Inverter heat dissipation structure

Abstract

The utility model discloses a heat dissipation structure of an inverter, and relates to the technical field of inverters. Comprising a shell, a heat dissipation assembly and a fan. The shell comprises a bottom plate and a cover body which are connected with each other; the cover body is buckled above the bottom plate; the bottom plate is connected with a heat transfer base, the heat transfer base in the cover body is connected with an integrated circuit assembly, the heat transfer base outside the cover body is provided with a heat dissipation assembly installation position used for installing a heat dissipation assembly, and one side of the shell corresponding to the heat dissipation assembly is provided with a fan installation position used for installing a plurality of fans. The shell is used for taking heat in the shell out of the shell; the heat dissipation assembly comprises a plurality of heat pipes, and the first ends of the heat pipes can extend into the shell to be connected with the heat transfer base and are used for bringing heat in the integrated circuit assembly on the heat transfer base out of the shell. Through two heat dissipation modes of the heat pipe and the heat transfer base of the shell, heat in the inverter can be quickly dissipated, so that the temperature in the shell is reduced, the operating temperature of internal devices is reduced, and the energy conversion efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of inverters, and particularly relates to a heat dissipation structure for an inverter. Background Art

[0002] During the process of an inverter converting direct current into alternating current, a large amount of heat is generated by its power devices. An effective heat dissipation structure is crucial for improving the efficiency and lifespan of the inverter. Traditional heat dissipation methods usually include natural convection and forced air cooling. Natural convection means allowing it to dissipate heat naturally, and forced air cooling, for example, uses an external fan to blow directly on the inverter. However, these methods cannot achieve efficient heat dissipation in high-power density devices. Especially in high-density and compact designs, it is difficult to meet the requirements of modern inverters, resulting in low heat dissipation efficiency. When the temperature is too high, the heat in the inverter cannot be discharged in time, reducing the service life of the inverter.

[0003] As an alternative, the liquid cooling system improves the heat dissipation performance, but its complex pipeline design and maintenance requirements increase the cost and are not suitable for all application scenarios. Therefore, there is an urgent need in the market for a new heat dissipation structure that combines efficient heat dissipation, simple structure, low maintenance, and cost-effectiveness. Summary of the Utility Model

[0004] The utility model provides a heat dissipation structure for an inverter to solve the problems in the prior art that natural convection and forced air cooling cannot effectively dissipate heat from the inverter, resulting in reduced heat dissipation efficiency, and that using a hydraulic system to dissipate heat from the inverter requires numerous pipelines, leading to a complex structure, inconvenient maintenance of components, and high costs.

[0005] The technical solution adopted by the utility model is as follows:

[0006] A heat dissipation structure for an inverter includes a housing, a heat dissipation component, and a fan; the housing includes a bottom plate and a cover body connected to each other; the cover body is buckled above the bottom plate;

[0007] A heat transfer base is connected to the bottom plate, an integrated circuit component is connected to the heat transfer base inside the cover body, a heat dissipation component installation position for installing the heat dissipation component is provided on the heat transfer base outside the cover body, and a fan installation position for installing a plurality of the fans is provided on one side of the housing corresponding to the heat dissipation component, for taking the heat inside the housing out of the housing; the heat dissipation component includes a plurality of heat pipes, and the first end of the heat pipe can extend into the housing to be connected to the heat transfer base, for taking the heat in the integrated circuit component on the heat transfer base out of the housing.

[0008] The heat dissipation structure for an inverter of the utility model further has the following additional technical features:

[0009] The heat dissipation component further includes a heat dissipation fin assembly and a plurality of heat dissipation fans; the heat dissipation fin assembly includes a plurality of heat dissipation fins connected in rows, and the heat dissipation fans are connected inside some of the heat dissipation fins.

[0010] Installation grooves corresponding to each other are formed in at least some areas of the heat dissipation fins, and a plurality of the installation grooves communicate with each other to form a heat dissipation fan installation position for installing the heat dissipation fans.

[0011] Installation holes corresponding to each other are formed in at least some areas of the heat dissipation fins, and a plurality of the installation holes communicate with each other to form a heat pipe installation position for installing the heat pipes, so that the second ends of the heat pipes can be inserted into some of the heat dissipation fins.

[0012] One side of the heat transfer base has a plurality of grooves for connecting the heat pipes, a connection hole is formed in one side of the housing facing the heat dissipation component, the first end of the heat pipe can be embedded in the groove by passing through the connection hole, and the second end of the heat pipe can be embedded in the installation hole of the radiator fin.

