Electromagnetic suction forming mold for UHPC wallboard
Through the innovative design of electromagnetic adsorption device and mold frame, the problems of high cost and long construction period of UHPC wall panel production molds are solved, and rapid on-site assembly and generalization are achieved, reducing costs and improving efficiency.
Patent Information
- Application Number
- CN202421866187.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-02
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-02
AI Technical Summary
The existing UHPC wall panel production molds have high customization costs and long construction periods, making it difficult to achieve rapid on-site assembly and generalization.
The electromagnetic adsorption device and a ferromagnetic mold frame are adopted. By connecting hooks and sealing strips, the mold frame is quickly assembled and positioned, and the mold is reliably fixed with magnetic field adsorption technology.
It shortens the construction period, reduces the cost of molds, and improves the versatility of molds and on-site assembly efficiency.
Smart Images

Figure CN223085048U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to a processing mold for UHPC wall panels, in particular to an electromagnetic suction molding mold for UHPC wall panels. Background Art
[0002] In the traditional construction industry, curtain wall panels, as an important exterior decoration material, not only carry the aesthetics of the building but also shoulder important functions such as protecting the interior of the building, heat insulation, and sound insulation. In recent years, a high-performance concrete curtain wall panel (UHPC, Ultra High Performance Concrete) has gradually been widely used in the construction field due to its excellent performance and unique advantages. The production of UHPC panels is similar to that of concrete panels, which are formed by the casting process. Generally, molds are customized with wooden molds, silicone molds, or fiberglass materials. Due to the large number of product specifications and low standardization, when customizing molds, it is necessary to customize them according to the shape requirements of the wall panels on-site. This not only has a long construction period but also a high mold cost. Summary of the Utility Model
[0003] The technical problem to be solved by the utility model is to provide an electromagnetic suction molding mold for UHPC wall panels that is easy to assemble on-site, more versatile, can shorten the construction period, and save costs in view of the deficiencies of the prior art.
[0004] To solve the above technical problems, the utility model adopts the following technical solutions.
[0005] An electromagnetic suction molding mold for UHPC wall panels includes a mold table surface, an electromagnetic adsorption device, and a plurality of ferromagnetic mold frames. The electromagnetic adsorption device is arranged at the bottom of the mold table surface, and the electromagnetic adsorption device is used to adsorb the mold frames. The plurality of mold frames are arranged in sequence to form a rectangular or square mold frame body. Two mutually perpendicular mold frames are connected by a connecting hook member. One end of the mold frame is provided with an end groove, a partition is formed at the bottom of the end groove, and a through hole is formed between the partition and the end of the end groove. The bottom of the connecting hook member is provided with a first bayonet, a fitting portion is formed adjacent to the first bayonet, and a second bayonet is formed at the bottom of the fitting portion. The first bayonet is buckled on the top of one mold frame, the fitting portion is arranged in the end groove of the other mold frame, and the second bayonet is buckled on the top of the partition.
[0006] Preferably, the opening width of the end groove gradually decreases from top to bottom, and the thickness of the fitting portion gradually decreases from top to bottom.
[0007] Preferably, an outwardly protruding barb portion is formed at one end of the mold frame away from the end groove. The barb portion is disposed in the end groove of the adjacent mold frame, and the barb portion is buckled on the top of the partition in the end groove.
[0008] Preferably, a sealing strip is embedded in the bottom surface of the mold frame.
[0009] Preferably, the sealing strip is a hollow strip with a "T"-shaped cross section.
[0010] Preferably, embedded parts are placed in the mold frame in an array distribution.
[0011] Preferably, the embedded parts are ferromagnetic embedded parts, and the electromagnetic adsorption device is used to adsorb the embedded parts.
