Combination device

Abstract

The coupling device includes: a stage that supports a coupling target; a lower transmissive member adjacent to the stage in the first direction; an upper transmissive member spaced apart from the lower transmissive member in the first direction; a chamber between the lower transmissive member and the upper transmissive member and partially defining an internal space for accommodating air; a film between the chamber and the lower transmissive member, defining an internal space together with the chamber, and configured to deform according to expansion of the internal space as air is introduced; and a vertical moving member configured to move the lower transmissive member in the first direction, and being separable from the lower transmissive member.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2023 - 0098315, filed on July 27, 2023, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical field

[0003] The present disclosure generally relates to bonding devices. Background art

[0004] With the development of information technology, the importance of display devices as a connection medium between users and information is increasing. Accordingly, display devices such as liquid crystal display devices, organic light - emitting display devices, and inorganic light - emitting display devices are increasingly used.

[0005] In an example, a display panel may be formed by transferring light - emitting elements onto a substrate having thin - film transistors formed thereon, and a display device including the formed display panel may be used.

[0006] Meanwhile, a process of bonding light - emitting elements may be performed in order to reduce the resistance in a region where the thin - film transistors and the light - emitting elements are connected to each other in the process of manufacturing the display panel as described above.

[0007] The above information disclosed in this background art section is only for enhancing the understanding of the background of the present disclosure and thus may include information that does not form the prior art. Summary of the utility model

[0008] Embodiments provide a bonding device capable of applying pressure to a bonding target with improved reliability and an operation method thereof. For example, in the bonding device and the operation method thereof, even when the stage is inclined with respect to a plane, substantially uniform pressure can be applied to the bonding target.

[0009] According to an aspect of the present disclosure, there is provided a bonding device including: a stage for supporting a bonding target; a lower transmissive member adjacent to the stage in a first direction; an upper transmissive member spaced apart from the lower transmissive member in the first direction; a chamber between the lower transmissive member and the upper transmissive member and partially defining an internal space for accommodating air; a film between the chamber and the lower transmissive member, defining the internal space together with the chamber, and configured to deform according to the expansion of the internal space as air is introduced; and a vertical moving member configured to move the lower transmissive member in the first direction and capable of being separated from the lower transmissive member.

[0010] The bonding device may further include: a first retainer between the lower transmissive member and the film on a first side of the chamber, and a second retainer between the lower transmissive member and the film on a second side of the chamber, wherein a first surface of the first retainer facing the internal space has a first inclination angle with respect to the film before the internal space expands, and wherein a second surface of the second retainer facing the internal space has a second inclination angle with respect to the film before the internal space expands.

[0011] The thickness of the first retainer may gradually increase in a direction toward the first side of the chamber, and the thickness of the second retainer may gradually increase in a direction toward the second side of the chamber.

[0012] The bonding device may further include: vertical support members spaced apart from each other in a second direction intersecting the first direction, with the lower transmissive member interposed therebetween, wherein the vertical moving member is configured to move along one or more of the vertical support members in the first direction.

[0013] The film may be configured to apply pressure to the lower transmissive member according to the expansion of the internal space after the lower transmissive member is separated from the vertical moving member.

[0014] The lower transmissive member may be configured to contact the bonding target or the stage according to the pressure applied by the film without support from the vertical moving member.

[0015] The lower transmissive member may be inclined with respect to a plane at an angle at which the stage is inclined with respect to the plane.

[0016] The lower transmissive member may include: lower transmissive members spaced apart from each other in a second direction intersecting the first direction, and a coupling member connecting the lower transmissive members to each other.

[0017] The film may be configured to apply pressure to the lower transmissive member according to the expansion of the internal space after the lower transmissive member is separated from the vertical moving member.

[0018] The lower transmissive member may be inclined with respect to a plane at an angle at which the stage is inclined with respect to the plane.

[0019] The bonding device may further include: a heat source spaced apart from the upper transmissive member in a first direction, overlapping the stage in the first direction, and configured to irradiate light that passes through the upper transmissive member and the lower transmissive member in a direction opposite to the first direction.

[0020] According to another aspect of the present disclosure, a method of operating a bonding apparatus including a stage is provided, the method including: providing a chamber and a film on the stage that define an internal space for accommodating air; moving a lower transmissive member in a first direction using a vertical moving member between the stage and the film; positioning a bonding target on an upper surface of the stage facing the lower transmissive member; separating the lower transmissive member from the vertical moving member by moving the vertical moving member; transmitting pressure to the bonding target through the lower transmissive member by expanding the internal space as air is introduced; and irradiating light through the lower transmissive member.

