Semiconductor centering finger

Abstract

The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor centering finger which comprises a finger body. The air inlet channel is formed in the finger body, and the shape of the air inlet channel is matched with that of the finger body; the multiple air outlets are symmetrically distributed in the two sides of the center line in the length direction of the finger body, the air outlets communicate with the air inlet channel, and the distances between any two adjacent air outlets located in the same side of the center line are equal; the air guide hoods are in one-to-one correspondence with the air outlets and are arranged in the air outlets; the detector is fixedly connected with the finger body, and the detector and the air guide cover are located on the same side of the finger body. According to the utility model, through the air inlet channel arranged in the finger body, the blowing consistency of the air outlet can be ensured, the stability in the wafer transfer process is improved, the arranged air guide cover can effectively reduce noise, and the arranged detector can detect whether a wafer is in place or not.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor equipment, and particularly relates to a semiconductor centering finger. Background Art

[0002] Most of the suckers of the existing semiconductor Bernoulli fingers adopt an adhesive method, so the suckers are easy to fall off; there is no noise reduction treatment, resulting in a large noise; there are multiple air channels, the air flow is uneven, and the adsorption force is uneven; there is no centering function, and the wafer will directly contact the sucker, contaminating the wafer; the sucker and the finger are not integrally made, and the thickness is relatively large.

[0003] Therefore, it is necessary to design a semiconductor centering finger to solve the above problems. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a semiconductor centering finger to solve the above problems and achieve the purpose of improving the stability during the wafer transfer process.

[0005] To achieve the above purpose, the utility model provides the following solution: A semiconductor centering finger includes

[0006] a finger body;

[0007] an air inlet channel, which is opened inside the finger body and is adapted to the shape of the finger body;

[0008] a plurality of air outlet ports, which are symmetrically distributed on both sides of the center line in the length direction of the finger body, the air outlet ports are communicated with the air inlet channel, and the distance between any two adjacent air outlet ports on the same side of the center line is equal;

[0009] a plurality of air guide covers, which are in one-to-one correspondence with the air outlet ports and are arranged in the air outlet ports;

[0010] a detector, which is fixedly connected to the finger body, and the detector and the air guide cover are located on the same side of the finger body.

[0011] Preferably, the air inlet channel includes a main air channel and an arc-shaped air channel. The main air channel is opened in the straight section of the finger body, the arc-shaped air channel is opened inside the arc section of the finger body, one end of the main air channel is communicated with the arc-shaped air channel, the other end of the main air channel is communicated with an air inlet nozzle, and the arc-shaped air channel is communicated with the air outlet ports one by one through branch air channels.

[0012] Preferably, the tangent line of the connection position between the branch air channel and the arc-shaped air channel forms an angle with the branch air channel, and the degrees of a plurality of the angles are equal.

[0013] Preferably, the inclination directions of several of the branch airways on the same side of the center line of the finger body are the same.

[0014] Preferably, a plurality of support columns are fixedly connected to the finger body, and the support columns and the air guide cover are on the same side of the finger body.

[0015] Preferably, a connecting plate is fixedly connected to one end of the straight section of the finger body away from the arc section.

[0016] Preferably, a finger pressing plate is arranged on the straight section of the finger body, and the finger pressing plate is close to the connecting plate.

[0017] Preferably, an inlet and outlet is provided at one end of the arc section of the finger body away from the straight section.

[0018] Compared with the prior art, the utility model has the following advantages and technical effects:

[0019] Through the air inlet channel opened in the finger body, the utility model can ensure the consistency of the air blowing at the air outlet, improve the stability in the process of wafer transfer, the provided air guide cover can effectively reduce noise, and the provided detector can detect whether the wafer is in place. Description of the Drawings

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings:

[0021] Figure 1 Schematic diagram of the present utility model Figure 1 ;

[0022] Figure 2 Schematic diagram of the present utility model Figure 2 ;

[0023] Figure 3 Schematic diagram of the air inlet channel of the present utility model;

[0024] Figure 4 Top view of the present utility model.

[0025] Wherein, 1, finger body; 2, air guide cover; 3, detector; 4, support column; 5, connecting plate; 6, finger pressing plate; 7, air inlet nozzle; 8, main airway; 9, arc airway; 10, branch airway; 12, inlet and outlet. Detailed Embodiments

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without making creative efforts shall fall within the protection scope of the present invention.

[0027] To make the above objects, features, and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0028] Refer to Figures 1 to 4 As shown, the present invention provides a semiconductor centering finger, including

[0029] a finger body 1;

[0030] an air inlet channel, which is opened inside the finger body 1 and is adapted to the shape of the finger body 1;

[0031] a plurality of air outlet ports, which are symmetrically distributed on both sides of the center line in the length direction of the finger body 1. The air outlet ports are communicated with the air inlet channel, and the distance between any two adjacent air outlet ports on the same side of the center line is equal;

[0032] a plurality of air guiding covers 2, which correspond to the air outlet ports one by one and are arranged in the air outlet ports;

[0033] a detector 3, which is fixedly connected to the finger body 1, and the detector 3 and the air guiding cover 2 are located on the same side of the finger body 1.

