Supporting platform and laser processing device

Abstract

The utility model provides a supporting platform and a laser processing device.The supporting platform comprises a base, a plurality of first driving parts and a plurality of supporting plates, each first driving part is fixedly connected with the base, each supporting plate is used for supporting a workpiece to be processed, and one first driving part is connected with one supporting plate; the first driving part is used for driving the supporting plate to move in the thickness direction of the supporting plate. The supporting platform provided by the utility model can solve the technical problem that the laser flame is easy to damage the supporting piece in the related technology. In addition, the supporting plate is driven by the first driving part, the step of manually adjusting the supporting plate can be omitted, and the machining efficiency can be improved.

Description

Technical Field

[0001] This application belongs to the technical field of laser processing, and more specifically, relates to a support platform and a laser processing device. Background Art

[0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between a laser beam and matter to cut, weld, surface treat, drill holes, and micro-machine materials (including metals and non-metals). Materials (workpieces to be processed) that need to be processed using a laser processing device need to be supported by a support, but during laser processing, the laser flame usually penetrates the workpiece to be processed and is likely to damage the support. Summary of the Utility Model

[0003] The purpose of the embodiments of this application is to provide a support platform and a laser processing device to solve the technical problem in the related art that the laser flame is likely to damage the support.

[0004] To achieve the above purpose, the technical solution adopted in this application is:

[0005] In a first aspect, this application provides a support platform, including a base, a plurality of first driving members, and a plurality of support plates. Each first driving member is fixedly connected to the base. Each support plate is used to support a workpiece to be processed. One first driving member is connected to one support plate, and the first driving member is used to drive the support plate to move along the thickness direction of the support plate.

[0006] In the support platform provided in this application, a plurality of support plates are all used to support the workpiece to be processed. A plurality of first driving members respectively drive a plurality of support plates, that is, a plurality of support plates are independent of each other. Each support plate is used to support the workpiece to be processed, and one first driving member is connected to drive one support plate. When the laser nozzle processes a certain part of the workpiece to be processed, the corresponding first driving member drives the corresponding support plate to move to avoid the laser flame of the laser nozzle, thereby preventing the laser flame from burning out the support plate.

[0007] Thus, the support platform provided in this application can solve the technical problem in the related art that the laser flame is likely to damage the support.

[0008] In addition, the support plate is driven by the first driving member, which can eliminate the step of manually adjusting the support plate and is beneficial to improving the processing efficiency.

[0009] In some embodiments of this application, a plurality of support plates include a plurality of plate groups. The plurality of plate groups are sequentially arranged at intervals along a first direction. Each plate group includes a plurality of support plates. The plurality of support plates in each plate group are sequentially arranged at intervals along a second direction. The first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the support plate;

[0010] And / or, a plurality of support plates are arranged in a matrix in a plane perpendicular to the thickness direction of the support plate.

[0011] In this way, the plurality of support plates include multiple rows and multiple columns, and can respectively support the workpiece to be processed, thereby maintaining the stability of the workpiece to be processed.

[0012] In some embodiments of the present application, the support plate includes a plurality of hollow holes that penetrate the support plate along the thickness direction of the support plate;

[0013] And / or, the support plate includes at least one connection hole, and the support plate is connected to the first driving member through the connection hole.

[0014] In this way, the waste generated during processing can fall through the hollow holes, avoiding staying and sticking on the support plate, which is beneficial to keeping the surface of the support plate clean. And the support plate can be connected to the first driving member through the connection hole, which is beneficial to improving the connection stability between the support plate and the first driving member.

[0015] In some embodiments of the present application, the plurality of hollow holes are arranged at intervals around the center of the support plate; and / or, a protective coating is provided on the surface of the support plate.

[0016] In this way, the hollow holes are arranged in different orientations at the center of the support plate, so that the waste at different positions can fall through the hollow holes. And the protective coating provided on the support plate can play a protective role for the support plate, which is beneficial to improving the service life of the support plate.

