Multi-graphics card server

Abstract

The utility model provides a multi-graphics card server. The multi-graphics card server comprises a case body, a mainboard, a first graphics card module, a second graphics card module, a fan module, a PCIE card module, a hard disk module and a power module, wherein a first space and a second space are formed in the case body along the length direction; the first graphics card module and the second graphics card module respectively comprise a plurality of graphics cards, the graphics cards in the first graphics card module are arranged in the upper half area of the first space of the case body, and the graphics cards in the second graphics card module are arranged in the lower half area of the second space of the case body. According to the server structure, more graphics cards can be installed, the number of the graphics cards of a single server is greatly increased, the performance of the single server is improved, and the high requirements of some fields for graphics card servers can be met.

Description

Technical Field

[0001] This application belongs to the field of computer technology, and particularly relates to a multi-graphics card server. Background Art

[0002] With the rapid improvement of the computing power of graphics cards, they have been widely used in many fields such as scientific computing, deep learning, and graphics rendering. High-performance graphics card servers have become indispensable computing resources in these fields. However, the existing designs of graphics card servers usually only support a limited number of graphics card slots, generally ranging from 2 to 10. This limitation has led to several key problems: First, for applications that require a large amount of parallel processing capabilities, such as the training of large-scale machine learning models, the existing graphics card servers cannot provide sufficient computing resources due to the limited number of graphics card slots, thus affecting the processing speed and efficiency. Second, with the continuous improvement of graphics card performance, the power consumption of a single graphics card has also increased, while the power supply and heat dissipation designs of existing servers often fail to match it, resulting in a decline in system stability and reliability. Finally, due to the limited number of graphics cards, users may need to purchase multiple servers or perform frequent hardware upgrades when facing tasks of different scales, increasing the cost and maintenance difficulty.

[0003] Therefore, the current demand for multi-graphics card and high-performance graphics card servers is increasing, and the existing graphics card servers are difficult to meet the growing graphics card performance requirements. Summary of the Utility Model

[0004] In view of the above-mentioned disadvantages of the prior art, the purpose of this utility model is to provide a multi-graphics card server for increasing the number of graphics cards in the server.

[0005] An embodiment of this application provides a multi-graphics card server, including: a chassis box body, a main board, a first graphics card module, a second graphics card module, a fan module, a PCIE card module, a hard disk module, and a power supply module; wherein: the chassis box body forms a first space and a second space along the length direction; the first graphics card module and the second graphics card module each include a plurality of graphics cards, and each of the graphics cards in the first graphics card module is arranged in the upper half area of the first space of the chassis box body, and each of the graphics cards in the second graphics card module is arranged in the lower half area of the second space of the chassis box body; the main board is arranged below the first graphics card module and the second graphics card module and is respectively connected to each of the graphics cards, the fan module, the PCIE card module, the hard disk module, and the power supply module in the first graphics card module and the second graphics card module.

[0006] In a possible implementation manner, the graphics card has a two-slot thickness.

[0007] In a possible implementation, the first graphics card module includes 8 of the graphics cards; the second graphics card module includes 8 of the graphics cards.

[0008] In a possible implementation, each of the graphics cards is connected to the motherboard through a PCIE extension cable.

[0009] In a possible implementation, the height difference between each of the graphics cards in the first graphics card module and each of the graphics cards in the second graphics card module is 2U.

[0010] In a possible implementation, the fan module includes a first fan module, a second fan module, and a third fan module; the first fan module and the second fan module are respectively arranged in the front-end area of the first space and the front-end area of the second space, and respectively correspond to the first graphics card module and the second graphics card module; the third fan module is arranged between the first graphics card module and the second graphics card module, and the third fan module includes two layers of fans stacked up and down.

[0011] In a possible implementation, the PCIE card module is arranged in the lower half area of the first space and is located in the front-end area of the chassis box.

[0012] In a possible implementation, the PCIE card module includes 4 half-height PCIE cards.