[0034] The finger body 1 is made of high-purity ceramic material. The air guiding cover 2 is fixed to the finger body 1 by bolts and is made of PPEK material. The air guiding cover 2 has the function of reducing noise. The detector 3 is used to detect whether the wafer is in place and is fixed to the finger body 1 by bolts.

[0035] In a further optimized solution, the air inlet channel includes a main air duct 8 and an arc-shaped air duct 9. The main air duct 8 is opened in the straight section of the finger body 1, and the arc-shaped air duct 9 is opened inside the arc section of the finger body 1. One end of the main air duct 8 is communicated with the arc-shaped air duct 9, and the other end of the main air duct 8 is communicated with an air inlet nozzle 7. The arc-shaped air duct 9 is communicated with the air outlet ports one by one through a branch air duct 10.

[0036] In a further optimized solution, the tangent line of the connecting position of the branch air duct 10 and the arc-shaped air duct 9 forms an angle with the branch air duct 10, and the degrees of a plurality of such angles are equal.

[0037] The gas enters through the air inlet nozzle 7 and finally exits from the air outlet ports through the main air duct 8, the arc-shaped air duct 9, and the branch air duct 10, generating a Bernoulli effect to adsorb the wafer.

[0038] The distance between any two adjacent air outlets is equal to the length of the branch airway 10 to ensure consistent blowing volume.

[0039] In a further optimized solution, the inclination directions of several branch airways 10 on the same side of the center line of the finger body 1 are the same.

[0040] In a further optimized solution, several support columns 4 are fixedly connected to the finger body 1, and the support columns 4 and the air guide cover 2 are located on the same side of the finger body 1.

[0041] The support columns 4 are used to limit the position of the wafer.

[0042] In a further optimized solution, a connecting plate 5 is fixedly connected to the end of the straight section of the finger body 1 far from the arc section.

[0043] The connecting plate 5 connects the finger body 1 to the robot arm.

[0044] In a further optimized solution, a finger pressing plate 6 is arranged on the straight section of the finger body 1, and the finger pressing plate 6 is close to the connecting plate 5.

[0045] The finger pressing plate 6 is used to adjust the parallelism of the wafer.

[0046] In a further optimized solution, an inlet / outlet 12 is formed at the end of the arc section of the finger body 1 far from the straight section.

[0047] The opening of the inlet / outlet 12 is greater than 90 mm to facilitate the finger body 1 to enter and exit the process position.

[0048] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0049] The embodiments described above are only descriptions of the preferred modes of the present invention, and do not limit the scope of the present invention. Without departing from the design spirit of the present invention, various deformations and improvements made by those of ordinary skill in the art to the technical solutions of the present invention should fall within the protection scope of the present invention.

Claims

1. A semiconductor centering finger, characterized in that, including finger body (1); an air inlet channel which is arranged inside the finger body (1) and is adapted to the shape of the finger body (1); a plurality of air outlet openings which are symmetrically distributed on both sides of the center line in the length direction of the finger body (1), the air outlet openings are communicated with the air inlet channel, and the distances between any two adjacent air outlet openings on the same side of the center line are equal; a plurality of air guide covers (2) which are in one-to-one correspondence with the air outlet openings and are arranged in the air outlet openings; a detector (3) which is fixedly connected to the finger body (1), and the detector (3) and the air guide cover (2) are located on the same side of the finger body (1).

2. The semiconductor centering finger according to claim 1, wherein The air inlet channel includes a main air duct (8) and an arc-shaped air duct (9), the main air duct (8) is arranged in the straight section of the finger body (1), the arc-shaped air duct (9) is arranged inside the arc section of the finger body (1), one end of the main air duct (8) is communicated with the arc-shaped air duct (9), the other end of the main air duct (8) is communicated with an air inlet nozzle (7), and the arc-shaped air duct (9) is communicated with the air outlet openings one by one through a branch air duct (10).

3. A semiconductor centering finger according to claim 2, characterized in that, The tangent line of the connecting position of the branch air duct (10) and the arc-shaped air duct (9) forms an angle with the branch air duct (10), and the degrees of a plurality of the angles are equal.

4. A semiconductor centering finger according to claim 3, characterized in that, The inclination directions of a plurality of the branch air ducts (10) on the same side of the center line of the finger body (1) are the same.

5. A semiconductor centering finger according to claim 1, characterized in that, A plurality of support columns (4) are also fixedly connected to the finger body (1), and the support columns (4) and the air guide cover (2) are located on the same side of the finger body (1).

6. A semiconductor centering finger according to claim 2, characterized in that, A connecting plate (5) is fixedly connected to one end of the straight section of the finger body (1) away from the arc section.

7. A semiconductor centering finger according to claim 6, wherein A finger pressing plate (6) is arranged on the straight section of the finger body (1), and the finger pressing plate (6) is close to the connecting plate (5).

8. A semiconductor centering finger according to claim 2, characterized in that, An inlet and outlet (12) is arranged at one end of the arc section of the finger body (1) away from the straight section.

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