Circuit board assembly, camera module and electronic equipment

Abstract

The utility model provides a circuit board assembly, and the assembly comprises a substrate which is provided with a mounting surface with a filling groove; the circuit board is arranged on the mounting surface and is provided with an avoiding hole coaxial with the filling groove, and the orthographic projection of the filling groove is completely located in the orthographic projection range of the avoiding hole in the direction perpendicular to the mounting surface; the photosensitive chip is arranged on the mounting surface, is positioned in the avoiding hole and covers the filling groove; the first bonding layer is arranged between the mounting surface and the circuit board so as to fix the circuit board on the substrate; and the second bonding layer is arranged between the photosensitive chip and the substrate and is accommodated in the filling groove, so that the photosensitive chip is fixed on the substrate, and the substrate can resist the stress of the second bonding layer and does not deform. The circuit board assembly can prevent the photosensitive chip bonded on the substrate from warping and prevent the photosensitive chip from rotating during bonding, so that the bonding quality of the photosensitive chip is improved. The utility model further provides a camera module comprising the circuit board assembly and electronic equipment comprising the camera module.

Description

Technical Field

[0001] The utility model relates to the technical field of imaging devices, in particular to a circuit board assembly, a camera module and an electronic device. Background Art

[0002] To miniaturize the camera module, a hollow area is generally provided on the circuit board, and a steel sheet is installed at the bottom of the circuit board, and the photosensitive chip is bonded to the steel sheet through thermosetting glue. However, due to the different expansion coefficients of the photosensitive chip, the steel sheet and the thermosetting glue, the photosensitive chip will warp during the curing process of the thermosetting glue, resulting in poor bonding quality of the photosensitive chip. Summary of the Utility Model

[0003] In view of the above, it is necessary to provide a circuit board assembly, a camera module and an electronic device to improve the bonding quality of the photosensitive chip.

[0004] An embodiment of the utility model provides a circuit board assembly, including:

[0005] A substrate having an installation surface, and a filling groove is formed on the installation surface;

[0006] A circuit board is disposed on the installation surface and is provided with an avoidance hole. In the direction perpendicular to the installation surface, the orthographic projection of the filling groove is completely within the orthographic projection range of the avoidance hole;

[0007] A photosensitive chip is disposed on the installation surface and is located within the avoidance hole, and the photosensitive chip covers the filling groove;

[0008] A first bonding layer is disposed between the installation surface and the circuit board to fix the circuit board on the substrate;

[0009] A second bonding layer is disposed between the photosensitive chip and the substrate and is accommodated in the filling groove to fix the photosensitive chip on the substrate, and the substrate can resist the stress of the second bonding layer without deformation.

[0010] In the above circuit board assembly, the filling groove formed on the substrate can accommodate the second bonding layer for bonding the photosensitive chip, so as to change the area and thickness of the second bonding layer bonded to the photosensitive chip, and the substrate can resist the stress of the second bonding layer without deformation, which is beneficial to avoiding warping of the photosensitive chip bonded to the substrate and preventing the photosensitive chip from rotating during bonding, thereby improving the bonding quality of the photosensitive chip.

[0011] In some embodiments, the substrate is further provided with an installation groove, the installation groove is located outside the filling groove, and a rib is formed between the installation groove and the filling groove. The circuit board is installed in the installation groove, and the photosensitive chip is disposed on the rib.

[0012] Therefore, the installation groove facilitates the rapid installation of the first adhesive layer and the circuit board, improving the assembly efficiency of the circuit board assembly.

[0013] In some embodiments, the outer edge of the rib is flush with the outer edge of the photosensitive chip, which is conducive to the miniaturization of the circuit board assembly.

[0014] In some embodiments, in the direction perpendicular to the mounting surface, the height of the circuit board is flush with the height of the photosensitive chip, or the height of the photosensitive chip is less than the height of the circuit board.

[0015] Therefore, through the above settings, the thickness of the circuit board assembly can be reduced, which is conducive to the miniaturization of the circuit board assembly.

[0016] In some embodiments, the circuit board assembly satisfies the relationship:

[0017] 0.6 ≤ S1 / S2 ≤ 0.9;

[0018] Wherein, S1 is the projected area of the filling groove in the direction perpendicular to the mounting surface, and S2 is the projected area of the substrate in the direction perpendicular to the mounting surface.

