Plastic package module capable of reducing bending stress

Abstract

The utility model discloses a plastic package module capable of reducing bending stress, which relates to the technical field of plastic package modules and comprises a plastic package power semiconductor module, the bottom of the plastic package power semiconductor module is in an arch shape with a low middle and two high ends, and the top of the plastic package power semiconductor module is provided with a plurality of stress release grooves; the bottom of the plastic package power semiconductor module is attached to the heat dissipation bottom plate through a fixing mechanism; because the top of the plastic package power semiconductor module is provided with the stress release groove, when the plastic package power semiconductor module is installed on the heat dissipation bottom plate, the camber of the bottom of the plastic package power semiconductor module is gradually reduced until the plastic package power semiconductor module is attached to the surface of the heat dissipation bottom plate, and meanwhile, the stress release groove at the top of the plastic package power semiconductor module generates small deformation. The bending stress of the plastic package power semiconductor module caused by camber reduction can be reduced, the reliability of the plastic package power semiconductor module is enhanced, and the cracking phenomenon of the plastic package power semiconductor module is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of plastic encapsulated modules, and particularly relates to a plastic encapsulated module capable of reducing bending stress. Background Art

[0002] Power semiconductor modules play a crucial role in modern electronic devices and energy systems. With the continuous development of electronic devices towards high power and high density, the reliability requirements for power semiconductor modules are also getting higher and higher. Plastic encapsulation technology has become the focus of the industry due to its excellent performance characteristics, such as sulfur resistance, moisture resistance, corrosion resistance, and high mechanical strength.

[0003] In order to improve the heat dissipation performance of the power module, the bottom surface of the power module is often designed to have a certain camber shape, which helps the module to better fit the surface of the radiator, thereby reducing the thermal resistance. However, when the power module is installed under the action of bolt pressure, the camber of the bottom surface will cause the overall deformation of the module. This deformation not only affects the mechanical stability of the power module but also generates bending stress inside the plastic encapsulation body. The accumulation of bending stress may lead to local cracking of the plastic encapsulation body, seriously affecting the long-term reliability and performance stability of the module. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a plastic encapsulated module capable of reducing bending stress and solve the following technical problems:

[0005] How to prevent the plastic encapsulated module from cracking due to bending stress during installation?

[0006] The purpose of the utility model can be achieved by the following technical solutions:

[0007] A plastic encapsulated module capable of reducing bending stress includes a plastic encapsulated power semiconductor module. The bottom of the plastic encapsulated power semiconductor module is arched with the middle low and both ends high. A plurality of stress relief grooves are opened at the top of the plastic encapsulated power semiconductor module;

[0008] It further includes a heat dissipation bottom plate. The bottom of the plastic encapsulated power semiconductor module is attached and installed on the heat dissipation bottom plate through a fixing mechanism.

[0009] As a further scheme of the utility model: The fixing mechanism includes a plurality of bolts. A plurality of groups of corresponding communicating screw holes are opened on the plastic encapsulated power semiconductor module and the heat dissipation bottom plate, and the plurality of bolts are respectively installed in the communicating screw holes.

[0010] As a further scheme of the utility model: The fixing mechanism includes four bolts. Corresponding communicating screw holes are opened at the four corners of the plastic encapsulated power semiconductor module and the heat dissipation bottom plate, and the four bolts are respectively installed in the communicating screw holes at the four corners.

[0011] As a further solution of the present utility model: the stress relief groove is a circular groove, a square groove, a polygonal groove or a special-shaped groove.

[0012] As a further solution of the present utility model: the stress relief groove includes three symmetrically distributed square stress relief grooves.

[0013] As a further solution of the present utility model: the stress relief groove includes three symmetrically distributed V-shaped stress relief grooves.

[0014] As a further solution of the present utility model:

[0015] Beneficial effects of the present utility model:

[0016] In the plastic-encapsulated module capable of reducing bending stress of the present utility model, a stress relief groove is provided at the top of the plastic-encapsulated power semiconductor module. When the plastic-encapsulated power semiconductor module is installed on the heat dissipation bottom plate, the camber at the bottom of the plastic-encapsulated power semiconductor module gradually shrinks until it fits with the surface of the heat dissipation bottom plate. At the same time, the stress relief groove at the top of the plastic-encapsulated power semiconductor module undergoes a small deformation, which can slow down the bending stress generated by the shrinkage of the camber of the plastic-encapsulated power semiconductor module, enhance the reliability of the plastic-encapsulated power semiconductor module, and prevent it from cracking. Description of the drawings

[0017] The following further describes the present utility model with reference to the drawings.

