Novel gateway interface circuit device

Abstract

The utility model provides a novel gateway interface circuit device which is compatible with wireless frequency band communication of 900MHz and 2.4 GHz, is higher in integration level, and meets the requirements of customers on miniaturization and lower cost of gateway interface equipment. The utility model relates to a wireless temperature acquisition device, which comprises an MCU module, a slave MCU module, an RS-232 module, a temperature acquisition module and a daughter board interface, the MCU module is connected with the slave MCU module, the slave MCU module is connected with the RS-232 module and the daughter board interface, the wireless temperature acquisition device further comprises a 900MHz wireless communication module and a 2.4 GHz wireless communication module, the 900MHz wireless communication module and the 2.4 GHz wireless communication module are respectively connected with the MCU module, and the 900MHz wireless communication module and the 2.4 GHz wireless communication module are respectively connected with the daughter board interface. The 900MHz wireless communication module or the 2.4 GHz wireless communication module is connected with an external server, and 900MHz wireless frequency band or 2.4 GHz wireless frequency band communication is provided.

Description

Technical Field

[0001] The utility model relates to the technical field of gateway devices, and particularly relates to a novel gateway interface circuit device. Background Technique

[0002] A gateway is a computer system or device that acts as a converter. It is used between two systems with different communication protocols, data formats, or languages, and even completely different architectures. A gateway is a translator. Currently, existing gateways usually communicate using a single wireless frequency band. They either use a 900 MHz wireless frequency band or a 2.4 GHz wireless frequency band for communication. Therefore, their functions are relatively single, and communication gateways that combine both wireless frequency bands are relatively scarce. If a communication gateway using a 900 MHz wireless frequency band is used, and communication using a 2.4 GHz wireless frequency band is required, additional communication devices need to be externally connected. Adding additional devices leads to a complex overall communication structure, high input costs, and the problem of occupying a larger volume. Content of the Utility Model

[0003] Aiming at the problem that existing gateways only support communication using a single wireless frequency band, and if communication using other wireless frequency bands is required, additional communication devices need to be externally connected, resulting in a complex overall communication structure, high input costs, and a larger occupied volume, the utility model provides a novel gateway interface circuit device, which is compatible with 900 MHz and 2.4 GHz wireless frequency band communications, has a higher integration level, and meets the customer's requirements for miniaturization and lower cost of gateway interface devices.

[0004] Its technical solution is as follows: A novel gateway interface circuit device includes an MCU module, a slave MCU module, an RS-232 module, a temperature acquisition module, and a daughter board interface. The MCU module is connected to the slave MCU module, and the slave MCU module is connected to the RS-232 module and the daughter board interface. It is characterized in that it further includes a 900 MHz wireless communication module and a 2.4 GHz wireless communication module. The 900 MHz wireless communication module and the 2.4 GHz wireless communication module are respectively connected to the MCU module, and are connected to an external server through the 900 MHz wireless communication module or the 2.4 GHz wireless communication module to provide 900 MHz wireless frequency band or 2.4 GHz wireless frequency band communication.