[0013] In a possible implementation, the hard disk module is arranged in the upper half area of the second space of the chassis box, a hard disk backplane is arranged on the chassis box, the hard disk backplane is connected to the motherboard through a high-speed cable, and the hard disk module is connected to the hard disk backplane in a hot-swappable manner.

[0014] In a possible implementation, the power supply module is arranged in the upper half area of the second space of the chassis box and is adjacent to the hard disk module, a power supply backplane is arranged on the chassis box, and the power supply module is connected to the power supply backplane in a hot-swappable manner.

[0015] As described above, in the server structure of the present application, more graphics cards can be installed, which greatly increases the number of graphics cards of a single server and improves the performance of a single server, and can meet the high requirements for graphics card servers in some fields; moreover, the present application can install multiple half-height PCIE cards and multiple hard disks, making up for the disadvantages of slow data transmission and small storage capacity of existing graphics card servers. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 and Figure 2 shows the internal structure schematic diagram of the multi-graphics card server of the present application in an embodiment.

[0017] Figure 3 and Figure 4 It shows a top view of the internal structure of the multi - graphics - card server of the present application in an embodiment.

[0018] Figure 5 It shows a front view of the multi - graphics - card server of the present application in an embodiment.

[0019] Figure 6 It shows a rear view of the multi - graphics - card server of the present application in an embodiment.

[0020] Figure 7 It shows an external schematic diagram of the overall structure of the chassis assembly of the multi - graphics - card server of the present application in an embodiment.

[0021] Figure 8 It shows a top view of the front of the chassis assembly of the multi - graphics - card server of the present application in an embodiment.

[0022] Figure 9 It shows a right - hand view of the chassis assembly of the multi - graphics - card server of the present application in an embodiment.

[0023] Description of component numbers

[0024] 100 Multi - graphics - card server

[0025] 110 Chassis housing

[0026] 120 Motherboard

[0027] 130 First graphics - card module

[0028] 140 Second graphics - card module

[0029] 150 Fan module

[0030] 151 First fan module

[0031] 152 Second fan module

[0032] 153 Third fan module

[0033] 160 Hard - disk module

[0034] 161 Hard - disk backplane

[0035] 170 Power - supply module

[0036] 171 Power - supply backplane

[0037] 180 PCIE card module Detailed implementation manners

[0038] The following uses specific specific examples to illustrate the implementation manners of the present application. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific implementation manners. Various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0039] It should be noted that the diagrams provided in the following embodiments only illustrate the basic concept of the present application in a schematic manner. Therefore, only the components related to the present application are shown in the diagrams, rather than being drawn according to the number, shape, and size of the components in actual implementation. The types, quantities, and proportions of the actual components in implementation can be arbitrarily changed, and the component layout type may also be more complex.

[0040] In the description of the present utility model, it should be understood that the orientation or positional relationships indicated by the terms "middle", "upper", "lower", "top", "inner", "outer", etc. are based on the orientation or positional relationships shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation to the present utility model.

[0041] In addition, it should also be understood that unless otherwise specifically stated or pointed out, the terms "first", "second", etc. appearing in the specification are only used to distinguish the various components, elements, steps, etc. in the specification, rather than indicating the logical relationships or sequence relationships between the various components, elements, steps, etc. Nor can it be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features.

[0042] The present utility model provides a multi-graphics card server for increasing the number of graphics cards in the server.

[0043] The following will combine Figures 1 to 9 to elaborate in detail the principle and implementation manner of a multi-graphics card server in this embodiment, so that those skilled in the art can understand the multi-graphics card server in this embodiment without creative labor.

[0044] This embodiment provides a multi-graphics card server, Figure 1 and Figure 2 shows the internal structure schematic diagram of the multi-graphics card server of the present application in an embodiment, Figure 3 and Figure 4 shows the top view of the internal structure of the multi-graphics card server of the present application in an embodiment, Figure 5 shows the front view of the multi-graphics card server of the present application in an embodiment, Figure 6Shown is a rear view of the multi - graphics - card server of the present application in an embodiment. Figure 7 Shown is an external schematic view of the overall structure of the chassis assembly of the multi - graphics - card server of the present application in an embodiment. Figure 8 Shown is a top view of the front of the chassis assembly of the multi - graphics - card server of the present application in an embodiment. Figure 9 Shown is a right view of the chassis assembly of the multi - graphics - card server of the present application in an embodiment. As Figures 1 to 9 shown, the multi - graphics - card server 100 of this embodiment includes: a chassis box 110, a main board 120, a first graphics - card module 130, a second graphics - card module 140, a fan module 150, a PCIE card module 180, a hard - disk module 160, and a power - supply module 170.