[0017] In some embodiments of the present application, the support plate includes a support surface and a connection surface that are oppositely arranged along the thickness direction. The support surface is used to support the workpiece to be processed, and the connection surface is used to connect the first driving member. The support plate further includes a convex arc surface that is tangent to the support surface. The convex arc surface extends along the edge of the support surface and includes a first side edge and a second side edge that are oppositely arranged. The first side edge is connected to the edge of the support surface, and the second side edge is located on the side of the first side edge close to the connection surface.

[0018] In this way, the edge of the support surface is smooth without sharp edges, which can avoid scratching the workpiece to be processed, thereby improving the reliability of the support plate.

[0019] In some embodiments of the present application, the connection hole is a countersunk hole that penetrates the support plate along the thickness direction of the support plate. The countersunk hole includes a first opening and a second opening. The diameter of the first opening is larger than the diameter of the second opening. The first opening is opened on the support surface, and the second opening is opened on the connection surface; or, the connection hole is a blind hole that extends along the thickness direction of the support plate, and the opening of the blind hole is opened on the connection surface.

[0020] In this way, when the support plate is connected to the first driving member through the connection hole, the required connecting member will not protrude from the support surface, keeping the support surface smooth, which is beneficial to avoiding scratching the workpiece to be processed.

[0021] In some embodiments of the present application, the base includes a fixed plate and a bracket. A plurality of support plates are located on one side in the thickness direction of the fixed plate, and the thickness direction of the fixed plate is the same as that of the support plates; the bracket is located on the other side in the thickness direction of the fixed plate and is fixedly connected to the fixed plate. The first driving member includes a fixed portion and a moving portion. The fixed portion is connected to at least one of the fixed plate and the bracket and is located on the side where the bracket is located. The moving portion can move relative to the fixed portion in the thickness direction of the fixed plate and passes through the fixed plate to be connected to the support plate.

[0022] In this way, the first driving member can be stably fixed on the base and can drive the support plate to move.

[0023] In a second aspect, the present application provides a laser processing device, which includes a frame, the above-mentioned support platform, a clamping assembly, a laser nozzle, and a driving assembly. The base is fixedly connected to the frame, thereby mounting the support platform on the frame. The clamping assembly is connected to the base and is used for clamping the workpiece to be processed, so as to cooperate with the support platform to stably clamp the workpiece to be processed on the frame. The driving assembly is connected to the frame, and the laser nozzle is mounted on the frame through the driving assembly. The driving assembly is used to drive the laser nozzle to move in a first direction, a second direction, and the thickness direction of the support plate. The first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the support plate.

[0024] The laser processing device provided by the present application has the same technical effects as the above-mentioned support platform, which will not be elaborated here.

[0025] In some embodiments of the present application, the driving stroke of the first driving member is greater than the maximum length of the laser flame ejected by the laser nozzle.

[0026] In this way, the first driving member can drive the support plate out of the range of the laser flame ejected by the laser nozzle, which is further beneficial to avoiding the laser flame burning out the support plate.

[0027] In some embodiments of the present application, the laser processing device further includes a positioning assembly and a controller. The positioning assembly is mounted on the frame and is configured to obtain the position of the laser nozzle. The controller is electrically connected to both the first driving member and the positioning assembly and is configured to control the first driving member according to the position of the laser nozzle, so that the first driving member drives the corresponding support plate to move in a direction away from the laser nozzle.

[0028] In this way, the first driving member can drive the corresponding support plate to move in a direction away from the laser nozzle according to the position of the laser nozzle, thereby avoiding the laser flame burning out the support plate. Moreover, the first driving member driving the support plate does not require manual determination and operation, further improving the processing efficiency. Description of the Drawings

[0029] To more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0030] Figure 1 Structural schematic diagram of the laser processing device provided by the embodiment of the present application;

[0031] Figure 2 For Figure 1 Partial enlarged view at position A in

[0032] Figure 3 Structural schematic diagram of the support platform provided by the embodiment of the present application;

[0033] Figure 4 Structural schematic diagram of the support plate and the first driving member provided by the embodiment of the present application.