[0005] It is further characterized in that: the MCU module includes an At128 single-chip microcomputer IC2, the At128 single-chip microcomputer IC2 is respectively connected to a clock IC3, a crystal oscillator X1 and a storage chip IC4, the 900MHz wireless transmission module includes a wireless transceiver chip IC6, the 2nd pin of the wireless transceiver chip IC6 is connected to one end of a capacitor C115, the other end of the capacitor C115 is connected to one end of a capacitor C97 and grounded, the other end of the capacitor C97 is connected to the 3rd pin of the wireless transceiver chip IC6 and a 3.3V1 voltage source, the 4th pin of the wireless transceiver chip IC6 is grounded through a capacitor C118, the 5th pin of the wireless transceiver chip IC6 is connected to the 3rd pin of a crystal oscillator X4 and one end of a capacitor C26, the other end of the capacitor C26 is connected to the 2nd pin of the crystal oscillator X3 and then grounded, the 6th pin of the wireless transceiver chip IC6 is connected to the 1st pin of the crystal oscillator X4 and one end of a capacitor C27, the other end of the capacitor C27 is connected to the 4th pin of the crystal oscillator X4 and grounded, the 7th pin of the wireless transceiver chip IC6 is connected to one end of a capacitor C117, one end of a resistor R25 and the 14th pin of the At128 single-chip microcomputer IC2, the other end of the capacitor C117 is grounded, the other end of the resistor R25 is connected to the 3.3V1 voltage source, the 8th, 9th, 16th to 19th pins of the wireless transceiver chip IC6 are respectively connected to the 53rd, 50th, 30th, 32nd, 31st, 16th pins of the At128 single-chip microcomputer IC2, the 14th pin of the wireless transceiver chip IC6 is connected to one end of a capacitor C132, one end of a capacitor C133 and the 3.3V1 voltage source, the other ends of the capacitor C132 and the capacitor C133 are connected to each other and then grounded, the 21st pin of the wireless transceiver chip IC6 is connected to one end of a capacitor C136 and one end of an inductor L15, the other end of the capacitor C136 is connected to one end of a capacitor C135 and then grounded, the other end of the inductor L15 is connected to the other end of the capacitor C135 and one end of a capacitor C134, the other end of the capacitor C134 is connected to the 3rd pin of a radio frequency switching switch IC29, the 0th pin of the wireless transceiver chip IC6 is connected to one end of a capacitor C129, one end of a capacitor C130 and grounded, the other ends of the capacitor C129 and the capacitor C130 are connected to each other and then connected to the 24th pin of the wireless transceiver chip IC6 and 3.A 3V1 voltage source, pins 15, 23, and 26 of the wireless transceiver chip IC6 are all grounded. Pin 25 of the wireless transceiver chip IC6 is connected to one end of inductor L14, one end of capacitor C127, and one end of capacitor C128. The other end of capacitor C127 is connected to the other end of capacitor C128 and then grounded. Pin 27 of the wireless transceiver chip IC6 is connected to one end of inductor L12. The other end of inductor L12 is connected to the other end of inductor L14, one end of capacitor C121, and one end of capacitor C125. The other end of capacitor C121 is connected to one end of inductor L11. The other end of inductor L11 is connected to one end of capacitor C119, one end of inductor L13, and one end of capacitor C126. The other end of inductor L13 is connected to the other end of capacitor C119, one end of capacitor C123, and pin 1 of the RF switch IC29. The other ends of capacitor C125, capacitor C126, and capacitor C123 are connected together and then grounded. Pin 2 of the RF switch IC29 is grounded. Pin 4 of the RF switch IC29 is connected to one end of capacitor C131 and one end of resistor R72. The other end of capacitor C131 is grounded. Pin 5 of the RF switch IC29 is connected to one end of capacitor C122. The other end of capacitor C122 is connected to pins 1 to 3 of the RF switch IC30, the 2.4GHz wireless communication module, and grounded. Pin 6 of the RF switch IC30 is connected to one end of capacitor C137, one end of resistor R81, and the gate of MOS transistor Q14. The other end of capacitor C137 is grounded. The other end of resistor R81 is connected to pin 16 of the At128 single-chip microcomputer IC2. The source of MOS transistor Q14 is connected to one end of capacitor C139 and one end of resistor R80 and grounded. The other end of resistor R80 is connected to the 3.3V1 voltage source. The drain of MOS transistor Q14 is connected to the other end of capacitor C139 and pin 4 of the RF switch IC30. Pin 5 of the RF switch IC14 is connected to one end of capacitor C138. The other end of capacitor C138 is connected to one end of the bidirectional diode D17 and pin 1 of the crystal oscillator X3. The other end of the bidirectional diode D17 is connected to pin 2 of the crystal oscillator X3 and then grounded;.

