Inner-layer core board and multilayer circuit board
By setting a circular fusion position on the process edge of the inner core board, the problems of uneven fusion temperature and low efficiency in the production of multi-layer circuit boards are solved, and the stability and production efficiency are improved.
Patent Information
- Application Number
- CN202421837238.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-31
- Publication Date
- 2025-07-08
- Estimated Expiration
- 2034-07-31
AI Technical Summary
In the production process of multi-layer circuit boards, there are problems such as uneven fusion temperature, unstable fusion point and low production efficiency. Especially when using electromagnetic hot melting machines, the edge-angle effect and electromagnetic interference caused by rectangular fusion positions are serious.
The process edge of the inner core plate is used to set a circular fusion position to match the direction of the electromagnetic field, reduce the edge and corner effect, achieve uniform heat distribution and stable fusion, and improve production efficiency.
Through the design of circular fusion positions, the melting points are evenly dispersed, which improves the stability and production efficiency of fusion, reduces electromagnetic interference, and shortens the heating time.
Smart Images
Figure CN223080201U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of printed circuit boards, and particularly to a multi-layer circuit board. Background Art
[0002] During the production process of circuit boards, especially before laminating multi-layer boards, the electromagnetic field generated by an electromagnetic hot melt machine acts on the fusion positions of the inner core boards, causing the inner core boards and prepregs to fuse together in order to bond the multi-layer boards.
[0003] Common hot melt positions are rectangular. When fusing, the heat melting points are concentrated at the four corners of the rectangle, and problems such as uneven fusion temperature, insecure fusion points, and low production efficiency are likely to occur. Utility Model Content
[0004] Based on this, it is necessary to provide a multi-layer circuit board to address problems such as uneven fusion temperature, insecure fusion points, and low production efficiency.
[0005] In a first aspect, the present application provides an inner core board, including a board body. The board body includes a circuit pattern area and a process edge. The circuit pattern area is located in the middle of the inner core board, and the process edge is arranged around the circuit pattern area. The process edge is provided with a fusion position, and the fusion position is circular.
[0006] For the above inner core board, by setting a circular fusion position on the process edge, the circular fusion position matches the direction of the electromagnetic field, which can reduce the edge effect, make the fusion points evenly dispersed within the circular fusion position, provide a uniform heat distribution, thereby improving the stability of fusion. At the same time, it can also reduce electromagnetic interference, enabling the electromagnetic hot melt machine to complete heating in a shorter time and improving production efficiency.
[0007] In one embodiment, the process edge includes a first side, a second side, a third side, and a fourth side. The first side and the second side both extend along a first direction, the third side and the fourth side both extend along a second direction, and the first direction is perpendicular to the second direction. At least one of the fusion positions is provided on the first side; and / or, at least one of the fusion positions is provided on the second side; and / or, at least one of the fusion positions is provided on the third side; and / or, at least one of the fusion positions is provided on the fourth side.
[0008] In one embodiment, one fusion position is provided in the middle of the first side along its length direction, one fusion position is provided in the middle of the second side along its length direction, one fusion position is provided in the middle of the third side along its length direction, and one fusion position is provided in the middle of the fourth side along its length direction.
[0009] In one embodiment, the fusion position has a first diameter in a first direction. The first diameter and the periphery of the fusion position have a first point and a second point. The first point is close to the edge of the circuit pattern area, and the second point is close to the edge of the plate body. In the first direction, the distance between the first point and the edge of the circuit pattern area is greater than or equal to 0.3 inches, and the distance between the second point and the edge of the plate body is greater than or equal to 0.45 inches.
[0010] In one embodiment, no copper layer is provided at the fusion position.
[0011] In one embodiment, the plate body is square.
[0012] In one embodiment, the circuit pattern area is square.
