Electric control device and air conditioner

Abstract

The electric control device comprises a power module, a circuit board, a radiator and an electric control box, and the power module is arranged on the first side surface of the circuit board; the radiator is arranged on the power module and is used for radiating the power module; the electric control box is located on the second side opposite to the first side of the circuit board and provided with a supporting part used for supporting the circuit board. Wherein a target gap is formed between the circuit board and the electric control box, and the target gap and the first side surface of the circuit board are filled with a waterproof material. Therefore, by arranging the supporting part in the electric control box, the supporting part supports the circuit board, and the waterproof material covers the first side surface of the circuit board and blocks the target gap between the circuit board and the electric control box, so that the circuit board and the electric control box form a sealed cavity. When the radiator carries out low-temperature refrigerant heat dissipation, condensation does not flow into the sealing cavity even if condensation is generated, the condensation is prevented from affecting the second side surface of the circuit board, and the first side surface of the circuit board is covered with the waterproof material, so that the condensation does not affect the first side surface of the circuit board. The power module can dissipate heat efficiently, and meanwhile normal operation of the air conditioner is guaranteed.

Description

Technical Field

[0001] This application relates to the technical field of manufacturing of electronic control devices, and particularly to an electronic control device and an air conditioner. Background Art

[0002] For the existing outdoor electronic control device of a household variable-frequency air conditioner, the internal power module has a relatively high heat generation temperature rise. Therefore, an aluminum radiator is usually used for air cooling of the power module or a refrigerant pipe is built in for refrigerant cooling.

[0003] In the prior art, the air cooling is limited by factors such as a low temperature difference from the environment, a small contact area between the aluminum radiator and air, a small air volume in the air duct, and a small air speed, and usually has a poor heat dissipation effect. And for the refrigerant cooling, due to the fast refrigerant flow rate, large flow, high heat transfer coefficient, etc., the heat dissipation effect is better than that of air cooling. However, when the temperature of the aluminum radiator is lower than the ambient temperature, condensate water may be generated, thus affecting the safety of the circuit board. Therefore, the refrigerant temperature is generally set 3 - 5 degrees higher than the ambient temperature.

[0004] However, when the ambient temperature is relatively high, the heat dissipation effect of refrigerant cooling will weaken, and it is necessary to reduce the operating frequency or operating power of the air conditioner to balance and reduce the temperature rise, thereby affecting the normal rated power output of the air conditioner. Summary of the Invention

[0005] In view of the above problems, this application provides an electronic control device and an air conditioner, which can reduce the influence of a high-temperature environment on the refrigerant heat dissipation effect and ensure the normal operation of the air conditioner.

[0006] According to the first aspect of this application, an electronic control device is provided, and the electronic control device includes:

[0007] A circuit board;

[0008] A power module, which is arranged on the first side surface of the circuit board;

[0009] A radiator, which is arranged on the power module and is used for dissipating heat from the power module;

[0010] An electronic control box, which is located on the second side opposite to the first side of the circuit board, and the electronic control box is provided with a supporting part, and the supporting part is used for supporting the circuit board;

[0011] Wherein, a target gap is formed between the circuit board and the electronic control box, and the target gap and the first side surface of the circuit board are filled with a waterproof material.

[0012] Optionally, the electronic control box includes a box bottom and side walls surrounding the box bottom;

[0013] The support part includes a support plate arranged on the side wall, and the support plate contacts a target area of the circuit board to support the circuit board, where the target area is an area with a distance less than a threshold value from the edge of the circuit board.

[0014] Optionally, the side wall and the edge of the circuit board form the target gap, and the target gap is filled with the waterproof material.

[0015] Optionally, the support plate is annularly arranged on the inner surface of the side wall.

[0016] Optionally, the first end of the side wall is connected to the bottom of the box, the second end of the side wall expands outwards to form a boss, and the support plate is located between the first end and the second end.

