Integrated circuit board processing pin welding device

Abstract

The utility model relates to the technical field of circuit board processing equipment, in particular to an integrated circuit board processing pin welding device, which comprises a workbench, a support arm, an electric push rod and a mounting plate, a supporting arm is connected to one side of the upper surface of the workbench, an electric push rod is connected into the supporting arm in a penetrating mode, and a mounting plate is connected to the bottom of the electric push rod. According to the pin welding device for integrated circuit board processing, smoke generated by welding is sucked into a universal gooseneck pipe by starting an exhaust fan and fed into a water tank, then water is sprayed out of a spraying pipe through a water pump, particles in the smoke are absorbed, the particles are exhausted after being absorbed through an activated carbon adsorption plate, then the smoke is purified through the pin welding device, and the welding quality of the integrated circuit board is improved. The servo motor is started to drive a welded circuit board to rotate to the position below the vertical hopper, one face of the semiconductor chilling plate is refrigerated and conducted to the cold conduction piece, air blown out of the fan is cooled, and the air is blown to the circuit board from the vertical hopper to be rapidly cooled, so that the pin welding device is rapidly cooled.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing equipment, in particular to a pin welding device for integrated circuit board processing. Background Technique

[0002] Integrated circuit boards are made using semiconductor manufacturing processes, with many transistors, resistors, capacitors and other components fabricated on a smaller single-crystalline silicon wafer, and the components are combined into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. In the manufacturing process of integrated circuit boards, a pin welding device is required to weld electronic components onto the integrated circuit board. There are still certain defects in the existing pin welding devices during use, such as;

[0003] Most of the existing pin welding devices directly weld the components on the circuit board. During welding, some fumes will be generated, and these fumes contain a large number of fine metal particles suspended and harmful to the human body. Most of the existing pin welding devices cannot purify the fumes. Moreover, after the pin welding device finishes welding, the circuit board is in a high-temperature state, and it is easy to scald the staff when removing it. Most of the existing pin welding devices do not have a cooling structure. Content of the Utility Model

[0004] The purpose of the utility model is to provide a pin welding device for integrated circuit board processing to solve the problems raised in the above background technique.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A pin welding device for integrated circuit board processing, including: a workbench, a support arm, an electric push rod and a mounting plate;

[0006] One side of the upper surface of the workbench is connected with a support arm, an electric push rod is connected through the support arm, and the bottom of the electric push rod is connected with a mounting plate;

[0007] The bottom of the mounting plate is connected with a welding head. A tin applicator is arranged inside the mounting plate near one side of the welding head, and a purification mechanism is arranged inside the mounting plate near the other side of the welding head. A cooling mechanism is arranged below the welding head. The purification mechanism includes: a universal gooseneck tube, a hose, a water tank, a partition plate, an exhaust fan, a water pump, an infusion tube, a spray tube, a water filtering cotton, a U-shaped plate and an activated carbon adsorption plate. A universal gooseneck tube is connected through the mounting plate near the other side of the welding head. The upper part of the universal gooseneck tube is connected with a hose. The hose penetrates through the inner wall of the support arm and is connected to one side of the support arm. The bottom of the workbench is connected with a water tank, and the end of the hose far from the universal gooseneck tube is connected through and arranged inside the water tank.

[0008] Preferably, a partition plate is connected to the lower part of the inner wall of the water tank, and an exhaust fan is connected to one side of the water tank. The exhaust fan is connected to the bottom of the workbench.

[0009] Preferably, a water pump is connected to the front part of the water tank. One side of the water pump is connected to an infusion pipe. The infusion pipe penetrates through the inner wall of the water tank and is connected to a spray pipe. The spray pipe is connected to the inner walls of the water tank and the partition board. A water filtering cotton is connected to the inner walls of the water tank and the partition board above the spray pipe.

[0010] Preferably, U-shaped plates are connected to both the lower and upper parts of the inner wall of the water tank far from the partition board. An activated carbon adsorption plate is slidably connected inside the U-shaped plates.

[0011] Preferably, the cooling mechanism includes: a support plate, a fixed seat, a servo motor, a driving gear, a driven gear, an L-shaped plate, a vertical hopper, a fan, a heat conduction sheet, a semiconductor refrigeration sheet and a heat dissipation fan. A support plate is arranged in the middle of the upper surface of the workbench. The support plate is arranged below the welding head, and a fixed seat is connected to the upper surface of the support plate;

[0012] A servo motor is embedded in the bottom of the workbench. The output end of the servo motor is connected to a driving gear. One side of the driving gear is meshed with a driven gear. The driven gear is connected to the bottom of the support plate through a bearing penetrating through the inner wall of the workbench.