[0013] The heat dissipation fans are arranged on at least one side of the heat dissipation fin assembly, and the heat pipes are connected below the heat dissipation fin assembly.

[0014] The integrated circuit component includes a capacitor board, a power board, an inductor and a communication board; a first installation position and a second installation position are formed on the first side of the heat transfer base, a third installation position and a fourth installation position are formed on the second side of the heat transfer base, the capacitor board is connected to the first installation position, and the power board is connected to the second installation position; the inductor is connected to the third installation position; the communication board is connected to the fourth installation position.

[0015] The integrated circuit component further includes a main control board, a terminal block and a power device; the four corners of the main control board are threadedly connected to the power board through connectors, and the main control board can cover some areas above the power board; the terminal block is attached and connected to a corner of the heat transfer base; the heat dissipation surface of the power device is attached and connected to the heat transfer base.

[0016] The pins of the power device are bent in an L shape, and the bent ends of the pins extend upward so that the heat dissipation surface of the power device is parallel to the heat dissipation bottom plate.

[0017] The cover body includes a top plate and a side plate connected to each other; the side plate is connected to the periphery of the bottom plate, the top plate is connected to the top of the side plate, and the top plate, the side plate and the bottom plate adopt an aluminum alloy structure.

[0018] Due to the adoption of the above technical solution, the beneficial effects obtained by the present utility model are:

[0019] 1. An inverter heat dissipation structure, comprising a housing, a heat dissipation component and a fan; the housing includes a bottom plate and a cover body connected to each other; the cover body is buckled above the bottom plate; a heat transfer base is connected to the bottom plate, and an integrated circuit component is connected to the heat transfer base within the cover body, and a heat dissipation component installation position for installing the heat dissipation component is provided on the heat transfer base outside the cover body. A fan installation position for installing a plurality of fans is provided on one side of the housing corresponding to the heat dissipation component, for taking the heat inside the housing out of the housing; the heat dissipation component includes a plurality of heat pipes, and the first end of the heat pipe can extend into the housing to be connected to the heat transfer base, for taking the heat in the integrated circuit component on the heat transfer base out of the housing.

[0020] By providing a heat transfer base on the bottom plate of the housing and connecting the heat transfer base to the first ends of a plurality of heat pipes, since the heat dissipation component is installed outside the cover body, the other ends of the heat pipes extend outside the housing. Therefore, the heat pipes can conduct the heat generated by the integrated circuit component connected to the heat transfer base into the heat pipes and take it out of the housing. The thermal resistance of an air-cooled all-copper or all-aluminum radiator can only reach 0.04 °C / W, while that of a heat pipe radiator can reach 0.01 °C / W. Under natural convection cooling conditions, the performance of the heat pipe radiator is more than ten times higher than that of a solid radiator. Through the two heat dissipation methods of the heat pipes and the heat transfer base of the housing, the heat inside the inverter can be quickly dissipated, reducing the temperature inside the housing, lowering the operating temperature of internal components, and improving the energy conversion efficiency.

[0021] 2. As a preferred embodiment of the present invention, the heat dissipation component further includes a heat dissipation fin assembly and a plurality of heat dissipation fans; the heat dissipation fin assembly includes a plurality of heat dissipation fins connected in rows, and the heat dissipation fans are connected to some of the heat dissipation fins.

[0022] The heat dissipation fins can be connected to the heat dissipation fans, so that when the heat on the heat pipes is transferred to the heat dissipation fins, the heat on the heat dissipation fins can be dissipated under the action of the wind force of the fans, thereby realizing the heat dissipation of the inverter.

[0023] 3. As a preferred embodiment of the present invention, installation grooves corresponding to each other are provided in at least some areas of the heat dissipation fins, and a plurality of the installation grooves are communicated to form a heat dissipation fan installation position for installing the heat dissipation fans.

[0024] Since multiple heat dissipation fins are connected in a row, and the heat dissipation fan has a certain width dimension, and in order to further enhance the heat dissipation effect of the heat dissipation fins, the heat dissipation fan is preferentially installed in the heat dissipation fins. Specifically, corresponding installation grooves can be respectively opened on all the heat dissipation fins, and the heat dissipation fan is installed in the installation grooves; alternatively, corresponding installation grooves can be opened on some of the heat dissipation fins, and since the installation grooves are connected to form a heat dissipation fan installation position for installing the heat dissipation fan. In order to install multiple heat dissipation fans, multiple groups of installation grooves need to be opened on the heat dissipation fins, each group of installation grooves is connected, and each group of installation grooves is used to install a heat dissipation fan, so that multiple heat dissipation fans can be installed on the heat dissipation structure.

