Anode plate device and electroplating device
By introducing moving and rotating modules into the electroplating device, the problem of plating uniformity caused by the fixation of the anode plate is solved, and the uniformity of the electroplating process and the extension of the anode plate life are achieved.
Patent Information
- Application Number
- CN202422132578.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-30
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-08-30
AI Technical Summary
The fixation of the anode plate in existing vertical copper plating equipment leads to poor plating uniformity.
An anode plate device including a first moving module and an anode plate assembly is designed, and the movement of the anode plate is achieved through the first driving member and the first guide member, and combined with the rotating module and the second moving module, ensuring that the anode plate can accurately move and adjust the angle between the parts to be plated to improve the uniformity of the plating.
Through the coordination of moving and rotating modules, the uniformity during the electroplating process is improved, the uniformity of the surface of the to-plating part is ensured, and the life of the anode plate is extended.
Smart Images
Figure CN223074304U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electroplating, and particularly relates to an anode plate device and an electroplating device. Background Art
[0002] Currently, the new energy industry represented by solar power generation is developing rapidly and will continue to develop at an even faster pace in the foreseeable future. How to further reduce the manufacturing cost of solar cells has become an important topic in the industry, and the cost of solar cell electrodes accounts for the largest proportion of the entire non-silicon cost.
[0003] In the prior art, the preparation of solar cell electrodes mostly uses the method of screen printing silver paste. Due to the high cost of screen printing equipment and silver paste, the industry is considering replacing screen printing silver paste with electroplating copper.
[0004] However, the anode plate of the current vertical electroplating copper equipment is fixed, which is prone to the problem of poor electroplating uniformity. Summary of the Utility Model
[0005] Therefore, the technical problem to be solved by the utility model is that the anode plate in the prior art is fixed and prone to poor electroplating uniformity.
[0006] To this end, the utility model provides an anode plate device, including:
[0007] A first moving module, including a first driving member and a first guiding member;
[0008] An anode plate assembly, including a frame and a plurality of anode plates connected to the frame. The frame is connected to the first driving member and the first guiding member; the plurality of anode plates are arranged at intervals, and a workpiece to be electroplated is suitable to be placed in the interval between the anode plates;
[0009] Wherein, the frame is driven by the first driving member to move along the guiding direction of the first guiding member, so as to drive the anode plates to move between the workpieces to be electroplated.
[0010] In the above structure, the first driving member provides power for the movement of the anode plate assembly, and the first guiding member can limit the movement direction of the anode plate assembly simultaneously with the first driving member, ensuring that the anode plate assembly can accurately move between the workpieces to be electroplated. The anode plate assembly includes a frame and a plurality of anode plates connected to the frame. The frame is connected to the first driving member and the first guiding member. The plurality of anode plates are arranged at intervals, and a workpiece to be electroplated is suitable to be placed in the interval between the anode plates. The first moving module drives the movement of the frame, thereby driving the anode plates to reciprocate between the workpieces to be electroplated, so as to improve the electroplating uniformity of the workpieces to be electroplated.
[0011] Optionally, the anode plate device further includes a second moving module, and the second moving module is arranged between the first moving module and the anode plate assembly;
[0012] The anode plate assembly is configured to be driven by the second moving module to drive the anode plate into or out of the interval between the workpieces to be plated.
[0013] In the above structure, when it is necessary to place the anode plate assembly between the workpieces to be plated for electroplating, the second moving module drives the anode plate assembly to move downward until the anode plate is between the workpieces to be plated. After electroplating is completed, the second moving module drives the anode plate assembly to move upward to separate from the electroplating solution, improving the service life of the anode plate.
[0014] Optionally, the second moving module and the anode plate assembly are configured to move synchronously under the drive of the first moving module.
[0015] Optionally, the anode plate device further includes a rotation module, which is arranged between the second moving module and the anode plate assembly;
[0016] The anode plate assembly is configured to be driven by the rotation module to rotate relative to the second moving module.
[0017] In the above structure, during actual use, the placement angle of the workpieces to be plated will change according to design requirements and on-site equipment requirements. Therefore, in order to ensure that the anode plate can be inserted into the interval between the workpieces to be plated corresponding to the placement angle of the workpieces to be plated, a rotation module is provided in this embodiment. The rotation module is arranged between the second moving module and the anode plate assembly, and the anode plate assembly is configured to be driven by the rotation module to rotate relative to the second moving module.