[0013] Preferably, an L-shaped plate is connected to the rear part of the upper surface of the workbench. A vertical hopper is connected through the L-shaped plate. The vertical hopper is arranged above the support plate, and a fan is connected to the inner wall of the vertical hopper.

[0014] Preferably, a heat conduction sheet is connected through the inner wall of the vertical hopper below the fan. One side of the heat conduction sheet is connected to a semiconductor refrigeration sheet.

[0015] Preferably, a heat dissipation fan is connected to one side of the semiconductor refrigeration sheet.

[0016] Compared with the prior art, the beneficial effects of the present utility model are as follows: For this integrated circuit board processing pin welding device, by starting the exhaust fan, the fumes generated during welding are inhaled into the universal gooseneck tube and sent into the water tank. Then the water pump sprays water from the spray pipe to absorb the particles in the fumes, and then the fumes are discharged after being absorbed by the activated carbon adsorption plate, so that the pin welding device purifies the fumes. By starting the servo motor to drive the already welded circuit board to rotate below the vertical hopper, one side of the semiconductor refrigeration sheet cools, and the heat is conducted to the heat conduction sheet to cool the air blown by the fan, and the cooled air is blown from the vertical hopper to the circuit board for rapid cooling, so that the pin welding device can be rapidly cooled. The specific content is as follows:

[0017] 1. By bending the end of the universal gooseneck tube towards the welding head, then starting the exhaust fan to discharge the air in the water tank, sucking the fumes generated by the welding of the welding head into the universal gooseneck tube, sending them into the water in the water tank through the hose, and then the water pump sending the water in the water tank into the spray pipe and spraying it to sprinkle the fumes, absorb the particles in the fumes, absorb them through the activated carbon adsorption plate, and discharge them from the exhaust fan, so as to purify the fumes by this pin welding device;

[0018] 2. By starting the servo motor to drive the workbench to rotate, rotating the already welded circuit board and its fixed fixing seat under the vertical hopper, starting the fan to suck in external air and blowing it onto the circuit board from the vertical hopper for rapid cooling. If the cooling is slow, power on the semiconductor refrigeration sheet and the radiator fan. One side of the semiconductor refrigeration sheet cools and conducts to the cold conduction sheet to cool the air blown out by the fan, forming cold air to accelerate the cooling, so as to quickly cool this pin welding device. Description of the Drawings

[0019] Figure 1 It is a schematic diagram of the main view cross-section structure of the water tank of the present utility model;

[0020] Figure 2 It is a schematic diagram of the main view structure of the present utility model;

[0021] Figure 3 It is a schematic diagram of the top view cross-section structure of the vertical hopper of the present utility model;

[0022] Figure 4 It is a schematic diagram of the top view structure of the L-shaped plate of the present utility model.

[0023] In the figure: 1. Workbench; 2. Support arm; 3. Electric push rod; 4. Mounting plate; 5. Welding head; 6. Tin applicator; 7. Purification mechanism; 701. Universal gooseneck tube; 702. Hose; 703. Water tank; 704. Partition board; 705. Exhaust fan; 706. Water pump; 707. Liquid delivery pipe; 708. Spray pipe; 709. Water filtering cotton; 710. U-shaped plate; 711. Activated carbon adsorption plate; 8. Cooling mechanism; 801. Support plate; 802. Fixing seat; 803. Servo motor; 804. Driving gear; 805. Driven gear; 806. L-shaped plate; 807. Vertical hopper; 808. Fan; 809. Cold conduction sheet; 810. Semiconductor refrigeration sheet; 811. Radiator fan. Detailed Embodiment

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present utility model.

[0025] Please refer to Figure 1 and Figure 2 ,the present utility model provides a technical solution: a pin soldering device for integrated circuit printed circuit board processing, comprising: a workbench 1, a support arm 2, an electric push rod 3 and a mounting plate 4;

[0026] One side of the upper surface of the workbench 1 is connected with a support arm 2, an electric push rod 3 is connected through the support arm 2, and the bottom of the electric push rod 3 is connected with a mounting plate 4; a soldering head 5 is connected to the bottom of the mounting plate 4, a tin feeder 6 is arranged in the mounting plate 4 on one side close to the soldering head 5, a purification mechanism 7 is arranged in the mounting plate 4 on the other side close to the soldering head 5, and a cooling mechanism 8 is arranged below the soldering head 5. The purification mechanism 7 comprises: a universal gooseneck tube 701, a hose 702, a water tank 703, a partition plate 704, a suction fan 705, a water pump 706, an infusion tube 707, a spray tube 708, a water filtering cotton 709, a U-shaped plate 710 and an activated carbon adsorption plate 711. The universal gooseneck tube 701 is connected through the mounting plate 4 on the other side close to the soldering head 5, the upper part of the universal gooseneck tube 701 is connected with a hose 702, the hose 702 penetrates through the inner wall of the support arm 2 and is connected to one side of the support arm 2, and the bottom of the workbench 1 is connected with a water tank 703. The end of the hose 702 far from the universal gooseneck tube 701 is connected through and arranged in the water tank 703.