[0021] The bonding apparatus may further include: an upper transmissive member, between a heat source for irradiating light and the chamber, wherein light is provided from the heat source to the bonding target through the upper transmissive member and the lower transmissive member.

[0022] The method may further include applying pressure to the lower transmissive member via the film according to the expansion of the internal space after the lower transmissive member is separated from the vertical moving member.

[0023] The lower transmissive member may contact the bonding target or the stage according to the pressure applied by the film without support from the vertical moving member.

[0024] The lower transmissive member may include: lower transmissive members spaced apart from each other in a second direction intersecting the first direction; and a coupling member connecting the lower transmissive members to each other.

[0025] The method may further include: applying pressure to each of the lower transmissive members via the film according to the expansion of the internal space after the lower transmissive member is separated from the vertical moving member. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Embodiments will now be described more fully hereinafter with reference to the accompanying drawings. However, the embodiments may be implemented in different forms and should not be construed as limited to the aspects set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the embodiments to those skilled in the art.

[0027] In the drawing figures, dimensions may be exaggerated for clarity. It will be understood that when an element is referred to as being “between” two elements, it can be the only element between the two elements, or there can also be one or more intervening elements. The same reference numerals always denote the same elements.

[0028] Figure 1 is a front view showing a bonding apparatus according to one or more embodiments of the present disclosure.

[0029] Figure 2 is a view showing Figure 1 any one of the holders shown in

[0030] Figure 3 is a perspective view showing Figure 1 any one of the vertical moving members shown in and the corresponding vertical support member thereof.

[0031] Figure 4 is a front view showing Figure 1 an example of the bonding device shown in in the process of pressing a bonding target through a lower transmissive member.

[0032] Figure 5 is a view showing Figure 1 another example of the bonding device shown in in the process of pressing a bonding target through a lower transmissive member.

[0033] Figure 6 is a front view showing one or more other embodiments of the bonding device.

[0034] Figure 7 is a flowchart showing a method of operating a bonding device according to one or more embodiments of the present disclosure. Detailed Description of Embodiments

[0035] Aspects of some embodiments of the present disclosure and methods of implementing them can be more easily understood by referring to the detailed description of the embodiments and the accompanying drawings. The described embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey the aspects of the present disclosure to those skilled in the art. Accordingly, processes, elements, and techniques that are redundant, not relevant to the description of the embodiments, or unnecessary for those of ordinary skill in the art to fully understand the aspects of the present disclosure may be omitted. Unless otherwise noted, throughout the drawings and the written description, the same reference numerals, characters, or combinations thereof represent the same elements, and thus, their repeated description may be omitted.

[0036] The described embodiments may have various modifications and may be implemented in different forms, and should not be construed as limited to the embodiments shown herein. The use of "can", "may", or "may not" in describing the embodiments corresponds to one or more embodiments of the present disclosure. The present disclosure encompasses all modifications, equivalents, and alternatives within the spirit and scope of the present disclosure. In addition, each of the features of the various embodiments of the present disclosure can be partially or fully combined with each other, and various interlocks and drives are technically possible. Each embodiment can be implemented independently of each other, or can be implemented in association with each other.

[0037] For ease of explanation, spatial relative terms such as "below", "beneath", "lower", "underside", "under", "above", "upper", "upside" etc. may be used herein to describe the relationship of one element or feature to another (or other) element or feature as shown in the figures. It will be understood that the spatial relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, an element described as "below", "beneath" or "under" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary terms "below" and "beneath" can encompass both an orientation of above and below. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and the spatial relative descriptors used herein should be interpreted accordingly. Similarly, when a first part is described as disposed "on" a second part, this means that the first part is disposed at the upper side or the lower side of the second part based on the direction of gravity, and is not limited to its upper side.

[0038] It will be understood that when an element, layer, region or component is referred to as "formed on", "on", "connected to" or "(operatively or communicatively) coupled to" another element, layer, region or component, it may be directly formed on, directly on, directly connected to or directly coupled to the other element, layer, region or component, or indirectly formed on, indirectly on, indirectly connected to or indirectly coupled to the other element, layer, region or component, such that there may be one or more intervening elements, layers, regions or components. Further, this may collectively mean direct coupling or direct connection or indirect coupling or indirect connection and integral coupling or integral connection or non-integral coupling or non-integral connection. For example, when a layer, region or component is referred to as "electrically connected" or "electrically coupled" to another layer, region or component, it may be directly electrically connected or directly electrically coupled to the other layer, region and / or component, or there may be one or more intervening layers, regions or components. One or more intervening components may include switches, resistors, capacitors, etc. When describing embodiments, unless explicitly described as a direct connection, the expression of connection indicates an electrical connection, and "direct connection / direct coupling" or "directly on" means that one component is directly connected or directly coupled to another component or directly on another component without an intermediate component.