[0012] In the electromagnetic suction molding die for UHPC wallboard disclosed by the utility model, the mold frame is in a long strip shape, so multiple mold frames can be arranged in sequence to form a rectangular or square mold frame body. Two mold frames at the corner of the mold frame body are connected by a connecting hook member. The bottom of the connecting hook member has a first bayonet and a fitting portion with a second bayonet. During assembly, the first bayonet is buckled on the top of one mold frame, and the second bayonet is buckled on the top of the partition of the mold frame perpendicular to it, so that two adjacent perpendicular mold frames are assembled and spliced. Similarly, the mold frame body can be fixed in a cuboid or cube shape by using four connecting hook members. When the electromagnetic adsorption device is powered on to generate a magnetic field, the ferromagnetic mold frame body is adsorbed on the top surface of the mold table, so as to reliably position the mold frame body. The inner space of the mold frame body is used to pour and form the UHPC wallboard. Compared with the prior art, the utility model is easier to assemble on site based on the above components, can effectively shorten the construction period, and there is no need to customize the mold on site, greatly saving the application cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 is a three-dimensional view after the assembly of the electromagnetic suction molding die for UHPC wallboard;
[0014] Figure 2 is a structural diagram of the bottom of the mold table;
[0015] Figure 3 is a top three-dimensional view of the mold frame;
[0016] Figure 4 is a bottom three-dimensional view of the mold frame;
[0017] Figure 5 is a cross-sectional view of the mold frame;
[0018] Figure 6Isometric view of the connecting hook member. Detailed implementation mode
[0019] The present utility model will be described in more detail below in conjunction with the accompanying drawings and embodiments.
[0020] The present utility model discloses an electromagnetic suction molding die for UHPC wall panels. In combination with Figures 1 to 6 As shown, it includes a die table 1, an electromagnetic adsorption device 2, and a plurality of ferromagnetic die frames 3. The electromagnetic adsorption device 2 is arranged at the bottom of the die table 1, and the electromagnetic adsorption device 2 is used to adsorb the die frames 3. The plurality of die frames 3 are arranged in sequence to form a rectangular or square die frame body. Two mutually perpendicular die frames 3 are connected by a connecting hook member 4. One end of the die frame 3 is provided with an end groove 30, and a partition 31 is formed at the bottom of the end groove 30. A through hole 32 is formed between the partition 31 and the end of the end groove 30. The bottom of the connecting hook member 4 is provided with a first bayonet 40, and a fitting portion 41 is formed adjacent to the first bayonet 40. A second bayonet 42 is formed at the bottom of the fitting portion 41. The first bayonet 40 is buckled on the top of a die frame 3, the fitting portion 41 is arranged in the end groove 30 of another die frame 3, and the second bayonet 42 is buckled on the top of the partition 31.
[0021] In the above structure, the die frame 3 is in a strip shape, so the plurality of die frames 3 can be arranged in sequence to form a rectangular or square die frame body. Two die frames 3 at the corner of the die frame body are connected by a connecting hook member 4. The bottom of the connecting hook member 4 has a first bayonet 40 and a fitting portion 41 with a second bayonet 42. During assembly, the first bayonet 40 is buckled on the top of a die frame 3, and the second bayonet 42 is buckled on the top of the partition 31 of the die frame 3 perpendicular thereto, so as to assemble and join two adjacent mutually perpendicular die frames 3. Similarly, the die frame body can be fixed in the shape of a cuboid or a cube by using four connecting hook members 4. When the electromagnetic adsorption device 2 is powered on to generate a magnetic field, the ferromagnetic die frame body is adsorbed on the top surface of the die table 1, so as to reliably position the die frame body. The inner space of the die frame body is used to pour and form the UHPC wall panel. Compared with the prior art, the present utility model is easier to assemble on site based on the above components, can effectively shorten the construction period, and there is no need to customize the die on site, which greatly saves the application cost.
[0022] For the convenience of insertion, in this embodiment, the end groove 30 is preferably a wedge-shaped or trapezoidal end groove. Correspondingly, the fitting portion 41 is preferably a wedge-shaped or trapezoidal fitting portion. In combination with Figure 3 、 Figure 4 and Figure 6As shown, the opening width of the end groove 30 gradually decreases from top to bottom, and the thickness of the fitting part 41 gradually decreases from top to bottom.