[0018] Optionally, the rotation module includes:
[0019] A substrate, connected to the second moving module, and the frame is hinged to the substrate;
[0020] A rotation driving member, connected between the substrate and the frame, and the frame is driven by the rotation driving member to rotate.
[0021] Optionally, the second moving module includes a second driving member and a second guiding member, and the guiding direction of the second guiding member is perpendicular to the guiding direction of the first guiding member.
[0022] Optionally, the driving member is a motor or a cylinder.
[0023] Optionally, the anode plate device further includes a detection component, connected to the anode plate assembly to detect the position of the anode plate.
[0024] Optionally, the detection component includes a sensor, and the sensor is connected to the anode plate assembly.
[0025] An electroplating device includes the above-mentioned anode plate device.
[0026] The plate device and electroplating device provided by the present utility model have the following advantages:
[0027] 1. The present utility model provides an anode plate device, which includes a first moving module and an anode plate assembly. The first moving module includes a first driving member and a first guiding member; the anode plate assembly includes a frame and a plurality of anode plates connected to the frame. The frame is connected to the first driving member and the first guiding member; the plurality of anode plates are arranged at intervals, and the interval between the anode plates is suitable for placing workpieces to be plated; wherein, the frame is driven by the first driving member to move along the guiding direction of the first guiding member, so as to drive the anode plates to move among the workpieces to be plated.
[0028] For the anode plate device with such a structure, the first moving module includes a first driving member and a first guiding member. The first driving member provides power for the movement of the anode plate assembly, and the first guiding member can, together with the first driving member, limit the moving direction of the anode plate assembly, ensuring that the anode plate assembly can accurately move among the workpieces to be plated. The first guiding member can adopt a linear slide rail or other conventional guide rails. The anode plate assembly includes a frame and a plurality of anode plates connected to the frame. The frame is connected to the first driving member and the first guiding member. The plurality of anode plates are arranged at intervals, and the interval between the anode plates is suitable for placing workpieces to be plated. The first moving module drives the movement of the anode plates by driving the movement of the frame. The first moving module drives the anode plates to reciprocate among the workpieces to be plated, so as to improve the electroplating uniformity of the workpieces to be plated.
[0029] 2. The present utility model provides an anode plate device, which further includes a rotating module. The rotating module is arranged between the second moving module and the anode plate assembly; the anode plate assembly is configured to be driven by the rotating module to rotate relative to the second moving module.
[0030] For the anode plate device with such a structure, during actual use, the placement angle of the workpieces to be plated will change according to design requirements and on-site equipment requirements. Therefore, in order to ensure that the anode plates can be inserted into the intervals between the workpieces to be plated corresponding to the placement angles of the workpieces to be plated, a rotating module is provided in this embodiment. The rotating module is arranged between the second moving module and the anode plate assembly, and the anode plate assembly is configured to be driven by the rotating module to rotate relative to the second moving module.
[0031] 3. The present utility model provides an anode plate device, which further includes a second moving module. The second moving module is arranged between the first moving module and the anode plate assembly;
[0032] The anode plate assembly is configured to be driven by the second moving module to drive the anode plates to enter or exit the intervals between the workpieces to be plated.
[0033] For the anode plate device of this structure, when it is necessary to place the anode plate assembly between the workpieces to be plated for electroplating, the second moving module drives the anode plate assembly to move downward until the anode plate is between the workpieces to be plated. Description of the Drawings
[0034] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0035] Figure 1 It is a schematic structural view of the anode plate device provided in Embodiment 1 of the present invention;
[0036] Description of the reference numerals:
[0037] 11 - First driving member; 12 - First guiding member;
[0038] 21 - Frame; 22 - Anode plate;
[0039] 3 - Second moving module;
[0040] 41 - Substrate; 42 - Rotation driving member. Specific Embodiments
[0041] The following will clearly and completely describe the technical solutions of the present invention with reference to the drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0042] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, the technical features involved in different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
[0043] Embodiment 1
[0044] This embodiment provides an anode plate device, which includes a first moving module, an anode plate assembly, a second moving module 3, a rotating module, and a detection component.