[0039] In addition, in this specification, when a part of a layer, film, region, plate, etc. is formed on another part, the forming direction is not limited to the upward direction, but includes forming the part on a side surface or in a downward direction. Conversely, when a part of a layer, film, region, plate, etc. is formed "under" another part, this includes not only the case where the part is "directly under" the other part, but also the case where there is another part between the part and the other part. At the same time, other expressions describing the relationship between components such as "between", "directly between", or "adjacent to" and "directly adjacent to" can be similarly interpreted. It will be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or there can also be one or more intermediate elements or layers.

[0040] For the purposes of this disclosure, when an expression such as "at least one of", "any one of", or "one or more of" is located after a list of elements, it modifies the entire list of elements and not an individual element in the list. For example, "at least one of X, Y, and Z", "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, any combination of two or more of X, Y, and Z (such as, for example, XYZ, XYY, YZ, and ZZ), or any variation thereof. Similarly, an expression such as "at least one of A and B" can include A, B, or A and B. As used herein, "or" generally means "and / or", and the term "and / or" includes any and all combinations of one or more of the associated listed items. For example, an expression such as "A and / or B" can include A, B, or A and B. Similarly, when expressions such as "at least one of", "a plurality of", "one of", and other prepositional phrases are located before / after a list of elements, they modify the entire list of elements and not an individual element in the list.

[0041] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms do not correspond to a particular order, position, or preference, and are used only to distinguish one element, member, component, zone, region, layer, segment, or section from another. Thus, without departing from the spirit and scope of the present disclosure, the first element, first component, first region, first layer, or first section described below may be referred to as the second element, second component, second region, second layer, or second section. Describing an element as a "first" element does not require or imply the existence of a second element or other elements. The terms "first", "second", etc. may also be used herein to distinguish different categories or groups of elements. For the sake of brevity, the terms "first", "second", etc. may respectively represent "first category (or first group)", "second category (or second group)", etc.

[0042] In an example, the x-axis, y-axis, and / or z-axis are not limited to the three axes of a rectangular coordinate system and may be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. This also applies to the first direction, second direction, and / or third direction.

[0043] The terms used herein are for the purpose of describing embodiments only and are not intended to limit the present disclosure. As used herein, the singular forms "a" and "an" are intended to also include the plural forms, and the plural forms are also intended to include the singular forms, unless the context clearly indicates otherwise. It will also be understood that when used in this specification, the terms "comprises", "comprising", "have", "having", "includes", and "including" specify the presence of the stated features, wholes, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, elements, components, and / or groups thereof.

[0044] When one or more embodiments can be implemented differently, a particular process order may be performed differently from the described order. For example, two consecutively described processes may be performed substantially simultaneously, or in an order opposite to the described order.

[0045] As used herein, the terms "substantially", "about", "approximate" and similar terms are used as approximating terms and not as terms of degree, and are intended to allow for the inherent deviations of measured or calculated values recognized by those of ordinary skill in the art. For example, "substantially" may include a range of + / - 5% of the corresponding value. Given the measurements discussed and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system), "about" or "approximate" as used herein includes the stated value and means within an acceptable deviation of the particular value determined by those of ordinary skill in the art. For example, "about" may mean within one or more standard deviations, or within + / - 30%, 20%, 10%, 5% of the stated value. Additionally, when describing embodiments of the present disclosure, the use of "may" refers to "one or more embodiments of the present disclosure".

[0046] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the relevant art and / or the context of this specification, and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0047] In addition, embodiments of the present disclosure are described herein with reference to schematic illustrations of ideal embodiments (and intermediate structures) thereof, such that variations in the shapes as illustrated may be expected due to, for example, manufacturing techniques and / or tolerances. Additionally, for purposes of clarity and / or description, the relative dimensions of elements, layers, and regions may be exaggerated. Accordingly, embodiments of the present disclosure should not be limited to the particular shapes of the regions shown herein, but include shape deviations caused by, for example, manufacturing techniques. The regions shown in the figures are schematic in nature, and their shapes do not represent the actual shape of the regions of the device and do not limit the scope of the present disclosure.