[0034] Among them, the reference numerals in the drawings are as follows:

[0035] 1 - frame; 2 - driving assembly; 21 - first carrier; 22 - first screw; 23 - second carrier; 24 - second screw; 25 - third carrier; 3 - support platform; 31 - support plate; 311 - support surface; 312 - convex arc surface; 313 - hollow hole; 314 - connection hole; 32 - first driving member; 321 - fixing part; 3211 - first air inlet and exhaust joint; 3212 - second air inlet and exhaust joint; 322 - moving part; 33 - base; 331 - fixing plate; 332 - bracket; 4 - laser nozzle; 5 - clamping assembly; 51 - clamping base; 52 - clamping plate; 6 - positioning detector. Detailed implementation manners

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the following further details the present application in conjunction with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0037] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] It should be understood that the orientation or positional relationship indicated by terms such as "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present application.

[0039] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present application, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0040] Laser processing technology is a processing technology that utilizes the characteristics of the interaction between a laser beam and a substance to cut, weld, surface-treat, punch, and micro-machine materials (including metals and non-metals). The materials (workpieces to be processed) that need to be processed by a laser processing device need to be supported by a support member, but during laser processing, the laser flame usually penetrates the workpiece to be processed, which is likely to cause damage to the support member. Especially in the field of laser cutting, when the laser flame processes the workpiece to be processed for a long time, it is easy to burn the support member. Hereinafter, taking the laser cutting of a printed circuit board as an example for illustration.

[0041] A printed circuit board (PCB) is usually laser-cut along its outer frame. When laser-cutting a printed circuit board, the bottom of the printed circuit board is generally supported by a support member at the bottom. In the related art, during the laser processing process, in order to avoid the processing flame, the position of the support member needs to be manually adjusted, resulting in low processing efficiency.

[0042] To solve the above technical problems, an embodiment of the present application provides a laser processing device.

[0043] Please refer to Figures 1 to 3 , and now the laser processing device provided by the embodiment of the present application will be described. The laser processing device includes a frame 1. The frame 1 serves as the support main body of the laser processing device and can support the laser processing device. The frame 1 is also provided with a protective housing, and the protective housing will not be described further.

[0044] Please refer to Figure 2 and Figure 3, the laser processing device further includes a support platform 3, and the support platform 3 includes a base 33, a plurality of first driving members 32, and a plurality of support plates 31. Each first driving member 32 is fixedly connected to the base 33, and each support plate 31 is used to support the workpiece to be processed. One first driving member 32 is connected to one support plate 31, and the first driving member 32 can drive the support plate 31 to move in the thickness direction of the support plate 31 (such as the Z direction in Figure 1 ). In this way, each support plate 31 can be individually driven by one first driving member 32. Among them, the base 33 is fixedly connected to the frame 1, so as to mount the support platform 3 on the frame 1.

[0045] Please continue to refer to Figure 2 , the laser processing device further includes a clamping assembly 5. The clamping assembly 5 includes a clamping base 51 and a clamping plate 52. The clamping assembly 5 is connected to the base 33 through the clamping base 51, and the clamping plate 52 is connected to the clamping base 51. The clamping plate 52 is used to clamp the workpiece to be processed, so as to cooperate with the support platform 3 to stably clamp the workpiece to be processed on the frame 1.

[0046] Please refer to Figures 1 to 3 together. The laser processing device further includes a laser nozzle 4 and a driving assembly 2. The driving assembly 2 is connected to the frame 1, and the laser nozzle 4 is installed on the frame 1 through the driving assembly 2. The driving assembly 2 can drive the laser nozzle 4 to move in the first direction (such as the X direction in Figure 1 ), the second direction (such as the Y direction in Figure 1 ) and the thickness direction of the support plate 31. Among them, the first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the support plate 31.

[0047] Please continue to refer to Figure 1 and Figure 2 to describe the structure of the driving assembly 2. The driving assembly 2 includes a second driving member (not shown in the figure), a first carrier 21, and a first screw 22. The second driving member and the first carrier 21 are both fixedly connected to the frame 1. The two ends of the first screw 22 are rotatably connected to the first carrier 21, and the second driving member is in transmission connection with the first screw 22 and can drive the first screw 22 to rotate.