[0006] The 2.4GHz wireless transmission module includes an RF gain chip IC9. Pins 1, 5, 9, 11, 13, and 17 of the RF gain chip IC9 are all grounded. Pins 2, 3, and 6 of the RF gain chip IC9 are respectively connected to one end of a resistor R52, one end of a resistor R47, and one end of a resistor R17. The other ends of the resistor R52, the resistor R47, and the resistor R17 are respectively connected to pins 42, 43, and 41 of the At128 single-chip microcomputer IC2. Pin 7 of the RF gain chip IC9 is connected to pin 15 of the At128 single-chip microcomputer IC2. Pin 8 of the RF gain chip IC9 is connected to one end of a capacitor C22, one end of an inductor L9, and one end of a capacitor C40. The other end of the capacitor C22 is connected to one end of a capacitor C21 and grounded. The other end of the capacitor C21, the other end of the inductor L9, and the other end of the capacitor C40 are connected together and then connected to the 900MHz wireless transmission module. Pin 10 of the RF gain chip IC9 is connected to one end of a capacitor C41 and one end of an inductor L17. The other end of the capacitor C41 is grounded. The other end of the inductor L17 is connected to one end of a capacitor C59 and one end of an inductor L18. The other end of the capacitor C59 is grounded. The other end of the inductor L18 is connected to pin 14 of the RF gain chip IC9, one end of a capacitor C58, and one end of an inductor L19. The other end of the inductor L19 is connected to one end of a capacitor C60, one end of a capacitor C70, and a 3V voltage source. The other ends of the capacitor C58, the capacitor C60, and the capacitor C70 are connected together and then grounded. Pin 15 of the RF gain chip IC9 is connected to one end of a resistor R53. The other end of the resistor R53 is connected to pin 16 of the At128 single-chip microcomputer IC2. Pin 16 of the RF gain chip IC9 is connected to one end of a capacitor C61, one end of a capacitor C69, and a 3V voltage source. The other end of the capacitor C69 is connected to the other end of the capacitor C61 and then grounded.

[0007] After adopting the above structure, through the settings of the 900MHz wireless transmission module and the 2.4GHz wireless transmission module, two wireless transmission frequency bands of 900MHz and 2.4G can be supported respectively. Among them, the 900MHz wireless transmission frequency band has the advantages of low frequency and longer transmission distance under the same transmission power, and the transmission distance can be increased by setting a higher power. While the 2.4GHz wireless transmission frequency band has the advantages of high frequency and can carry more transmission information within the same transmission time. Through the integrated compatibility design, the integration degree is higher, meeting the customer's requirements for the miniaturization and lower cost of the gateway interface device. Description of the Drawings

[0008] Figure 1 It is the circuit schematic diagram of the MCU module of the present invention;

[0009] Figure 2 It is the circuit schematic diagram of the slave MCU module of the present invention;

[0010] Figure 3 This is the circuit schematic diagram of the RS-232 module and the daughter board interface of the present utility model;

[0011] Figure 4 This is the circuit schematic diagram of the temperature acquisition module of the present utility model;

[0012] Figure 5 This is the circuit schematic diagram of the 900MHz wireless communication module of the present utility model;

[0013] Figure 6 This is the circuit schematic diagram of the 2.4GHz wireless communication module of the present utility model;

[0014] Figure 7 This is the circuit schematic diagram of the composite power supply module of the present utility model;

[0015] Figure 8 This is the circuit schematic diagram of the sub-power supply module of the present utility model;

[0016] Figure 9 This is the circuit schematic diagram of the daughter board power supply module of the present utility model;

[0017] Figure 10 This is the circuit schematic diagram of the switch and interface of the present utility model;

[0018] Figure 11 This is the circuit schematic diagram of the test point of the present utility model. Specific embodiments