[0017] Optionally, the support part further includes at least one support column, one end of the support column is fixed on the bottom of the electric control box, and the other end contacts the second side surface of the circuit board to support the circuit board.

[0018] Optionally, the radiator includes a heat dissipation body and a flow channel arranged inside the heat dissipation body, and the flow channel is used for the circulation of the refrigerant. Wherein, when the electric control device is in a heat dissipation state, the temperature of the refrigerant flowing through the flow channel is lower than the ambient temperature of the electric control device.

[0019] Optionally, the filling thickness of the waterproof material on the first side surface of the circuit board is greater than or equal to 1 mm.

[0020] Optionally, the electric control device further includes a plurality of components, and all of the plurality of components are located on the first side surface of the circuit board, or some of the plurality of components are located on the second side surface of the circuit board.

[0021] According to the second aspect of the present application, an air conditioner is provided, and the air conditioner includes the aforementioned electric control device.

[0022] One or more of the above technical solutions in the embodiments of the present specification have at least the following technical effects:

[0023] An electronic control device and an air conditioner provided by an embodiment of this specification include a power module, a circuit board, a radiator, and an electronic control box. The power module is arranged on the first side surface of the circuit board; the radiator is arranged on the power module and is used for dissipating heat from the power module; the electronic control box is located on the second side opposite to the first side of the circuit board, and the electronic control box is provided with a supporting part for supporting the circuit board; wherein, a target gap is formed between the circuit board and the electronic control box, and a waterproof material is filled between the target gap and the first side surface of the circuit board. In this way, by arranging the supporting part in the electronic control box to support the circuit board, and then filling the waterproof material on the first side surface of the circuit board, the waterproof material not only covers the first side surface of the circuit board, but also seals the target gap between the circuit board and the electronic control box, so that the circuit board and the electronic control box form a sealed cavity. When the radiator dissipates heat from the low-temperature refrigerant, even if condensation occurs, it will not flow into the sealed cavity, avoiding the influence of condensation on the second side surface of the circuit board, and since the first side surface of the circuit board is covered with the waterproof material, condensation will not affect the first side surface of the circuit board either. It can enable the power module to dissipate heat efficiently, reduce the temperature rise of the power module, thereby derating and selecting the power module, and reducing costs. Even when operating in a high-temperature environment for refrigeration, there is no need to reduce the operating frequency or power of the air conditioner, ensuring the normal operation of the air conditioner.

[0024] The above description is only an overview of the technical solution of this application. In order to be able to understand the technical means of this application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of this application more obvious and understandable, the specific embodiments of this application are specifically described below. Brief Description of the Drawings

[0025] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become clear to those of ordinary skill in the art. The drawings are only for the purpose of showing the preferred embodiments and are not considered to be a limitation of this application. And throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0026] Figure 1 Shows a circuit topology diagram in an embodiment of this application.

[0027] Figure 2 Shows a schematic diagram of an electronic control device in an embodiment of this application.

[0028] Figure 3 Shows a cross-sectional schematic diagram of an electronic control device in an embodiment of this application.

[0029] Legend:

[0030] Electric control box - 1, circuit board - 2, power module - 3, heat dissipation body - 4, flow channel - 5, waterproof material - 6, target gap - 7, side wall - 11, box bottom - 12, pallet - 13, boss - 14, support column - 15. Detailed implementation manners

[0031] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application.

[0032] In addition, the present application may repeat reference numerals and / or reference letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but those of ordinary skill in the art may be aware of the application of other processes and / or the use of other materials.

[0033] The present application will be described below with reference to the accompanying drawings and specific embodiments:

[0034] In the related art, air-cooled heat dissipation is limited by factors such as a low temperature difference from the environment, a small contact area between the radiator and air, a small air volume in the air duct, and a small wind speed, and usually has a poor heat dissipation effect. Refrigerant heat dissipation has a better heat dissipation effect than air-cooled heat dissipation because of its fast refrigerant flow rate, large flow rate, and high heat transfer coefficient.