[0019] Therefore, by reasonably configuring the ratio range of S1 and S2, the substrate can meet the requirement of carrying the circuit board on the basis of low processing cost.

[0020] In some embodiments, the circuit board assembly satisfies the relationship:

[0021] S1 < S3 < S2;

[0022] Wherein, S3 is the projected area of the photosensitive chip in the direction perpendicular to the mounting surface.

[0023] Therefore, by reasonably configuring the size relationship among S1, S3, and S2, a sufficient connection area can be formed between the photosensitive chip and the substrate to ensure the connection strength between the photosensitive chip and the substrate.

[0024] In some embodiments, the circuit board assembly satisfies the relationship:

[0025] 0.2 ≤ D1 / D2 ≤ 0.5, and / or, D3 ≤ D1;

[0026] Wherein, D1 is the depth of the filling groove in the direction perpendicular to the mounting surface, D2 is the thickness of the substrate in the direction perpendicular to the mounting surface, and D3 is the depth of the installation groove in the direction perpendicular to the mounting surface.

[0027] Therefore, by reasonably configuring the ratio range of D1 to D2, it is possible to make the accommodating groove on the substrate accommodate the second adhesive layer with the required thickness while the substrate has sufficient strength. In addition, by reasonably configuring the sizes of D3 and D1, it is possible to facilitate the rapid assembly of the circuit board assembly and make the supplementary substrate have sufficient strength.

[0028] In some embodiments, the substrate includes a steel sheet or a ceramic plate, which can transfer the heat generated when the photosensitive chip works, and is beneficial to improving the service life of the photosensitive chip.

[0029] The embodiment of the present invention also provides an imaging module, including:

[0030] The above-mentioned circuit board assembly;

[0031] The lens assembly is disposed on one side of the circuit board assembly, and the lens assembly and the photosensitive chip are oppositely arranged in the optical axis direction of the imaging module, and light irradiates the photosensitive chip through the lens assembly.

[0032] The circuit board assembly in the above-mentioned imaging module can prevent the photosensitive chip adhered to the substrate from warping and prevent the photosensitive chip from rotating during adhesion, so that the adhesion quality of the photosensitive chip is high, thereby improving the imaging quality of the imaging module.

[0033] The embodiment of the present invention also provides an electronic device, including:

[0034] A housing;

[0035] The above-mentioned imaging module, and the imaging module is installed in the housing.

[0036] The imaging module in the above-mentioned electronic device has high imaging quality, which is beneficial to improving the quality of the electronic device. Description of the Drawings

[0037] Figure 1 It is a schematic structural diagram of the circuit board assembly according to the embodiment of the present invention.

[0038] Figure 2 It is Figure 1 The exploded schematic diagram of the circuit board assembly shown.

[0039] Figure 3 It is Figure 1 The cross-sectional schematic diagram of the circuit board assembly shown along the III-III direction.

[0040] Figure 4 It is Figure 3 The cross-sectional schematic diagram of the circuit board assembly in another embodiment shown.

[0041] Description of the Main Element Symbols

[0042] Circuit board assembly 100

[0043] Substrate 110

[0044] Mounting surface 110a

[0045] Filling groove 110b

[0046] Mounting groove 110c

[0047] Convex rib 110d

[0048] Circuit board 120

[0049] Avoidance hole 120a

[0050] Photosensitive chip 130

[0051] First adhesive layer 140

[0052] Second adhesive layer 150 Detailed implementation mode

[0053] The embodiments of the present invention will be described in detail below. Examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for explaining the present invention and should not be construed as limiting the present invention.

[0054] In the description of the present invention, it should be noted that, unless otherwise clearly defined and limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present invention can be understood according to specific situations.

[0055] The following will describe each embodiment of this case in detail with reference to the drawings.

