Atomization assembly and electronic atomization device

Abstract

The utility model relates to an atomization assembly and an electronic atomization device, and the atomization assembly comprises a heating part which is used for heating an aerosol generating substrate; the conductive ejector pin is arranged on one side of the heating piece and is provided with a contact surface, and the contact surface is in contact with the heating piece so that the conductive ejector pin can be electrically connected with the heating piece; wherein the contact surface is provided with at least one receding groove which is concave inwards. According to the atomization assembly, due to the fact that the receding groove is formed in the contact face of the conductive ejector pin, the contact area between the contact face and the heating piece is reduced, the contact stress between the conductive ejector pin and the heating piece is reduced, the electrodes on the heating piece are prevented from being damaged by the conductive ejector pin, and the service life of the atomization assembly is prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of atomization, and particularly relates to an atomization component and an electronic atomization device. Background Art

[0002] A sol is a colloidal dispersion system formed by small solid or liquid particles dispersed and suspended in a gas medium. Since an aerosol can be absorbed by the human body through the respiratory system, it provides a new alternative absorption method for users. An atomization device refers to a device that forms an aerosol by heating or ultrasonic means on a stored atomizable medium. The atomizable medium includes a liquid, a gel, a paste, or a solid aerosol generating matrix. Atomizing these media can deliver an inhalable aerosol to the user, replacing the conventional product form and absorption method.

[0003] However, in some existing atomization devices, the method of using a thimble in contact with a heating element to supply power to the heating element is adopted. However, due to the structural defects of the existing thimble, the contact area between the thimble and the heating element is large, and the force-bearing area of the heating element is large, resulting in the heating element being extremely easy to damage, thus affecting the service life of the atomization device. Summary of the Invention

[0004] Based on this, it is necessary to provide an atomization component and an electronic atomization device for the problem that the heating element is easily damaged under the pressure of the thimble.

[0005] An atomization component includes:

[0006] A heating element for heating an aerosol generating matrix; and

[0007] A conductive thimble disposed on one side of the heating element, the conductive thimble having a contact surface, and the contact surface contacting the heating element to electrically connect the conductive thimble and the heating element;

[0008] Wherein, at least one inwardly recessed relief groove is formed in the contact surface.

[0009] In one embodiment, the conductive thimble has a central axis extending in one direction, and the contact surface circumferentially surrounds the central axis.

[0010] In one embodiment, the relief groove extends from one axial end of the conductive thimble towards the other axial end of the conductive thimble.

[0011] In one embodiment, the relief groove spirally extends from one axial end of the conductive thimble around the central axis towards the other axial end of the conductive thimble.

[0012] In one embodiment, a plurality of the relief grooves are formed in the contact surface, and all the relief grooves have the same helix direction and are arranged in parallel.

[0013] In one embodiment, a plurality of the avoidance grooves are formed in the contact surface, and from one axial end of the conductive thimble to the other axial end, some of the avoidance grooves form right-handed threads and some of the avoidance grooves form left-handed threads.

[0014] In one embodiment, the avoidance grooves linearly extend from one axial end of the conductive thimble towards the other axial end along the extension direction of the central axis.

[0015] In one embodiment, a plurality of the avoidance grooves are formed in the contact surface, and all the avoidance grooves are arranged at intervals along the circumferential direction of the conductive thimble. In one embodiment, the surface of the heating element in contact with the conductive thimble is a flat surface.

[0016] An electronic atomization device includes the above atomization assembly, and the electronic atomization device further includes a battery assembly, and the battery assembly is electrically connected to the atomization assembly.

[0017] For the above atomization assembly, since the avoidance grooves formed in the contact surface of the conductive thimble reduce the contact area between the contact surface and the heating element, the contact stress between the conductive thimble and the heating element is reduced, thereby preventing the electrode on the heating element from being damaged by the conductive thimble and prolonging the service life of the atomization assembly. Description of the Drawings

[0018] Figure 1 It is a schematic structural diagram of an electronic atomization device according to an embodiment of the present application.

[0019] Figure 2 is Figure 1 a schematic internal structural diagram of the shown electronic atomization device.

[0020] Figure 3 is an assembly schematic diagram of a conductive thimble and a heating element of the prior art.

[0021] Figure 4 is an assembly schematic diagram of a conductive thimble and a heating element according to the first embodiment of the present application.

[0022] Figure 5 is a schematic diagram of the conductive thimble according to the first embodiment of the present application.