[0025] 4. As a preferred embodiment of the present invention, corresponding installation holes are opened in at least part of the heat dissipation fins, and multiple installation holes are connected to form a heat pipe installation position for installing a heat pipe, so that the second end of the heat pipe can be inserted into part of the heat dissipation fins.

[0026] The heat pipe can be connected to the heat dissipation fins to transfer the heat on the heat transfer base to the heat dissipation fins through the heat pipe, and then the heat on the heat dissipation fins is blown away by multiple heat dissipation fans in the heat dissipation fins. Therefore, in order to strengthen the stable connection between the heat pipe and the heat dissipation fins, corresponding installation holes are opened on the heat dissipation fins, and multiple installation holes form a heat pipe installation position for installing the heat pipe. The second end of the heat pipe extends along the heat pipe installation position and is fixedly connected to the heat pipe installation position. Here, the installation position of the heat pipe is not specifically limited. It can be the bottom of the heat dissipation fins or other positions of the heat dissipation fins. Preferably, it is located at the bottom of the heat dissipation fins, which can avoid interference with the heat dissipation fan. Moreover, since the first end of the heat pipe is connected to the bottom of the heat transfer base and the first end is also connected to the bottom of the heat dissipation fins, the extending direction of the heat pipe can be on the same horizontal line, protecting the heat pipe from bending, facilitating the heat transfer of the heat pipe, and further protecting the heat pipe from damage and improving the service life of the heat pipe.

[0027] 5. As a preferred embodiment of the present invention, one side of the heat transfer base has multiple grooves for connecting heat pipes, and the housing is provided with connection holes on the side facing the heat dissipation component. The first end of the heat pipe can be inserted into the grooves through the connection holes, and the second end of the heat pipe can be inserted into the installation holes of the radiator fins.

[0028] To strengthen the connection between the heat pipe and the heat transfer base, a plurality of grooves for installing the heat pipe are provided on one side of the heat transfer base. The grooves can be circular grooves adapted to the diameter size of the heat pipe. A connection hole is provided on the corresponding side of the housing for the groove, so that the heat pipe can enter the groove on one side of the heat transfer base through the connection hole. The second end of the heat pipe is inserted and connected into the groove to realize the connection and fixation of a plurality of heat pipes and the heat transfer base, thereby further enhancing the connection strength between the heat transfer base and the heat pipe, further enhancing the heat transfer efficiency from the heat transfer base to the heat pipe, facilitating the rapid dissipation of the heat inside the inverter, reducing the temperature inside the housing, and reducing the operating temperature of the internal components, thereby improving the energy conversion efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are used to provide a further understanding of the present invention and form a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation to the present invention. In the drawings:

[0030] Figure 1 is a structural diagram of an inverter heat dissipation structure under an embodiment of the present invention;

[0031] Figure 2 is an internal structural diagram of an inverter heat dissipation structure under an embodiment of the present invention;

[0032] Figure 3 is a schematic diagram of a heat dissipation circuit of an inverter heat dissipation structure under an embodiment of the present invention;

[0033] Figure 4 is a schematic diagram of a heat dissipation structure of a power device for an inverter heat dissipation under an embodiment of the present invention;

[0034] Figure 5 is a partial schematic diagram of a heat dissipation component of an inverter heat dissipation structure under an embodiment of the present invention;

[0035] In the figure,

[0036] 1, housing; 101, cover plate; 102, side plate; 103, bottom plate; 2, capacitor plate; 3, power board; 4, main control board; 5, inductor; 6, heat dissipation fin; 7, heat pipe; 8, fan; 9, communication board; 10, terminal block; 11, power device; 12, heat transfer base; 13, centrifugal cooling fan. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0037] In the following description, many specific details are set forth to provide a thorough understanding of the present utility model. However, the present utility model may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present utility model is not limited by the specific embodiments disclosed below.

[0038] In addition, in the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present utility model.