[0048] Figure 1 is a front view showing a bonding device according to one or more embodiments of the present disclosure.

[0049] Referring to Figure 1 , the bonding device 100 may include a stage 110, a lower transmissive member 120, (a plurality of) vertical support members 130, (a plurality of) horizontal support members 140, an upper transmissive member 150, a chamber 160, (a plurality of) vertical moving members 170, and a heat source 180.

[0050] The stage 110 may have an upper surface extending in a first direction DR1 and in a second direction DR2 that intersects the first direction DR1.

[0051] The upper surface of the stage 110 may be configured as a flat plate shape, but embodiments of the present disclosure are not limited thereto.

[0052] The stage 110 may be configured as a three-dimensional shape extending in a third direction DR3 that intersects the first direction DR1 and the second direction DR2. For example, the stage 110 may have a rectangular parallelepiped shape or a hexahedron shape, but embodiments of the present disclosure are not limited thereto.

[0053] The bonding target 10 (see Figure 4 ) may be mounted on the upper surface of the stage 110.

[0054] The lower transmissive member 120 may have upper and lower surfaces extending in the first direction DR1 and in the second direction DR2.

[0055] The upper and lower surfaces of the lower transmissive member 120 may be configured as flat plate shapes, but embodiments of the present disclosure are not limited thereto.

[0056] The lower transmissive member 120 may be configured as a three-dimensional shape extending in the third direction DR3. For example, the lower transmissive member 120 may have a rectangular parallelepiped shape or a hexahedron shape, but embodiments of the present disclosure are not limited thereto.

[0057] The lower surface of the lower transmissive member 120 and the upper surface of the stage 110 may be adjacent to each other in the third direction DR3.

[0058] The lower transmissive member 120 may be detachable from the (multiple) vertical moving members 170. According to this configuration, if light is irradiated from the heat source 180, it is possible to control the lower transmissive member 120 to contact the bonding target or the stage 110 without being connected to another component. Therefore, if the stage 110 is inclined with respect to a plane extending in the first direction DR1 and in the second direction DR2, the lower transmissive member 120 may also be inclined at the same angle as the stage 110.

[0059] The lower transmissive member 120 may be formed of a material having a light transmittance (e.g., the light transmittance of light having a wavelength band irradiated from the heat source 180). For example, materials having a light transmittance may include quartz, glass, etc., but the present disclosure is not limited thereto.

[0060] (Multiple) vertical support members 130 may include a first vertical support member 131 and a second vertical support member 132. The first vertical support member 131 and the second vertical support member 132 may be spaced apart from each other in the second direction DR2. The first vertical support member 131 and the second vertical support member 132 may be spaced apart from each other, and the stage 110, the lower transmissive member 120, the chamber 160, and the upper transmissive member 150 may be interposed therebetween.

[0061] The first vertical support member 131 may extend in the third direction DR3. The first vertical support member 131 may support the first horizontal support member 141 and the first vertical moving member 171. The first vertical support member 131 may have various shapes.

[0062] The second vertical support member 132 may extend in the third direction DR3. The second vertical support member 132 may support the second horizontal support member 142 and the second vertical moving member 172. The second vertical support member 132 may have various shapes.

[0063] (Multiple) horizontal support members 140 may include a first horizontal support member 141 and a second horizontal support member 142.

[0064] The first horizontal support member 141 may extend in the second direction DR2. The first horizontal support member 141 may be coupled to the first vertical support member 131 and may support the chamber 160. The first horizontal support member 141 may have various shapes.

[0065] The second horizontal support member 142 may extend in the second direction DR2. The second horizontal support member 142 may be coupled to the second vertical support member 132 and may support the chamber 160. The second horizontal support member 142 may have various shapes.

[0066] The upper transmissive member 150 may have an upper surface and a lower surface that extend in the first direction DR1 and the second direction DR2.

[0067] The upper surface and the lower surface of the upper transmissive member 150 may be in a flat plate shape, but embodiments of the present disclosure are not limited thereto.

[0068] The upper transmissive member 150 may be provided in a three-dimensional shape that extends in the third direction DR3. For example, the upper transmissive member 150 may have a rectangular parallelepiped shape or a regular hexahedron shape, but embodiments of the present disclosure are not limited thereto.

[0069] The lower surface of the upper transmissive member 150 and the chamber 160 may be adjacent to each other in the third direction DR3.