[0035] However, when the temperature of the aluminum radiator is lower than the ambient temperature, condensate may be generated, which may affect the safety of the circuit board. Therefore, the refrigerant temperature is generally set 3 - 5 degrees higher than the ambient temperature. However, when the ambient temperature is relatively high, for example, when the sun shines directly on the outdoor unit of the air conditioner in summer and the surrounding ventilation is poor, the ambient temperature where the electric control device is located may be as high as 50 - 60 degrees, and the refrigerant temperature may reach more than 60 degrees. The temperature difference between the refrigerant temperature and the power module temperature (the temperature is about 75 degrees) is further reduced, greatly affecting the heat dissipation effect of the refrigerant. It may be necessary to reduce the operating frequency or operating power of the air conditioner to balance and reduce the temperature rise, thereby affecting the normal rated power output of the air conditioner.

[0036] Based on the above situation, in combination with Figure 1 、 Figure 2 and Figure 3As shown in the figure, the present application provides an electronic control device and an air conditioner. By providing a support portion inside the electronic control box 1, the support portion holds up the circuit board 2, and then a waterproof material 6 is filled on the first side surface of the circuit board 2. The waterproof material 6 also seals the target gap 7 between the circuit board 2 and the electronic control box 1, so that a sealed cavity is formed between the circuit board 2 and the electronic control box 1. When the radiator dissipates heat from the power module 3 with low-temperature refrigerant, even if condensation occurs, it will not flow into the sealed cavity and will not affect the second side surface of the circuit board 2. Moreover, since the first side surface of the circuit board 2 is covered with the waterproof material 6, the condensation will not affect the first side surface of the circuit board 2 either. Thus, while improving the heat dissipation effect of the refrigerant, the normal operation of the air conditioner is ensured.

[0037] Specifically, the embodiment of the present application provides an electronic control device, which mainly includes: a power module 3, a circuit board 2, a radiator, and an electronic control box 1. Among them, in combination Figure 2 As shown in the figure, the upper side of the circuit board 2 is the first side of the circuit board 2, and the upper surface of the circuit board 2 is the first side surface of the circuit board 2; correspondingly, the lower side of the circuit board 2 is the second side of the circuit board 2, and the lower surface of the circuit board 2 is the second side surface of the circuit board 2. The electronic control box 1 is located on the second side of the circuit board 2. The power module 3 is arranged on the first side surface of the circuit board 2. The power module 3 is the main heat-generating module on the circuit board 2. In this embodiment, the power module 3 can be a PIM module (Power Integrated Module), or can be composed of discrete power devices. In combination Figure 1 As shown in the figure, the electronic control device of this embodiment can be an outdoor controller of a three-phase power supply air conditioner, and its circuit topology is a three-phase rectification + three-phase inversion circuit, but it is not limited to this, and it can also be other three-phase circuit topology types.

[0038] This embodiment is described by taking the circuit topology of three-phase rectification + three-phase inversion circuit as an example, which specifically includes a filtering circuit, a PIM module, a bus capacitor E1, a sampling resistor R2, and an absorption resistor R1. Among them, the input terminals AC1, AC2, AC3, and N of the AC380V three-phase AC power supply are connected to the filtering circuit, and the output terminals L1, L2, and L3 of the filtering circuit (including an EMI filtering circuit, a surge protection circuit, an inrush current protection circuit, a phase loss and phase sequence detection circuit, etc.) are connected to the PIM-a part (three-phase rectification, composed of 6 diodes D1 - D6) of the PIM module. The PIM-a part is also connected to the bus capacitor E1. The absorption resistor R1 is connected to the PIM-b part of the PIM module (composed of IGBT and FRD, where the emitter of the IGBT is connected to the absorption resistor R1 and then returns to the negative terminal of the bus). The sampling resistor R2 is connected to the PIM-c part (three-phase inversion, composed of 6 power transistors Q1 - Q6, where the sources of Q4 - Q6 are connected to the sampling resistor R2 and then return to the negative terminal of the bus) of the PIM module. The PIM-c part is also connected to the compressor COMP.