[0056] Please refer to Figure 1 and Figure 2, an embodiment of the present utility model provides a circuit board assembly 100, including a substrate 110, a circuit board 120, a photosensitive chip 130, a first adhesive layer 140, and a second adhesive layer 150. The substrate 110 has an installation surface 110a, and a filling groove 110b is provided on the installation surface 110a. The circuit board 120 is arranged on the installation surface 110a and is provided with an avoidance hole 120a. In the direction perpendicular to the installation surface 110a, the orthographic projection of the filling groove 110b is completely within the orthographic projection range of the avoidance hole 120a. The photosensitive chip 130 is arranged on the installation surface 110a and is located within the avoidance hole 120a, and the photosensitive chip 130 covers the filling groove 110b. The first adhesive layer 140 is arranged between the installation surface 110a and the circuit board 120, and the first adhesive layer 140 is respectively connected to the substrate 110 and the circuit board 120 to fix the circuit board 120 on the substrate 110. The second adhesive layer 150 is arranged between the photosensitive chip 130 and the substrate 110 and is accommodated in the filling groove 110b. The second adhesive layer 150 is respectively connected to the substrate 110 and the photosensitive chip 130 to fix the photosensitive chip 130 on the substrate 110, and the substrate 110 can resist the stress of the second adhesive layer 150 without deformation.

[0057] In this embodiment, the avoidance hole 120a and the filling groove 110b have the same shape and are coaxially arranged. In other embodiments, the filling groove 110b may also have the same shape as the avoidance hole 120a but be non-coaxial, or the filling groove 110b may be multiple independent and interconnected filling units, or the filling groove 110b may be multiple independent filling units.

[0058] In the above circuit board assembly 100, the filling groove 110b provided on the substrate 110 can accommodate the second adhesive layer 150 for bonding the photosensitive chip 130, so as to change the area and thickness of the second adhesive layer 150 bonded to the photosensitive chip 130, and the substrate 110 can resist the stress of the second adhesive layer 150 without deformation, which is beneficial to avoiding warping of the photosensitive chip 130 bonded to the substrate 110 and preventing the photosensitive chip 130 from rotating during bonding, thereby improving the bonding quality of the photosensitive chip 130.

[0059] Please refer to Figure 2 and Figure 3 , in some embodiments, an installation groove 110c is further provided on the installation surface 110a of the substrate 110. The installation groove 110c is located outside the filling groove 110b. Specifically, the installation groove 110c surrounds the filling groove 110b, and a rib 110d is formed between the installation groove 110c and the filling groove 110b. The circuit board 120 is installed in the installation groove 110c, and the photosensitive chip 130 is arranged on the rib 110d.

[0060] Therefore, the installation groove 110c facilitates the rapid installation of the first adhesive layer 140 and the circuit board 120, improving the assembly efficiency of the circuit board assembly 100.

[0061] In some embodiments, the outer edge of the rib 110d is flush with the outer edge of the photosensitive chip 130, which is beneficial to the miniaturization of the circuit board assembly 100.

[0062] In this embodiment, the rib 110d is a ring-shaped cuboid, and the photosensitive chip 130 is also a cuboid. The outer edge of the rib 110d being flush with the outer edge of the photosensitive chip 130 specifically means that the four side surfaces of the photosensitive chip 130 correspond to the four outer side surfaces of the rib 110d one by one, and each side surface of the photosensitive chip 130 and the corresponding outer side surface in the rib 110d are in a plane perpendicular to the mounting surface 110a.

[0063] In some embodiments, in the direction perpendicular to the mounting surface 110a, the height of the circuit board 120 is flush with the height of the photosensitive chip 130, or the height of the photosensitive chip 130 is less than the height of the circuit board 120.

[0064] Specifically, the height of the circuit board 120 being flush with the height of the photosensitive chip 130 means that the surface of the circuit board 120 facing away from the substrate 110 is flush with the surface of the photosensitive chip 130 facing away from the substrate 110. At this time, the cross-sectional view of the circuit board assembly 100 is as Figure 3 shown. The height of the photosensitive chip 130 being less than the height of the circuit board 120 means that the surface of the photosensitive chip 130 facing away from the substrate 110 is lower than the surface of the circuit board 120 facing away from the substrate 110. At this time, the cross-sectional view of the circuit board assembly 100 is as Figure 4 shown.

[0065] Therefore, through the above settings, the thickness of the circuit board assembly 100 can be reduced, which is beneficial to the miniaturization of the circuit board assembly 100.

[0066] In some embodiments, the circuit board assembly 100 satisfies the relationship:

[0067] 0.6 ≤ S1 / S2 ≤ 0.9;

[0068] wherein, S1 is the projected area of the filling groove 110b in the direction perpendicular to the mounting surface 110a, and S2 is the projected area of the substrate 110 in the direction perpendicular to the mounting surface 110a.