[0039] In the present utility model, unless otherwise clearly defined and limited, the terms "mounted", "connected", "connected to", "fixed", etc. shall be construed in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral body; it may be a mechanical connection, an electrical connection, or a communication connection; it may be directly connected, or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0040] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. In the description of this specification, the description with reference to terms such as "embodiment", "example", "an example", "example" or "specific example" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0041] In order to more clearly illustrate the overall concept of the present utility model, the following will be described in detail by way of examples in conjunction with the drawings of the specification.

[0042] The present utility model relates to an inverter heat dissipation structure, such as Figures 1-5As shown in the figure, it includes a housing 1, a heat dissipation component, and a fan 8; the housing 1 includes a bottom plate 103 and a cover body that are connected; the cover body is buckled above the bottom plate 103; a heat transfer base 12 is connected to the bottom plate 103, an integrated circuit component is connected to the heat transfer base 12 inside the cover body, a heat dissipation component installation position for installing the heat dissipation component is provided on the heat transfer base 12 outside the cover body, and a fan 8 installation position for installing a plurality of fans 8 is provided on one side of the housing 1 corresponding to the heat dissipation component, which is used to take the heat inside the housing 1 out of the housing 1; the heat dissipation component includes a plurality of heat pipes 7, and the first end of the heat pipe 7 can extend into the housing 1 to be connected to the heat transfer base 12, which is used to take the heat in the integrated circuit component on the heat transfer base 12 out of the housing 1.

[0043] By providing a heat transfer base 12 on the bottom plate 103 of the housing 1 and connecting the heat transfer base 12 to the first ends of a plurality of heat pipes 7, since the heat dissipation component is installed outside the cover body, the other ends of the heat pipes 7 extend outside the housing 1. Therefore, the heat pipes 7 can conduct the heat generated by the integrated circuit component connected to the heat transfer base 12 into the heat pipes 7 and take it out of the housing 1; the thermal resistance of an air-cooled all-copper or all-aluminum radiator can only reach 0.04 °C / W, while the heat pipe 7 radiator can reach 0.01 °C / W. Under natural convection cooling conditions, the performance of the heat pipe 7 radiator is more than ten times higher than that of a solid radiator. Through the two heat dissipation methods of the heat pipes 7 and the heat transfer base 12 of the housing 1, the heat inside the inverter can be quickly dissipated, the temperature inside the housing can be reduced, the operating temperature of internal components can be lowered, and the energy conversion efficiency can be improved.

[0044] The heat pipe 7 of the present application is sealed, the first end is connected to the heat transfer base 12, the second end can be connected to the heat dissipation component, and the working fluid inside will not be consumed. Therefore, it has a very long service life and does not pollute the environment; moreover, it has good isothermal performance. After thermal equilibrium, the temperature gradient between its evaporation section and cooling section is quite small, and the heat can be evenly distributed inside the system without obvious heat accumulation or uneven heat distribution.

[0045] The heat dissipation structure of the present application has a high cost performance. Under the condition of the same thermal resistance, the consumable material of the heat pipe 7 as a radiator is half of that of an aluminum (copper) solid radiator. Hydraulic water cooling not only requires more equipment but also an additional water system. In contrast, the heat pipe 7 of the present application is simpler in structure, more convenient to install and use, smaller in volume and lighter in weight, and is convenient for maintenance and repair, thereby improving the user experience.

[0046] As a preferred implementation, the heat dissipation component further includes a heat dissipation fin 6 assembly and a plurality of heat dissipation fans 13; the heat dissipation fin 6 assembly includes a plurality of heat dissipation fins 6 connected in rows, and the heat dissipation fans 13 are connected inside some of the heat dissipation fins 6.

[0047] The heat dissipation fin 6 can be connected to the heat dissipation fan 13, so that when the heat on the heat pipe 7 is transferred to the heat dissipation fin 6, the heat on the heat dissipation fin 6 can be dissipated under the action of the wind force of the fan 8, thereby realizing the heat dissipation of the inverter.

[0048] As a preferred embodiment, at least some areas of the heat dissipation fin 6 are provided with corresponding installation grooves, and a plurality of installation grooves communicate with each other to form a heat dissipation fan 13 installation position for installing the heat dissipation fan 13.

