covers the chip. The crimping device presses the chip through the film material and includes:

[0035] A punch unit 1, including a plurality of sub-punches 101. The lower surface of each sub-punch 101 is a working surface. The working surfaces of the plurality of sub-punches 101 are combined to form a pressure application surface to jointly apply pressure to the chip, and the adjacent two working surfaces are attached; in this embodiment, the number of punch units 1 corresponds one-to-one with the number of chips. Each punch unit 1 is used to apply pressure to its corresponding chip. As Figure 1 and Figure 2 shown, in this embodiment, there are three punch units 1 for applying pressure to three chips. The more the number of sub-punches 101 in each punch unit 1, the smaller the working surface of a single sub-punch 101, and the more uniform the force on the chip;

[0036] A driving unit 2, there are a plurality of them, and each driving unit 2 includes a piston 201 slidably arranged and a pressure rod 202 arranged between the piston 201 and the sub-punch 101 and used to press down the sub-punch 101;

[0037] And an upper die base 3 for installing the punch unit 1 and the driving unit 2. A plurality of piston holes 301 for the piston 201 to slide are opened inside it, and an air cavity 302 communicated with the plurality of piston holes 301 and used to drive the piston 201 in the piston hole 301 to move downward when ventilated. The adjacent two piston holes 301 are arranged in a vertical staggered manner, and the pistons 201 slidably arranged inside it are also arranged in a vertical staggered manner to save layout space;

[0038] First, place the chip on the vehicle and cover the chip with the film material. The film material is pressed by a pressure cover above (the chip, vehicle, film material, and pressure cover are not shown in the figure). Then, ventilate the air cavity 302. The gas evenly enters the plurality of piston holes 301 from the air cavity 302 and pushes the pistons 201 in each piston hole 301 to move downward synchronously. During the downward movement of the pistons 201, pressure is applied to the sub-punches 101 through the pressure rods 202. The plurality of sub-punches 101 jointly press the chip. The working surface of a single sub-punch 101 is small, and the unevenness generated by the film material covering the chip has little impact on it. Therefore, each sub-punch 101 applies the same pressure to the chip, and the entire chip is uniformly stressed; while the integral punch with an integral pressure application surface has a larger area, and the unevenness generated by the film material has a greater impact on it when the pressure application surface is pressed down, which will cause the downward pressure of the integral pressure application surface to be uneven, resulting in uneven stress on the chip.

[0039] In some examples, the upper die base 3 includes a cover plate 303, a first intermediate plate 304, a second intermediate plate 305, and a bottom plate 306 connected in sequence from top to bottom;

[0040] The piston hole 301 includes a large-diameter hole and a small-diameter hole that communicate with each other. Two adjacent piston holes 301 are divided into an upper piston hole 301a and a lower piston hole 301b. The large-diameter hole of the upper piston hole 301a is located above the large-diameter hole of the lower piston hole 301b, thus forming a staggered distribution structure.

[0041] The piston 201 includes a large-diameter section that mates with the large-diameter hole and a small-diameter section that mates with the small-diameter hole. Two adjacent pistons 201 are divided into an upper piston and a lower piston. The large-diameter section of the upper piston 201 is located above the large-diameter section of the lower piston 201.

[0042] The cover plate 303 and the first intermediate plate 304 enclose the air cavity 302 and the upper piston hole 301a. The first intermediate plate 304 and the second intermediate plate 305 enclose the lower piston hole 301b, as Figure 5 shown.

[0043] In some examples, a heat insulation plate 307 is provided between the bottom plate 306 and the second intermediate plate 305. The heat insulation plate 307 is made of a material with a low thermal conductivity coefficient and is used to isolate the heat generated by chip sintering. The heat insulation plate 307 and the second intermediate plate 305 are internally provided with a chute for the pressure rod 202 to slide, as Figure 3 shown.

[0044] In some examples, a first seal 308 is sleeved outside the piston 201. The first seal 308 can be, but is not limited to, an O-ring. A first seal cavity for installing the first seal 308 is formed by enclosing between the cover plate 303 and the first intermediate plate 304, or between the first intermediate plate 304 and the second intermediate plate 305. A retaining ring is provided between the first seal 308 and the piston 201. The retaining ring has a flange extending along its radial direction and is fixed in the first seal cavity through the flange.