[0069] Therefore, by reasonably configuring the ratio range of S1 to S2, the substrate 110 can meet the requirement of carrying the circuit board 120 on the basis of low processing cost. Specifically, if S1 / S2 is less than 0.6, compared with S1 / S2 being greater than 0.6, the area of the substrate 110 increases, resulting in an increase in the cost of the substrate 110. If S1 / S2 is greater than 0.9, compared with S1 / S2 being less than 0.9, the area of the filling groove 110b on the substrate 110 is too large, while the area for carrying the circuit board 120 is too small, making the substrate 110 unable to effectively support the circuit board 120.

[0070] In this embodiment, S1 / S2 can be 0.6, 0.7, 0.8, 0.9. Preferably, S1 / S2 is 0.7.

[0071] In some embodiments, the circuit board assembly 100 satisfies the relationship:

[0072] S1 < S3 < S2;

[0073] wherein, S3 is the projected area of the photosensitive chip 130 in the direction perpendicular to the mounting surface 110a.

[0074] Therefore, by reasonably configuring the size relationship among S1, S3, and S2, a sufficient connection area can be formed between the photosensitive chip 130 and the substrate 110 to ensure the connection strength between the photosensitive chip 130 and the substrate 110.

[0075] Please refer to Figure 3 , in some embodiments, the circuit board assembly 100 satisfies the relationship:

[0076] 0.2 ≤ D1 / D2 ≤ 0.5;

[0077] wherein, D1 is the depth of the filling groove 110b in the direction perpendicular to the mounting surface 110a, and D2 is the thickness of the substrate 110 in the direction perpendicular to the mounting surface 110a.

[0078] Therefore, by reasonably configuring the ratio range of D1 to D2, the filling groove 110b on the substrate 110 can accommodate the second adhesive layer 150 with the required thickness on the basis that the substrate 110 has sufficient strength. Specifically, if D1 / D2 is less than 0.2, compared with D1 / D2 being greater than 0.2, the depth of the filling groove 110b is too shallow, and the thickness of the accommodated second adhesive layer 150 is limited, unable to meet the requirement of bonding the photosensitive chip 130. If D1 / D2 is greater than 0.5, compared with D1 / D2 being less than 0.5, the strength of the substrate 110 decreases, unable to meet the supporting effect on the circuit board 120.

[0079] In this embodiment, D1 / D2 can be 0.2, 0.3, 0.4, 0.5. Preferably, D1 / D2 is 0.3.

[0080] In some embodiments, the circuit board assembly 100 satisfies the relationship:

[0081] D3 ≤ D1;

[0082] wherein, D1 is the depth of the filling groove 110b along the direction perpendicular to the mounting surface 110a, and D3 is the depth of the mounting groove 110c along the direction perpendicular to the mounting surface 110a.

[0083] Therefore, by reasonably configuring the sizes of D3 and D1, it is possible to facilitate the rapid assembly of the circuit board assembly 100 and enable the substrate 110 to have sufficient strength. Specifically, if D3 is greater than D1, compared with D3 ≤ D1, the strength of the substrate 110 is reduced.

[0084] It should be noted that the circuit board assembly 100 may also satisfy 0.2 ≤ D1 / D2 ≤ 0.5 and D3 ≤ D1 simultaneously.

[0085] In some embodiments, the filling groove 110b is provided in the middle area of the substrate 110, and the filling groove 110b, the mounting surface 110a, and the substrate 110 are all symmetrically structured with respect to the center of the substrate 110.

[0086] Therefore, through the above settings, a stable connection area is formed between the photosensitive chip 130 and the substrate 110, which is beneficial to improving the connection stability between the photosensitive chip 130 and the substrate 110.

[0087] In some embodiments, both the first adhesive layer 140 and the second adhesive layer 150 are formed by curing a colloid. Among them, the colloid can be a thermosetting adhesive.

[0088] Therefore, the first adhesive layer 140 formed by curing the colloid can be fully filled between the circuit board 120 and the substrate 110, and the second adhesive layer 150 formed by curing the colloid can be fully filled between the photosensitive chip 130 and the substrate 110, thereby being beneficial to improving the overall structural stability of the circuit board assembly 100.

