Chip mounting device

By adjusting the sliding of the component to change the spacing between the movable part and the positioning part, the problem of inconsistent bonding thickness of the piezoelectric ceramic sensor is solved, and flexible adjustment of sensor performance and quality improvement is achieved.

CN223080378UActive Publication Date: 2025-07-08GOLDCARD SMART GROUP (HANGZHOU) CO LTD
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Patent Information

Application Number
CN202422271856.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-14
Publication Date
2025-07-08
Estimated Expiration
2034-09-14

AI Technical Summary

Technical Problem

In the prior art, the adhesive bonding thickness of piezoelectric ceramic sensors cannot be flexibly adjusted, resulting in unstable performance of sensors of different specifications and affecting service life.

Method used

By adjusting the assembly, the movable member is driven to slide, the spacing between the movable member and the positioning part is changed, and the pressure of the pressure applying device to the second workpiece is adjusted to adapt to the bonding requirements of sensors of different specifications.

Benefits of technology

The bonding thickness adjustment is achieved according to the sensor specifications, improving product quality and performance stability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223080378U_ABST
    Figure CN223080378U_ABST
Patent Text Reader

Abstract

The utility model discloses a chip mounting device, comprising a support assembly which defines a moving space, the inner wall of one side of the moving space along a first direction is provided with a positioning part, and the positioning part is used for positioning a first workpiece; the adjusting assembly comprises a movable part and a pressure applying device, the movable part is arranged in the movable space and can move in the first direction, the pressure applying device is arranged on the movable part and is opposite to the positioning part, and the pressure applying device is constructed to apply pressure to the second workpiece so as to press the second workpiece to the first workpiece; and the driving assembly is arranged on the support assembly and is in transmission connection with the movable part, and the driving assembly is configured to adjust the distance between the movable part and the positioning part. According to the chip mounting device, the adjusting assembly drives the movable part to slide along the first direction, the distance between the movable part and the positioning part is changed, the pressure of the pressure applying device on the second workpiece is changed, the pressure on the second workpiece can be flexibly adjusted according to actual requirements, and the chip mounting device is suitable for the bonding requirements of sensors of different specifications.
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Description

Technical Field

[0001] The utility model relates to the field of household appliances, in particular to a patch device. Background Art

[0002] With the continuous progress of modern technology, sensors are more and more widely used in various fields. The performance of sensors is directly related to their reliability and accuracy in practical applications. Therefore, improving the manufacturing process and performance of sensors has become the focus of research. Among them, piezoelectric ceramic sensors are widely used in detection fields such as acoustics, vibration, and pressure due to their advantages such as high sensitivity and fast response.

[0003] In the manufacturing process of piezoelectric ceramic sensors, the bonding quality between the piezoelectric ceramic and the metal shell has a crucial impact on the performance of the sensors. In the prior art, the piezoelectric ceramic is usually fixed on the metal shell by means of glue bonding. During the glue bonding process, it is very important to control the consistency of the glue bonding thickness, because uneven glue thickness will lead to unstable performance of the sensor and even affect its service life.

[0004] In order to ensure the consistency of the glue bonding thickness, in the prior art, it is generally achieved by controlling the bonding pressure. The bonding pressure of the conventional bonding tooling is fixed, and when bonding sensors of different specifications are required, it cannot flexibly meet different bonding requirements. Summary of the Utility Model

[0005] The utility model aims to at least solve one of the technical problems existing in the prior art. For this reason, an object of the utility model is to provide a patch device, which drives the movable part to slide along the first direction through the adjusting component, changes the distance between the movable part and the positioning part, thereby changing the pressure of the pressing device on the second workpiece, and can flexibly adjust the pressure on the second workpiece according to actual needs, so as to meet the bonding requirements of sensors of different specifications.

[0006] An embodiment of the present application provides a patch device for patching a first workpiece and a second workpiece, including: a bracket assembly that defines a movable space, and an inner wall of one side of the movable space along the first direction is provided with a positioning part for positioning the first workpiece; an adjusting component including a movable part and a pressing device, the movable part is arranged in the movable space and is movable along the first direction, the pressing device is arranged on the movable part and is arranged opposite to the positioning part, and the pressing device is configured to press the second workpiece to press the second workpiece against the first workpiece; a driving component arranged on the bracket assembly and in transmission connection with the movable part, and the driving component is configured to adjust the distance between the movable part and the positioning part.

[0007] For the patch device of the present utility model, a worker starts the driving component, and the transmission drives the moving part to move along the first direction, changing the distance between the moving part and the positioning part, and further changing the pressing force of the pressing device on the second workpiece. In this way, the bonding thickness of the glue between the first workpiece and the second workpiece during pressing is changed. Thus, different bonding forces can be selected according to different specifications of sensors, thereby improving the product quality.

[0008] In some embodiments, the bracket assembly includes: a first fixing plate and a second fixing plate. The first fixing plate and the second fixing plate are arranged opposite to each other and spaced apart along the first direction to jointly define the moving space, and the positioning part is arranged on one of the first fixing plate and the second fixing plate.