[0045] As Figure 1 shown, the first moving module includes a first driving member 11 and a first guiding member 12. The anode plate assembly includes a frame 21 and a plurality of anode plates 22 connected to the frame 21. The frame 21 is connected to the first driving member 11 and the first guiding member 12. The plurality of anode plates 22 are arranged at intervals, and the intervals between the anode plates 22 are suitable for placing workpieces to be plated. The frame 21 is driven by the first driving member 11 to move along the guiding direction of the first guiding member 12, so as to drive the anode plates 22 to move between the workpieces to be plated. Among them, the number of the anode plates 22 can be set according to the usage requirements.
[0046] Currently, the anode plates of vertical electroplating copper equipment are fixed, and it is easy to have poor electroplating uniformity. Therefore, the first moving module is provided to drive the anode plate assembly to move, so as to improve the electroplating uniformity.
[0047] Specifically, as Figure 1 shown, the first moving module includes a first driving member 11 and a first guiding member 12. The first driving member 11 and the first guiding member 12 are arranged in parallel. The first driving member 11 provides power for the movement of the anode plate assembly. For example, components such as motors or cylinders are used. The first guiding member 12 can limit the moving direction of the anode plate assembly simultaneously with the first driving member 11, ensuring that the anode plate assembly can accurately move between the workpieces to be plated. The first guiding member 12 can adopt a linear slide rail or other conventional guide rails. The first driving member 11 and the first guiding member 12 are fixed on the same bottom plate.
[0048] Still referring to Figure 1 , the anode plate assembly includes a frame 21 and a plurality of anode plates 22 connected to the frame 21. The frame 21 is connected to the first driving member 11 and the first guiding member 12. The plurality of anode plates 22 are arranged at intervals, and the intervals between the anode plates 22 are suitable for placing workpieces to be plated. The first moving module drives the movement of the anode plates 22 by driving the movement of the frame 21.
[0049] In this embodiment, the workpieces to be plated are silicon wafers. The silicon wafers are placed at intervals, and the anode plates 22 are placed between the silicon wafers. The first moving module drives the anode plates 22 to reciprocate between the silicon wafers to improve the electroplating uniformity of the silicon wafers.
[0050] Furthermore, the second moving module 3 is arranged between the first moving module and the anode plate assembly. The anode plate assembly is configured to be driven by the second moving module 3 to drive the anode plates 22 to enter or exit the intervals between the workpieces to be plated.
[0051] When the anode plate assembly needs to be placed between the workpieces to be plated for electroplating, the anode plate assembly is driven downward by the second moving module 3 until the anode plate 22 is between the workpieces to be plated.
[0052] It can be understood that in order to enable the anode plate assembly to reciprocate under the drive of the first movable module after the second movable module 3 drives the anode plate assembly to move downward, in this embodiment, the second movable module 3 and the anode plate assembly are configured to move synchronously driven by the first movable module.
[0053] Specifically, Figure 1 As shown, the second moving module 3 also includes a second driving member and a second guide member, and the anode plate assembly is slidably arranged on the second guide member and driven by the second driving member in the second moving module 3 to move on the second guide member. The second driving member can be a motor or a cylinder.
[0054] In this embodiment, the second driving member and the second guiding member are both fixed on a plate-like member, which is connected to the first driving member 11 and the first guiding member 12 in the first movable module to achieve synchronous movement of the second movable module 3 and the anode plate assembly driven by the first movable module.
[0055] like Figure 1 As shown, in this embodiment, the moving directions of the first movable module and the second movable module 3 are perpendicular, which is set to adapt to a specific use environment.
[0056] Furthermore, in actual use, the placement angle of the workpiece to be plated will change with the design requirements and on-site equipment requirements. Therefore, in order to ensure that the anode plate 22 can be inserted into the interval of the workpiece to be plated corresponding to the placement angle of the workpiece to be plated, a rotating module is provided in this embodiment. The rotating module is arranged between the second movable module 3 and the anode plate assembly, and the anode plate assembly is configured to be driven by the rotating module and rotate relative to the second movable module 3.
[0057] like Figure 1 As shown, the rotating module includes a base plate 41 and a rotating driving member 42. The base plate 41 is connected to the second movable module 3, and the frame 21 is hinged to the base plate 41. The rotating driving member 42 is connected between the base plate 41 and the frame 21, and the frame 21 is driven by the rotating driving member 42 to rotate.