[0070] The upper transmissive member 150 may be formed of a material having a light transmittance (e.g., the light transmittance of light having a wavelength band irradiated from the heat source 180). For example, materials having a light transmittance may include quartz, glass, etc., but the present disclosure is not limited thereto.

[0071] The chamber 160 may include an air inlet 161, a first retainer 163, and a second retainer 164.

[0072] The chamber 160 is configured to face the bonding target 10 located on the stage 110 (seeFigure 4 ) Apply pressure. The chamber 160 can define an internal space together with the film 162, and the internal space can accommodate a gas (e.g., air) injected through the inlet port 161. Due to the gas injected into the internal space of the chamber 160, the internal space can expand, and thus, the film 162 can be deformed. The gas injected into the internal space of the chamber 160 can include, for example, an inert gas having low reactivity, but embodiments of the present disclosure are not limited thereto. As the gas is injected into the internal space of the chamber 160, the air pressure in the internal space of the chamber 160 can become higher than the atmospheric pressure. In some embodiments, the gas injected into the chamber 160 can be discharged through an outlet port provided in the chamber 160.

[0073] In one or more embodiments, the inlet port 161 can include a valve. When the valve is opened or closed, gas can be injected into the chamber 160, or the injection of the gas can be blocked.

[0074] The film 162 and the chamber 160 can together define the internal space of the chamber 160. The film 162 can be understood as a component included in the chamber 160. The film 162 can be understood as the lower surface of the chamber 160.

[0075] The film 162 can be configured to apply pressure to the bonding target 10 located on the stage 110 (see Figure 4 ) Apply pressure. The film 162 can be formed of an elastic material. For example, the film 162 can include a rubber material and / or a flexible plastic material (e.g., polyimide), but embodiments of the present disclosure are not limited thereto. The film 162 can be deformed due to its elasticity, and thus, if gas is introduced through the inlet port 161, the internal space defined by the chamber 160 and the film 162 can expand. When the film 162 expands, the film 162 can be in surface contact with the upper surface of the lower transmissive member 120. Pressure can be applied to the surface contact area of the lower transmissive member 120 through the expanded film 162. The pressure can be transmitted to the bonding target 10 through the lower transmissive member 120.

[0076] The first holder 163 can be coupled to one side of the chamber 160 facing the first vertical support member 131. The second holder 164 can be coupled to the other side of the chamber 160 facing the second vertical support member 132. The first holder 163 and the second holder 164 can be spaced apart from each other in the second direction DR2, and the film 162 is interposed therebetween.

[0077] The first retainer 163 may be located between the lower transmissive member 120 and the film 162 at one side of the chamber 160. The second retainer 164 may be located between the lower transmissive member 120 and the film 162 at the other side of the chamber 160. Thus, if the film 162 expands, the first retainer 163 and the second retainer 164 may be closely attached to the film 162.

[0078] The portion of the chamber 160 that overlaps with the lower transmissive member 120 and the upper transmissive member 150, and the film 162 may be formed of a material having a light transmittance (e.g., the light transmittance of light having a wavelength band irradiated from the heat source 180). For example, the material having a light transmittance may include quartz, glass, etc., but the present disclosure is not limited thereto. Thus, at least a part of the light irradiated from the heat source 180 may be provided to the bonding target 10 while passing through the upper transmissive member 150, the film 162, and the lower transmissive member 120.

[0079] The (multiple) vertical moving members 170 may include a first vertical moving member 171 and a second vertical moving member 172.

[0080] The (multiple) vertical moving members 170 may be configured to move the lower transmissive member 120. For example, the (multiple) vertical moving members 170 may move (e.g., lift and drive) the lower transmissive member 120 in the third direction DR3 and in the direction opposite to the third direction DR3. The (multiple) vertical moving members 170 may include a motor to move the lower transmissive member 120.

[0081] The first vertical moving member 171 may be coupled to the first vertical support member 131 and may have various shapes. The second vertical moving member 172 may be coupled to the second vertical support member 132 and may have various shapes.

[0082] The first vertical moving member 171 and the second vertical moving member 172 may be spaced apart from each other in the second direction DR2, and the lower transmissive member 120 and the stage 110 may be interposed therebetween.

[0083] The heat source 180 may irradiate light. The light irradiated from the heat source 180 may enter the chamber 160 through the upper surface of the chamber 160 while passing through the upper transmissive member 150. In addition, the light irradiated from the heat source 180 may pass through the film 162 and may enter the bonding target 10 while passing through the lower transmissive member 120. Thus, heat may be applied to the bonding target 10 in the bonding process. In some embodiments, the heat source 180 may irradiate infrared light having a wavelength band longer than the wavelength band of visible light, but the embodiments of the present disclosure are not limited thereto.