[0009] Through the combination of the first fixing plate and the second fixing plate, a stable structural framework is formed, improving the stability and reliability of the bracket assembly during use.

[0010] According to some embodiments of the present utility model, the bracket assembly includes: a connecting rod. Both the first fixing plate and the second fixing plate are fixedly connected to the connecting rod. The moving part is located between the first fixing plate and the second fixing plate, and the connecting rod also passes through the moving part.

[0011] The connecting rod provides a guiding function for the sliding of the moving part along the first direction, further improving the stability of the bracket assembly during use.

[0012] According to some embodiments of the present utility model, the first fixing plate is provided with a first guiding hole, the moving part is provided with a second guiding hole, the positioning part is arranged on the second fixing plate, the first guiding hole, the second guiding hole and the positioning part are corresponding to each other along the first direction. The pressing device includes a pressing rod, and the pressing rod includes a first end and a second end. The first end passes through the first guiding hole and extends to the side of the first fixing plate facing away from the moving part, and the second end passes through the second guiding hole and extends to the side of the moving part facing the second fixing plate. The pressing rod is in transmission cooperation with the moving part to press the second workpiece under the drive of the moving part.

[0013] By making the first guiding hole, the second guiding hole and the positioning part corresponding to each other along the first direction, it is ensured that the pressing rod can ensure accurate guiding during movement, thereby improving the accuracy of the pressing rod pressing the second workpiece; at the same time, the first guiding hole and the second guiding hole provide a dual guiding function for the pressing rod, reducing the offset and shaking of the pressing rod during the process of pressing the second workpiece, and enhancing the stability of the system.

[0014] According to some embodiments of the present utility model, the pressing rod is movable relative to the movable member, and the pressing device further includes: an elastic member, both ends of the elastic member are respectively connected to the movable member and the second end, and the movable member adjusts the acting force applied by the pressing rod to the second workpiece through the elastic member.

[0015] The elastic member provides buffering for the pressing process of the pressing rod on the second workpiece, avoiding damage to the first workpiece and the second workpiece due to large mechanical acting forces.

[0016] According to some embodiments of the present utility model, the bracket assembly further includes: a first linear bearing disposed in the first guiding hole, an inner ring of the bearing of the first linear bearing is fitted with the pressing rod, and an outer ring of the bearing of the first linear bearing is fitted with the first fixing plate; and / or, a second linear bearing disposed in the second guiding hole, an inner ring of the bearing of the second linear bearing is fitted with the pressing rod, and an outer ring of the bearing of the second linear bearing is fitted with the movable member.

[0017] By respectively fitting the first linear bearing and the second linear bearing with the pressing rod, the frictional effect between the pressing rod and the first guiding hole and the second guiding hole during the relative sliding of the pressing rod and the first fixing plate to press the second workpiece is reduced, which is beneficial to extending the service life of the pasting device.

[0018] According to some embodiments of the present utility model, the movable member is provided with a through hole penetrating the movable member along the first direction, the driving assembly includes a lead screw, the lead screw is rotatably disposed in the through hole and is in threaded cooperation with the through hole, and the movable member is configured to move along the first direction when the lead screw rotates relative to the movable member.

[0019] By driving the movable member to move relative to the first fixing plate through the rotation of the lead screw, the structure is simple, and the worker only needs to rotate the lead screw to drive the movable member to move, which is convenient to operate.

[0020] According to some embodiments of the present utility model, the driving assembly further includes a lead screw nut, the lead screw nut is fixedly disposed in the through hole, and the lead screw is in threaded cooperation with the lead screw nut.

[0021] The linear motion accuracy of the threaded cooperation between the lead screw and the lead screw nut is high, so that the pressure is accurate during the pressing process of the pressing rod on the second workpiece; the lead screw nut system has a self-locking function, and when the driving force stops, the lead screw can maintain its position unchanged, and the bonding thickness of the glue between the first workpiece and the second workpiece at different positions of the movable member can be accurately detected to meet the bonding requirements of sensors of different specifications.

[0022] According to some embodiments of the present utility model, a first assembly hole is provided on the first fixing plate, a second assembly hole is provided on the second fixing plate, the first assembly hole and the second assembly hole are both opposite to the through hole, the first end of the lead screw passes through the first assembly hole and extends to the side of the first fixing plate facing away from the movable member, and the second end of the lead screw extends to the second assembly hole.

[0023] Both ends of the lead screw are fixed through the first assembly hole and the second assembly hole respectively, providing double support and enhancing the stability of the lead screw during the pressing process. The arrangement of the first assembly hole and the second assembly hole makes the installation and disassembly of the lead screw more convenient, reducing the maintenance cost and difficulty of the chip mounter.