[0023] Figure 6 is an assembly schematic diagram of a conductive thimble and a heating element according to the second embodiment of the present application.

[0024] Figure 7 is a schematic diagram of the conductive thimble according to the second embodiment of the present application.

[0025] Figure 8 is an assembly schematic diagram of a conductive thimble and a heating element according to the third embodiment of the present application.

[0026] Figure 9 Schematic diagram of the conductive thimble according to the third embodiment of the present application.

[0027] Figure 10 Assembly schematic diagram of the conductive thimble and the heating element according to the fourth embodiment of the present application.

[0028] Figure 11 Schematic diagram of the conductive thimble according to the fourth embodiment of the present application.

[0029] Figure 12 Assembly schematic diagram of the conductive thimble and the heating element according to the fifth embodiment of the present application.

[0030] Figure 13 Schematic diagram of the conductive thimble according to the fifth embodiment of the present application.

[0031] Explanation of reference numerals:

[0032] 100, electronic atomization device; 20, atomization component; 21, housing; 212, liquid storage cavity; 214, air flow channel; 23, heating element; 232, substrate; 234, heating body; 236, electrode; 25, conductive thimble; 252, contact surface; 252a, avoidance groove; 40, power supply component. Detailed implementation manners

[0033] To make the above objects, features, and advantages of the present application more obvious and understandable, the following will describe the detailed implementation manners of the present application with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0034] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0035] In addition, if the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0036] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0037] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0038] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for illustrative purposes and do not represent the only implementation.

[0039] Please refer to Figure 1 and Figure 2 , an embodiment of this application provides an electronic atomization device 100 for heating an aerosol-forming substrate to generate an aerosol for user use. The aerosol-forming substrate includes but is not limited to materials for medical, health preservation, health, and beauty purposes. For example, the aerosol-forming substrate is a liquid medicine or an oil.

[0040] The electronic atomization device 100 includes an atomization component 20 and a power supply component 40. The atomization component 20 is used to store the aerosol-forming matrix. The power supply component 40 is connected to one end of the atomization component 20 and electrically connected to the atomization component 20. The atomization component 20 is used to heat and atomize the aerosol-forming matrix under the action of the electric energy of the power supply component 40. The aerosol-forming matrix is heated and atomized to generate aerosol, which flows out of the electronic atomization device 100 for the user to use.

[0041] Further, the atomization component 20 includes a housing 21, a heating element 23, and two conductive thimbles 25. The housing 21 has a liquid storage cavity 212, an atomization cavity communicating with the liquid storage cavity 212, and an air flow channel 214 communicating the atomization cavity with the external atmosphere. The heating element 23 and the conductive thimbles 25 are both received in the atomization cavity. One of the conductive thimbles 25 connects the positive electrode of the heating element 23 to the positive electrode of the power supply component 40, and the other conductive thimble 25 connects the negative electrode of the heating element 23 to the negative electrode of the power supply component 40, thus forming a complete current loop.

[0042] In this way, the aerosol-forming matrix is stored in the liquid storage cavity 212. During the use of the electronic atomization device 100, the aerosol-forming matrix in the liquid storage cavity 212 gradually enters the atomization cavity and contacts the heating element 23. The heating element 23 can heat the aerosol-forming matrix to generate aerosol under the action of the electric energy of the power supply component 40. The aerosol in the atomization cavity can flow out through the air flow channel 214 for the user to use.

[0043] As Figure 4 shown, the heating element 23 includes a substrate 232, a heating body 234, and electrodes 236.

[0044] The substrate 232 is in the shape of a cuboid. The length direction of the substrate 232 extends along the Figure 4 X direction in Figure 4 the figure, the width direction of the substrate 232 extends along the Figure 4 Y direction in the figure, and the height direction of the substrate 232 extends along the

[0045] Z direction in the figure. The substrate 232 is formed of a hard porous structure such as porous ceramic, and has the characteristics of being insulating, high-temperature resistant, and chemically stable while being able to absorb and store the aerosol-forming matrix.

[0046] The heating element 23 includes two electrodes 236, one positive and one negative. Both electrodes 236 are provided on the side surface of the substrate 232 where the heating body 234 is provided. The two electrodes 236 are located at opposite ends of the heating body 234 in the length direction of the substrate 232, and the two electrodes 236 are respectively electrically connected to the two end portions of the heating body 234.