[0084] Figure 2 is shown Figure 1A perspective view of any one of the retainers shown in Figure 2 The retainer 200 shown in Figure 1 can be provided as at least one of the first retainer 163 and the second retainer 164 shown in

[0085] Reference Figure 1 and Figure 2 , the retainer 200 can have an inclined surface 210. The inclined surface 210 can be inclined at a first angle AG1 from the bottom surface of the retainer 200 (or the planar direction defined by the first direction DR1 and the second direction DR2).

[0086] The retainer 200 can have various shapes including the inclined surface 210. However, the shape of the retainer 200 is not limited to Figure 2 the shape shown in

[0087] If the film 162 expands due to the air injected into the chamber 160, the inclined surface 210 can be relatively closely attached to the film 162.

[0088] When the film 162 expands, the inclination angle of the inclined surface of the film 162 may not reach the corresponding angle or be greater. For example, the inclination angle of one inclined surface of the film 162 can be equal to (or substantially equal to) the first angle AG1 which is the inclination angle of the retainer 200. In addition, the inclination angle of the other inclined surface of the film 162 can be equal to (or substantially equal to) the first angle AG1 which is the inclination angle of the retainer 200.

[0089] When the retainer 200 is not present in the bonding device 100, the film 162 that expands due to the air injected into the internal space of the chamber 160 can contact the lower transmissive member 120 over a larger area. As the contact surface becomes larger, the pressure per unit area applicable to the bonding process may increase. For example, a higher pressure may be applied to the lower transmissive member 120 by the film 162. To apply a higher pressure, the film 162 may expand further inadvertently due to injecting a corresponding amount of air or more. Due to the expansion of the film 162, the film 162 may be damaged.

[0090] On the other hand, the retainer 200 is disposed at each of one side and the other side of the chamber 160 such that if the internal space of the chamber 160 expands, the film 162 can contact the intended area of the lower transmissive member 120. Therefore, an appropriate amount of air can be injected into the chamber 160 in order to apply the pressure applicable to the bonding process. In addition, the inadvertent expansion of the film 162 can be reduced or prevented.

[0091] Figure 3 is a view showing Figure 1A perspective view of any one of the vertical moving members shown in and its corresponding vertical support member. Figure 1 The first vertical support member 131 and the first vertical moving member 171 shown in can be set to Figure 3 The vertical support member 310 and the vertical moving member 320 shown in. In addition, Figure 1 The second vertical support member 132 and the second vertical moving member 172 shown in can be set to Figure 3 The vertical support member 310 and the vertical moving member 320 shown in.

[0092] Reference Figure 1 and Figure 3 , the vertical moving member 320 can be coupled to the vertical support member 310 in the second direction DR2.

[0093] The vertical moving member 320 can be configured to move the lower transmissive member 120. For example, the upper surface 321 of the vertical moving member 320 can support a part of the lower surface of the lower transmissive member 120. In one or more embodiments, the vertical moving member 320 can include a motor. The vertical moving member 320 can move (e.g., lift and drive) the lower transmissive member 120 in the third direction DR3 and the opposite direction of the third direction DR3.

[0094] The upper surface 321 of the vertical moving member 320 can have various shapes. The shape of the upper surface 321 is not limited to Figure 3 the shape shown in.

[0095] Figure 4 is a front view showing an example of the bonding device in the process of pressing the bonding target through the lower transmissive member. Figure 1 shown in.

[0096] Reference Figure 1 and Figure 4 , the first vertical moving member 171 and the second vertical moving member 172 can move the lower transmissive member 120 in the third direction DR3. The lower transmissive member 120 can be spaced apart from the upper surface of the stage 110. Thus, the bonding target 10 can be located between the lower transmissive member 120 and the upper surface of the stage 110.

[0097] After that, when the valve of the air inlet 161 is opened, air can be injected into the internal space of the chamber 160. As air is injected into the chamber 160, the air pressure inside the chamber 160 can become higher than the atmospheric pressure. Therefore, the film 162 can expand.

[0098] When the film 162 expands, the inclination angles of one inclined surface and the other inclined surface of the film 162 may not exceed the corresponding reference angles. For example, the inclination angle formed by one side of the film 162 with respect to the plane may be substantially equal to the first angle AG1 which is the inclination angle of the first holder 163, and the inclination angle formed by the other side of the film 162 with respect to the plane may be substantially equal to the second angle AG2 which is the inclination angle of the second holder 164.