[0049] Since a plurality of heat dissipation fins 6 are connected in rows, and the heat dissipation fan 13 has a certain width dimension, and furthermore, in order to further enhance the heat dissipation effect of the heat dissipation fins 6, the heat dissipation fan 13 is preferably installed in the heat dissipation fins 6; specifically, corresponding installation grooves can be respectively opened on all the heat dissipation fins 6, and the heat dissipation fan 13 is installed in the installation grooves; alternatively, corresponding installation grooves can be opened on some of the heat dissipation fins 6, and since the installation grooves communicate with each other, a heat dissipation fan 13 installation position for installing the heat dissipation fan 13 can be formed. In order to install a plurality of heat dissipation fans 13, multiple groups of installation grooves need to be opened on the heat dissipation fins 6, and each group of installation grooves communicates with each other. Each group of installation grooves is used to install a heat dissipation fan 13, so that a plurality of heat dissipation fans 13 can be installed on the heat dissipation structure.

[0050] As a preferred embodiment, at least some areas of the heat dissipation fin 6 are provided with corresponding installation holes, and a plurality of installation holes communicate with each other to form a heat pipe 7 installation position for installing the heat pipe 7, so that the second end of the heat pipe 7 can be inserted into some of the heat dissipation fins 6.

[0051] The heat pipe 7 can be connected to the heat dissipation fin 6, and is used to transfer the heat on the heat transfer base 12 to the heat dissipation fin 6 through the heat pipe 7, and then the heat on the heat dissipation fin 6 is blown away by a plurality of heat dissipation fans 13 in the heat dissipation fin 6; therefore, in order to strengthen the stable connection between the heat pipe 7 and the heat dissipation fin 6, corresponding installation holes are opened on the heat dissipation fin 6, and a plurality of installation holes form a heat pipe 7 installation position for installing the heat pipe 7. The second end of the heat pipe 7 extends along the heat pipe 7 installation position and is fixedly connected to the heat pipe 7 installation position; here, the installation position of the heat pipe 7 is not specifically limited, it can be the bottom of the heat dissipation fin 6 or other positions of the heat dissipation fin 6. Preferably, as described below, the heat pipe 7 is located at the bottom of the heat dissipation fin 6, which can avoid interference with the heat dissipation fan 13, and because the first end of the heat pipe 7 is connected to the bottom of the heat transfer base 12 and the first end is also connected to the bottom of the heat dissipation fin 6, it can make the extension direction of the heat pipe 7 on the same horizontal line, protect the heat pipe 7 from bending, facilitate the heat transfer of the heat pipe 7, and also further protect the heat pipe 7 from damage and improve the service life of the heat pipe 7.

[0052] As a preferred embodiment, one side of the heat transfer base 12 has a plurality of grooves for connecting the heat pipes 7. A connection hole is formed on the side of the housing 1 facing the heat dissipation assembly. The first end of the heat pipe 7 can be embedded in the groove through the connection hole, and the second end of the heat pipe 7 can be embedded in the mounting hole of the radiator fin.

[0053] To strengthen the connection between the heat pipe 7 and the heat transfer base 12, a plurality of grooves for installing the heat pipe 7 are formed on one side of the heat transfer base 12. The grooves can be circular grooves adapted to the diameter size of the heat pipe 7. A connection hole is formed on the side of the housing 1 corresponding to the groove, so that the heat pipe 7 can enter the groove on one side of the heat transfer base 12 through the connection hole. The second end of the heat pipe 7 is inserted and connected into the groove to realize the connection and fixation of the plurality of heat pipes 7 and the heat transfer base 12, thereby further enhancing the connection strength between the heat transfer base 12 and the heat pipe 7, further enhancing the heat transfer efficiency of the heat transfer base 12 transferred to the heat pipe 7, facilitating the rapid dissipation of the heat inside the inverter, reducing the temperature inside the housing 1, reducing the operating temperature of the internal components, and thus improving the energy conversion efficiency.

[0054] Further, as Figure 1 shown, at least one side of the heat sink fin 6 assembly is provided with the cooling fan 13; the heat pipe 7 is connected below the heat sink fin 6 assembly.

[0055] The cooling fan 13 is arranged on at least one side of the heat sink fin 6 assembly. Preferably, the cooling fan 13 is arranged on the side of the heat sink fin 6 assembly facing the outside of the housing 1 and is arranged at intervals along the length direction of the heat sink fin 6 assembly. To enhance the connection strength between the heat pipe 7, the heat sink fin 6 and the heat transfer base 12, and to avoid bending of the heat pipe 7 during extension, the second end of the heat pipe 7 is connected between the bottom of the heat sink fin 6 assembly and the heat transfer base 12, so that the heat pipe 7 transfers the heat in the heat transfer base 12 to the heat sink fin 6 assembly, and then the heat in the heat sink fin 6 assembly is blown away by the cooling fan 13, thereby reducing the heat in the heat sink fin 6 assembly, reducing the temperature of the entire inverter, being able to quickly dissipate the heat of the inverter and its internal components, quickly reducing the temperature inside the housing 1, and thus ensuring the stable operation of the inverter and ensuring the service life of the inverter.