[0045] Among them, in this embodiment, the chassis box 110 forms a first space and a second space along the length direction; the first graphics - card module 130 and the second graphics - card module 140 each include multiple graphics cards. Each of the graphics cards in the first graphics - card module 130 is arranged in the upper - half area of the first space of the chassis box 110, and each of the graphics cards in the second graphics - card module 140 is arranged in the lower - half area of the second space of the chassis box 110; the main board 120 is arranged below the first graphics - card module 130 and the second graphics - card module 140, and is respectively connected to each of the graphics cards in the first graphics - card module 130 and the second graphics - card module 140, the fan module 150, the PCIE card module 180, the hard - disk module 160, and the power - supply module 170.

[0046] In the server structure of the present application, more graphics cards can be installed, greatly increasing the number of graphics cards in a single server, improving the performance of a single server, and meeting the high requirements for graphics - card servers in some fields.

[0047] The multi - graphics - card server 100 of this embodiment will be described in detail below.

[0048] In this embodiment, the chassis box 110 forms a first space and a second space along the length direction; where the first space and the second space are the front space and the rear space of the chassis box 110, and the first space and the second space can be enclosed spaces or non - enclosed spaces, and this embodiment does not make a clear limitation on this.

[0049] In this embodiment, the height of the chassis assembly structure is of the 6U size standard, the width is 19 inches, and the length can be made into different lengths according to the length of the graphics card.

[0050] The chassis box body 110 is the carrier for installing other modules. The material of the chassis box body 110 can be galvanized steel plate with a thickness of 1 mm - 3 mm. The chassis made of galvanized steel plate has a certain anti-corrosion ability and a lower cost compared to painting.

[0051] In this embodiment, the main board 120 has a plurality of high-speed signal interfaces, and the high-speed signal interfaces are used to connect to the PCIE interfaces of the graphics cards. Among them, the number of high-speed signal interfaces on the main board 120 matches the total number of the graphics cards, PCIE cards, and hard disks.

[0052] In this embodiment, as Figure 1 and Figure 2 shown, the first graphics card module 130 and the second graphics card module 140 respectively include a plurality of graphics cards. Each of the graphics cards in the first graphics card module 130 is arranged in the upper half area of the first space of the chassis box body 110, and each of the graphics cards in the second graphics card module 140 is arranged in the lower half area of the second space of the chassis box body 110; the graphics cards in the first space of the chassis box body 110 and the graphics cards in the second space of the chassis box body 110 are vertically offset, which can prevent the hot air from the graphics cards in the first space from directly flowing to the graphics cards in the second space, and is beneficial to the heat dissipation of the graphics cards in the second space.

[0053] In a possible implementation manner, the graphics card has a two-slot thickness, that is, the graphics card occupies the positions of two PCIe slots on the main board 120. The slot thickness of the graphics card directly affects the installation position and space of its modules in the chassis box body 110. The graphics card with a two-slot thickness provides a balance in design compared to single-slot or three-slot graphics cards. It can meet the heat dissipation and circuit design requirements of medium performance needs without overly occupying the limited space inside the chassis.

[0054] In a possible implementation manner, each of the graphics cards is connected to the main board 120 through a PCIE extension cable. In a possible implementation manner, the height difference between each of the graphics cards in the first graphics card module 130 and each of the graphics cards in the second graphics card module 140 is 2U.

