DIP welding selection verification device

Abstract

The utility model provides a DIP welding selection checking device which comprises a supporting assembly, the top of the supporting assembly is provided with a jig assembly, and the jig assembly comprises a jig plate, a receding hole, a detection hole, scale marks, a mounting groove and an electronic level meter. Yielding holes and detection holes are uniformly formed in the upper surface of the jig plate, scale marks are uniformly formed in the upper surface of the jig plate, the scale marks are arranged on one side of the yielding holes, and a mounting groove is formed in the upper surface of the jig plate. The jig plate is placed on the top of the supporting assembly, the levelness of the jig plate is detected through the electronic level meter, the levelness of the supporting assembly can be rapidly detected, the welding precision of DIP selective welding is guaranteed, and the product quality is improved. The position of the welding spot is represented through the detection hole, and the deviation between the coordinate position of the DIP selective welding flux and the preset position is detected through the position of the detection hole, so that the deviation distance is rapidly analyzed, and the DIP selective welding calibration precision is improved.

Description

Technical Field

[0001] The utility model relates to a calibration device, in particular to a DIP selective soldering calibration device, belonging to the technical field of DIP soldering. Background Technique

[0002] As a core connection technology in electronic manufacturing, DIP soldering precisely inserts the pins of electronic components into the holes of the PCB board and uses solder to achieve a firm connection. This technology is widely used in consumer electronics, industrial automation, medical equipment, communication equipment, automotive electronics and other fields, ensuring the performance and reliability of products. The advantages of DIP soldering are its large solder joint contact area, strong seismic resistance, and convenient maintenance and replacement, especially suitable for special components such as high-power, high-frequency, and high-temperature components. With the continuous progress of automation and intelligent manufacturing technologies, the DIP soldering process is developing towards higher efficiency, more environmental protection, and higher precision.

[0003] Before DIP selective soldering, it is necessary to calibrate the position of the nozzle first to ensure that the coordinate accuracy of the flux can reach the required level. Most of the existing coordinate accuracy calibrations of DIP selective soldering flux are manually measured by measuring tools. Measuring multiple points takes a lot of time and the measurement accuracy is insufficient. Therefore, a DIP selective soldering calibration device is proposed. Summary of the Utility Model

[0004] In view of this, the utility model provides a DIP selective soldering calibration device to solve or alleviate one of the technical problems existing in the prior art and at least provide a beneficial option.

[0005] The technical solution of the embodiment of the utility model is realized as follows: A DIP selective soldering calibration device includes a support assembly, and a fixture assembly is arranged on the top of the support assembly. The fixture assembly includes a fixture plate, a relief hole, a detection hole, a scale line, an installation groove and an electronic level;

[0006] The upper surface of the fixture plate is evenly provided with relief holes and detection holes. The upper surface of the fixture plate is evenly provided with scale lines. The scale lines are arranged on one side of the relief holes. An installation groove is opened on the upper surface of the fixture plate, and an electronic level is installed on the inner side wall of the installation groove. By detecting the levelness of the fixture plate through the electronic level, the levelness of the support assembly can be quickly detected, ensuring the soldering accuracy of DIP selective soldering and improving the product quality. During the calibration process, the position of the solder joint is represented by the position of the detection hole, and the deviation between the coordinate position of the DIP selective soldering flux and the preset position is detected by using the position of the detection hole, so as to quickly analyze the deviation distance and improve the calibration accuracy of DIP selective soldering.

[0007] Further preferably: The support assembly includes a bottom plate and a first support plate;

[0008] The upper surface of the bottom plate is fixedly connected with a first support plate.

[0009] Further preferably: A first motor is installed on the front surface of the first support plate.

[0010] Further preferably: The upper surface of the bottom plate is fixedly connected with a first support.

[0011] Further preferably: The output shaft of the first motor is fixedly connected with one end of a threaded rod, and the threaded rod is rotatably connected between the first support plate and the first support.

[0012] Further preferably: The outer side wall of the threaded rod is threadedly connected with a second support plate, and the second support plate is slidably connected to the upper surface of the bottom plate.

[0013] Further preferably: The upper surface of the bottom plate is fixedly connected with a second support, and a guide rod is fixedly connected to the front surface of the second support. The second support plate is slidably connected to the outer side wall of the guide rod.