[0024] According to some embodiments of the present utility model, the bracket assembly further includes: a first ball bearing provided in the first assembly hole, the inner ring of the bearing of the first ball bearing is matched with the lead screw, and the outer ring of the bearing of the first ball bearing is matched with the first fixing plate; and / or, a second ball bearing provided in the second assembly hole, the inner ring of the bearing of the second ball bearing is matched with the lead screw, and the outer ring of the bearing of the second ball bearing is matched with the first fixing plate.

[0025] The first ball bearing and the second ball bearing reduce the friction between the lead screw and the first assembly hole and the second assembly hole during rotation, extending the service life of the equipment.

[0026] According to some embodiments of the present utility model, it further includes: a positioning member that defines a receiving cavity for receiving the first workpiece, the receiving cavity is open on the side facing the pressing rod, and the positioning member constitutes the positioning portion.

[0027] During chip processing, the receiving cavity serves to receive and fix the first workpiece. When the first workpiece and the second workpiece are pressed together, the relative position between the first workpiece and the second workpiece is fixed, thereby improving the consistency of the product.

[0028] According to some embodiments of the present utility model, a positioning structure is provided on the peripheral wall of the receiving cavity, and the second workpiece is provided with a positioning cooperation structure. When the pressing device presses the second workpiece, the positioning cooperation structure is in positioning cooperation with the positioning structure.

[0029] The positioning cooperation between the positioning structure and the positioning cooperation structure makes the relative position between the second workpiece and the receiving cavity fixed, preventing the second workpiece from shifting or sliding during the pressing process, making the pressing force evenly distributed, reducing the processing error, and thus improving the qualified rate of the product.

[0030] The additional aspects and advantages of the present utility model will be partially given in the following description, partially become apparent from the following description, or be understood through the practice of the present utility model. Brief Description of the Drawings

[0031] The above and / or additional aspects and advantages of the present utility model will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, wherein:

[0032] Figure 1 is a schematic structural diagram of a chip mounting device according to an embodiment of the present utility model;

[0033] Figure 2 is a schematic cross-sectional structural diagram of a chip mounting device according to an embodiment of the present utility model;

[0034] Figure 3 is a partial structural diagram of a bracket assembly according to an embodiment of the present utility model;

[0035] Figure 4 is a partial structural diagram of a bracket assembly according to an embodiment of the present utility model;

[0036] Figure 5 is a schematic structural diagram of a pressing device according to an embodiment of the present utility model;

[0037] Figure 6 is a partial structural diagram of a driving assembly according to an embodiment of the present utility model;

[0038] Figure 7 is a schematic diagram of the processing and fitting of a positioning portion and a piezoelectric ceramic sensor according to an embodiment of the present utility model.

[0039] Reference Numerals:

[0040] 100 - Chip mounting device;

[0041] 110 - Bracket assembly; 110a - Activity space; 111 - First fixing plate; 1111 - First guiding hole; 1112 - First assembly hole; 112 - Second fixing plate; 1121 - Second assembly hole; 113 - Connecting rod; 114 - First linear bearing; 115 - Second linear bearing; 116 - First ball bearing; 117 - Second ball bearing;

[0042] 120 - Positioning portion;

[0043] 130 - Adjusting assembly; 131 - Movable part; 1311 - Second guiding hole; 1312 - Through hole; 132 - Pressing device; 1321 - Pressing rod; 1322 - Elastic member;

[0044] 140 - Driving assembly; 141 - Lead screw; 142 - Lead screw nut; 143 - Operating handle;

[0045] 150 - Positioning member; 151 - Accommodating cavity; 152 - Positioning structure;

[0046] 200 - Piezoelectric ceramic sensor;

[0047] 210 - First workpiece;

[0048] 220 - Second workpiece; 221 - Positioning and fitting structure. Detailed implementation manners

[0049] The embodiments of the present utility model will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0050] In the prior art, the thickness of the glue bonding layer between the metal shell and the piezoelectric ceramic of the piezoelectric ceramic sensor is fixed and cannot be changed according to the specifications of the piezoelectric ceramic sensor, which affects the performance of piezoelectric ceramic sensors of different specifications.

[0051] In view of this, the present application provides a patch device. By driving the movable member to slide along the first direction through the adjusting component, the distance between the movable member and the positioning portion is changed, so that the pressure applied by the pressing device to the second workpiece is changed, and the pressure on the second workpiece can be flexibly adjusted according to actual needs.

[0052] For the convenience of description, refer to Figure 1 , it is stipulated that the first direction can be the height direction of the patch device.

[0053] Refer to Figures 1 to 7 to describe a patch device 100 of the present utility model. The patch device 100 can be used for patch processing of the piezoelectric ceramic sensor 200. Refer to Figure 7 , the piezoelectric ceramic sensor 200 can include a first workpiece 210 and a second workpiece 220. For example, the first workpiece 210 can be a piezoelectric ceramic, and the second workpiece 220 can be a metal shell. The patch device 100 applies pressure to the second workpiece 220 to make the first workpiece 210 fit with the second workpiece 220.