[0048] The driving assembly 2 further includes a third driving member, a second carrier 23, and a second screw 24. The two ends of the second screw 24 are rotatably connected to the second carrier 23. The third driving member is fixedly connected to the first carrier 21 and is in transmission connection with the second screw 24 and can drive the second screw 24 to rotate. The third driving member. The second carrier 23 is slidably connected to the first carrier 21 and is in threaded cooperation with the first screw 22. In this way, when the second driving member drives the first screw 22 to rotate, the second carrier 23 can slide relative to the first carrier 21 (slide in the Y direction in Figure 1 ).

[0049] The driving assembly 2 further includes a fourth driving member and a third carrier 25. The third carrier 25 is slidably connected to the second carrier 23 and is in threaded engagement with the second screw 24. In this way, when the third driving member drives the second screw 24 to rotate, the third carrier 25 can slide relative to the second carrier 23 (slide along the Figure 1 X direction in Figure 1 ). The fourth driving member is fixed to the third carrier 25 and is connected to the laser nozzle 4, so that the laser nozzle 4 can be driven to slide along the

[0050] Y direction in

[0051] Exemplarily, the second driving member, the third driving member, and the fourth driving member can be rotary driving cylinders, rotary driving motors, or other rotary drivers, and their specific structures and principles will not be elaborated herein.

[0052] It can be understood that in the support platform 3 provided in the present application, multiple support plates 31 are all used to support the workpiece to be processed, and multiple first driving members 32 respectively drive the multiple support plates 31. That is, the multiple support plates 31 are independent of each other, each support plate 31 is used to support the workpiece to be processed, and one first driving member 32 drives one support plate 31 to be connected. When the laser nozzle 4 processes a certain part of the workpiece to be processed, the corresponding first driving member 32 drives the corresponding support plate 31 to move to avoid the laser flame of the laser nozzle 4, thereby preventing the laser flame from burning out the support plate 31 and also preventing the laser flame from burning out the printed circuit board during the movement.

[0053] Please refer to Figures 1 to 4 together. In some embodiments of the present application, the base 33 includes a fixing plate 331 and a bracket 332. Multiple support plates 31 are located on one side (such as Figure 1 the A side in Figure 3 the Z direction) of the thickness direction of the fixing plate 331, and the thickness direction of the fixing plate 331 is the same as the thickness direction of the support plate 31. The bracket 332 is located on the other side (such as Figure 3 the B side in

[0054] The first driving member 32 includes a fixing portion 321 and a moving portion 322. The fixing portion 321 is connected to at least one of the fixing plate 331 and the bracket 332 and is located on the side where the bracket 332 is located. That is to say, the fixing portion 321 can be fixedly connected to the fixing plate 331, or fixedly connected to the bracket 332, or fixedly connected to both the fixing plate 331 and the bracket 332 at the same time. Moreover, the fixing portion 321 and the bracket 332 are located on the same side of the fixing plate 331.

[0055] Wherein, the moving portion 322 can move relative to the fixing portion 321 along the thickness direction of the fixing plate 331 and passes through the fixing plate 331 to be connected to the support plate 31. In this way, the first driving member 32 can be stably fixed on the base 33 and can drive the support plate 31 to move.

[0056] Exemplarily, the first driving member 32 can be a cylinder. The cylinder block of the cylinder serves as the fixing portion 321, and the telescopic rod of the cylinder serves as the moving portion 322. The first air inlet and exhaust joint 3211 and the second air inlet and exhaust joint 3212 are respectively arranged at both ends of the cylinder block; when the telescopic rod extends, the first air inlet and exhaust joint 3211 exhausts, and the second air inlet and exhaust joint 3212 intakes air; when the telescopic rod retracts, the first air inlet and exhaust joint 3211 intakes air, and the second air inlet and exhaust joint 3212 exhausts air. The cylinder is controlled by an electromagnetic valve (DC24V) connected to the air source, and the air source can provide compressed air of 0.5Mp to 0.7Mp to the cylinder.

[0057] Of course, the first driving member 32 can also be a linear driving motor or other linear drivers that can drive the support plate 31 to move.