[0013] In a second aspect, the present application provides a multi-layer circuit board, including:
[0014] The above-mentioned inner core board, with a plurality of the inner core boards provided, and all the inner core boards are stacked; and
[0015] A first prepreg, with the first prepreg provided between two adjacent inner core boards. The first prepreg can be melted to fuse two adjacent inner core boards to form a pre-laminated board.
[0016] For the above-mentioned multi-layer circuit board, by providing a circular fusion position on the process edge, the circular fusion position matches the direction of the electromagnetic field, which can reduce the corner effect, make the fusion points evenly dispersed within the circular fusion position, provide a uniform heat distribution, thereby improving the stability of fusion. At the same time, it can also reduce electromagnetic interference, enabling the electromagnetic fusion machine to complete heating in a shorter time and improving production efficiency.
[0017] In one embodiment, the multi-layer circuit board further includes outer layers, with two outer layers provided. The two outer layers are respectively provided at both ends of the pre-laminated board along the stacking direction, and both of the two outer layers are connected to the pre-laminated board.
[0018] In one embodiment, the multi-layer circuit board further includes a second prepreg board, with the second prepreg board provided between the outer layer and the adjacent inner core board. Description of the Drawings
[0019] Figure 1 It is a schematic structural diagram of an inner core board according to an embodiment of the present application.
[0020] Figure 2 It is Figure 1 The partial enlarged schematic diagram at A in
[0021] Description of the attached reference numerals:
[0022] 10. Inner core board; 11. Board body; 111. Circuit pattern area; 112. Process edge; 1121. First side; 1122. Second side; 1123. Third side; 1124. Fourth side; 12. Fusion position 12. Specific implementation manners
[0023] To make the above objects, features, and advantages of the present application more apparent and understandable, the specific implementation manners of the present application will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.
[0024] Refer to Figure 1 , Figure 1 which shows a schematic structural view of the inner core board of an embodiment of the present application. The multi-layer circuit board provided by an embodiment of the present application includes an inner core board 10 and a first prepreg. A plurality of inner core boards 10 are provided, and all the inner core boards 10 are stacked, and a first prepreg is provided between two adjacent inner core boards 10.
[0025] During production, before the lamination step, an electromagnetic fusion machine is used to fuse a plurality of inner core boards 10 and the first prepreg, so that all the inner core boards 10 are bonded together to form a pre-stack. Specifically, the electromagnetic fusion machine utilizes the principle of electromagnetic induction to convert electrical energy into heat energy, melts the first prepreg through high temperature, and makes all the inner core boards 10 bonded together to form a pre-stack.
[0026] In one embodiment, refer to Figure 1 , Figure 1 which shows a schematic structural view of the inner core board of an embodiment of the present application. The inner core board 10 includes a board body 11. The board body 11 includes a circuit pattern area 111 and a process edge 112. The circuit pattern area 111 is located in the middle of the inner core board 10, and a circuit pattern is provided in the circuit pattern area 111. The process edge 112 is disposed around the circuit pattern area 111.
[0027] It can be understood that the process edge 112 is an area formed by enclosing the edge of the circuit pattern area 111 and the edge of the board body 11.
[0028] Further, refer to Figure 1 , Figure 1The schematic structural diagram of the inner core board according to an embodiment of the present application is shown. The process edge 112 is provided with a fusion position 12, and the fusion position 12 is circular. During production, the electromagnetic field generated by the electromagnetic fusion machine melts the first prepreg through the fusion position 12. By providing a circular fusion position 12 on the process edge 112, the circular fusion position 12 matches the direction of the electromagnetic field, which can reduce the edge effect, make the fusion points evenly dispersed within the circular fusion position 12, provide a uniform heat distribution, thereby improving the stability of fusion. At the same time, it can also reduce electromagnetic interference, enabling the electromagnetic fusion machine to complete heating in a shorter time and improving production efficiency.
[0029] It should be noted that since the copper surface cannot achieve the hot melting effect, the copper layer located at the fusion position 12 is removed, so that there is no copper layer at the fusion position 12.