[0054] Refer to Figures 1 to 4 , the patch device 100 can include: a bracket assembly 110, an adjusting assembly 130, and a driving assembly 140.

[0055] Among them, an activity space 110a is defined inside the bracket assembly 110. A positioning portion 120 is provided in the activity space 110a. The positioning portion 120 is located on an inner wall of the activity space 110a on one side along the first direction. The positioning portion 120 is used to position the first workpiece 210, that is, the piezoelectric ceramic. That is, when the pasting device 100 performs a pressing and pasting process on the first workpiece 210 and the second workpiece 220, the first workpiece 210 is positioned through the positioning portion 120. In this way, a reference can be provided for the second workpiece 220, that is, the metal shell, during the pasting process, ensuring the precise connection position between the first workpiece 210 and the second workpiece 220, which is beneficial to improving the pasting quality.

[0056] The adjusting assembly 130 may include a movable member 131 and a pressing device 132. Among them, the movable member 131 may be a movable plate. The movable member 131 is provided in the activity space 110a and is movable along the first direction. For example, the movable member 131 may be movably connected to the bracket assembly 110. The pressing device 132 is provided on the movable member 131 and is arranged opposite to the positioning portion 120 along the first direction. The pressing device 132 is configured to apply pressure to the second workpiece 220 to press the second workpiece 220 onto the first workpiece 210. For example, when the movable member 131 moves in a direction close to the positioning portion 120, it drives the pressing device 132 to move in a direction close to the first workpiece 210. The pressing device 132 applies pressure to the second workpiece 220, causing the second workpiece 220 to be pressed onto the first workpiece 210. Or, the pressing device 132 applies pressure simultaneously from both sides of the first workpiece 210 and the second workpiece 220, causing the second workpiece 220 to be pressed onto the first workpiece 210 to form the piezoelectric ceramic sensor 200.

[0057] The driving assembly 140 is provided on the bracket assembly 110 and is in transmission connection with the movable member 131. The driving assembly 140 can provide power for the movable member 131. The driving assembly 140 is configured to adjust the distance between the movable member 131 and the positioning portion 120. Among them, the connection manner between the driving assembly 140 and the movable member 131 may be a ball screw connection. The driving assembly 140 drives the ball screw to move the movable member 131 along the first direction, thereby changing the distance between the movable member 131 and the positioning portion 120, and further changing the pressing force of the pressing device 132 on the second workpiece 220. Or, the driving assembly 140 may also be connected to the movable member 131 through a push rod with a self-locking device. The driving assembly 140 drives the push rod to move linearly to move the movable member 131 along the first direction, thereby changing the distance between the movable member 131 and the positioning portion 120, and further changing the pressing force of the pressing device 132 on the second workpiece 220.

[0058] For the patch device 100 of the present utility model, an operator starts the driving component 140, which drives the moving part 131 to move in the first direction, changing the distance between the moving part 131 and the positioning part 120, and further changing the pressing force of the pressing device 132 on the second workpiece 220. In this way, the bonding thickness of the glue between the first workpiece 210 and the second workpiece 220 during pressing is changed. Thus, different bonding forces can be selected according to sensors of different specifications, thereby improving the product quality.

[0059] It can be understood that the patch device 100 of this embodiment can also be used as a test tooling. By driving the moving part 131 to be located at different positions by the driving component 140, the pressing device 132 applies different pressing forces to the second workpiece 220. By detecting and comparing the performance of the piezoelectric ceramic sensors 200 produced under different pressing forces, the most suitable pressing force during the production of the piezoelectric ceramic sensors 200 can be determined, thereby improving the product quality.

[0060] Reference Figures 1 to 4 , in some embodiments, the bracket assembly 110 may include: a first fixing plate 111, a second fixing plate 112, and a connecting rod 113. The first fixing plate 111 and the second fixing plate 112 are arranged opposite to each other and spaced apart in the first direction (such as the up-down direction). The first fixing plate 111 and the second fixing plate 112 can jointly define a moving space 110a. That is, the first fixing plate 111 constitutes the top plate of the bracket assembly 110, and the second fixing plate 112 can constitute the bottom plate of the bracket assembly 110. The moving space 110a is between the first fixing plate 111 and the second fixing plate 112.

[0061] Both the first fixing plate 111 and the second fixing plate 112 are fixedly connected to the connecting rod 113. Through the combination of the first fixing plate 111, the second fixing plate 112, and the connecting rod 113, a stable structural framework is formed, improving the stability and reliability of the bracket assembly 110 during use.

[0062] The moving part 131 is located between the first fixing plate 111 and the second fixing plate 112, and the connecting rod 113 passes through the moving part 131, providing a guiding function for the sliding of the moving part 131 in the first direction, further improving the stability of the bracket assembly 110 during use. The positioning part 120 is provided on one of the first fixing plate 111 and the second fixing plate 112. For example, the positioning part 120 can be provided on the first fixing plate 111, or the positioning part 120 can also be provided on the second fixing plate 112, both of which can play a positioning role for the first workpiece 210.