[0027] The lower part of the inner wall of the water tank 703 is connected with a partition plate 704, and one side of the water tank 703 is connected with a suction fan 705. The suction fan 705 is connected to the bottom of the workbench 1. The front part of the water tank 703 is connected with a water pump 706, one side of the water pump 706 is connected with an infusion tube 707, the infusion tube 707 penetrates through the inner wall of the water tank 703 and is connected with a spray tube 708, and the spray tube 708 is connected to the inner walls of the water tank 703 and the partition plate 704. The water filtering cotton 709 is connected to the inner walls of the water tank 703 and the partition plate 704 above the spray tube 708. The lower and upper parts of the inner wall of the water tank 703 far from the partition plate 704 are both connected with U-shaped plates 710, and activated carbon adsorption plates 711 are slidably connected in the U-shaped plates 710.

[0028] During specific implementation, water is filled into the water tank 703. The end of the flexible universal gooseneck tube 701 is bent towards the welding head 5. Then, the exhaust fan 705 is started to discharge the air in the water tank 703. The air pressure in the water tank 703 decreases, sucking the fumes generated by the welding of the welding head 5 into the universal gooseneck tube 701 and sending them into the water in the water tank 703 through the hose 702. Then, the water pump 706 sends the water in the water tank 703 into the spray pipe 708 through the infusion pipe 707 and sprays it out to spray the fumes, absorb the particles in the fumes, then filter out the moisture through the water filter cotton 709, absorb it through the activated carbon adsorption plate 711, and discharge it from the exhaust fan 705. After long-term use, the valve on one side of the water tank 703 is opened to discharge the waste water, and the sealed door at the front of the water tank 703 is opened to take out and replace the activated carbon adsorption plate 711, so as to purify the fumes by the pin welding device.

[0029] Refer to Figures 1-4 As can be seen, the cooling mechanism 8 includes: a support plate 801, a fixed seat 802, a servo motor 803, a driving gear 804, a driven gear 805, an L-shaped plate 806, a vertical hopper 807, a fan 808, a heat conduction fin 809, a semiconductor refrigeration chip 810, and a radiator fan 811. A support plate 801 is arranged in the middle of the upper surface of the workbench 1. The support plate 801 is arranged below the welding head 5, and the upper surface of the support plate 801 is connected with a fixed seat 802; a servo motor 803 is embedded at the bottom of the workbench 1. The output end of the servo motor 803 is connected with a driving gear 804. One side of the driving gear 804 is meshed and connected with a driven gear 805. The driven gear 805 is connected to the bottom of the support plate 801 through the inner wall of the workbench 1 by a bearing. The L-shaped plate 806 is connected to the rear part of the upper surface of the workbench 1. A vertical hopper 807 is connected through the L-shaped plate 806. The vertical hopper 807 is arranged above the support plate 801, and a fan 808 is connected to the inner wall of the vertical hopper 807. A heat conduction fin 809 is connected through the inner wall of the vertical hopper 807 below the fan 808. One side of the heat conduction fin 809 is connected with a semiconductor refrigeration chip 810. One side of the semiconductor refrigeration chip 810 is connected with a radiator fan 811.

[0030] During specific implementation, the servo motor 803 is started to drive the driving gear 804 to rotate. The driving gear 804 drives the driven gear 805 to drive the workbench 1 to rotate, rotating the welded circuit board and its fixed fixed seat 802 below the vertical hopper 807. The fan 808 is started to suck external air and blow it onto the circuit board from the vertical hopper 807 for rapid cooling. If there are fewer components welded on the circuit board and the welding is faster, and only the cooling by the fan 808 is slower, the semiconductor refrigeration chip 810 and the radiator fan 811 are powered on. One side of the semiconductor refrigeration chip 810 refrigerates and conducts to the heat conduction fin 809 to cool the air blown out by the fan 808 to form cold air to accelerate cooling. The other side of the semiconductor refrigeration chip 810 generates heat and the heat is dissipated by the radiator fan 811, so as to quickly cool the pin welding device.