[0019] As Figures 1 to 4 shown, a new type of gateway interface circuit device includes an MCU module, a slave MCU module, an RS-232 module, a temperature acquisition module, and a daughter board interface. The MCU module is connected to the slave MCU module, and the slave MCU module is connected to the RS-232 module and the daughter board interface. The MCU module serves as the main control module. Through the setting of the RS-232 module, a 232 serial port communication method is provided, which is connected to the MCU module via the slave MCU module. As Figure 5 , 6 shown, it further includes a 900MHz wireless communication module and a 2.4GHz wireless communication module. The 900MHz wireless communication module and the 2.4GHz wireless communication module are respectively connected to the MCU module, and are connected to an external server through the 900MHz wireless communication module or the 2.4GHz wireless communication module, providing 900MHz wireless band or 2.4GHz wireless band communication. During operation, the 900MHz wireless communication module or the 2.4GHz wireless communication module is selected according to the actual situation, so that through the compatible design, the integration degree is higher, meeting the customer's requirements for the miniaturization and lower cost of the gateway interface device.

[0020] Specifically, the MCU module includes the At128 single-chip microcomputer IC2, and the At128 single-chip microcomputer IC2 is respectively connected to the clock IC3, the crystal oscillator X1, and the storage chip IC4. Specifically, the 900MHz wireless transmission module includes the wireless transceiver chip IC6. The 2nd pin of the wireless transceiver chip IC6 is connected to one end of the capacitor C115. The other end of the capacitor C115 is connected to one end of the capacitor C97 and grounded. The other end of the capacitor C97 is connected to the 3rd pin of the wireless transceiver chip IC6 and the 3.3V1 voltage source. The 4th pin of the wireless transceiver chip IC6 is grounded through the capacitor C118. The 5th pin of the wireless transceiver chip IC6 is connected to the 3rd pin of the crystal oscillator X4 and one end of the capacitor C26. The other end of the capacitor C26 is connected to the 2nd pin of the crystal oscillator X3 and then grounded. The 6th pin of the wireless transceiver chip IC6 is connected to the 1st pin of the crystal oscillator X4 and one end of the capacitor C27. The other end of the capacitor C27 is connected to the 4th pin of the crystal oscillator X4 and grounded. The 7th pin of the wireless transceiver chip IC6 is connected to one end of the capacitor C117, one end of the resistor R25, and the 14th pin of the At128 single-chip microcomputer IC2. The other end of the capacitor C117 is grounded. The other end of the resistor R25 is connected to the 3.3V1 voltage source. The 8th, 9th, 16th to 19th pins of the wireless transceiver chip IC6 are respectively connected to the 53rd, 50th, 30th, 32nd, 31st, and 16th pins of the At128 single-chip microcomputer IC2. The 14th pin of the wireless transceiver chip IC6 is connected to one end of the capacitor C132, one end of the capacitor C133, and the 3.3V1 voltage source. The other ends of the capacitor C132 and the capacitor C133 are connected to each other and then grounded. The 21st pin of the wireless transceiver chip IC6 is connected to one end of the capacitor C136 and one end of the inductor L15. The other end of the capacitor C136 is connected to one end of the capacitor C135 and then grounded. The other end of the inductor L15 is connected to the other end of the capacitor C135 and one end of the capacitor C134. The other end of the capacitor C134 is connected to the 3rd pin of the RF switch IC29. The 0th pin of the wireless transceiver chip IC6 is connected to one end of the capacitor C129, one end of the capacitor C130, and grounded. The other ends of the capacitor C129 and the capacitor C130 are connected to each other and then connected to the 24th pin of the wireless transceiver chip IC6 and 3.A 3V1 voltage source, pins 15, 23, and 26 of the wireless transceiver chip IC6 are all grounded. Pin 25 of the wireless transceiver chip IC6 is connected to one end of inductor L14, one end of capacitor C127, and one end of capacitor C128. The other end of capacitor C127 is connected to the other end of capacitor C128 and then grounded. Pin 27 of the wireless transceiver chip IC6 is connected to one end of inductor L12. The other end of inductor L12 is connected to the other end of inductor L14, one end of capacitor C121, and one end of capacitor C125. The other end of capacitor C121 is connected to one end of inductor L11. The other end of inductor L11 is connected to one end of capacitor C119, one end of inductor L13, and one end of capacitor C126. The other end of inductor L13 is connected to the other end of capacitor C119, one end of capacitor C123, and pin 1 of the RF switching switch IC29. The other ends of capacitor C125, capacitor C126, and capacitor C123 are connected together and then grounded. Pin 2 of the RF switching switch IC29 is grounded. Pin 4 of the RF switching switch IC29 is connected to one end of capacitor C131 and one end of resistor R72. The other end of capacitor C131 is grounded. Pin 5 of the RF switching switch IC29 is connected to one end of capacitor C122. The other end of capacitor C122 is connected to pins 1 to 3 of the RF switching switch IC30, the 2.4GHz wireless communication module, and grounded. Pin 6 of the RF switching switch IC30 is connected to one end of capacitor C137, one end of resistor R81, and the gate of MOS transistor Q14. The other end of capacitor C137 is grounded. The other end of resistor R81 is connected to pin 16 of the At128 single-chip microcomputer IC2. The source of MOS transistor Q14 is connected to one end of capacitor C139 and one end of resistor R80 and grounded. The other end of resistor R80 is connected to the 3.3V1 voltage source. The drain of MOS transistor Q14 is connected to the other end of capacitor C139 and pin 4 of the RF switching switch IC30. Pin 5 of the RF switching switch IC14 is connected to one end of capacitor C138. The other end of capacitor C138 is connected to one end of the bidirectional diode D17 and pin 1 of the crystal oscillator X3. The other end of the bidirectional diode D17 is connected to pin 2 of the crystal oscillator X3 and then grounded.