[0039] It should be noted that the electronic control device may also include other components (or modules), and these components are installed on the circuit board 2. The components can be installed on the circuit board 2 in a through-hole manner or soldered to the circuit board 2.

[0040] Among them, the power module 3 can be soldered on the first side surface of the circuit board 2, that is, the top layer of the upper surface of the circuit board 2. In one device layout method, the power module 3 and other components are all located on the first side surface of the circuit board 2. In another device layout method, the power module 3 and some components are installed on the first side surface of the circuit board 2, and some other components are installed on the second side surface of the circuit board 2.

[0041] In this embodiment, a radiator is arranged on the power module 3 for dissipating heat from the power module 3. The radiator includes a heat dissipation body 4 and a flow channel 5. Among them, the heat dissipation body 4 is in close contact with the surface of the power module 3 to absorb the heat of the power module 3. A flow channel 5 is arranged inside the heat dissipation body 4, and the refrigerant flows through the flow channel 5. When the electronic control device is in a heat dissipation state, that is, when the power module 3 needs to dissipate heat, the power module 3 is cooled by using a low-temperature refrigerant heat dissipation method.

[0042] Specifically, the heat dissipation body 4 absorbs the heat of the power module 3, and the refrigerant flows through the flow channel 5. The refrigerant exchanges heat with the heat dissipation body 4 to take away the heat, thereby reducing the temperature rise of the power module 3 and ensuring the normal operation of the power module 3. It should be noted that the refrigerant flowing through the flow channel 5 is the low-temperature refrigerant after throttling in the air conditioner system, and the temperature of the refrigerant flowing through the flow channel 5 is lower than the ambient temperature of the electronic control device.

[0043] For example, in summer, the ambient temperature where the electric control device of the outdoor unit is located is 45 degrees Celsius, the temperature of the power module 3 is 75 degrees Celsius, the temperature of the refrigerant flowing through the flow channel 5 is 15 degrees Celsius. The heat dissipation body 4 is in close contact with the power module 3 and absorbs the heat of the power module 3. The refrigerant flows through the flow channel 5 in the heat dissipation body 4, exchanges heat with the heat dissipation body 4, and quickly takes away the heat, thereby reducing the temperature of the power module 3.

[0044] It should be noted that when the low-temperature refrigerant heat dissipation method is adopted, when the air with a higher temperature in the electric control box 1 comes into contact with the radiator through which the low-temperature refrigerant flows, condensation is likely to occur on the radiator. After the condensation accumulates on the circuit board 2, it may affect the safety of the circuit board 2.

[0045] Based on this, in this embodiment, a support portion is provided in the electric control box 1, and the support portion is used to support the circuit board 2. The electric control box 1 is a semi-sealed box body, that is, five of the six sides of the electric control box 1 are closed, and only the top side is open. During assembly, the top opening of the electric control box 1 is blocked by the circuit board 2. The second side surface of the circuit board 2 faces the electric control box 1, and the first side surface faces the outside of the electric control box 1.

[0046] It should be noted that the second side surface of the circuit board 2 is not a flat surface, and the pins of some modules or components will penetrate the second side surface and be exposed. Even some modules or components are arranged on the second side surface of the circuit board 2. Therefore, a support portion is provided in the electric control box 1. The support portion is in contact with the circuit board 2 and supports the circuit board 2 at a certain height in the electric control box 1. The height of the support portion can be set according to the distance between the circuit board 2 and the bottom 12 of the electric control box 1, and this embodiment does not limit this.

[0047] After the circuit board 2 is placed in the electric control box 1, the circuit board 2 is in close contact with the support portion, and the circuit board 2 is in a horizontal placement state. In this embodiment, fixing members such as buckles or screws can be used to fix the circuit board 2. After fixing the circuit board 2, a target gap 7 will be formed between the edge of the circuit board 2 and the electric control box 1.