[0058] In some embodiments of the present application, the driving stroke of the first driving member 32 is greater than the maximum length of the laser flame ejected by the laser nozzle 4. That is to say, the stroke of the moving portion 322 of the first driving member 32 is greater than the maximum length of the laser flame ejected by the laser nozzle 4. In this way, the first driving member 32 can drive the support plate 31 out of the range where the laser flame ejected by the laser nozzle 4 is located, which is further beneficial to avoiding the laser flame from burning out the support plate 31.

[0059] Please continue to refer to Figures 1 to 3 , in some embodiments of the present application, the multiple support plates 31 in the support platform 3 provided in the present application include multiple plate groups, and each plate group includes multiple support plates 31. That is to say, in the support platform 3 provided in the present application, all the support plates 31 are divided into multiple plate groups, and the number of support plates 31 in each plate group is multiple. That is, the support plates 31 in each plate group are a part of all the support plates 31 in the support platform 3.

[0060] Wherein, the multiple plate groups are arranged at intervals in sequence along the first direction (such as Figure 1 the X direction inFigure 1 are arranged at intervals in the Y direction (in the Y direction in the following).

[0061] It can be understood that the multiple support plates 31 in the support platform 3 provided in the present application include multiple rows and multiple columns, and each of the multiple support plates 31 can support the workpiece to be processed, thereby maintaining the stability of the workpiece to be processed. Moreover, when the multiple support plates 31 support the workpiece to be processed, the flatness of the workpiece to be processed can be improved, which is beneficial to improving the cutting accuracy.

[0062] Wherein, in the second direction, the interval distance between two adjacent plate groups is a; in the first direction, the interval distance between two adjacent support plates 31 in each plate group is b, and a and b can be equal or unequal. Moreover, in the second direction, the projections of two adjacent plate groups may completely overlap or partially overlap.

[0063] In this way, the multiple support plates 31 can form quadrilaterals such as rectangles, rhombuses, and trapezoids, which can match printed circuit boards of different shapes.

[0064] Exemplarily, the multiple support plates 31 are arranged in a matrix in a plane perpendicular to the thickness direction of the support plate 31. That is, the multiple support plates 31 form a rectangle.

[0065] It can be understood that when the printed circuit board is slender strip-shaped, the support platform 3 provided in the present application can support the printed circuit board with only one plate group, or multiple support plates 31 can be selected from different plate groups and arranged in a column or a row to support the printed circuit board.

[0066] That is to say, without exceeding the boundary of the support platform, the support platform provided in the present application can use only some of the support plates 31 to support the printed circuit board, and the remaining support plates 31 can be idle. Therefore, the support platform provided in the present application can be applicable to printed circuit boards of different shapes.

[0067] Certainly, in some other embodiments of the present application, when the printed circuit board is only slender strip-shaped, the multiple support plates 31 in the support platform 3 provided in the present application can form only one plate group, and all the support plates 31 are included in this plate group. That is, the multiple support plates 31 in the support platform 3 provided in the present application are arranged at intervals in sequence in the first direction to form a row.

[0068] Please continue to refer to Figure 1 and Figure 2 , in some embodiments of the present application, the laser processing device further includes a positioning component, the positioning component is installed on the frame 1, and the positioning component is configured to obtain the position of the laser nozzle 4. Wherein, the positioning component includes multiple positioning detectors 6, and the positioning detectors 6 are arranged on the first carrier 21 and the second carrier 23. The positioning detectors 6 on the first carrier 21 and the second carrier 23 can detect the position of the laser nozzle 4.

[0069] Among them, the positioning detector 6 can be a photoelectric switch.

[0070] For example, m sensors are arranged on the first carrier 21, and the m sensor plates are arranged at intervals in the second direction in sequence. n sensors are arranged on the second carrier 23, and the n sensor plates are arranged at intervals in the first direction in sequence. Correspondingly, the multiple support plates 31 include m plate groups, and the m plate groups are arranged at intervals in the second direction in sequence. Each plate group includes n support plates 31, and the n support plates 31 are arranged at intervals in the first direction in sequence.

[0071] Among them, the m sensors and the m plate groups correspond one by one, and the n sensors and the m support plates 31 correspond one by one. In this way, the positioning detector 6 on the first carrier 21 and the second carrier 23 can detect the position of the laser nozzle 4 and can obtain the position of the corresponding support plate 31.