[0021] Specifically, the 2.4GHz wireless transmission module includes an RF gain chip IC9. The RF gain chip IC9 can adopt a 24AF20 gain chip. Pins 1, 5, 9, 11, 13, and 17 of the RF gain chip IC9 are all grounded. Pins 2, 3, and 6 of the RF gain chip IC9 are respectively connected to one end of a resistor R52, one end of a resistor R47, and one end of a resistor R17. The other ends of the resistor R52, the resistor R47, and the resistor R17 are respectively connected to pins 42, 43, and 41 of the At128 single-chip microcomputer IC2. Pin 7 of the RF gain chip IC9 is connected to pin 15 of the At128 single-chip microcomputer IC2. Pin 8 of the RF gain chip IC9 is connected to one end of a capacitor C22, one end of an inductor L9, and one end of a capacitor C40. The other end of the capacitor C22 is connected to one end of a capacitor C21 and grounded. The other ends of the capacitor C21, the inductor L9, and the capacitor C40 are connected together and then connected to the 900MHz wireless transmission module. Pin 10 of the RF gain chip IC9 is connected to one end of a capacitor C41 and one end of an inductor L17. The other end of the capacitor C41 is grounded. The other end of the inductor L17 is connected to one end of a capacitor C59 and one end of an inductor L18. The other end of the capacitor C59 is grounded. The other end of the inductor L18 is connected to pin 14 of the RF gain chip IC9, one end of a capacitor C58, and one end of an inductor L19. The other end of the inductor L19 is connected to one end of a capacitor C60, one end of a capacitor C70, and a 3V voltage source. The other ends of the capacitor C58, the capacitor C60, and the capacitor C70 are connected together and then grounded. Pin 15 of the RF gain chip IC9 is connected to one end of a resistor R53. The other end of the resistor R53 is connected to pin 16 of the At128 single-chip microcomputer IC2. Pin 16 of the RF gain chip IC9 is connected to one end of a capacitor C61, one end of a capacitor C69, and a 3V voltage source. The other end of the capacitor C69 is connected to the other end of the capacitor C61 and then grounded.