[0048] In this embodiment, a waterproof material 6 is filled on the first side surface of the circuit board 2 and in the target gap 7. The waterproof material 6 in this embodiment refers to a material that can play a role in waterproofing, electrical insulation, and heat conduction. The waterproof material 6 can be sealant, waterproof glue, potting glue, etc.

[0049] This embodiment is described by taking the waterproof glue as an example. After fixing the circuit board 2, the waterproof glue is poured in, and the waterproof glue evenly covers the first side surface of the circuit board 2 in a self-leveling manner, while filling the target gap 7. The covered waterproof glue needs to reach a certain thickness. For example, the thickness of the waterproof glue on the first side surface of the circuit board 2 is greater than or equal to 1 mm. After the waterproof glue is cured, the waterproof glue covers the first side surface of the circuit board 2 and fills the target gap 7, thereby isolating the surface of the circuit board 2 from the external air and forming a sealed cavity between the circuit board 2 and the electric control box 1. External water vapor cannot enter the internal cavity of the electric control box 1, thus eliminating the influence of condensation on the circuit board 2. In addition, it can better prevent dust and corrosion, which is beneficial to improving the safety of the electric control device.

[0050] It is worth mentioning that there are various implementation manners for the support part.

[0051] In an optional implementation manner, the support part can be a surrounding support plate 13. Specifically, the electric control box 1 includes a box bottom 12 and side walls 11 surrounding the box bottom 12. A target gap 7 is formed between the side walls 11 and the edge of the circuit board 2, and the target gap 7 is filled with waterproof glue. The support plate 13 contacts the target area of the circuit board 2 for supporting the circuit board 2, and the target area refers to the area where the distance from the edge of the circuit board 2 is less than a threshold value. The threshold value can be 5 mm, 10 mm or even larger, and is specifically set according to the actual situation of the circuit board 2.

[0052] The support plate 13 can be surrounded on the inner surface of the side wall 11, that is, the support plate 13 is horizontally and continuously arranged around the side wall 11 for one week. In design and production, preferably, the support plate 13 can be integrally formed with the side wall 11. In addition, the shape of the support plate 13 can also have various styles.

[0053] In one embodiment, the widths of each part of the support plate 13 are equal.

[0054] In another embodiment, the widths of each part of the support plate 13 are not completely the same, and the width of the support plate 13 depends on the layout of the modules or components on the circuit board 2. If some modules or components are arranged close to the edge, making the distance from the module or component to the edge of the circuit board 2 relatively close, correspondingly, the width of the support plate 13 corresponding to that place is reduced.

[0055] If the support plate 13 is used to support the circuit board 2, when pouring the waterproof glue, the waterproof glue will not flow into the cavity between the circuit board 2 and the electric control box 1. In this way, the amount of waterproof glue used can be reduced and the cost can be saved.

[0056] In an alternative embodiment, the supporting portion may also be a plurality of support columns 15. Specifically, the electronic control box 1 includes a box bottom 12 and side walls 11 surrounding the box bottom 12. One end of the support column 15 is fixed to the box bottom 12, and the other end contacts the circuit board 2 to support the circuit board 2. The plurality of support columns 15 may be evenly distributed on the box bottom 12. For example, the distance between adjacent support columns 15 is equal, or the distance from each support column 15 to the center point of the box bottom 12 is equal.

[0057] If the support columns 15 are used to vertically support the circuit board 2, the overall support effect on the circuit board 2 can be ensured. When there are many modular components on the horizontally installed circuit board 2, the support columns 15 can prevent the middle part of the circuit board 2 from sagging.

[0058] In another alternative embodiment, the supporting portion includes a support plate 13 and a plurality of support columns 15. The specific content can be referred to the foregoing, and will not be elaborated here. It should be noted that the height of the support column 15 from the box bottom 12 is less than or equal to the height of the support plate 13 from the box bottom 12.