[0055] Specifically, in a possible implementation, the first graphics card module 130 includes 8 of the graphics cards; the second graphics card module 140 includes 8 of the graphics cards. That is, in this embodiment, the maximum number of graphics cards is 16 double-slot graphics cards. The graphics cards are connected to the motherboard 120 through PCIE extension cables. Compared with existing graphics card servers on the market, more graphics cards can be installed, improving the performance of a single server. Therefore, in this embodiment, an example of a distribution method of the graphics cards is as follows: 8 graphics cards are installed in the front and back of the chassis respectively. The 8 graphics cards in the front of the chassis are placed near the upper half of the chassis, and the 8 graphics cards in the back are placed near the lower half of the chassis. In this way, the front and back graphics cards are offset by about 2U in height, preventing the hot air from the front graphics cards from directly flowing to the 8 graphics cards in the back, which is beneficial to the heat dissipation of the 8 graphics cards in the back.

[0056] In a possible implementation, as Figure 1 and Figure 3 shown, the fan module 150 includes a first fan module 151, a second fan module 152, and a third fan module 153; the first fan module 151 and the second fan module 152 are respectively disposed in the front-end regions of the first space and the second space, and respectively correspond to the first graphics card module 130 and the second graphics card module 140; the third fan module 153 is disposed between the first graphics card module 130 and the second graphics card module 140, and the third fan module 153 includes two layers of fans stacked up and down.

[0057] In this embodiment, the chassis air duct is set, for example, to be front-in and rear-out. There are three rows of front, middle, and rear cooling fans in the chassis, which can provide a good heat dissipation environment for the graphics cards.

[0058] In this embodiment, the speed of the fans can be adjusted according to the temperature of the motherboard 120 or the CPU.

[0059] Among them, in this embodiment, the first fan module 151 and the second fan module 152 respectively include a fan assembly, and each fan assembly includes a fan bracket and 4 fans. The third fan module 153 includes two fan assemblies stacked up and down, and each fan assembly includes a fan bracket and 4 fans. Therefore, the third fan module 153 includes 8 fans stacked up and down. In this embodiment, the fan module 150 installs 4 fans respectively behind the first graphics card module 130 and the second graphics card module 140, and installs 8 fans stacked up and down in the middle to discharge the heat in the first graphics card module 130 and the second graphics card module 140.

[0060] In this embodiment, as Figure 5As shown, the PCIE card module 180 includes multiple PCIE (Peripheral Component Interconnect Express) cards, such as high-speed network cards, which are used for data transmission. In a possible implementation, the PCIE card module 180 is disposed in the lower half area of the first space and in the front area of the chassis box 110. Each PCIE card in the PCIE card module 180 is connected to the motherboard 120 through a PCIE extension cable.

[0061] Specifically, since a graphics card is installed in the upper half area of the first space and PCIE cards are installed in the lower half area of the first space, the PCIE cards are standard half-height PCIE cards. In a possible implementation, the PCIE card module 180 includes 4 half-height PCIE cards. That is, in this embodiment, the maximum number of half-height PCIE cards is 4.

[0062] In a possible implementation, as Figure 6 shown, the hard disk module 160 is disposed in the upper half area of the second space of the chassis box 110. A hard disk backplane 161 is provided on the chassis box 110, and the hard disk backplane 161 is connected to the motherboard 120 through a high-speed cable. As Figure 4 shown, the hard disk module 160 is connected to the hard disk backplane 161 in a hot-swappable manner. Therefore, the hard disk module 160 in this embodiment can be installed in a hot-swappable manner, which is convenient for replacement and maintenance.

[0063] Among them, the hard disk module 160 includes a hard disk and a hard disk tray for installing the hard disk. The way that the hard disk module 160 can be installed in a hot-swappable manner is as follows: First, install the hard disk on the hard disk tray, and then insert it into the chassis and connect it to the hard disk backplane 161. The hard disk backplane 161 is connected to the motherboard 120 through a high-speed cable.

[0064] In this embodiment, the hard disk is, for example, a 2.5-inch hard disk, and the number of hard disks is 4. Therefore, this embodiment can install 4 half-height PCIE cards and 4 2.5-inch hard disks, effectively compensating for the disadvantages of slow data transmission and small storage capacity of existing graphics card servers.