[0018] Figure 1 is a schematic structural diagram of a plastic-encapsulated module in the prior art;

[0019] Figure 2 is a schematic structural diagram of the plastic-encapsulated module in the prior art when cracking occurs;

[0020] Figure 3 is a schematic structural diagram of the plastic-encapsulated module capable of reducing bending stress in Embodiment 1 of the present utility model;

[0021] Figure 4 is a schematic structural diagram of the plastic-encapsulated module capable of reducing bending stress in Embodiment 1 of the present utility model after installation;

[0022] Figure 5 is a schematic structural diagram of the plastic-encapsulated module capable of reducing bending stress in Embodiment 2 of the present utility model;

[0023] Figure 6 is a schematic structural diagram of the plastic-encapsulated module capable of reducing bending stress in Embodiment 2 of the present utility model after installation.

[0024] In the figure: 1, plastic-encapsulated power semiconductor module; 12, square stress relief groove; 13, V-shaped stress relief groove; 2, heat dissipation bottom plate; 3, bolt. Detailed implementation manners

[0025] Next, in combination with the accompanying drawings in the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] Before introducing the plastic package module of the present invention that can reduce bending stress, first understand the structure of the plastic package module in the prior art, as Figure 1 shown. The bottom of the plastic package power semiconductor module 1 in the prior art is arched with the middle low and both ends high, and the top is flat. The plastic package power semiconductor module 1 is installed on the heat dissipation bottom plate 2 through bolts 3. Since the arch at the bottom will deform during installation, making the bottom surface of the plastic package power semiconductor module 1 gradually fit with the heat dissipation bottom plate 2, bending stress will be generated inside the plastic package power semiconductor module 1, resulting in local cracking on the top of the plastic package power semiconductor module 1 as Figure 2 shown.

[0027] Based on this, the present invention provides a plastic package module that can reduce bending stress, which can avoid the phenomenon of local cracking of the plastic package power semiconductor module 1 during installation in the prior art. The following specifically describes the present invention in combination with Embodiments 1-2.

[0028] Embodiment 1

[0029] Please refer to Figure 3 , this embodiment discloses a plastic package module that can reduce bending stress, including a plastic package power semiconductor module 1, a heat dissipation bottom plate 2, and four bolts 3.

[0030] Among them, the bottom of the plastic package power semiconductor module 1 is arched with the middle low and both ends high, and three symmetrically distributed square stress relief grooves 12 are opened on the top of the plastic package power semiconductor module 1; threaded holes are opened at the four corners of the heat dissipation bottom plate 2, and threaded holes are also opened at the four corners of the plastic package power semiconductor module 1. The threaded holes at the four corners of the heat dissipation bottom plate 2 and the plastic package power semiconductor module 1 correspond one by one, and the corresponding threaded holes penetrate to form communicating threaded holes.

[0031] Please refer to Figure 4, when installing the plastic-encapsulated power semiconductor module 1 on the heat dissipation bottom plate 2, first, the threaded holes at the four corners of the plastic-encapsulated power semiconductor module 1 and the heat dissipation bottom plate 2 are made to correspond one by one to form communicating threaded holes, and then bolts 3 are inserted into the communicating threaded holes to form a fixed connection. During the process of rotating and fixing the bolts 3, the camber at the bottom of the plastic-encapsulated power semiconductor module 1 gradually shrinks until it fits the surface of the heat dissipation bottom plate 2. At the same time, the square stress relief groove 12 at the top of the plastic-encapsulated power semiconductor module 1 undergoes a slight deformation, reducing the bending stress generated by the shrinking of the camber of the plastic-encapsulated power semiconductor module 1, enhancing the reliability of the plastic-encapsulated power semiconductor module 1, and preventing it from cracking.

[0032] Embodiment 2

[0033] Please refer to Figure 5 , this embodiment discloses a plastic-encapsulated module capable of reducing bending stress, including a plastic-encapsulated power semiconductor module 1, a heat dissipation bottom plate 2, and four bolts 3.