[0059] If the support plate 13 and the support columns 15 are used together to support the circuit board 2, it can not only save the amount of waterproof glue, but also ensure the overall support effect on the circuit board 2.

[0060] In addition, it is worth mentioning that the first end of the side wall 11 is connected to the box bottom 12, and the second end of the side wall 11 expands outward to form a boss 14. The support plate 13 is located between the first end and the second end of the side wall 11. The boss 14 is above the support plate 13, and the boss 14 can be parallel to the box bottom 12. When pouring the waterproof glue, the boss 14 is also covered with the waterproof glue. The boss 14 can increase the contact area between the waterproof glue and the side wall 11. And adding the boss 14 makes the side wall 11 have a turning angle, preventing the waterproof glue from separating from the side wall 11 during thermal expansion and contraction, so as to improve the sealing effect.

[0061] In summary, an electronic control device provided by an embodiment of this specification includes a power module 3, a circuit board 2, a radiator, and an electronic control box 1. The power module 3 is disposed on the first side surface of the circuit board 2; the radiator is disposed on the power module 3 for dissipating heat from the power module 3; the electronic control box 1 is located on the second side opposite to the first side of the circuit board 2, and the electronic control box 1 is provided with a support portion for supporting the circuit board 2; wherein, a target gap 7 is formed between the circuit board 2 and the electronic control box 1, and a waterproof material 6 is filled in the target gap 7 and on the first side surface of the circuit board 2. In this way, by providing a support portion in the electronic control box 1 to support the circuit board 2 with the support portion, and then filling the waterproof material 6 on the first side surface of the circuit board 2, the waterproof material 6 not only covers the first side surface of the circuit board 2, but also seals the target gap 7 between the circuit board 2 and the electronic control box 1, so that a sealed cavity is formed between the circuit board 2 and the electronic control box 1. When the radiator dissipates heat with low-temperature refrigerant, even if condensation occurs, it will not flow into the sealed cavity, avoiding the influence of condensation on the second side surface of the circuit board 2. Moreover, since the first side surface of the circuit board 2 is covered with the waterproof material 6, condensation will not affect the first side surface of the circuit board 2 either. It can enable the power module 3 to dissipate heat efficiently, reduce the temperature rise of the power module 3, thereby enabling derating selection for the power module 3 and reducing costs. Even during refrigeration operation in a high-temperature environment, there is no need to reduce the operating frequency or operating power of the air conditioner, ensuring the normal operation of the air conditioner.

[0062] Based on the same concept, the present application further provides an air conditioner, which includes the aforementioned electronic control device. The electronic control device can be the electronic control device in an outdoor unit of a three-phase power supply air conditioner or the electronic control device in an outdoor unit of a single-phase power supply air conditioner. This embodiment does not limit this.

[0063] Since the air conditioner provided by the present application includes the electronic control device of the above technical solution, the air conditioner provided by the present application has all the beneficial effects of the above electronic control device.

[0064] In summary, an air conditioner provided by an embodiment of this specification includes a power module 3, a circuit board 2, a radiator, and an electric control box 1. The power module 3 is disposed on a first side surface of the circuit board 2. The radiator is disposed on the power module 3 and is used for dissipating heat from the power module 3. The electric control box 1 is located on a second side opposite to the first side of the circuit board 2. The electric control box 1 is provided with a support portion for supporting the circuit board 2. Wherein, a target gap 7 is formed between the circuit board 2 and the electric control box 1, and a waterproof material 6 is filled in the target gap 7 and on the first side surface of the circuit board 2. In this way, by providing the support portion in the electric control box 1 to support the circuit board 2, and then filling the waterproof material 6 on the first side surface of the circuit board 2, the waterproof material 6 not only covers the first side surface of the circuit board 2, but also seals the target gap 7 between the circuit board 2 and the electric control box 1, so that the circuit board 2 and the electric control box 1 form a sealed cavity. When the radiator dissipates heat from low-temperature refrigerant, even if condensation occurs, it will not flow into the sealed cavity, avoiding the influence of the condensation on the second side surface of the circuit board 2. Moreover, since the first side surface of the circuit board 2 is covered by the waterproof material 6, the condensation will not affect the first side surface of the circuit board 2 either. It can enable the power module 3 to dissipate heat efficiently, reduce the temperature rise of the power module 3, thereby enabling derating selection for the power module 3 and reducing costs. Even when operating in a high-temperature environment for refrigeration, there is no need to reduce the operating frequency or operating power of the air conditioner, ensuring the normal operation of the air conditioner.