[0045] In some examples, a second seal cavity is formed by enclosing between the cover plate 303 and the first intermediate plate 304. The second seal cavity is located outside the air cavity 302 and a second seal 309 is installed in the second seal cavity. The second seal 309 can be, but is not limited to, an O-ring. Through the second seal 309, the pressure relief caused by the leakage of the gas introduced into the air cavity 302 can be avoided.

[0046] In some examples, there are several pressure rods 202 in the same driving unit 2. The several pressure rods 202 are distributed vertically and the bottom of each pressure rod 202 is set as a downwardly convex arc surface to reduce the contact area between two adjacent pressure rods 202 or between the pressure rod 202 and the sub-punch 101, thereby further isolating heat transfer and making the seal in the piston hole 301 not easily age due to high temperature.

[0047] In some examples, as Figure 6 and Figure 7As shown, the sub-punch 101 is in the shape of a "work" character, which includes an upper connecting portion 1011, a lower connecting portion 1012 and a neck portion 1013 located between the two. Both the upper connecting portion 1011 and the lower connecting portion 1012 protrude from the neck portion 1013. The bottom plate 306 is provided with a perforation 3061 for the neck portion 1013 to pass through, and a lower receiving groove 3062 for accommodating the lower connecting portion 1012 is formed by expanding the bottom of the bottom plate 306. The bottom of the heat insulation plate 307 is provided with an upper receiving groove 3071 for accommodating the upper connecting portion 1011. In the initial state, due to the gravity of the sub-punch 101, its upper connecting portion 1011 abuts against the upper surface of the bottom plate 306. After ventilation, the piston 201 moves downward and presses the sub-punch 101 through the pressure rod 202, so that the upper connecting portion 1011 of the sub-punch 101 continuously fits with the upper surface of the bottom plate 306 to continuously press the chip. There is a gap between the piston 201 and the pressure rod 202, so as to further isolate the heat generated by chip sintering.

[0048] In some examples, a number of pressure rods 202 are correspondingly arranged on the same sub-punch 101 at intervals. The number thereof can be one, two, three or four, etc. In this embodiment, four pressure rods 202 are used to press a sub-punch 101 simultaneously.

[0049] In some examples, as Figure 4 shown, it further includes a demolding unit 4. The demolding unit 4 includes a separating rod 401 that is slidably connected to the upper die base 3 and penetrates downward through the upper die base 3, an elastic member 402 sleeved outside the separating rod 401 and used to drive the separating rod 401 to move downward, and a separating plate 403 fixed to the bottom of the separating rod 401 and used to press the carrier for placing the chip so that the punch unit 1 is separated from the chip. The separating plate 403 is provided with a perforation 3061 for the punch unit 1 to pass through, and the bottom plate 306 is provided with a groove 3063 for the separating plate 403 to be embedded. When the whole crimping device moves downward, the separating plate 403 first contacts the carrier to press the film material. During the continuous downward movement of the crimping device, the elastic member 402 stores energy until the punch unit 1 presses the chip. When the sintering is completed and the whole crimping device moves upward, the separating plate 403 continues to press the film material under the action of the elastic member 402, so that the upward moving punch unit 1 is first separated from the film material to prevent the two from sticking. Finally, during the continuous upward movement of the whole crimping device, the separating plate 403 is separated from the film material.

[0050] In some examples, as Figure 3 and Figure 6 shown, a sleeve 310 is sleeved outside the pressure rod 202. The sleeve 310 provides guidance for the pressure rod 202, and the bottom of the upper receiving groove 3071 is provided to prevent the sleeve 310 from falling. The fixing plate 311 is provided with a through hole for the pressure rod 202 to pass through.