[0089] In some embodiments, the substrate 110 includes a steel sheet or a ceramic plate, which can transfer the heat generated when the photosensitive chip 130 works, and is beneficial to improving the service life of the photosensitive chip 130.

[0090] An embodiment of the present invention further provides a camera module (not shown), including a lens assembly (not shown) and the circuit board assembly 100 of the above embodiment. The lens assembly is provided on one side of the circuit board assembly 100, and the lens assembly and the photosensitive chip 130 are oppositely arranged in the optical axis direction of the camera module, and external light irradiates the photosensitive chip 130 through the lens assembly.

[0091] The circuit board assembly 100 in the above camera module can prevent the photosensitive chip 130 adhered to the substrate 110 from warping and prevent the photosensitive chip 130 from rotating during adhesion, resulting in high adhesion quality of the photosensitive chip 130, thereby improving the imaging quality of the camera module.

[0092] An embodiment of the present invention further provides an electronic device (not shown), including a housing (not shown) and the camera module of the above embodiment, and the camera module is installed in the housing. Among them, the electronic device can be a mobile phone, a camera, a drone, etc.

[0093] The camera module in the above electronic device has high imaging quality, which is beneficial to improving the quality of the electronic device.

[0094] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and without departing from the spirit or basic characteristics of the present invention, the present invention can be implemented in other specific forms. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, it is intended to cover all changes falling within the meaning and scope of the equivalent elements of the claims in the present invention.

[0095] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not restrictive. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention.

Claims

1. A circuit board assembly, characterized in that, Comprising: A substrate having a mounting surface, and a filling groove is formed in the mounting surface; A circuit board is disposed on the mounting surface and has an avoidance hole. In the direction perpendicular to the mounting surface, the orthographic projection of the filling groove is completely within the orthographic projection range of the avoidance hole; A photosensitive chip is disposed on the mounting surface and within the avoidance hole, and the photosensitive chip covers the filling groove; A first adhesive layer is disposed between the mounting surface and the circuit board to fix the circuit board on the substrate; A second adhesive layer is disposed between the photosensitive chip and the substrate and is accommodated in the filling groove to fix the photosensitive chip on the substrate, and the substrate can resist the stress of the second adhesive layer without deformation.

2. The circuit board assembly according to claim 1, wherein The substrate further has a mounting groove, the mounting groove is located outside the filling groove, and a rib is formed between the mounting groove and the filling groove. The circuit board is mounted in the mounting groove, and the photosensitive chip is disposed on the rib.

3. The circuit board assembly according to claim 2, wherein The outer edge of the rib is flush with the outer edge of the photosensitive chip.

4. The circuit board assembly according to claim 1, wherein In the direction perpendicular to the mounting surface, the height of the circuit board is flush with the height of the photosensitive chip, or the height of the photosensitive chip is less than the height of the circuit board.

5. The circuit board assembly according to claim 1, wherein The circuit board assembly satisfies the relationship: 0.6 ≤ S1 / S2 ≤ 0.9; wherein, S1 is the projected area of the filling groove in the direction perpendicular to the mounting surface, and S2 is the projected area of the substrate in the direction perpendicular to the mounting surface.

6. The circuit board assembly according to claim 5, wherein, The circuit board assembly satisfies the relationship: S1 < S3 < S2; wherein, S3 is the projected area of the photosensitive chip in the direction perpendicular to the mounting surface.

7. The circuit board assembly according to claim 2, wherein, The circuit board assembly satisfies the relationship: 0.2 ≤ D1 / D2 ≤ 0.5, and / or, D3 ≤ D1; wherein, D1 is the depth of the filling groove in the direction perpendicular to the mounting surface, D2 is the thickness of the substrate in the direction perpendicular to the mounting surface, and D3 is the depth of the mounting groove in the direction perpendicular to the mounting surface.

8. The circuit board assembly according to claim 1, wherein The substrate comprises a steel sheet or a ceramic plate.

9. An imaging module, characterized in that, Comprising: The circuit board assembly according to any one of claims 1 to 8; A lens assembly is disposed on one side of the circuit board assembly, and the lens assembly and the photosensitive chip are oppositely disposed in the optical axis direction of the imaging module, and light passes through the lens assembly and irradiates the photosensitive chip.

10. An electronic device, characterized in that, Comprising: A housing; The imaging module according to claim 9, and the imaging module is mounted in the housing.

Images