[0063] Reference Figure 1 , Figure 2 and Figure 4Furthermore, a first guide hole 1111 is provided on the first fixed plate 111, a second guide hole 1311 is provided on the movable part 131, and the positioning portion 120 is provided on the second fixed plate 112. The first guide hole 1111, the second guide hole 1311 and the positioning portion 120 correspond to each other along the first direction, so that the pressure device 132 can maintain precise guidance during the movement of the movable part 131, thereby improving the accuracy of pressure on the second workpiece 220.

[0064] refer to Figure 1 , Figure 2 and Figure 5 The pressure device 132 may include a pressure rod 1321, which includes a first end and a second end. The first end extends through the first guide hole 1111 to the side of the first fixed plate 111 facing away from the movable member 131, and the second end extends through the second guide hole 1311 to the side of the movable member 131 facing the second fixed plate 112.

[0065] The pressure rod 1321 cooperates with the movable part 131 in transmission so as to apply pressure to the second workpiece 220 under the drive of the movable part 131, wherein the pressure rod 1321 and the movable part 131 can be cooperated in a manner that the pressure rod 1321 is fixed relative to the movable part 131, and the movable part 131 moves along a first direction to drive the pressure rod 1321 to press the first workpiece 210 and the second workpiece 220, or a transmission part (such as the elastic part 1322 described below) is provided between the movable part 131 and the pressure rod 1321, and when the movable part 131 moves along the first direction, the pressure rod 1321 is driven by the transmission part to move and press the first workpiece 210 and the second workpiece 220.

[0066] The first guide hole 1111 and the second guide hole 1311 provide dual guiding functions for the pressure rod 1321, reducing the deviation and shaking of the pressure rod 1321 during the process of applying pressure to the second workpiece 220, enhancing the structural stability of the patch device 100, and also facilitating improving the connection accuracy between the first workpiece 210 and the second workpiece 220, thereby improving the patch qualification rate.

[0067] Continue to refer Figure 1 , Figure 2 and Figure 5 According to some embodiments of the utility model, the pressure rod 1321 can move relative to the movable part 131, and the relative movement mode can be that the pressure rod 1321 can slide along a first direction relative to the movable part 131, or the pressure rod 1321 and the movable part 131 can be connected by a threaded transmission, and the pressure rod 1321 rotates relative to the movable part 131, which can change the relative position between the pressure rod 1321 and the movable part 131.

[0068] The pressure device 132 may also include: an elastic member 1322, the two ends of which are respectively connected to the movable member 131 and the second end of the pressure rod 1321, for example, the second end of the pressure rod 1321 is provided with a circumferentially protruding pressure portion, one end of the elastic member 1322 abuts against the end surface of the pressure portion away from the second fixed plate 112, and the other end abuts against the end surface of the movable member 131 facing the second fixed plate 112. In this way, when the movable member 131 drives the pressure rod 1321 to move through the elastic member 1322, the elastic member 1322 provides a buffer for the pressure rod 1321 to apply pressure to the second workpiece 220, thereby preventing the first workpiece 210 and the second workpiece 220 from being damaged by a large mechanical force. When the relative position between the movable member 131 and the pressure rod 1321 changes, the expansion and contraction amount of the elastic member 1322 changes, so that the pressing force of the pressure rod 1321 on the second workpiece 220 changes.

[0069] Furthermore, the elastic member 1322 can be sleeved on the pressure rod 1321, and both ends of the elastic member 1322 are respectively in contact with the pressure portion and the movable member 131, so that the pressure force applied by the pressure portion of the pressure rod 1321 to the second workpiece 220 can be more uniform.

[0070] Optionally, the elastic member 1322 may be a spring or an elastic rubber sleeve, thereby saving the production cost of the patch device 100 .

[0071] refer to Figures 1 to 3 According to some embodiments of the present invention, the bracket assembly 110 may also include: a first linear bearing 114 and a second linear bearing 115, the first linear bearing 114 is arranged in the first guide hole 1111, the inner ring of the bearing of the first linear bearing 114 cooperates with the pressure rod 1321, and the outer ring of the bearing of the first linear bearing 114 cooperates with the first fixed plate 111; the second linear bearing 115 is arranged in the second guide hole 1311, the inner ring of the bearing of the second linear bearing 115 cooperates with the pressure rod 1321, and the outer ring of the bearing of the second linear bearing 115 cooperates with the movable part 131.

[0072] By cooperating with the pressure rod 1321 respectively through the first linear bearing 114 and the second linear bearing 115, the friction between the pressure rod 1321 and the first guide hole 1111 and the second guide hole 1311 is reduced when the pressure rod 1321 slides relative to the first fixed plate 111 to apply pressure to the second workpiece 220, which is beneficial to extending the service life of the patch device 100.