[0072] The laser processing device further includes a controller (not shown in the figure). The controller is electrically connected to the first driving member 32 and the positioning assembly. The controller is configured to control the first driving member 32 according to the position of the laser nozzle 4, so that the first driving member 32 drives the corresponding support plate 31 to move in a direction away from the laser nozzle 4. That is, the controller can control the operation of the first driving member 32 according to the position of the laser nozzle 4, so that the first driving member 32 drives the corresponding support plate 31 to move in a direction away from the laser nozzle 4.

[0073] In this way, the first driving member 32 can drive the corresponding support plate 31 to move in a direction away from the laser nozzle 4, away from the range of the laser flame, so as to avoid the laser flame burning out the support plate 31. Moreover, the first driving member 32 driving the support plate 31 does not require manual judgment and operation, further improving the processing efficiency and avoiding damage to the workpiece to be processed caused by human misoperation.

[0074] When the printed circuit board is laser cut, waste will be generated. The waste staying on the support plate 31 is likely to adhere to the surface of the support plate 31, affecting the cleanliness of the surface of the support part.

[0075] Please continue to refer to Figure 4 , in some embodiments of the present application, the support plate 31 includes a plurality of hollow holes 313, and the hollow holes 313 penetrate through the support plate 31 along the thickness direction of the support plate 31. In this way, the waste generated by processing can fall through the hollow holes 313, avoiding staying and adhering on the support plate 31, which is beneficial to keeping the surface of the support plate 31 clean.

[0076] Among them, a plurality of hollow holes 313 are arranged at intervals around the center of the support plate 31. In this way, the hollow holes 313 are arranged in different orientations at the center of the support plate 31, so that the waste materials at different positions can fall through the hollow holes 313, which is further conducive to keeping the surface of the support plate 31 clean.

[0077] In some embodiments of the present application, the support plate 31 includes a support surface 311 and a connection surface (not shown in the figure) that are oppositely arranged in the thickness direction. The support surface 311 is used to support the workpiece to be processed, and the connection surface is used to cooperate with and connect to the first driving member 32. The support plate 31 includes at least one connection hole 314, and the support plate 31 is connected to the moving part 322 of the first driving member 32 through the connection hole 314, which is conducive to improving the connection stability between the support plate 31 and the first driving member 32.

[0078] In some other embodiments of the present application, the support plate 31 can be welded to the moving part 322 of the first driving member 32.

[0079] In some embodiments of the present application, the connection hole 314 is a countersunk hole that penetrates the support plate 31 in the thickness direction of the support plate 31. The countersunk hole includes a first opening and a second opening. The diameter of the first opening is larger than that of the second opening. The first opening is opened on the support surface 311, and the second opening is opened on the connection surface.

[0080] In this way, when the support plate 31 is connected to the first driving member 32 through the connection hole 314, the required connecting piece will not protrude from the support surface 311, making the support surface 311 smooth, which is conducive to avoiding scratching the workpiece to be processed.

[0081] In some other embodiments of the present application, the connection hole 314 is a blind hole extending in the thickness direction of the support plate 31, and the opening of the blind hole is opened on the connection surface. In this way, the area of the opening on the support surface 311 is reduced, which is conducive to improving the stability of the support surface 311 for supporting the workpiece to be processed.

[0082] In some embodiments of the present application, the support plate 31 further includes a convex arc surface 312 that is tangent to the support surface 311. The convex arc surface 312 extends along the edge of the support surface 311 and includes a first side and a second side that are oppositely arranged. The first side is connected to the edge of the support surface 311, and the second side is located on the side of the first side close to the connection surface.

[0083] Exemplarily, the four sides of the support plate 31 are provided with bending edges that are bent towards the connection surface.

[0084] Exemplarily, the four sides of the support plate 31 are provided with round chamfers.

[0085] In this way, the edge of the support surface 311 is smooth without sharp edges, which can avoid scratching the workpiece to be processed, thereby improving the reliability of the support plate 31.