[0014] Further preferably: A second motor is installed on one side of the first support plate and the second support plate. The output shaft of the second motor is fixedly connected with one side of a sprocket. The sprocket is rotatably connected to one side of the first support plate and the second support plate. A conveyor chain is sleeved on the outer side wall of the sprocket.

[0015] Due to the adoption of the above technical solutions in the embodiments of the present invention, it has the following advantages:

[0016] First, by placing the jig plate on the top of the support assembly and detecting the levelness of the jig plate through an electronic level, the present invention can quickly detect the levelness of the support assembly, ensure the welding accuracy of DIP selective soldering, and improve the product quality.

[0017] Second, by using the detection holes to represent the positions of the solder joints and detecting the deviation between the coordinate positions of the DIP selective soldering flux and the preset positions through the positions of the detection holes, the present invention can quickly analyze the deviation distance and improve the accuracy of DIP selective soldering calibration.

[0018] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments, and features, further aspects, embodiments, and features of the present invention will be readily apparent by reference to the drawings and the following detailed description. Description of the Drawings

[0019] To more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0020] Figure 1 It is a structural diagram of the present utility model;

[0021] Figure 2 It is a rear view structural diagram of the present utility model;

[0022] Figure 3 It is a structural diagram of the fixture assembly of the present utility model;

[0023] Figure 4 It is a structural diagram of the installation groove of the present utility model.

[0024] Reference numerals: 10, support assembly; 11, bottom plate; 12, first support plate; 13, first motor; 14, first support; 15, threaded rod; 16, second support plate; 17, second support; 18, guide rod; 19, second motor; 110, sprocket; 111, conveyor chain; 20, fixture assembly; 21, fixture plate; 22, relief hole; 23, detection hole; 24, scale line; 25, installation groove; 26, electronic level. Detailed implementation manners

[0025] In the following, only some exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present utility model. Therefore, the drawings and the description are considered to be exemplary in nature rather than restrictive.

[0026] The following will describe the embodiments of the present utility model in detail with reference to the drawings.

[0027] As Figures 1 - 4 shown, the embodiment of the present utility model provides a DIP selective soldering verification device, including a support assembly 10. A fixture assembly 20 is provided on the top of the support assembly 10. The fixture assembly 20 includes a fixture plate 21, a relief hole 22, a detection hole 23, a scale line 24, an installation groove 25 and an electronic level 26;

[0028] The upper surface of the jig plate 21 is evenly provided with relief holes 22 and detection holes 23. The upper surface of the jig plate 21 is evenly provided with scale lines 24. The scale lines 24 are arranged on one side of the relief holes 22. An installation groove 25 is provided on the upper surface of the jig plate 21. An electronic level 26 is installed on the inner side wall of the installation groove 25. By detecting the levelness of the jig plate 21 through the electronic level 26, the levelness of the support assembly 10 can be quickly detected, ensuring the welding accuracy of DIP selective soldering and improving product quality. During the calibration process, the position of the solder joint is represented by the position of the detection hole 23. The deviation between the coordinate position of the DIP selective soldering flux and the preset position is detected by using the position of the detection hole 23, so as to quickly analyze the deviation distance and improve the accuracy of DIP selective soldering calibration.

[0029] In this embodiment, specifically: The support assembly 10 includes a bottom plate 11 and a first support plate 12;

[0030] The upper surface of the bottom plate 11 is fixedly connected with a first support plate 12. The first support plate 12 is used to support the first motor 13 and assist in completing the movement of the second support plate 16.

[0031] In this embodiment, specifically: The first motor 13 is installed on the front surface of the first support plate 12.

[0032] In this embodiment, specifically: The upper surface of the bottom plate 11 is fixedly connected with a first support 14. The first support 14 serves to support the threaded rod 15.

[0033] In this embodiment, specifically: The output shaft of the first motor 13 is fixedly connected to one end of the threaded rod 15. The threaded rod 15 is rotatably connected between the first support plate 12 and the first support 14. When the first motor 13 works, it drives the threaded rod 15 to rotate, adjusting the distance between the first support plate 12 and the second support plate 16.

[0034] In this embodiment, specifically: The outer side wall of the threaded rod 15 is threadedly connected with a second support plate 16. The second support plate 16 is slidably connected to the upper surface of the bottom plate 11. The second support plate 16 is driven to move by the rotation of the threaded rod 15.