[0073] Optionally, the bracket assembly 110 may be provided with a first linear bearing 114 only in the first guide hole 1111, or the bracket assembly 110 may be provided with a second linear bearing 115 only in the second guide hole 1311, which may also reduce the friction between the pressure rod 1321 and the bracket assembly 110.

[0074] Reference Figure 1 and Figure 2 According to some embodiments of the present utility model, the positioning portions 120 are all a plurality of circumferentially spaced along the circumferential direction of the moving space 110a, and the first guide holes 1111, the second guide holes 1311 and the pressing device 132 correspond to the positioning portions 120 one by one.

[0075] By setting the positioning portions 120 and the structures corresponding to the positioning portions 120 to be a plurality, the chip mounter 100 can simultaneously press a plurality of second workpieces 220 onto the first workpiece 210, thereby improving the chip mounting efficiency; moreover, a plurality of piezoelectric ceramic sensors 200 are processed simultaneously, and the pressing forces applied to the second workpieces 220 of each piezoelectric ceramic sensor 200 are the same. Thus, it is beneficial to improve the consistency of the product, thereby improving the product quality.

[0076] Reference Figure 1 、 Figure 2 、 Figure 4 and Figure 6 According to some embodiments of the present utility model, the moving member 131 is provided with a through hole 1312 penetrating the moving member 131 along the first direction. The driving assembly 140 includes a lead screw 141. The lead screw 141 is rotatably disposed in the through hole 1312 and is in threaded cooperation with the through hole 1312. When the lead screw 141 rotates relative to the moving member 131, the moving member 131 moves along the first direction, and the elongation of the elastic member 1322 of the driving assembly 140 changes, and the pressing force of the pressing device 132 on the second workpiece 220 changes.

[0077] By rotating the lead screw 141 to drive the moving member 131 to move relative to the first fixing plate 111, the structure is simple. The worker only needs to rotate the lead screw 141 to drive the moving member 131 to move, and the operation is convenient.

[0078] Continue to refer to Figure 2 Furthermore, the driving assembly 140 may further include a lead screw nut 142. The lead screw nut 142 is fixedly disposed in the through hole 1312, and the lead screw 141 is in threaded cooperation with the lead screw nut 142. The linear motion precision of the threaded cooperation between the lead screw 141 and the lead screw nut 142 is high, so that the pressure is accurate during the pressing process of the pressing rod 1321 on the second workpiece 220; the lead screw nut 142 system has a self-locking function. When the driving force stops, the lead screw 141 can maintain its position unchanged, and the bonding thickness of the glue between the first workpiece 210 and the second workpiece 220 at different positions of the moving member 131 can be produced to meet the bonding requirements of sensors of different specifications.

[0079] Reference Figures 2 to 4, According to some embodiments of the present utility model, the first fixing plate 111 is provided with a first assembly hole 1112, and the second fixing plate 112 is provided with a second assembly hole 1121. The first assembly hole 1112 and the second assembly hole 1121 are both opposite to the through hole 1312. The first end of the lead screw 141 passes through the first assembly hole 1112 and extends to the side of the first fixing plate 111 opposite to the movable member 131, and the second end of the lead screw 141 extends to the second assembly hole 1121. The two ends of the lead screw 141 are respectively fixed by the first assembly hole 1112 and the second assembly hole 1121, providing double support and enhancing the stability of the lead screw 141 during the pressing process. The arrangement of the first assembly hole 1112 and the second assembly hole 1121 also makes the installation and disassembly of the lead screw 141 more convenient, thereby reducing the maintenance cost and difficulty of the chip mounter 100.

[0080] Reference Figure 1 , Figure 2 and Figure 6 , According to some embodiments of the present utility model, the driving assembly 140 includes an operating handle 143, and the operating handle 143 is arranged at the first end of the lead screw 141. Workers can drive the lead screw 141 by manually rotating the operating handle 143. The operation is labor-saving and convenient, without a complex control system, suitable for various operating environments. Compared with the copied driving device, driving the lead screw 141 to rotate through the operating handle 143 saves the production cost of the chip mounter 100.

[0081] Reference Figure 2 and Figure 3 , According to some embodiments of the present utility model, the bracket assembly 110 may further include: a first ball bearing 116 and a second ball bearing 117. The first ball bearing 116 is arranged in the first assembly hole 1112. The inner ring of the bearing of the first ball bearing 116 cooperates with the lead screw 141, and the outer ring of the bearing of the first ball bearing 116 cooperates with the first fixing plate 111; the second ball bearing 117 is arranged in the second assembly hole 1121. The inner ring of the bearing of the second ball bearing 117 cooperates with the lead screw 141, and the outer ring of the bearing of the second ball bearing 117 cooperates with the first fixing plate 111. The first ball bearing 116 and the second ball bearing 117 reduce the friction between the lead screw 141 and the first assembly hole 1112 and the second assembly hole 1121 during the rotation process, and extend the service life of the chip mounter 100.