[0030] In one embodiment, refer to Figure 1 , Figure 1 The schematic structural diagram of the inner core board according to an embodiment of the present application is shown. The process edge 112 includes a first side 1121, a second side 1122, a third side 1123, and a fourth side 1124. The first side 1121 and the second side 1122 both extend along the first direction, and the third side 1123 and the fourth side 1124 both extend along the second direction.
[0031] Wherein, the first direction is perpendicular to the second direction. For the convenience of understanding, refer to Figure 1 , Figure 1 The schematic structural diagram of the inner core board according to an embodiment of the present application is shown, using X to represent the first direction and Y to represent the second direction.
[0032] Furthermore, refer to Figure 1 , Figure 1 The schematic structural diagram of the inner core board according to an embodiment of the present application is shown. The first side 1121 is provided with at least one fusion position 12; and / or, the second side 1122 is provided with at least one fusion position 12; and / or, the third side 1123 is provided with at least one fusion position 12; and / or, the fourth side 1124 is provided with at least one fusion position 12. With such a setting, it can be ensured that the first prepreg can be melted, so that all the inner core boards 10 can be bonded together.
[0033] Optionally, refer to Figure 1 , Figure 1The structural schematic diagram of the inner core board according to an embodiment of the present application is shown. A fusion position 12 is provided in the middle of the first side 1121 along its length direction, a fusion position 12 is provided in the middle of the second side 1122 along its length direction, a fusion position 12 is provided in the middle of the third side 1123 along its length direction, and a fusion position 12 is provided in the middle of the fourth side 1124 along its length direction. In this way, by providing the fusion positions 12 on the first side 1121, the second side 1122, the third side 1123, and the fourth side 1124, the firmness of the fusion can be improved, and at the same time, the production efficiency can also be improved.
[0034] It can be understood that the connection line between the center of the fusion position 12 of the first side 1121 and the center of the fusion position 12 of the second side 1122 is located on the horizontal center line, and the center of the fusion position 12 of the third side 1123 and the center of the fusion position 12 of the fourth side 1124 are located on the vertical center line.
[0035] Of course, in other embodiments, two or more than three fusion positions 12 may also be provided on the first side 1121, the second side 1122, the third side 1123, and the fourth side 1124.
[0036] In one embodiment, refer to Figure 1 and Figure 2 , Figure 1 The structural schematic diagram of the inner core board according to an embodiment of the present application is shown, Figure 2 shows Figure 1 The partial enlarged schematic diagram of the A position in
[0037] For the convenience of understanding, refer to Figure 2 , Figure 2 shows Figure 1 The partial enlarged schematic diagram of the A position in
[0038] In one embodiment, the multilayer circuit board further includes an outer layer board. Optionally, the outer layer board is a copper foil. There are two outer layer boards, and the two outer layer boards are respectively arranged at both ends of the pre-laminated board along the lamination direction, and both outer layer boards are connected to the pre-laminated board. In this way, a multilayer circuit board can be formed.
[0039] Specifically, the multi-layer circuit board further includes a second semi-cured board, which is disposed between the outer layer board and the adjacent inner core board 10. During production, a second semi-cured sheet is placed at each end of the pre-laminated board along the lamination direction, then the outer layer board is disposed on the side of the second semi-cured sheet facing away from the pre-laminated sheet, and finally the pre-laminated board, the second semi-cured board, and the outer layer board are placed in a press for pressing to obtain the multi-layer circuit board.
[0040] During production, the fusion parameters are as follows:
[0041]
[0042] In summary, for the inner core board of this embodiment, by providing a circular fusion position 12 on the process edge 112, and the circular fusion position 12 being matched with the direction of the electromagnetic field, the corner effect can be reduced, enabling the fusion points to be evenly dispersed within the circular fusion position 12, providing a uniform heat distribution, thereby improving the stability of fusion. At the same time, electromagnetic interference can also be reduced, enabling the electromagnetic fusion machine to complete heating in a shorter time and improving production efficiency.