[0035] In this embodiment, specifically: The upper surface of the bottom plate 11 is fixedly connected with a second support 17. The front surface of the second support 17 is fixedly connected with a guide rod 18. The second support plate 16 is slidably connected to the outer side wall of the guide rod 18. The second support plate 16 moves along the guide rod 18, using the guide rod 18 to improve the stability of the second support plate 16 during the movement process.

[0036] In this embodiment, specifically: a second motor 19 is installed on one side of the first support plate 12 and the second support plate 16. The output shaft of the second motor 19 is fixedly connected to one side of the sprocket 110. The sprocket 110 is rotatably connected to one side of the first support plate 12 and the second support plate 16. A conveying chain 111 is sleeved on the outer sidewall of the sprocket 110. The second motor 19 drives the sprocket 110 and the conveying chain 111 to move, so as to convey the jig plate 21.

[0037] When the utility model works: the first motor 13 works to drive the threaded rod 15 to rotate, and adjust the distance between the first support plate 12 and the second support plate 16 until the jig plate 21 can be placed. The jig plate 21 is placed on the conveying chain 111. The second motor 19 drives the sprocket 110 and the conveying chain 111 to move to convey the jig plate 21. After the jig plate 21 arrives, the electronic level 26 is used to detect the levelness of the jig plate 21, so as to quickly detect the levelness of the support assembly 10, ensure the welding accuracy of DIP selective soldering, and improve the product quality. During the calibration process, the position of the detection hole 23 represents the position of the solder joint, and the deviation between the coordinate position of the DIP selective soldering flux detected by the position of the detection hole 23 and the preset position is utilized to quickly analyze the deviation distance and improve the calibration accuracy of DIP selective soldering.

[0038] The above is only the specific embodiment of the utility model, but the protection scope of the utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the utility model can easily think of various changes or substitutions, and these should all be covered within the protection scope of the utility model. Therefore, the protection scope of the utility model should be subject to the protection scope of the claims.

Claims

1. A DIP selective soldering verification device, comprising a support assembly (10), characterized in that: A fixture component (20) is provided at the top of the support component (10). The fixture component (20) includes a fixture plate (21), a relief hole (22), a detection hole (23), a scale line (24), a mounting groove (25), and an electronic level (26). Relief holes (22) and detection holes (23) are evenly formed in the upper surface of the fixture plate (21). Scale lines (24) are evenly formed in the upper surface of the fixture plate (21). The scale lines (24) are arranged on one side of the relief holes (22). A mounting groove (25) is formed in the upper surface of the fixture plate (21). An electronic level (26) is mounted on the inner side wall of the mounting groove (25).

2. The DIP selective soldering verification device according to claim 1, wherein: The support component (10) includes a bottom plate (11) and a first support plate (12). The first support plate (12) is fixedly connected to the upper surface of the bottom plate (11).

3. The DIP selective soldering verification device according to claim 2, characterized in that: A first motor (13) is mounted on the front surface of the first support plate (12).

4. The DIP selective soldering verification device according to claim 3, characterized in that: A first support (14) is fixedly connected to the upper surface of the bottom plate (11).

5. The DIP selective soldering verification device according to claim 4, characterized in that: The output shaft of the first motor (13) is fixedly connected to one end of a threaded rod (15). The threaded rod (15) is rotatably connected between the first support plate (12) and the first support (14).

6. The DIP selective soldering verification device according to claim 5, wherein: A second support plate (16) is threadedly connected to the outer side wall of the threaded rod (15). The second support plate (16) is slidably connected to the upper surface of the bottom plate (11).

7. The DIP selective soldering verification device according to claim 6, characterized in that: A second support (17) is fixedly connected to the upper surface of the bottom plate (11). A guide rod (18) is fixedly connected to the front surface of the second support (17). The second support plate (16) is slidably connected to the outer side wall of the guide rod (18).

8. The DIP selective soldering verification device according to claim 7, wherein: A second motor (19) is mounted on one side of the first support plate (12) and the second support plate (16). The output shaft of the second motor (19) is fixedly connected to one side of a sprocket (110). The sprocket (110) is rotatably connected to one side of the first support plate (12) and the second support plate (16). A conveyor chain (111) is sleeved on the outer side wall of the sprocket (110).

Images