[0058] Specifically, the substrate 41 is connected to the second driving member and the second guide member in the second movable module 3, and the lower surface of the substrate 41 is hinged to the frame 21. This design can ensure that the frame 21 will rotate with the substrate 41 at the hinge when subjected to force. The anode plate 22 is fixed to the frame 21. Therefore, by adjusting the rotation angle of the frame 21, the angle of the anode plate 22 can be adjusted until the anode plate 22 can be accurately inserted between the parts to be plated.
[0059] One end of the rotation driving member 42 is connected to the upper side wall of the upper end of the substrate 41, and the other end of the rotation driving member 42 is connected to the frame 21. The rotation driving member 42 provides power for the rotation of the frame 21. The rotation driving member 42 can adopt a telescopic cylinder, and the rotation degree of the frame 21 is controlled by the telescopic degree of the telescopic cylinder.
[0060] Further, the detection component is connected to the anode plate component to detect the position of the anode plate 22. Specifically, the detection component includes a sensor, and the sensor is connected to the anode plate component. The sensor can be a sensor of types such as laser, infrared, or optoelectronic.
[0061] In the anode plate device provided in this embodiment, during use, the anode plate component is driven to rotate by the rotation module until the anode plate 22 is adjusted to a set angle. Then, the anode plate component is driven to move downward by the second moving module 3 until the anode plate 22 is inserted into the interval between the workpieces to be plated. The anode plate component is driven to reciprocate by the first moving module, thereby improving the electroplating uniformity of the workpieces to be plated. At the same time, the up-and-down movement of the anode plate component after flipping can avoid interference with the electroplating tooling.
[0062] Embodiment 2
[0063] This embodiment provides an electroplating device, including the anode plate device in Embodiment 1. Therefore, the electroplating device in this embodiment has all the advantages of the anode plate device in Embodiment 1.
[0064] Obviously, the above embodiments are merely examples given for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.
Claims
1. An anode plate device, characterized in that, Comprising: A first moving module, including a first driving member (11) and a first guiding member (12); An anode plate assembly, including a frame (21) and a plurality of anode plates (22) connected to the frame (21), the frame (21) being connected to the first driving member (11) and the first guiding member (12); the plurality of anode plates (22) are arranged at intervals, and the intervals between the anode plates (22) are adapted to place workpieces to be plated; Wherein, the frame (21) is driven by the first driving member (11) to move along the guiding direction of the first guiding member (12), so as to drive the anode plates (22) to move between the workpieces to be plated.
2. The anode plate device according to claim 1, wherein It further includes a second moving module (3), and the second moving module (3) is arranged between the first moving module and the anode plate assembly; The anode plate assembly is configured to be driven by the second moving module (3) to drive the anode plates (22) to enter or exit the intervals between the workpieces to be plated.
3. The anode plate device according to claim 2, wherein The second moving module (3) and the anode plate assembly are configured to move synchronously by being driven by the first moving module.
4. The anode plate device according to claim 2, wherein It further includes a rotating module, and the rotating module is arranged between the second moving module (3) and the anode plate assembly; The anode plate assembly is configured to be driven by the rotating module to rotate relative to the second moving module (3).
5. The anode plate device according to claim 4, characterized in that, The rotating module includes: A substrate (41), connected to the second moving module (3), and the frame (21) is hinged to the substrate (41); A rotation driving member (42), connected between the substrate (41) and the frame (21), and the frame (21) is driven by the rotation driving member (42) to rotate.
6. The anode plate device according to any one of claims 2-5, characterized in that, The second moving module (3) includes a second driving member and a second guiding member, and the guiding direction of the second guiding member is perpendicular to the guiding direction of the first guiding member (12).
7. The anode plate device according to claim 6, characterized in that, The driving member is a motor or a cylinder.
8. The anode plate device according to any one of claims 2-5, characterized in that, It further includes a detection component, connected to the anode plate assembly to detect the position of the anode plate (22).
9. The anode plate device according to claim 8, wherein The detection component includes a sensor, and the sensor is connected to the anode plate assembly.
10. An electroplating device, characterized in that, An anode plate device according to any one of claims 1-9.