[0043] For the multi-layer circuit board of this embodiment, by providing a circular fusion position 12 on the process edge 112, and the circular fusion position 12 being matched with the direction of the electromagnetic field, the corner effect can be reduced, enabling the fusion points to be evenly dispersed within the circular fusion position 12, providing a uniform heat distribution, thereby improving the stability of fusion. At the same time, electromagnetic interference can also be reduced, enabling the electromagnetic fusion machine to complete heating in a shorter time and improving production efficiency.
[0044] In the description of the present application, it should be understood that if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.
[0045] In addition, if there are terms such as "first" and "second", these terms are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one such feature. In the description of the present application, if there is a term "plurality", the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.
[0046] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "joined", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0047] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can be that the first feature is directly above or obliquely above the second feature, or merely means that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or merely means that the horizontal height of the first feature is less than that of the second feature.
[0048] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there can also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.
[0049] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as falling within the scope described in this specification.
[0050] The above-described embodiments merely represent several implementation manners of this application. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent application. It should be noted that for those of ordinary skill in the art, without departing from the concept of this application, several modifications and improvements can still be made, and these all belong to the protection scope of this application. Therefore, the protection scope of the patent of this application should be subject to the appended claims.
Claims
1. An inner core board, characterized in that, It includes a board body, the board body includes a circuit pattern area and a process edge, the circuit pattern area is located in the middle of the inner core board, the process edge is arranged around the circuit pattern area, and the process edge is provided with a fusion position, and the fusion position is circular.
2. The inner core board according to claim 1, characterized in that The process edge includes a first side, a second side, a third side and a fourth side. The first side and the second side both extend along a first direction, the third side and the fourth side both extend along a second direction, and the first direction is perpendicular to the second direction; At least one of the fusion positions is provided on the first side; and / or, at least one of the fusion positions is provided on the second side; and / or, at least one of the fusion positions is provided on the third side; and / or, at least one of the fusion positions is provided on the fourth side.
3. The inner core board according to claim 2, wherein One of the fusion positions is provided in the middle of the first side along its length direction, one of the fusion positions is provided in the middle of the second side along its length direction, one of the fusion positions is provided in the middle of the third side along its length direction, and one of the fusion positions is provided in the middle of the fourth side along its length direction.
4. The inner core board according to claim 1, characterized in that, The fusion position has a first diameter along a first direction. The first diameter and the periphery of the fusion position have a first point and a second point. The first point is close to the edge of the circuit pattern area, and the second point is close to the edge of the board body; in the first direction, the distance between the first point and the edge of the circuit pattern area is greater than or equal to 0.3 inches, and the distance between the second point and the edge of the board body is greater than or equal to 0.45 inches.
5. The inner core board according to claim 1, characterized in that, No copper layer is provided on the fusion position.
6. The inner core board according to any one of claims 1 to 5, characterized in that, The board body is square.
7. The inner core board according to any one of claims 1 to 5, characterized in that, The circuit pattern area is square.
8. A multilayer circuit board, characterized in that, It includes: The inner core boards as described in any one of claims 1 to 7, there are multiple of the inner core boards, and all the inner core boards are stacked; And The first prepreg, the first prepreg is provided between two adjacent inner core boards, and the first prepreg can be melted to fuse two adjacent inner core boards to form a prepreg stack.
9. The multilayer circuit board according to claim 8, wherein, The multilayer circuit board further includes outer layers, there are two outer layers, and the two outer layers are respectively arranged at both ends of the prepreg stack along the stacking direction, and the two outer layers are both connected to the prepreg stack.
10. The multilayer printed circuit board according to claim 9, wherein, The multilayer circuit board further includes a second prepreg board, and the second prepreg board is arranged between the outer layer and the adjacent inner core board.