[0065] In this application, unless otherwise clearly specified and limited, the first feature being "on" or "under" the second feature may include direct contact between the first and second features, or may include indirect contact between the first and second features through additional features therebetween. Moreover, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly below and obliquely below the second feature, or merely indicating that the first feature has a lower horizontal height than the second feature.

[0066] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application.

[0067] It should be noted that all the directional indications in the embodiments of the present application are only used to explain the relative positional relationship, movement conditions, etc. between components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0068] In the present application, unless otherwise clearly defined and limited, the terms "connection", "fixation", etc. shall be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0069] In addition, in the present application, the descriptions such as "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless otherwise clearly and specifically defined.

[0070] In the description of this specification, the descriptions with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in this specification.

[0071] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0072] Although the embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and purpose of the present application. The scope of the present application is defined by the claims and their equivalents.

Claims

1. An electronic control device, characterized in that, The electronic control device includes: A circuit board; A power module, which is arranged on the first side surface of the circuit board; A radiator, which is arranged on the power module and is used for dissipating heat from the power module; An electronic control box, which is located on the second side opposite to the first side of the circuit board, and the electronic control box is provided with a supporting part for supporting the circuit board; Wherein, a target gap is formed between the circuit board and the electronic control box, and the target gap and the first side surface of the circuit board are filled with waterproof material.

2. The electronic control device according to claim 1, characterized in that, The radiator includes a heat dissipation body and a flow channel arranged inside the heat dissipation body for the circulation of refrigerant. Wherein, when the electronic control device is in a heat dissipation state, the temperature of the refrigerant flowing through the flow channel is lower than the ambient temperature of the electronic control device.

3. The electronic control device according to claim 1, characterized in that, The electronic control box includes a box bottom and side walls surrounding the box bottom; The supporting part includes a supporting plate arranged on the side wall, and the supporting plate contacts a target area of the circuit board to support the circuit board, and the target area is an area with a distance less than a threshold value from the edge of the circuit board.

4. The electronic control device according to claim 3, characterized in that The side wall and the edge of the circuit board form the target gap, and the target gap is filled with the waterproof material.

5. The electronic control device according to claim 3, characterized in that, The supporting plate is annularly arranged on the inner surface of the side wall.

6. The electronic control device according to claim 3, characterized in that, The first end of the side wall is connected to the box bottom, the second end of the side wall expands to form a boss, and the supporting plate is located between the first end and the second end.

7. The electronic control device according to any one of claims 1-6, characterized in that The supporting part further includes at least one supporting column, one end of the supporting column is fixed on the box bottom of the electronic control box, and the other end contacts the second side surface of the circuit board to support the circuit board.

8. The electronic control device according to claim 1, wherein The filling thickness of the waterproof material on the first side surface of the circuit board is greater than or equal to 1 mm.

9. The electronic control device according to claim 1, characterized in that The electronic control device further includes a plurality of components, all of the plurality of components are located on the first side surface of the circuit board, or some of the plurality of components are located on the second side surface of the circuit board.

10. An air conditioner, characterized in that, The air conditioner includes the electronic control device according to any one of claims 1-9.

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