[0065] The power supply module 170 is used to supply power to the multi-graphics card server 100 and is responsible for converting 220V alternating current into low-voltage direct current required by each module. In this embodiment, the power supply module 170 selects a commonly used hot-swappable power supply module 170 on the server, which is convenient for replacing and maintaining the power supply module 170.

[0066] In a possible implementation, as Figure 6As shown, the power supply module 170 is disposed in the upper half region of the second space of the chassis box body 110 and is adjacent to the hard disk module 160, as Figure 4 shown, a power supply backplane 171 is provided on the chassis box body 110, and the power supply module 170 is connected to the power supply backplane 171 in a hot pluggable manner.

[0067] Among them, in a specific embodiment, the number of the power supply modules 170 is 4, and the power supply modules 170 are hot pluggable power supply modules 170, which provide low-voltage direct current for the whole machine. The power supply modules 170 are connected to the power supply backplane 171 installed inside the chassis, and then the current is distributed from the power supply backplane 171 to the components that need to be powered by cables.

[0068] In summary, in the server structure of the present application, more graphics cards can be installed, which greatly increases the number of graphics cards of a single server and improves the performance of a single server, and can meet the high requirements for graphics card servers in some fields; moreover, the present application can install multiple half-height PCIE cards and multiple hard disks, making up for the disadvantages of slow data transmission and small storage capacity of existing graphics card servers.

[0069] The above embodiments are only illustrative of the principles and effects of the present application and are not used to limit the present application. Any person familiar with this technology can modify or change the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes made by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present application should still be covered by the claims of the present application.

Claims

1. A multi-graphics card server, characterized in that, Including: a chassis housing, a main board, a first graphics card module, a second graphics card module, a fan module, a PCIE card module, a hard disk module, and a power supply module; wherein: the chassis housing forms a first space and a second space along the length direction; the first graphics card module and the second graphics card module each include a plurality of graphics cards, each of the graphics cards in the first graphics card module is disposed in the upper half region of the first space of the chassis housing, and each of the graphics cards in the second graphics card module is disposed in the lower half region of the second space of the chassis housing; the main board is disposed below the first graphics card module and the second graphics card module and is respectively connected to each of the graphics cards, the fan module, the PCIE card module, the hard disk module, and the power supply module in the first graphics card module and the second graphics card module.

2. The multi-graphics card server according to claim 1, wherein The graphics card has a two-slot thickness.

3. The multi-graphics card server according to claim 1 or 2, characterized in that, The first graphics card module contains 8 of the graphics cards; the second graphics card module contains 8 of the graphics cards.

4. The multi-graphics card server according to claim 1, wherein Each of the graphics cards is connected to the main board through a PCIE extension cable.

5. The multi-graphics card server according to claim 1, wherein The height difference between each of the graphics cards in the first graphics card module and each of the graphics cards in the second graphics card module is 2U.

6. The multi-graphics card server according to claim 1, characterized in that The fan module includes a first fan module, a second fan module, and a third fan module; the first fan module and the second fan module are respectively disposed in the front end region of the first space and the front end region of the second space and correspond to the first graphics card module and the second graphics card module respectively; the third fan module is disposed between the first graphics card module and the second graphics card module, and the third fan module includes two layers of fans stacked up and down.

7. The multi-graphics card server according to claim 1, wherein The PCIE card module is disposed in the lower half region of the first space and is located in the front end region of the chassis housing.

8. The multi-graphics card server according to claim 6, wherein The PCIE card module contains 4 half-height PCIE cards.

9. The multi-graphics card server according to claim 1, characterized in that, The hard disk module is disposed in the upper half region of the second space of the chassis housing, a hard disk backplane is provided on the chassis housing, the hard disk backplane is connected to the main board through a high-speed cable, and the hard disk module is connected to the hard disk backplane in a hot-swap manner.

10. The multi-graphics card server according to claim 1, wherein, The power supply module is disposed in the upper half region of the second space of the chassis housing and is adjacent to the hard disk module, a power supply backplane is provided on the chassis housing, and the power supply module is connected to the power supply backplane in a hot-swap manner.

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