[0086] In some embodiments of the present application, a protective coating is provided on the surface of the support plate 31. The protective coating provided on the support plate 31 can play a protective role for the support plate 31, which is beneficial to improving the service life of the support plate 31.

[0087] Exemplarily, the protective coating can be a polytetrafluoroethylene coating. The polytetrafluoroethylene coating can also improve the smoothness of the support plate 31. Of course, the protective coating can also be other materials that can play a protective role for the support plate 31.

[0088] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included within the protection scope of the present application.

Claims

1. A support platform for a laser processing device, characterized in that, The support platform includes: A base; A plurality of first driving members fixedly connected to the base; A plurality of support plates for supporting the workpiece to be processed; One of the first driving members is connected to one of the support plates, and the first driving member is configured to drive the support plate to move along the thickness direction of the support plate to avoid the laser flame of the laser nozzle of the laser processing device.

2. The support platform according to claim 1, characterized in that, The plurality of support plates include a plurality of plate groups, the plurality of plate groups are sequentially arranged at intervals in a first direction, each plate group includes a plurality of the support plates, and the plurality of support plates in each plate group are sequentially arranged at intervals in a second direction, the first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the support plate; And / or, the plurality of support plates are arranged in a matrix in a plane perpendicular to the thickness direction of the support plate.

3. The support platform according to claim 1, characterized in that, The support plate includes a plurality of hollow holes that penetrate the support plate along the thickness direction of the support plate; And / or, the support plate includes at least one connection hole, and the support plate is connected to the first driving member through the connection hole.

4. The support platform according to claim 3, characterized in that, The plurality of hollow holes are arranged at intervals around the center of the support plate; and / or, a protective coating is provided on the surface of the support plate.

5. The support platform according to claim 3, wherein The support plate includes a support surface and a connection surface arranged opposite to each other in the thickness direction, the support surface is used for supporting the workpiece to be processed, and the connection surface is used for connecting the first driving member; The support plate further includes a convex arc surface tangent to the support surface, the convex arc surface extends along the edge of the support surface, and includes a first side and a second side arranged opposite to each other, the first side is connected to the edge of the support surface, and the second side is located on the side of the first side close to the connection surface.

6. The support platform according to claim 5, characterized in that, The connection hole is a counterbore that penetrates the support plate along the thickness direction of the support plate, the counterbore includes a first opening and a second opening, the diameter of the first opening is larger than the diameter of the second opening, the first opening is opened on the support surface, and the second opening is opened on the connection surface; Alternatively, the connection hole is a blind hole extending along the thickness direction of the support plate, and the opening of the blind hole is opened on the connection surface.

7. The support platform according to claim 1, wherein The base includes: A fixing plate, the plurality of support plates are located on one side of the fixing plate in the thickness direction, and the thickness direction of the fixing plate is the same as the thickness direction of the support plate; A bracket located on the other side of the fixing plate in the thickness direction and fixedly connected to the fixing plate; The first driving member includes a fixed part and a moving part, the fixed part is connected to at least one of the fixing plate and the bracket and is located on the side where the bracket is located, and the moving part can move relative to the fixed part along the thickness direction of the fixing plate and passes through the fixing plate to be connected to the support plate.

8. A laser processing device, characterized in that, Includes: A frame; The support platform according to any one of claims 1-7, the base is fixedly connected to the frame; A clamping assembly connected to the base for clamping the workpiece to be processed; A laser nozzle; The driving assembly is connected to the frame and is used to drive the laser nozzle to move in a first direction, a second direction, and the thickness direction of the support plate. The first direction is perpendicular to the second direction, and both the first direction and the second direction are perpendicular to the thickness direction of the support plate.

9. The laser processing device according to claim 8, characterized in that, The driving stroke of the first driving member is greater than the maximum length of the flame ejected by the laser nozzle.

10. The laser processing device according to claim 8, characterized in that, The laser processing device further includes: a positioning assembly, which is installed on the frame and is configured to obtain the position of the laser nozzle; a controller, which is electrically connected to both the first driving member and the positioning assembly and is configured to control the first driving member according to the position of the laser nozzle, so that the first driving member drives the corresponding support plate to move in a direction away from the laser nozzle.

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