[0099] The expanded film 162 may contact a part of the upper surface of the lower transmissive member 120 substantially uniformly. The expanded film 162 may apply a substantially uniform pressure to the lower transmissive member 120 in the surface contact area (see the arrows shown in Figure 4 . Thus, the lower transmissive member 120 may apply a substantially uniform pressure to the bonding target 10.

[0100] After that, the heat source 180 may irradiate the light LB. The light LB irradiated from the heat source 180 may reach the bonding target 10 while passing through the upper transmissive member 150, the chamber 160, and the lower transmissive member 120. The light LB may provide heat to the bonding target 10.

[0101] Figure 5 is a diagram showing Figure 1 another example of the bonding apparatus shown in during the process of pressing the bonding target through the lower transmissive member.

[0102] Referring to Figure 5 , the upper surface of the stage 510 may not be parallel to the plane extending in the first direction DR1 and the second direction DR2. For example, as shown in Figure 5 , the upper surface of the stage 510 may be inclined at a third angle AG3 with respect to a surface (e.g., the ground) due to wear, corrosion, etc. in the process.

[0103] According to one or more embodiments of the present disclosure, similar to the stage 510, the lower transmissive member 120 may be inclined at the third angle AG3 with respect to the plane.

[0104] When the lower transmissive member 120 is fixed to an assembly similar to the (multiple) vertical moving members 170, the lower transmissive member 120 may maintain a state parallel to the plane regardless of the inclination of the upper surface of the stage 510 with respect to the plane.

[0105] According to one or more embodiments of the present disclosure, if the internal space of the chamber 160 expands and the lower transmissive member 120 is not fixed to the (multiple) vertical moving members 170, then the lower transmissive member 120 may be inclined at the third angle AG3 with respect to the plane, similar to the stage 510.

[0106] As air is injected into chamber 160, the air pressure inside chamber 160 may become higher than the atmospheric pressure. Accordingly, the film 162 may expand.

[0107] The expanded film 162 may contact a part of the upper surface of the lower transmissive member 120 substantially uniformly. The expanded film 162 may apply a substantially uniform pressure to the lower transmissive member 120 in the surface contact area (see the arrows shown in Figure 5 . Accordingly, the lower transmissive member 120 may apply a substantially uniform pressure to the bonding target 10.

[0108] After that, the heat source 180 may irradiate light LB. The light LB irradiated from the heat source 180 may reach the bonding target 10 while passing through the upper transmissive member 150, the chamber 160, and the lower transmissive member 120. The light LB may supply heat to the bonding target 10.

[0109] Figure 6 is a front view showing one or more other embodiments of the bonding apparatus.

[0110] Referring to Figure 6 , the bonding apparatus 600 may include a stage 110, (a plurality of) lower transmissive members 610, a film 162, an upper transmissive member 150, and a heat source 620. Hereinafter, descriptions of parts overlapping those shown in Figure 1 will be omitted.

[0111] (A plurality of) lower transmissive members 610 may include a plurality of lower transmissive members. For example, as shown in Figure 6 , (a plurality of) lower transmissive members 610 may include a first lower transmissive member 611, a second lower transmissive member 612, and a coupling member 613, but the present disclosure is not limited thereto.

[0112] The first lower transmissive member 611 and the second lower transmissive member 612 may be connected to each other by the coupling member 613. (A plurality of) lower transmissive members 610 may be moved in the third direction DR3 or in a direction opposite to the third direction DR3 by a first vertical movement member 171 and a second vertical movement member 172.

[0113] As air is injected into the internal space of the chamber 160, the air pressure inside the chamber 160 may become higher than the atmospheric pressure. Accordingly, the film 162 may expand.

[0114] The expanded film 162 may contact the upper surface of the first lower transmissive member 611 substantially uniformly. In addition, the expanded film 162 may contact a part of the upper surface of the second lower transmissive member 612 substantially uniformly.

[0115] The inflated film 162 can apply a substantially uniform pressure to the regions in the surface that contacts the first lower transmission member 611 (see the arrows shown in Figure 6 . Thus, the first lower transmission member 611 can apply a substantially uniform pressure to the bonding target 61. In addition, the inflated film 162 can apply a substantially uniform pressure to the regions in the surface that contacts the second lower transmission member 612. Thus, the second lower transmission member 612 can apply a substantially uniform pressure to the bonding target 62.