[0022] As Figures 7 to 10 shown, it further includes a power supply module. The power supply module mainly includes three major parts of circuits. One is a composite power supply module that converts direct current and battery power supply into a VCC-MAIN power supply. The second is a sub-power supply module that converts the VCC-MAIN power supply into 3V or 3.3V. The third is a daughter board power supply module that converts the VCC-MAIN power supply into a V-SIM power supply. Through this power supply module circuit, it is used to internally supply power to other various modules in this application, improving the portability of use.

[0023] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any changes or substitutions that can be easily thought of by those familiar with the technology within the technical scope disclosed by the present invention should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A new type of gateway interface circuit device, which includes an MCU module, a slave MCU module, an RS-232 module, a temperature acquisition module, and a daughter board interface. The MCU module is connected to the slave MCU module, and the slave MCU module is connected to the RS-232 module and the daughter board interface. It is characterized in that: It further includes a 900 MHz wireless communication module and a 2.4 GHz wireless communication module. The 900 MHz wireless communication module and the 2.4 GHz wireless communication module are respectively connected to the MCU module, and are connected to an external server through the 900 MHz wireless communication module or the 2.4 GHz wireless communication module to provide communication in the 900 MHz wireless frequency band or the 2.4 GHz wireless frequency band.

2. The novel gateway interface circuit device according to claim 1, characterized in that: The MCU module includes the At128 single-chip microcomputer IC2. The At128 single-chip microcomputer IC2 is respectively connected to the clock IC3, the crystal oscillator X1, and the storage chip IC4. The 900MHz wireless communication module includes the wireless transceiver chip IC6. One end of the capacitor 115 is connected to pin 2 of the wireless transceiver chip IC6. The other end of the capacitor C115 is connected to one end of the capacitor C97 and grounded. The other end of the capacitor C97 is connected to pin 3 of the wireless transceiver chip IC6 and the 3.3V1 voltage source. Pin 4 of the wireless transceiver chip IC6 is grounded through the capacitor C118. Pin 5 of the wireless transceiver chip IC6 is connected to pin 3 of the crystal oscillator X4 and one end of the capacitor C26. The other end of the capacitor C26 is connected to pin 2 of the crystal oscillator X3 and then grounded. Pin 6 of the wireless transceiver chip IC6 is connected to pin 1 of the crystal oscillator X4 and one end of the capacitor C27. The other end of the capacitor C27 is connected to pin 4 of the crystal oscillator X4 and grounded. Pin 7 of the wireless transceiver chip IC6 is connected to one end of the capacitor C117, one end of the resistor R25, and pin 14 of the At128 single-chip microcomputer IC2. The other end of the capacitor C117 is grounded. The other end of the resistor R25 is connected to the 3.3V1 voltage source. Pins 8, 9, 16 to 19 of the wireless transceiver chip IC6 are respectively connected to pins 53, 50, 30, 32, 31, 16 of the At128 single-chip microcomputer IC2. Pin 14 of the wireless transceiver chip IC6 is connected to one end of the capacitor C132, one end of the capacitor C133, and the 3.3V1 voltage source. The other ends of the capacitor C132 and the capacitor C133 are connected to each other and then grounded. Pin 21 of the wireless transceiver chip IC6 is connected to one end of the capacitor C136 and one end of the inductor L15. The other end of the capacitor C136 is connected to one end of the capacitor C135 and then grounded. The other end of the inductor L15 is connected to the other end of the capacitor C135 and one end of the capacitor C134. The other end of the capacitor C134 is connected to pin 3 of the RF switch IC29. Pin 0 of the wireless transceiver chip IC6 is connected to one end of the capacitor C129, one end of the capacitor C130, and grounded. The other ends of the capacitor C129 and the capacitor C130 are connected to each other and then connected to pin 24 of the wireless transceiver chip IC6 and 3.A 3V1 voltage source, pins 15, 23, and 26 of the wireless transceiver chip IC6 are all grounded. Pin 25 of the wireless transceiver chip IC6 is connected to one end of inductor L14, one end of capacitor C127, and one end of capacitor C128. The other end of capacitor C127 is connected to the other end of capacitor C128 and then grounded. Pin 27 of the wireless transceiver chip IC6 is connected to one end of inductor L12. The other end of inductor L12 is connected to the other end of inductor L14, one end of capacitor C121, and one end of capacitor C125. The other end of capacitor C121 is connected to one end of inductor L11. The other end of inductor L11 is connected to one end of capacitor C119, one end of inductor L13, and one end of capacitor C126. The other end of inductor L13 is connected to the other end of capacitor C119, one end of capacitor C123, and pin 1 of the RF switch IC29. The other ends of capacitor C125, capacitor C126, and capacitor C123 are connected together and then grounded. Pin 2 of the RF switch IC29 is grounded. Pin 4 of the RF switch IC29 is connected to one end of capacitor C131 and one end of resistor R72. The other end of capacitor C131 is grounded. Pin 5 of the RF switch IC29 is connected to one end of capacitor C122. The other end of capacitor C122 is connected to pins 1 to 3 of the RF switch IC30, the 2.4GHz wireless communication module, and is grounded. Pin 6 of the RF switch IC30 is connected to one end of capacitor C137, one end of resistor R81, and the gate of MOS transistor Q14. The other end of capacitor C137 is grounded. The other end of resistor R81 is connected to pin 16 of the At128 microcontroller IC2. The source of MOS transistor Q14 is connected to one end of capacitor C139 and one end of resistor R80 and is grounded. The other end of resistor R80 is connected to the 3.3V1 voltage source. The drain of MOS transistor Q14 is connected to the other end of capacitor C139 and pin 4 of the RF switch IC30. Pin 5 of the RF switch IC14 is connected to one end of capacitor C138. The other end of capacitor C138 is connected to one end of the bidirectional diode D17 and pin 1 of the crystal oscillator X3. The other end of the bidirectional diode D17 is connected to pin 2 of the crystal oscillator X3 and then grounded.