[0082] Optionally, the arrangement of the first ball bearing 116 and the second ball bearing 117 may also be: only the first ball bearing 116 is arranged in the first assembly hole 1112, or only the second ball bearing 117 is arranged in the second assembly hole 1121, which can also play the role of reducing the friction between the lead screw 141 and the bracket assembly 110 and extending the service life of the chip mounter 100.

[0083] Understandably, both the first roller bearing and the second ball bearing 117 are provided with snap rings, and the lead screw 141 is in a limiting fit with the snap rings, so that the relative position of the lead screw 141 within the support assembly 110 is fixed, thereby improving the structural stability of the chip mounter 100.

[0084] Reference Figure 1 and Figure 7 According to some embodiments of the present invention, the chip mounter 100 may further include a positioning member 150. The positioning member 150 defines a receiving cavity 151 for receiving the first workpiece 210. The receiving cavity 151 is open on a side facing the pressing rod 1321, and the positioning member 150 constitutes the positioning portion 120. During chip processing, the first workpiece 210 is placed in the receiving cavity 151. The receiving cavity 151 functions to receive and fix the first workpiece 210. When the first workpiece 210 and the second workpiece 220 are pressed together, the relative position between the first workpiece 210 and the second workpiece 220 is fixed, thereby improving the product consistency.

[0085] Optionally, the positioning member 150 may be polytetrafluoroethylene (commonly known as Teflon). Polytetrafluoroethylene has the characteristics of high lubricity and non-stickiness, making it more convenient to remove the product from the positioning member 150 after the first workpiece 210 and the second workpiece 220 are chip-pressed together.

[0086] Further, the peripheral wall of the receiving cavity 151 is provided with a positioning structure 152, and the second workpiece 220 is provided with a positioning mating structure 221. Among them, the positioning structure 152 may be a positioning groove, and the positioning mating structure 221 may be a protrusion adapted to the positioning groove. When the pressing device 132 presses the second workpiece 220, the positioning mating structure 221 and the positioning structure 152 are in positioning cooperation, that is, the protrusion is clamped in the positioning groove, so that the relative position between the second workpiece 220 and the receiving cavity 151 is fixed, preventing the second workpiece 220 from shifting or sliding during the pressing process, enabling the pressing force to be evenly distributed, reducing the processing error, and further improving the product qualification rate.

[0087] The working principle of the chip mounter 100 of the present invention is as follows:

[0088] The first workpiece 210 of the piezoelectric ceramic sensor 200 is placed in the receiving cavity 151 of the positioning member 150. Glue is applied to the top of the first workpiece 210, and the positioning mating structure 221 of the second workpiece 220 is placed towards the positioning structure 152 on the positioning member 150. The worker rotates the operating handle 143, and the lead screw 141 drives the movable member 131 to move towards the positioning member 150 in the first direction. At this time, the pressing rod 1321 abuts against the side of the second workpiece 220 away from the first workpiece 210, applying a pressing force to the second workpiece 220, so that the first workpiece 210 and the second workpiece 220 are bonded together.

[0089] Alternatively, when the patch device 100 of the present utility model is used as a test tooling, the working principle is as follows: by rotating the operating handle 143, the distance between the movable member 131 and the positioning member 150 is changed, and the elongation of the elastic member 1322 of the pressing device 132 is different, so that the pressing force applied to the second workpiece 220 is different. By testing the performance of the product under different pressing forces, the most suitable pressing force is determined, and thus mass production can be carried out. Among them, the pressing force can be calculated according to the deformation of the elastic member 1322.

[0090] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0091] In the description of the present utility model, the "first feature" and "second feature" may include one or more of such features.

[0092] In the description of the present utility model, the meaning of "a plurality of" is two or more.

[0093] In the description of the present utility model, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact through other features therebetween.

[0094] In the description of the present utility model, the first feature being "above", "over" and "on" the second feature includes the first feature being directly above and obliquely above the second feature, or merely indicating that the first feature is at a higher horizontal level than the second feature.

[0095] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "schematic embodiments", "examples", "specific examples", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0096] Although embodiments of the present utility model have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present utility model. The scope of the present utility model is defined by the claims and their equivalents.

Claims

1. A chip mounting device (100) for chip mounting a first workpiece (210) and a second workpiece (220), characterized in that Comprising: A bracket assembly (110) defining an active space (110a), on an inner wall of one side of the active space (110a) along a first direction, a positioning portion (120) is provided, and the positioning portion (120) is used for positioning the first workpiece (210); An adjusting assembly (130) including a movable member (131) and a pressing device (132), the movable member (131) is disposed in the active space (110a) and is movable along the first direction, the pressing device (132) is disposed on the movable member (131) and is arranged opposite to the positioning portion (120), and the pressing device (132) is configured to press the second workpiece (220) to press-fit the second workpiece (220) to the first workpiece (210); A driving assembly (140) disposed on the bracket assembly (110) and in transmission connection with the movable member (131), and the driving assembly (140) is configured to adjust a distance between the movable member (131) and the positioning portion (120).

