Embedded metal-based printed circuit board and electronic product

Abstract

The utility model discloses a printed circuit board with an embedded metal matrix and an electronic product, the printed circuit board comprises a first laminated board, the first laminated board comprises a first core board, a first insulating layer and a second core board which are laminated for the first time, the first core board is located above the first insulating layer, and the second core board is located below the first insulating layer; the first pressing plate is provided with a vertically-through groove, a metal base is placed in the groove, and the thickness of the metal base is larger than that of the first pressing plate; a second insulating layer is arranged above the first laminated plate, a first metal layer is arranged above the second insulating layer, a third insulating layer is arranged below the first laminated plate, and a second metal layer is arranged below the third insulating layer; and the first metal layer, the second insulating layer, the first laminated plate, the third insulating layer and the second metal layer are laminated for the second time to form the printed circuit board. Therefore, the problems that glue overflows on the surface of the metal base after the printed circuit board is pressed and the metal base is easy to deflect are solved.

Description

Technical Field

[0001] The utility model relates to the field of circuit boards, in particular to a printed circuit board with an embedded metal base and an electronic product. Background Art

[0002] With the continuous development of printed circuit boards towards miniaturization, multi-function, high integration and high power, the requirements for the heat dissipation performance of PCB boards are also getting higher and higher. Embedding a metal base in the PCB will greatly help the PCB board or components to dissipate heat effectively.

[0003] At present, the processing process of a printed circuit board containing a metal base is as follows:

[0004] First, perform milling groove processing on the first core board, the second core board and the first insulating layer respectively. After combining the first core board, the first insulating layer and the second core board in the order from top to bottom, insert the metal base into the groove for the first lamination. After the lamination is completed, since the first insulating layer will melt and flow out from the gaps between the metal base and the first and second core boards to contaminate the surfaces of the metal base and the core boards, in order to reduce the overflow of glue, before lamination, use auxiliary materials with buffering performance on the upper surface of the first core board and the lower surface of the second core board to block the glue and then perform lamination. After lamination, use the grinding brush wheel leveling process to remove the overflow glue on the surfaces of the core board and the metal base. Because the surfaces of the metal base and the core board are uneven after lamination, the overflow glue cannot be completely removed, and manual inspection and scraping are still required. After the surface is cleaned, electroplating and graphic etching processes are used to produce the inner layer circuit to achieve the first lamination. The core board after the first lamination is combined with insulating layers and metal layers respectively on the upper and lower sides for the second lamination.

[0005] The above-mentioned printed circuit board has the following deficiencies:

[0006] First, there are problems of overflow glue on the surface of the metal base during the lamination process of the printed circuit board, and the metal base is prone to skew.

[0007] Second, in the process of forming the printed circuit board, buffer auxiliary materials must be used to perform the first lamination treatment, resulting in high costs; and the processing flow for forming the printed circuit board is relatively long.

[0008] Third, the existing printed circuit boards are prone to incomplete removal of overflow glue by manual inspection and scraping, and a large amount of manual inspection is required. Summary of the Invention

[0009] The embodiments of the utility model provide a printed circuit board with an embedded metal base and an electronic product to solve the problems of overflow glue on the surface of the metal base during the lamination process of the printed circuit board, and the metal base is prone to skew.

[0010] In one embodiment, an embedded metal-based printed circuit board is provided, and the printed circuit board includes:

[0011] A first pressed board, which includes a first core board, a first insulating layer, and a second core board formed by a first pressing. The first core board is located above the first insulating layer, and the second core board is located below the first insulating layer;

[0012] The first pressed board has a groove penetrating up and down, and a metal base is placed in the groove, and the thickness of the metal base is greater than the thickness of the first pressed board;

[0013] A second insulating layer is provided above the first pressed board, a first metal layer is provided above the second insulating layer, a third insulating layer is provided below the first pressed board, a second metal layer is provided below the third insulating layer, and the first metal layer, the second insulating layer, the first pressed board, the third insulating layer, and the second metal layer are second-pressed to form a printed circuit board.

[0014] In one embodiment, a first support structure is provided on a first groove wall of the groove, and a second support structure is provided on a second groove wall of the groove. The first groove wall and the second groove wall are non-adjacent groove walls. The first support structure is used to support a first side edge of the metal base, and the second support structure is used to support a second side edge of the metal base. The first side edge and the second side edge are a set of opposite side edges on the metal base.