3. A novel gateway interface circuit device according to claim 2, characterized in that: The 2.4 GHz wireless communication module includes an RF gain chip IC9. Pins 1, 5, 9, 11, 13, and 17 of the RF gain chip IC9 are all grounded. Pins 2, 3, and 6 of the RF gain chip IC9 are respectively connected to one end of a resistor R52, one end of a resistor R47, and one end of a resistor R17. The other ends of the resistor R52, the resistor R47, and the resistor R17 are respectively connected to pins 42, 43, and 41 of the At128 single-chip microcomputer IC2. Pin 7 of the RF gain chip IC9 is connected to pin 15 of the At128 single-chip microcomputer IC2. Pin 8 of the RF gain chip IC9 is connected to one end of a capacitor C22, one end of an inductor L9, and one end of a capacitor C40. The other end of the capacitor C22 is connected to one end of a capacitor C21 and grounded. The other end of the capacitor C21, the other end of the inductor L9, and the other end of the capacitor C40 are connected together and then connected to the 900 MHz wireless communication module. Pin 10 of the RF gain chip IC9 is connected to one end of a capacitor C41 and one end of an inductor L17. The other end of the capacitor C41 is grounded. The other end of the inductor L17 is connected to one end of a capacitor C59, one end of an inductor L18. The other end of the capacitor C59 is grounded. The other end of the inductor L18 is connected to pin 14 of the RF gain chip IC9, one end of a capacitor C58, and one end of an inductor L19. The other end of the inductor L19 is connected to one end of a capacitor C60, one end of a capacitor C70, and a 3V voltage source. The other ends of the capacitor C58, the capacitor C60, and the capacitor C70 are connected together and then grounded. Pin 15 of the RF gain chip IC9 is connected to one end of a resistor R53. The other end of the resistor R53 is connected to pin 16 of the At128 single-chip microcomputer IC2. Pin 16 of the RF gain chip IC9 is connected to one end of a capacitor C61, one end of a capacitor C69, and a 3V voltage source. The other end of the capacitor C69 is connected to the other end of the capacitor C61 and then grounded.

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