[0047] The conductive thimble 25 is disposed on one side of the heating element 23. The conductive thimble 25 has a contact surface 252. The contact surface 252 contacts the heating element 23 so that the conductive thimble 25 is electrically connected to the heating element 23. At least one inwardly recessed avoidance groove 252a is formed in the contact surface 252. Specifically, the conductive thimble 25 is disposed on one side in the width direction of the base body 232. The conductive thimble 25 contacts the electrode 236 of the heating element 23 through the contact surface 252, and the surface of the electrode 236 contacting the conductive thimble 25 is a plane.

[0048] When a pre-pressure is applied to the conductive thimble 25 towards the electrode 236, since the avoidance groove 252a formed in the contact surface 252 reduces the contact area between the contact surface 252 and the electrode 236, the contact stress between the conductive thimble 25 and the electrode 236 is reduced, thereby preventing the electrode 236 from being damaged by the conductive thimble 25 and extending the service life of the atomization assembly 20.

[0049] In some embodiments, the conductive thimble 25 is a columnar structure made of a conductive material such as stainless steel. The conductive thimble 25 has a central axis extending in one direction, and the extending direction of the central axis is parallel to the height direction of the base body 232. One axial end of the conductive thimble 25 protrudes from the lower surface of the base body 232 to connect to the power supply assembly 40, and the height of the other axial end of the conductive thimble 25 is lower than the upper surface of the base body 232. Wherein, the lower surface of the base body 232 refers to one end face of the base body 232 on the side close to the power supply assembly 40 in the height direction, and the upper surface of the base body 32 refers to one end face of the base body 232 on the side far from the power supply assembly 40 in the height direction.

[0050] Furthermore, the contact surface 252 forms a cylindrical surface around the central axis of the conductive thimble 25 in the circumferential direction, and the cross-section of the conductive thimble 25 perpendicular to the central axis is circular. As a preferred embodiment, the central axis of the conductive thimble 25 is parallel to the width direction of the base body 232. It can be understood that the shape of the conductive thimble 25 is not limited to this, and the cross-section of the conductive thimble 25 perpendicular to the central axis can also be other shapes.

[0051] In some embodiments, the avoidance groove 252a extends from one axial end of the conductive thimble 25 towards the other axial end of the conductive thimble 25, and the length of the avoidance groove 252a in the central axis direction of the conductive thimble 25 is adapted to the length of the electrode 236. The cross-section of the avoidance groove 252a perpendicular to its own extending direction can be in different shapes such as circular arc shape, parabolic shape, tooth shape, etc., which are not limited herein.

[0052] Such as Figure 4 and Figure 5As shown, in some embodiments, the avoidance groove 252a linearly extends from one axial end of the conductive thimble 25 along the extension direction of the central axis towards the other axial end of the conductive thimble 25. Specifically, a plurality of avoidance grooves 252a are formed in the contact surface 252, and all the avoidance grooves 252a are arranged at intervals along the circumferential direction of the conductive thimble 25. Each avoidance groove 252a longitudinally extends along the extension direction of the central axis of the conductive thimble 25, and the distance between every two adjacent avoidance grooves 252a may be the same or different.

[0053] As Figure 6 , Figure 8 and Figure 10 As shown, in some embodiments, the avoidance groove 252a spirally extends from one axial end of the conductive thimble 25 around the central axis towards the other axial end of the conductive thimble 25, and the spiral direction of the avoidance groove 252a can be set as required. Specifically, in some embodiments, a plurality of spirally extending avoidance grooves 252a are formed in the contact surface 252, and all the avoidance grooves 252a have the same spiral direction and are arranged in parallel. In other embodiments, a plurality of spirally extending avoidance grooves 252a are formed in the contact surface 252. From one axial end of the conductive thimble 25 to the other axial end, some of the avoidance grooves 252a form right-handed threads, and some of the avoidance grooves 252a form left-handed threads.

[0054] Table 1-1

[0055]

[0056] As Figure 3 shown, the conductive thimble in the prior art is generally cylindrical, and the contact surface of the conductive thimble is a smoothly extending cylindrical surface without the avoidance grooves in the present application. Specifically, the diameter of the part of the conductive thimble provided with the contact surface is 1.2 mm, and the length of the contact surface is 2.25 mm.

[0057] Combined with Table 1-1, during the simulation test, when the conductive thimble is pre-pressed 0.03 mm downward in the direction perpendicular to the heating element, the effective contact area between the contact surface of the conductive thimble and the electrode can be obtained as 1.0625 mm 2 , the displacement of the conductive thimble is 0.032 mm, the depression depth of the electrode is 0.024 mm, the strain of the electrode is 0.024 mm / mm, and the stress borne by the electrode is 12489 MPa.