[0015] In one embodiment, a third support structure is provided on a third groove wall of the groove, and a fourth support structure is provided on a fourth groove wall of the groove. The third groove wall and the fourth groove wall are non-adjacent groove walls. The third support structure is used to support a third side edge of the metal base, and the fourth support structure is used to support a fourth side edge of the metal base. The third side edge and the fourth side edge are a set of opposite side edges on the metal base.

[0016] In one embodiment, the first support structure, the second support structure, the third support structure, and the fourth support structure are all protruding structures reserved when milling the first pressed board.

[0017] In one embodiment, the width of the groove wall of the groove is greater than the width of the side edge of the metal base.

[0018] In one embodiment, the first insulating layer, the second insulating layer, and the third insulating layer are all made of prepreg.

[0019] In one embodiment, the metal base is a copper block.

[0020] In one embodiment, both the first metal layer and the second metal layer are made of copper foil.

[0021] In one embodiment, the surface of the convex structure is provided with threads.

[0022] In one embodiment, an electronic product is provided, and the electronic product includes the printed circuit board as described in any one of the embodiments.

[0023] The above-mentioned printed circuit board and electronic product are formed by uniformly arranging grooves on the first pressing plate, placing the metal base, combining two insulating layers and two metal layers, and then performing secondary pressing. The buffer auxiliary material used to prevent glue overflow during pressing in the prior art is cancelled, and it can ensure that there is no glue overflow on the surface of the copper foil, eliminating the need for subsequent planing and manual maintenance, saving a large amount of production costs; moreover, by setting the thickness of the metal base to be increased by a certain thickness compared to the thickness of the plate after the first pressing, the flatness of the metal base after pressing is higher. Description of the Drawings

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required to be used in the description of the embodiments of the present invention. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0025] Figure 1 It is a schematic structural diagram of a printed circuit board with an embedded metal base in an embodiment of the present invention;

[0026] Figure 2 It is a top view of two support structures arranged in the groove of the first pressing plate in an embodiment of the present invention;

[0027] Figure 3 It is a top view of four support structures arranged in the groove of the first pressing plate in an embodiment of the present invention;

[0028] The label descriptions are as follows:

[0029] 1. First core board; 2. First insulating layer; 3. Second core board; 4. Groove; 5. Metal base; 6. Second insulating layer; 7. First metal layer; 8. Third insulating layer; 9. Second metal layer; 10. First support structure; 11. Second support structure; 12. Third support structure; 13. Fourth support structure. Detailed Embodiments

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the protection scope of the present utility model.

[0031] It should be understood that the present utility model can be implemented in different forms and should not be construed as limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the present utility model to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout the drawings.

[0032] It should be understood that when an element or layer is referred to as being "on", "adjacent to", "connected to", or "coupled to" another element or layer, it can be directly on, adjacent to, connected to, or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as being "directly on", "directly adjacent to", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, the first element, component, region, layer, or part discussed below may be denoted as the second element, component, region, layer, or part without departing from the teachings of the present utility model.

[0033] Spatial relationship terms such as "under", "below", "lower", "beneath", "above", "upper", etc. are used herein for convenience of description to describe the relationship of one element or feature shown in the drawings with other elements or features. It should be understood that, in addition to the orientation shown in the drawings, spatial relationship terms are intended to also include different orientations of the device during use and operation. For example, if the device in the drawing is flipped, then an element or feature described as "under" or "beneath" or "below" another element or feature will be oriented "above" the other element or feature. Thus, the exemplary terms "under" and "below" can include both an upper and a lower orientation. The device may be otherwise oriented (rotated 90 degrees or other orientations) and the spatial descriptors used herein are to be interpreted accordingly.

[0034] The purpose of the terms used herein is only to describe specific embodiments and is not a limitation of the present utility model. When used herein, the singular forms "a", "an", and "the" are also intended to include the plural forms unless the context clearly dictates otherwise. It should also be understood that the terms "comprising" and / or "including", when used in this specification, determine the presence of the described features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term "and / or" includes any and all combinations of the related listed items.

[0035] To thoroughly understand the present utility model, detailed structures and steps will be presented in the following description to illustrate the technical solutions proposed by the present utility model. The preferred embodiments of the present utility model are described in detail below. However, in addition to these detailed descriptions, the present utility model may also have other embodiments.