[0031] In summary, when using the pin welding device for integrated circuit circuit board processing, first, insert the electronic components on the circuit board, turn the circuit board over with the pins facing up, and fix it in the fixing seat 802. Start the servo motor 803 to rotate it under the welding head 5. The electric push rod 3 extends to press the welding head 5 against the pins. The tin feeder 6 transports the solder wire to contact with the welding head 5. The welding head 5 melts the solder wire and the molten solder flows onto the pins for welding. The fumes generated during welding are sucked away by the universal gooseneck tube 701. The fixing seat 802 moves horizontally to pass the pins under the welding head 5. The electric push rod 3 continuously drives the welding head 5 to move up and down to weld all the pins on the circuit board. After welding, the servo motor 803 operates again to rotate the welded circuit board under the vertical hopper 807. The fan 808 blows air for cooling, and then it rotates out from under the vertical hopper 807 to take out the welded circuit board. Fix the circuit board to be welded in the fixing seat 802 and rotate it under the welding head 5 for welding, and work in a continuous cycle. The content not described in detail in this specification belongs to the prior art well-known to those skilled in the art.

[0032] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or perform equivalent replacements for some technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An integrated circuit board processing pin soldering device, comprising: Workbench (1), support arm (2), electric push rod (3) and mounting plate (4), Characterized in that; One side of the upper surface of the workbench (1) is connected with a support arm (2), an electric push rod (3) is connected through the support arm (2), and the bottom of the electric push rod (3) is connected with a mounting plate (4); The bottom of the mounting plate (4) is connected with a welding head (5). A soldering tin applicator (6) is arranged in the mounting plate (4) on one side close to the welding head (5), and a purification mechanism (7) is arranged in the mounting plate (4) on the other side close to the welding head (5). A cooling mechanism (8) is arranged below the welding head (5). The purification mechanism (7) includes: a universal gooseneck tube (701), a hose (702), a water tank (703), a partition plate (704), a suction fan (705), a water pump (706), an infusion tube (707), a spray tube (708), a water filtering cotton (709), a U-shaped plate (710) and an activated carbon adsorption plate (711). The universal gooseneck tube (701) is connected through the mounting plate (4) on the other side close to the welding head (5). The upper part of the universal gooseneck tube (701) is connected with a hose (702). The hose (702) penetrates through the inner wall of the support arm (2) and is connected to one side of the support arm (2). The bottom of the workbench (1) is connected with a water tank (703). The end of the hose (702) far away from the universal gooseneck tube (701) is connected to the water tank (703).

2. The pin soldering device for processing an integrated circuit circuit board according to claim 1, wherein: The lower part of the inner wall of the water tank (703) is connected with a partition plate (704), and one side of the water tank (703) is connected with a suction fan (705). The suction fan (705) is connected to the bottom of the workbench (1).

3. The pin soldering device for integrated circuit printed circuit board processing according to claim 2, wherein: The front part of the water tank (703) is connected with a water pump (706). One side of the water pump (706) is connected with an infusion tube (707). The infusion tube (707) penetrates through the inner wall of the water tank (703) and is connected with a spray tube (708). The spray tube (708) is connected to the inner walls of the water tank (703) and the partition plate (704). The inner walls of the water tank (703) and the partition plate (704) above the spray tube (708) are connected with a water filtering cotton (709).

4. The pin soldering device for integrated circuit printed circuit board processing according to claim 2, characterized in that: U-shaped plates (710) are connected to the lower part and the upper part of the inner wall of the water tank (703) far away from the partition plate (704). The activated carbon adsorption plates (711) are slidably connected in the U-shaped plates (710).

5. The pin soldering device for integrated circuit printed circuit board processing according to claim 1, wherein: The cooling mechanism (8) includes: a support plate (801), a fixed seat (802), a servo motor (803), a driving gear (804), a driven gear (805), an L-shaped plate (806), a vertical hopper (807), a fan (808), a heat conduction sheet (809), a semiconductor refrigeration sheet (810) and a heat dissipation fan (811). A support plate (801) is arranged in the middle of the upper surface of the workbench (1). The support plate (801) is arranged below the welding head (5), and the upper surface of the support plate (801) is connected with a fixed seat (802); A servo motor (803) is embedded at the bottom of the workbench (1). The output end of the servo motor (803) is connected to a driving gear (804). One side of the driving gear (804) is meshed and connected to a driven gear (805). The driven gear (805) passes through the inner wall of the workbench (1) through a bearing and is connected to the bottom of the support plate (801).

6. The pin soldering device for processing an integrated circuit circuit board according to claim 5, characterized in that: An L-shaped plate (806) is connected to the rear side above the workbench (1). A vertical hopper (807) is connected through the L-shaped plate (806). The vertical hopper (807) is arranged above the support plate (801), and a fan (808) is connected to the inner wall of the vertical hopper (807).

7. The pin soldering device for integrated circuit printed circuit board processing according to claim 6, wherein: A heat conduction sheet (809) is connected through the inner wall of the vertical hopper (807) near the lower side of the fan (808). One side of the heat conduction sheet (809) is connected to a semiconductor refrigeration sheet (810).

8. The pin soldering device for integrated circuit printed circuit board processing according to claim 7, characterized in that: One side of the semiconductor refrigeration sheet (810) is connected to a cooling fan (811).

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