[0056] As a preferred embodiment, as Figure 2 shown, the integrated circuit assembly includes a capacitor board 2, a power board 3, an inductor 5 and a communication board 9; a first installation position and a second installation position are formed on the first side of the heat transfer base 12, a third installation position and a fourth installation position are formed on the second side of the heat transfer base 12, the capacitor board 2 is connected to the first installation position, the power board 3 is connected to the second installation position; the inductor 5 is connected to the third installation position; the communication board 9 is connected to the fourth installation position.

[0057] On the first side of the heat transfer base 12, a first mounting position and a second mounting position are provided. On the second side of the heat transfer base 12, a third mounting position and a fourth mounting position are provided, which can integrally connect the capacitor plate 2, the power board 3, the inductor 5, and the communication board 9 to various positions of the heat transfer base 12. In the first mounting position, threaded holes are provided on the heat transfer base 12, and corresponding holes are provided at the four corners of the capacitor plate 2, so that the heat transfer base 12 can be threadedly connected to the capacitor plate 2. Similarly, the power board 3, the inductor 5, and the communication board 9 are threadedly connected to the heat transfer base 12 to prevent interference with each other. Moreover, since they are connected to the heat transfer base 12 and covered inside the housing 1, the housing 1 is made of an aluminum alloy structure. With such a setting, the electronic components are sealed in the housing 1 made of aluminum alloy that can achieve heat dissipation, so that the device has a high protection level, and can effectively shield the electromagnetic interference (EMI) generated by the high-frequency signal switch inside the housing 1 from the outside, and at the same time also has better electromagnetic compatibility performance (EMC).

[0058] As a preferred embodiment, as Figure 3 and Figure 4 shown, the integrated circuit assembly further includes a main control board 4, a terminal block 10, and a power device 11; the four corners of the main control board 4 are threadedly connected to the power board 3 through connectors, and the main control board 4 can cover a part of the area above the power board 3; the terminal block 10 is adhesively connected to a corner of the heat transfer base 12; the heat dissipation surface of the power device 11 is adhesively connected to the heat transfer base 12.

[0059] Due to the vulnerability of the power device 11 itself, using the high thermal conductivity of the heat pipe 7 far higher than that of metals (copper, aluminum), the heat of the main heat source (power device 11) is directly transferred outside the housing 1 and then dissipated, which can effectively reduce the temperature of the power device 11, effectively reduce the performance degradation and failures caused by overheating, and extend the product life.

[0060] Furthermore, as Figure 4 shown, the pins of the power device 11 are bent in an L shape, and the bent ends of the pins extend upward so that the heat dissipation surface of the power device 11 is parallel to the heat dissipation bottom plate 103.

[0061] The power device 11 is welded to the heat transfer base 12. As Figure 4 shown, the power device 11 faces downward, and the pins of the power device 11 are bent in an L shape at 90°, so that the heat dissipation surface of the power device 11 is parallel to the heat transfer base 12. The heat dissipation surface of the power device 11 is adhesively mounted to the heat transfer base 12, and the other side of the heat transfer base 12 is adhesively mounted to the bottom plate 103 of the housing 1 made of aluminum alloy with heat dissipation function.

[0062] As a preferred embodiment, as Figure 1 shown, the cover body includes a top plate 101 and a side plate 102 which are connected; the side plate 102 is connected to the peripheral side of the bottom plate 103, the top plate 101 is connected to the top of the side plate 102, and the top plate 101, the side plate 102 and the bottom plate 103 adopt an aluminum alloy structure.

[0063] The top plate 101, the side plate 102 and the bottom plate 103 form a sealed housing 1. A heat transfer base 12 is connected inside the bottom plate 103, which is used to transfer the heat inside the housing 1 to the heat dissipation component through the heat pipe 7 connected to the heat transfer base 12 for heat dissipation, so as to reduce the heat of the entire inverter. In order to enhance the heat dissipation function of the top plate 101, the side plate 102 and the bottom plate 103, the top plate 101, the side plate 102 and the bottom plate 103 adopt an aluminum alloy structure. In order to enhance the connection strength between the top plate 101, the side plate 102 and the bottom plate 103, and at the same time ensure the performance of being detachable and convenient for maintenance, the top plate 101, the side plate 102 and the bottom plate 103 are fixedly connected by bolts.