[0036] In one embodiment, an embedded metal-based printed circuit board is provided, as Figure 1 shown, the printed circuit board comprising:

[0037] A first press plate, the first press plate comprising a first core board 1, a first insulating layer 2, and a second core board 3 formed by a first pressing. The first core board 1 is located above the first insulating layer 2, and the second core board 3 is located below the first insulating layer 2;

[0038] The first press plate has a through-hole groove 4 extending through the upper and lower sides, and a metal base 5 is placed in the groove 4. The thickness of the metal base 5 is greater than the thickness of the first press plate;

[0039] A second insulating layer 6 is provided above the first press plate, a first metal layer 7 is provided above the second insulating layer 6, a third insulating layer 8 is provided below the first press plate, and a second metal layer 9 is provided below the third insulating layer 8. The first metal layer 7, the second insulating layer 6, the first press plate, the third insulating layer 8, and the second metal layer 9 are subjected to a second pressing to form a printed circuit board.

[0040] Wherein, after the first core board 1, the first insulating layer 2, and the second core board 3 are subjected to a first pressing to form the first press plate, the first press plate also needs to be subjected to drilling, electroplating, and graphic etching processes to form circuit layers on the upper surface of the first core board 1 and the lower surface of the second core board 3 in the first press plate. Then, a grooving process is performed at a preset position of the first press plate to obtain the through-hole groove 4 extending through the upper and lower sides of the first press plate, preparing for the placement of the metal base 5.

[0041] Then, the metal base 5 is subjected to surface roughening treatment. The surface-roughened metal base 5 is placed in the groove 4, and then the first metal layer 7, the second insulating layer 6, the first pressing plate, the third insulating layer 8, and the second metal layer 9 are subjected to a second pressing to obtain a printed circuit board.

[0042] In this embodiment, the pressing means that after multiple inner core boards and insulating layers are combined together, the insulating layer is melted and adhered to the core board under high temperature and high pressure to become an integrated multi-layer PCB circuit board. That is, the printed circuit board formed by the second pressing is a double-layer PCB circuit board.

[0043] The printed circuit board of this embodiment is formed by uniformly arranging the groove 4 on the first pressing plate, placing the metal base 5, combining two insulating layers and two metal layers, and performing a second pressing. The buffer auxiliary material used to prevent glue overflow during pressing in the prior art is cancelled, and it can ensure that there is no glue overflow on the surface of the copper foil, eliminating the need for subsequent planing and manual inspection, saving a large amount of production costs. Moreover, by setting the thickness of the metal base 5 to be increased by a certain thickness compared to the thickness of the board after the first pressing, the flatness of the metal base 5 after pressing is higher.

[0044] In one embodiment, as Figure 2 shown, a first support structure 10 is provided on the first groove wall of the groove 4, a second support structure 11 is provided on the second groove wall of the groove 4. The first groove wall and the second groove wall are non-adjacent groove walls. The first support structure 10 is used to support the first side of the metal base 5, and the second support structure 11 is used to support the second side of the metal base 5. The first side and the second side are a set of opposite sides on the metal base 5.

[0045] For the printed circuit board of this embodiment, when the groove 4 is opened on the first pressing plate, the first support structure 10 and the second support structure 11 are respectively provided on the symmetric first groove wall and second groove wall, which can generate a supporting effect when the metal base 5 is inserted, avoiding the metal base 5 from tilting in the groove.

[0046] In one embodiment, as Figure 3 shown, a third support structure 12 is provided on the third groove wall of the groove 4, a fourth support structure 13 is provided on the fourth groove wall of the groove 4. The third groove wall and the fourth groove wall are non-adjacent groove walls. The third support structure 12 is used to support the third side of the metal base 5, and the fourth support structure 13 is used to support the fourth side of the metal base 5. The third side and the fourth side are a set of opposite sides on the metal base 5.

[0047] For the printed circuit board of this embodiment, when forming the groove 4 in the first laminated board, the first support structure 10 and the second support structure 11 are respectively and correspondingly arranged on the symmetric first groove wall and second groove wall, and the third support structure 12 and the fourth support structure 13 are respectively and correspondingly arranged on the symmetric third groove wall and fourth groove wall, which can produce the best supporting effect when inserting the metal base 5 and prevent the metal base 5 from tilting in the groove.