[0051] Based on the inspiration of the ideal embodiments of the present utility model, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this utility model. The technical scope of this utility model is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A pressure equalizing pneumatic crimping device, characterized in that: Comprising: A punch unit (1), including a plurality of sub-punches (101), the lower surface of each sub-punch (101) being a working surface, and the working surfaces of the plurality of sub-punches (101) being joined together to form a pressing surface for pressing on the chip; A plurality of driving units (2), each driving unit (2) including a piston (201) slidably arranged and a pressure rod (202) arranged between the piston (201) and the sub-punch (101) and used for pressing down the sub-punch (101); And an upper die base (3) for installing the punch unit (1) and the driving units (2), with a plurality of piston holes (301) for the piston (201) to slide therein and an air chamber (302) communicated with the plurality of piston holes (301) and used for driving the piston (201) in the piston hole (301) to move downward when ventilated, and adjacent two piston holes (301) being distributed in a vertically staggered manner.

2. The equalizing pressure air pressure crimping device according to claim 1, wherein: The upper die base (3) includes a cover plate (303), a first intermediate plate (304), a second intermediate plate (305) and a bottom plate (306) connected in sequence from top to bottom, and adjacent two piston holes (301) are divided into an upper piston hole (301a) and a lower piston hole (301b); The cover plate (303) and the first intermediate plate (304) enclose to form the above-mentioned air chamber (302) and the upper piston hole (301a), and the first intermediate plate (304) and the second intermediate plate (305) enclose to form the above-mentioned lower piston hole (301b).

3. The equalizing pressure air pressure crimping device according to claim 2, characterized in that: A heat insulation plate (307) is arranged between the bottom plate (306) and the second intermediate plate (305), and a sliding groove for the pressure rod (202) to slide is provided inside the heat insulation plate (307) and the second intermediate plate (305).

4. The equalizing pressure air pressure crimping device according to claim 2, characterized in that: A first seal (308) is sleeved outside the piston (201), and a first seal cavity for installing the first seal (308) is enclosed between the cover plate (303) and the first intermediate plate (304), or between the first intermediate plate (304) and the second intermediate plate (305).

5. The equalizing pressure air pressure crimping device according to claim 2, characterized in that: A second seal cavity is enclosed between the cover plate (303) and the first intermediate plate (304), the second seal cavity is located outside the air chamber (302) and a second seal (309) is installed in the second seal cavity.

6. The equalizing pressure air pressure crimping device according to claim 1, characterized in that: There are several pressure rods (202) in the same driving unit (2), the several pressure rods (202) are distributed vertically and the bottom of each pressure rod (202) is set as a downwardly convex arc surface.

7. The equalizing pressure air pressure crimping device according to claim 3, characterized in that: The sub-punch (101) is in an "I" shape, including an upper connecting portion (1011), a lower connecting portion (1012) and a neck portion (1013) located between the two, the bottom plate (306) is provided with a through hole (3061) for the neck portion (1013) to pass through, the bottom of the bottom plate (306) expands to form a lower receiving groove (3062) for accommodating the lower connecting portion (1012), and the bottom of the heat insulation plate (307) is provided with an upper receiving groove (3071) for accommodating the upper connecting portion (1011).

8. The equalizing air pressure crimping device according to claim 1, wherein: Several pressure rods (202) are correspondingly arranged at intervals on the same sub-punch (101).

9. The equalizing air pressure crimping device according to claim 2, characterized in that: It further includes a demolding unit (4). The demolding unit (4) includes a separating rod (401) that is slidably connected to the upper die base (3) and passes downward through the upper die base (3), an elastic member (402) sleeved outside the separating rod (401) and used to drive the separating rod (401) to move downward, and a separating plate (403) fixed to the bottom of the separating rod (401) and used to press the carrier for placing the chip so that the pressing head unit (1) is separated from the chip. The separating plate (403) is provided with a through hole (3061) for the pressing head unit (1) to pass through, and the bottom plate (306) is provided with a groove (3063) for the separating plate (403) to be embedded in.

10. The equalizing pressure air pressure crimping device according to claim 7, characterized in that: A sleeve (310) is sleeved outside the pressing rod (202), and a fixing plate (311) is arranged at the bottom of the upper accommodating groove (3071). A through hole for the pressing rod (202) to pass through is opened on the fixing plate (311).

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