[0116] The pressure can be applied to the plurality of bonding targets 61 and 62 through the plurality of lower transmission members 611 and 612.

[0117] Figure 7 is a flowchart showing a method of operating a bonding device according to one or more embodiments of the present disclosure.

[0118] Referring to Figure 4 and Figure 7 , in S710, the lower transmission member 120 can be moved between the stage 110 and the film 162 using the vertical movement members 171 and 172.

[0119] In S720, the bonding target 10 can be positioned on the upper surface of the stage 110 facing the lower transmission member 120.

[0120] In S730, the lower transmission member 120 can be separated from the vertical movement members 171 and 172 by moving the vertical movement members 171 and 172.

[0121] In S740, by expanding the internal space of the chamber 160 as air is introduced, pressure can be transmitted to the bonding target 10 through the lower transmission member 120.

[0122] In S750, light LB can be irradiated through the lower transmission member 120.

[0123] Before the internal space of the chamber 160 expands as air is introduced, the vertical movement members 171 and 172 can be separated from the lower transmission member 120 by moving the vertical movement members 171 and 172. Thus, the lower transmission member 120 can apply a substantially uniform pressure to the bonding target 10 based on the expansion of the internal space of the chamber 160. Thus, pressure can be applied to the bonding target 10 with improved reliability.

[0124] According to the present disclosure, a bonding device and a method of operating the same that can apply pressure to a bonding target with improved reliability can be provided.

[0125] Embodiments have been disclosed herein, and although specific terms are used, they are used and are to be interpreted as having only a general and descriptive meaning and not for purposes of limitation. In some instances, as will be apparent to one of ordinary skill in the art at the time of filing this application, unless otherwise expressly indicated, aspects of the description with respect to a particular embodiment may be used alone or in combination with aspects described with respect to other embodiments. Accordingly, those skilled in the art will understand that various changes may be made in form and detail without departing from the spirit and scope of the present disclosure as set forth in the appended claims (the functional equivalents of which are to be included therein).

Claims

1. A combining device, characterized in that, Comprising: a stage, supporting and bonding to a target; a lower transmissive member, adjacent to the stage in a first direction; an upper transmissive member, spaced apart from the lower transmissive member in the first direction; a chamber, between the lower transmissive member and the upper transmissive member, and partially defining an internal space for accommodating air; a thin film, between the chamber and the lower transmissive member, defining the internal space together with the chamber, and configured to deform according to the expansion of the internal space as air is introduced; and a vertically moving member, configured to move the lower transmissive member in the first direction and separable from the lower transmissive member.

2. The combining device according to claim 1, wherein Further comprising: a first retainer, between the lower transmissive member and the thin film on a first side of the chamber, and a second retainer, between the lower transmissive member and the thin film on a second side of the chamber, wherein a first surface of the first retainer facing the internal space has a first inclination angle relative to the thin film before the internal space expands, and wherein a second surface of the second retainer facing the internal space has a second inclination angle relative to the thin film before the internal space expands.

3. The combining device according to claim 2, wherein The thickness of the first retainer gradually increases in a direction towards the first side of the chamber, and wherein the thickness of the second retainer gradually increases in a direction towards the second side of the chamber.

4. The combining device according to claim 1, characterized in that, Further comprising: vertical support members, spaced apart from each other in a second direction intersecting the first direction, with the lower transmissive member interposed therebetween, wherein the vertically moving member is configured to move along one or more of the vertical support members in the first direction.

5. The combining device according to claim 1, wherein The thin film is configured to apply pressure to the lower transmissive member according to the expansion of the internal space after the lower transmissive member is separated from the vertically moving member.

6. The combining device according to claim 5, wherein The lower transmissive member is configured to contact the bonding target or the stage according to the pressure applied by the thin film without support from the vertically moving member.

7. The combining device according to claim 6, characterized in that, The lower transmissive member is inclined at an angle at which the stage is inclined relative to a plane.

8. The combining device according to claim 1, characterized in that, The lower transmissive member includes: lower transmissive members, spaced apart from each other in a second direction intersecting the first direction, and a coupling member, connecting the lower transmissive members to each other.

9. The combining device according to claim 8, characterized in that, The thin film is configured to apply pressure to the lower transmissive member according to the expansion of the internal space after the lower transmissive member is separated from the vertically moving member.

10. The combining device according to claim 9, characterized in that, The lower transmissive member is inclined at an angle at which the stage is inclined relative to a plane.

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