[0048] In one embodiment, as Figure 3 shown, the first support structure 10, the second support structure 11, the third support structure 12 and the fourth support structure 13 are all protruding structures reserved when milling the groove of the first laminated board. That is, the protruding structure is a part of the first laminated board when milling the groove of the first laminated board, that is, the protruding structure and the first laminated board are integrally designed.

[0049] In one embodiment, the surface of the protruding structure is provided with threads, which are used to produce a better supporting effect when inserting the metal base 5 into the groove 4 of the first laminated board.

[0050] In one embodiment, as Figure 1 shown, the width of the groove wall of the groove 4 is greater than the side width of the metal base 5. When the grooving size of the groove 4 is slightly larger than the size of the metal base 5 on one side by a certain size, the flatness of the metal base 5 after being inserted into the groove 4 of the first laminated board and then re-pressed can be higher.

[0051] In one embodiment, the first insulating layer 2, the second insulating layer 6 and the third insulating layer 8 are all made of prepregs. Among them, the prepreg is composed of glass cloth and resin, which is in a semi-cured state before pressing and becomes a cured state after being melted at high temperature, and is used as an insulating layer to bond each core board together.

[0052] In one embodiment, the metal base 5 is a copper block. Of course, the metal base 5 can also be made of other metal blocks with heat dissipation effects.

[0053] In one embodiment, the first metal layer 7 and the second metal layer 9 are both made of copper foil. After the second pressing, holes are burned on the surface of the metal base 5 by laser and electroplated, so that the metal base 5 is connected with the first metal layer 7 and the second metal layer 9 as a whole to play a heat dissipation role.

[0054] In one embodiment, an electronic product is provided, and the electronic product includes the printed circuit board as described in any one of the embodiments.

[0055] The above-described embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. An embedded metal-based printed circuit board, characterized in that The printed circuit board includes: A first laminated board, which includes a first core board, a first insulating layer, and a second core board laminated for the first time. The first core board is located above the first insulating layer, and the second core board is located below the first insulating layer; The first laminated board has a groove that penetrates through the upper and lower sides. A metal base is placed in the groove, and the thickness of the metal base is greater than the thickness of the first laminated board; A second insulating layer is provided above the first laminated board, and a first metal layer is provided above the second insulating layer. A third insulating layer is provided below the first laminated board, and a second metal layer is provided below the third insulating layer. The first metal layer, the second insulating layer, the first laminated board, the third insulating layer, and the second metal layer are laminated for the second time to form a printed circuit board.

2. The printed circuit board according to claim 1, wherein A first supporting structure is provided on the first groove wall of the groove, and a second supporting structure is provided on the second groove wall of the groove. The first groove wall and the second groove wall are non-adjacent groove walls. The first supporting structure is used to support the first side edge of the metal base, and the second supporting structure is used to support the second side edge of the metal base. The first side edge and the second side edge are a set of opposite side edges on the metal base.

3. The printed circuit board according to claim 2, wherein, A third supporting structure is provided on the third groove wall of the groove, and a fourth supporting structure is provided on the fourth groove wall of the groove. The third groove wall and the fourth groove wall are non-adjacent groove walls. The third supporting structure is used to support the third side edge of the metal base, and the fourth supporting structure is used to support the fourth side edge of the metal base. The third side edge and the fourth side edge are a set of opposite side edges on the metal base.

4. The printed circuit board according to claim 3, wherein The first supporting structure, the second supporting structure, the third supporting structure, and the fourth supporting structure are all raised structures reserved during the milling of the first laminated board.

5. The printed circuit board according to any one of claims 1 to 3, characterized in that, The width of the groove wall of the groove is greater than the width of the side edge of the metal base.

6. The printed circuit board according to any one of claims 1 to 3, characterized in that, The first insulating layer, the second insulating layer, and the third insulating layer are all made of prepreg.

7. The printed circuit board according to any one of claims 1 to 3, characterized in that, The metal base is a copper block.

8. The printed circuit board according to any one of claims 1 to 3, characterized in that, The first metal layer and the second metal layer are both made of copper foil.

9. The printed circuit board according to claim 4, wherein Threads are provided on the surface of the raised structure.

10. An electronic product, characterized in that, The electronic product includes the printed circuit board according to any one of claims 1 to 9.

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