2. The patch device (100) according to claim 1, characterized in that, The bracket assembly (110) includes: a first fixing plate (111) and a second fixing plate (112), the first fixing plate (111) and the second fixing plate (112) are arranged opposite to and spaced apart from each other along the first direction to jointly define the active space (110a), The positioning portion (120) is disposed on one of the first fixing plate (111) and the second fixing plate (112).

3. The patch device (100) according to claim 2, characterized in that, The bracket assembly (110) includes: a connecting rod (113), both the first fixing plate (111) and the second fixing plate (112) are fixedly connected to the connecting rod (113), the movable member (131) is located between the first fixing plate (111) and the second fixing plate (112), and the connecting rod (113) also passes through the movable member (131).

4. The patch device (100) according to claim 2, characterized in that, A first guiding hole (1111) is provided on the first fixing plate (111), a second guiding hole (1311) is provided on the movable member (131), the positioning portion (120) is disposed on the second fixing plate (112), and the first guiding hole (1111), the second guiding hole (1311) and the positioning portion (120) are corresponding to each other along the first direction, The pressing device (132) includes a pressing rod (1321), the pressing rod (1321) includes a first end and a second end, the first end passes through the first guiding hole (1111) and extends to a side of the first fixing plate (111) facing away from the movable member (131), the second end passes through the second guiding hole (1311) and extends to a side of the movable member (131) facing the second fixing plate (112), and the pressing rod (1321) is in transmission cooperation with the movable member (131) to press the second workpiece (220) under the drive of the movable member (131).

5. The patch device (100) according to claim 4, characterized in that, The pressure bar (1321) is movable relative to the movable member (131). The pressing device (132) further includes: an elastic member (1322), both ends of the elastic member (1322) are respectively connected to the movable member (131) and the second end, and the movable member (131) adjusts the acting force applied by the pressure bar (1321) to the second workpiece (220) through the elastic member (1322).

6. The patch device (100) according to claim 4, wherein The bracket assembly (110) further includes: a first linear bearing (114) disposed in the first guiding hole (1111), the inner ring of the bearing of the first linear bearing (114) is engaged with the pressure bar (1321), and the outer ring of the bearing of the first linear bearing (114) is engaged with the first fixing plate (111); and / or, a second linear bearing (115) disposed in the second guiding hole (1311), the inner ring of the bearing of the second linear bearing (115) is engaged with the pressure bar (1321), and the outer ring of the bearing of the second linear bearing (115) is engaged with the movable member (131).

7. The patch device (100) according to any one of claims 4-6, characterized in that, The movable member (131) is provided with a through hole (1312) penetrating through the movable member (131) along the first direction. The driving assembly (140) includes a lead screw (141), the lead screw (141) is rotatably disposed through the through hole (1312) and is in threaded engagement with the through hole (1312), and the movable member (131) is configured to move along the first direction when the lead screw (141) rotates relative to the movable member (131).

8. The patch device (100) according to claim 7, characterized in that, The driving assembly (140) further includes a lead screw nut (142), the lead screw nut (142) is fixedly disposed in the through hole (1312), and the lead screw (141) is in threaded engagement with the lead screw nut (142).

9. The patch device (100) according to claim 7, characterized in that, The first fixing plate (111) is provided with a first assembly hole (1112), the second fixing plate (112) is provided with a second assembly hole (1121), both the first assembly hole (1112) and the second assembly hole (1121) are opposite to the through hole (1312), the first end of the lead screw (141) passes through the first assembly hole (1112) and extends to the side of the first fixing plate (111) facing away from the movable member (131), and the second end of the lead screw (141) extends to the second assembly hole (1121).

10. The patch device (100) according to claim 9, characterized in that, The bracket assembly (110) further includes: a first ball bearing (116) disposed in the first assembly hole (1112), the inner ring of the bearing of the first ball bearing (116) is engaged with the lead screw (141), and the outer ring of the bearing of the first ball bearing (116) is engaged with the first fixing plate (111); and / or, a second ball bearing (117) disposed in the second assembly hole (1121), the inner ring of the bearing of the second ball bearing (117) is engaged with the lead screw (141), and the outer ring of the bearing of the second ball bearing (117) is engaged with the first fixing plate (111).

11. The patch device (100) according to any one of claims 4-6, characterized in that, Further included: Positioning member (150), the positioning member (150) defines a receiving cavity (151) for receiving the first workpiece (210), the receiving cavity (151) is open on a side facing the pressing rod (1321), and the positioning member (150) constitutes the positioning portion (120).

12. The patch device (100) according to claim 11, characterized in that, The peripheral wall of the receiving cavity (151) is provided with a positioning structure (152), and the second workpiece (220) is provided with a positioning cooperation structure (221). When the pressing device (132) presses the second workpiece (220), the positioning cooperation structure (221) cooperates with the positioning structure (152) for positioning.