[0058] As Figure 4 , Figure 5As shown in the figure, the first embodiment of the present application provides a conductive thimble 25. Multiple sets of avoidance grooves 252a are formed on the contact surface 252 of the conductive thimble 25. The multiple sets of avoidance grooves 252a are spaced and evenly arranged along the circumferential direction of the conductive thimble 25. Each set of avoidance grooves 252a includes two avoidance grooves 252a spaced along the circumferential direction of the conductive thimble 25. Each avoidance groove 252a extends longitudinally along the axial direction of the conductive thimble 25, and the distance between adjacent two sets of avoidance grooves 252a is greater than the distance between the two avoidance grooves 252a in the same set.

[0059] Specifically, the width H1 of each avoidance groove 252a in the circumferential direction of the conductive thimble 25 is 0.0936 mm - 0.2181 mm, and the distance L1 between adjacent two avoidance grooves 252a is 0.1732 mm - 0.2193 mm.

[0060] As shown in Table 1-1, during the simulation test, when the conductive thimble 25 is pre-pressed downward in a direction perpendicular to the electrode 236 and the pre-pressing length is 0.03 mm, the effective contact area between the contact surface 252 and the electrode 236 can be obtained as 0.2731 mm 2 , the displacement of the conductive thimble 25 is 0.030 mm, the depression depth of the electrode 236 is 0.009 mm, the strain of the electrode 236 is 0.029 mm / mm, and the stress borne by the electrode 236 is 4242.3 MPa, which is less than the stress of 12489 MPa borne by the electrode in the prior art.

[0061] Please refer to Figure 6 and Figure 7 , the second embodiment of the present application provides a conductive thimble 25. Only one avoidance groove 252a is formed on the contact surface 252 of the conductive thimble 25. The avoidance groove 252a spirally extends from the axial end of the conductive thimble 25 close to the upper surface of the base 232 along the central axis of the conductive thimble 25 towards the other axial end of the conductive thimble 25. Specifically, the thread width of the avoidance groove 252a is 0.0688 mm, and the thread pitch is 0.2303 mm.

[0062] As shown in Table 1-1, during the simulation test, when the conductive thimble 25 is advanced in a direction parallel to the width direction of the base and the advancement length is 2.64 mm, the interference amount between the conductive thimble 25 and the electrode 236 is 0.02 mm, the depression depth of the electrode 236 is 0.004 mm, the strain of the electrode 236 is 0.014 mm / mm, and the stress borne by the electrode 236 is 2694.3 MPa, which is less than the stress of 12489 MPa borne by the electrode in the prior art.

[0063] Such as Figure 8 、 Figure 9As shown in the figure, the third embodiment of the present application provides a conductive thimble 25. Two relief grooves 252a are formed on the contact surface 252 of the conductive thimble 25. The two relief grooves 252a respectively extend spirally from one axial end of the conductive thimble 25 close to the upper surface of the base 232 along the central axis of the conductive thimble 25 towards the other axial end of the conductive thimble 25, and the two relief grooves 252a are parallel and spaced apart. Specifically, the thread width of each relief groove 252a is 0.0492 mm - 0.1359 mm, and the thread pitch is 0.2276 mm.

[0064] As shown in Table 1-1, during the simulation test, the conductive thimble 25 is advanced in a direction parallel to the width direction of the base with a length of 2.64 mm. The interference amount between the conductive thimble 25 and the electrode 236 is 0.02 mm, the depression depth of the electrode 236 is 0.004 mm, the strain of the electrode 236 is 0.016 mm / mm, and the stress borne by the electrode 236 is 2743.2 MPa, which is less than the stress of 12489 MPa borne by the electrode in the prior art.

[0065] As Figure 10 , Figure 11 As shown in the figure, the fourth embodiment of the present application provides a conductive thimble 25. Three relief grooves 252a are formed on the contact surface 252 of the conductive thimble 25. The three relief grooves 252a respectively extend spirally from the axial end of the conductive thimble 25 close to the upper surface of the base 232 along the central axis of the conductive thimble 25 towards the other axial end of the conductive thimble 25, and the three relief grooves 252a are parallel and spaced apart. Specifically, the thread width of each relief groove 252a is 0.0483 mm - 0.0965 mm, and the thread pitch is 0.2232 mm - 0.238 mm.