[0064] What is not described in this utility model can be realized by adopting or referring to the existing technology.

[0065] Each embodiment in this specification is described in a progressive manner. The same or similar parts among the embodiments can be referred to each other, and the key point of each embodiment is to illustrate the differences from other embodiments.

[0066] The above are only the embodiments of the present utility model, and are not used to limit the present utility model. For those skilled in the art, various changes and modifications can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the scope of the claims of the present utility model.

Claims

1. An inverter heat dissipation structure, characterized in that, It includes a housing, a heat dissipation assembly and a fan; the housing includes a bottom plate and a cover body connected to each other; the cover body is buckled on the top of the bottom plate; A heat transfer base is connected to the bottom plate, an integrated circuit component is connected to the heat transfer base in the cover body, a heat dissipation component mounting position for mounting a heat dissipation component is provided on the heat transfer base outside the cover body, and a fan mounting position for mounting a plurality of fans is provided on a side of the shell corresponding to the heat dissipation component, so as to bring the heat in the shell out of the shell; the heat dissipation component includes a plurality of heat pipes, and a first end of the heat pipe can extend to the inside of the shell and connect to the heat transfer base, so as to bring the heat in the integrated circuit component on the heat transfer base out of the shell.

2. The heat dissipation structure of an inverter according to claim 1, wherein The heat dissipation assembly also includes a heat dissipation fin assembly and a plurality of heat dissipation fans; the heat dissipation fin assembly includes a plurality of heat dissipation fins connected in a row, and the heat dissipation fans are connected to some of the heat dissipation fins.

3. The inverter heat dissipation structure according to claim 2, characterized in that, At least a portion of the heat dissipation fins are provided with corresponding mounting grooves, and a plurality of the mounting grooves are connected to form a heat dissipation fan mounting position for mounting the heat dissipation fan.

4. The inverter heat dissipation structure according to claim 2, characterized in that, At least part of the heat dissipation fins are provided with corresponding mounting holes, and a plurality of the mounting holes are connected to form a heat pipe mounting position for mounting the heat pipe, so that the second end of the heat pipe can be installed in part of the heat dissipation fins.

5. The heat dissipation structure of an inverter according to claim 4, characterized in that, One side of the heat transfer base has a plurality of grooves for connecting the heat pipes, and a connecting hole is provided on the side of the shell facing the heat dissipation component. The first end of the heat pipe can be embedded in the groove by passing through the connecting hole, and the second end of the heat pipe can be embedded in the mounting hole of the radiator.

6. The inverter heat dissipation structure according to claim 2, wherein, The heat dissipation fan is disposed on at least one side of the heat dissipation fin assembly, and the heat pipe is connected below the heat dissipation fin assembly.

7. The heat dissipation structure of an inverter according to claim 1, characterized in that, The integrated circuit component includes a capacitor plate, a power plate, an inductor and a communication board; a first mounting position and a second mounting position are opened on the first side of the heat transfer base, and a third mounting position and a fourth mounting position are opened on the second side of the heat transfer base. The capacitor plate is connected to the first mounting position, and the power plate is connected to the second mounting position; the inductor is connected to the third mounting position; and the communication board is connected to the fourth mounting position.

8. The inverter heat dissipation structure according to claim 7, characterized in that, The integrated circuit assembly also includes a main control board, a terminal block and a power device; the four corners of the main control board are threadedly connected to the power board through connectors, which can cover a partial area above the power board; the terminal block is fitted and connected to a corner of the heat transfer base; the heat dissipation surface of the power device is fitted and connected to the heat transfer base.

9. A heat dissipation structure of an inverter according to claim 8, characterized in that, The pins of the power device are bent in an L shape, and the bent ends of the pins extend upward so that the heat dissipation surface of the power device is parallel to the heat dissipation bottom plate.

10. The inverter heat dissipation structure according to claim 1, characterized in that, The cover body comprises a top plate and side plates connected to each other; the side plates are connected to the peripheral side of the bottom plate, the top plate is connected to the top of the side plates, and the top plate, the side plates and the bottom plate are made of aluminum alloy structure.

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