[0034] Among them, the bottom of the plastic-encapsulated power semiconductor module 1 is arched with a lower middle and higher ends, and three symmetrically distributed V-shaped stress relief grooves 13 are provided at the top of the plastic-encapsulated power semiconductor module 1; threaded holes are provided at the four corners of the heat dissipation bottom plate 2, and threaded holes are also provided at the four corners of the plastic-encapsulated power semiconductor module 1. The threaded holes at the four corners of the heat dissipation bottom plate 2 and the plastic-encapsulated power semiconductor module 1 correspond one by one, and the corresponding threaded holes penetrate to form communicating threaded holes.

[0035] Please refer to Figure 6 , when installing the plastic-encapsulated power semiconductor module 1 on the heat dissipation bottom plate 2, first, the threaded holes at the four corners of the plastic-encapsulated power semiconductor module 1 and the heat dissipation bottom plate 2 are made to correspond one by one to form communicating threaded holes, and then bolts 3 are inserted into the communicating threaded holes to form a fixed connection. During the process of rotating and fixing the bolts 3, the camber at the bottom of the plastic-encapsulated power semiconductor module 1 gradually shrinks until it fits the surface of the heat dissipation bottom plate 2. At the same time, the V-shaped stress relief groove 13 at the top of the plastic-encapsulated power semiconductor module 1 undergoes a slight deformation, reducing the bending stress generated by the shrinking of the camber of the plastic-encapsulated power semiconductor module 1, enhancing the reliability of the plastic-encapsulated power semiconductor module 1, and preventing it from cracking.

[0036] Working principle of the present utility model:

[0037] In the plastic-encapsulated module capable of reducing bending stress of the present utility model, a stress relief groove is provided at the top of the plastic-encapsulated power semiconductor module 1. When installing the plastic-encapsulated power semiconductor module 1 on the heat dissipation bottom plate 2, the camber at the bottom of the plastic-encapsulated power semiconductor module 1 gradually shrinks until it fits the surface of the heat dissipation bottom plate 2. At the same time, the stress relief groove at the top of the plastic-encapsulated power semiconductor module 1 undergoes a slight deformation, which can reduce the bending stress generated by the shrinking of the camber of the plastic-encapsulated power semiconductor module 1, enhance the reliability of the plastic-encapsulated power semiconductor module 1, and prevent it from cracking.

[0038] In the description of the present utility model, it should be understood that the terms "upper", "lower", "left", "right", etc. indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, as well as a specific orientation structure and operation. Therefore, it cannot be understood as a limitation to the present utility model. In addition, "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Therefore, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more than two.

[0039] In the description of the present utility model, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0040] The above has described in detail one embodiment of the present utility model, but the content described is only the preferred embodiment of the present utility model and cannot be considered as used to limit the scope of implementation of the present utility model. All equivalent changes and improvements made according to the scope of the application of the present utility model should still fall within the scope covered by the patent of the present utility model.

Claims

1. A plastic-encapsulated module capable of reducing bending stress, comprising a plastic-encapsulated power semiconductor module (1), wherein the bottom of the plastic-encapsulated power semiconductor module (1) is arched with a lower middle and higher ends, characterized in that, A plurality of stress relief grooves are formed at the top of the plastic-encapsulated power semiconductor module (1); It further includes a heat dissipation bottom plate (2), and the bottom of the plastic-encapsulated power semiconductor module (1) is fitted and installed on the heat dissipation bottom plate (2) through a fixing mechanism.

2. The plastic encapsulated module capable of reducing bending stress according to claim 1, wherein The fixing mechanism includes a plurality of bolts (3), and a plurality of groups of corresponding communicating screw holes are formed in the plastic-encapsulated power semiconductor module (1) and the heat dissipation bottom plate (2), and the plurality of bolts (3) are respectively installed in the communicating screw holes.

3. The plastic-encapsulated module capable of reducing bending stress according to claim 2, wherein The fixing mechanism includes four bolts (3), and corresponding communicating screw holes are formed at the four corners of the plastic-encapsulated power semiconductor module (1) and the heat dissipation bottom plate (2), and the four bolts (3) are respectively installed in the communicating screw holes at the four corners.

4. The plastic encapsulated module capable of reducing bending stress according to claim 1, characterized in that, The stress relief groove is a circular groove, a square groove, a polygonal groove or a special-shaped groove.

5. The plastic encapsulated module capable of reducing bending stress according to claim 4, wherein The stress relief groove includes three symmetrically distributed square stress relief grooves (12).

6. The plastic-encapsulated module capable of reducing bending stress according to claim 4, characterized in that, The stress relief groove includes three symmetrically distributed V-shaped stress relief grooves (13).

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