[0066] As shown in Table 1-1, during the simulation test, the conductive thimble 25 is advanced in a direction parallel to the width direction of the base with a length of 2.64 mm. The interference amount between the conductive thimble 25 and the electrode 236 is 0.02 mm, the depression depth of the electrode 236 is 0.004 mm, the strain of the electrode 236 is 0.019 mm / mm, and the stress borne by the electrode 236 is 3004.4 MPa, which is less than the stress of 12489 MPa borne by the electrode in the prior art.

[0067] Please refer to Figure 12 , Figure 13, the fifth embodiment of the present application provides a conductive thimble 25. Two relief grooves 252a are formed on the contact surface 252 of the conductive thimble 25. The two relief grooves 252a respectively spiral extend from the axial end of the conductive thimble 25 close to the upper surface of the base body 232 along the central axis of the conductive thimble 25 towards the other axial end of the conductive thimble 25. And from one axial end of the conductive thimble 25 to the other axial end, one of the relief grooves 252a forms a right-handed thread, and the other relief groove 252a forms a left-handed thread. Specifically, the thread width of each relief groove 252a is 0.1 mm - 0.369 mm, and the thread pitch is 0.2311 mm - 0.3 mm.

[0068] As shown in Table 1-1, during the simulation test, when the conductive thimble 25 is pre-pressed downward by 0.03 mm in the direction perpendicular to the electrode 236, the effective contact area between the contact surface 252 and the electrode 236 can be obtained as 0.294 mm 2 , the displacement of the electrode 236 is 0.04 mm, the strain of the electrode 236 is 0.016 mm / mm, and the stress of the electrode 236 is 2884.8 MPa, which is less than the stress of 12489 MPa borne by the electrode in the prior art.

[0069] It can be seen that in the above-mentioned Embodiments 1 to 5, due to the setting of the relief grooves 252a, the stress borne by the electrode 236 is less than the stress borne by the electrode in the prior art, thereby effectively preventing the electrode 236 from being damaged by the conductive thimble 25.

[0070] In summary, for the conductive thimble 25, the atomization assembly 20 and the electronic atomization device 100 of the present application, by providing relief grooves 252a on the contact surface 252 of the conductive thimble 25, the contact area between the contact surface 252 and the electrode 236 is reduced, thereby reducing the contact stress between the conductive thimble 25 and the electrode 236, and further preventing the electrode 236 from being damaged by the conductive thimble 25, and prolonging the service life of the atomization assembly 20.

[0071] The technical features of the above-mentioned embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0072] The above-mentioned embodiments only represent several implementation manners of the present application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several deformations and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. An atomization component, characterized in that, Comprising: A heating element for heating an aerosol-forming substrate; And A conductive thimble provided on one side of the heating element, the conductive thimble having a contact surface that contacts the heating element to electrically connect the conductive thimble to the heating element; Wherein, at least one inwardly recessed avoidance groove is provided on the contact surface.

2. The atomization component according to claim 1, wherein The conductive thimble has a central axis extending in one direction, and the contact surface circumferentially surrounds the central axis.

3. The atomization component according to claim 2, wherein The avoidance groove extends from one axial end of the conductive thimble towards the other axial end of the conductive thimble.

4. The atomization component according to claim 3, wherein The avoidance groove spirally extends from one axial end of the conductive thimble around the central axis towards the other axial end of the conductive thimble.

5. The atomization assembly according to claim 4, wherein A plurality of the avoidance grooves are provided on the contact surface, and all the avoidance grooves have the same helix direction and are arranged in parallel.

6. The atomization component according to claim 4, characterized in that A plurality of the avoidance grooves are provided on the contact surface, and from one axial end of the conductive thimble to the other axial end, some of the avoidance grooves form a right-handed thread and some of the avoidance grooves form a left-handed thread.

7. The atomization component according to claim 2, characterized in that, The avoidance groove linearly extends from one axial end of the conductive thimble along the extension direction of the central axis towards the other axial end of the conductive thimble.

8. The atomization component according to claim 7, wherein A plurality of the avoidance grooves are provided on the contact surface, and all the avoidance grooves are circumferentially spaced apart along the conductive thimble.

9. The atomization component according to any one of claims 1 to 8, characterized in that, The surface of the heating element in contact with the conductive thimble is a plane.

10. An electronic atomization device, characterized in that, Comprising the atomization assembly according to any one of claims 1-9, the electronic atomization device further comprises a battery assembly, and the battery assembly is electrically connected to the atomization assembly.

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