[0023] As a preferred method, in combination with Figure 1 , Figure 3 and Figure 4 As shown, at one end of the mold frame 3 away from the end groove 30, there is a barb 33 protruding outward. The barb 33 is arranged in the end groove 30 of the adjacent mold frame 3, and the barb 33 is buckled on the top of the partition 31 in the end groove 30. In the above structure, after the size of the wall panel is determined, if the length and width of the wall panel are greater than the length of a single mold frame 3, two or more mold frames 3 can be spliced in sequence. Specifically, two or more mold frames 3 can be arranged in a line, and the adjacent two mold frames 3 are fitted and matched through the barb 33 and the end groove 30, so as to meet the application requirements of various sizes, so it is more versatile.
[0024] In order to seal between the mold frame 3 and the mold table 1, in this embodiment, in combination with Figure 4 and Figure 5 As shown, a sealing strip 34 is embedded in the bottom surface of the mold frame 3. Further, the sealing strip 34 is a hollow strip with a "T" - shaped cross - section.
[0025] In the specific pouring process flow, embedded parts can also be added to the wall to make the surface of the wall present corresponding concave - convex shapes. Please refer to Figure 1 and Figure 2 , and there are embedded parts 5 distributed in an array in the mold frame.
[0026] In order to fix the embedded parts 5, in this embodiment, the embedded parts 5 are ferromagnetic embedded parts, and the electromagnetic adsorption device 2 is used to adsorb the embedded parts 5.
[0027] In this embodiment, please refer to Figure 1 and Figure 3 , an opening groove 35 is provided at a position near the outside of the bottom of the mold frame 3. In actual application, after the UHPC wall is formed by pouring, it needs to stay for enough time to cure and form. When demolding, first remove the connecting hook 4, then insert a tool into the opening groove 35 on the outside of the mold frame 3, and demold it by prying the mold frame 3. And so on, complete the demolding process of all mold frames 3, and finally lift the UHPC wall and gently knock the embedded parts 5 until all the embedded parts 5 are taken out.
[0028] The above are only the preferred embodiments of the present utility model, and are not intended to limit the present utility model. Any modifications, equivalent substitutions or improvements made within the technical scope of the present utility model shall be included within the scope protected by the present utility model.
Claims
1. An electromagnetic suction die-casting mold for UHPC wall panels, characterized in that, It includes a mold tabletop (1), an electromagnetic adsorption device (2), and multiple ferromagnetic mold frames (3). The electromagnetic adsorption device (2) is arranged at the bottom of the mold tabletop (1), and the electromagnetic adsorption device (2) is used to adsorb the mold frames (3). The multiple mold frames (3) are arranged in sequence to form a rectangular or square mold frame body. Two mutually perpendicular mold frames (3) are connected by a connecting hook member (4). One end of the mold frame (3) is provided with an end groove (30), and a partition (31) is formed at the bottom of the end groove (30). A through hole (32) is formed between the partition (31) and the end of the end groove (30). The bottom of the connecting hook member (4) is provided with a first bayonet (40), and a fitting portion (41) is formed adjacent to the first bayonet (40). A second bayonet (42) is formed at the bottom of the fitting portion (41). The first bayonet (40) is buckled on the top of a mold frame (3), the fitting portion (41) is arranged in the end groove (30) of another mold frame (3), and the second bayonet (42) is buckled on the top of the partition (31).
2. The electromagnetic suction die forming mold for UHPC wallboard according to claim 1, characterized in that, The opening width of the end groove (30) gradually decreases from top to bottom, and the thickness of the fitting portion (41) gradually decreases from top to bottom.
3. The electromagnetic suction molding die for UHPC wallboard according to claim 1, characterized in that, One end of the mold frame (3) away from the end groove (30) forms an outwardly protruding barb portion (33). The barb portion (33) is arranged in the end groove (30) of the adjacent mold frame (3), and the barb portion (33) is buckled on the top of the partition (31) in the end groove (30).
4. The electromagnetic suction molding die for UHPC wallboard according to claim 1, characterized in that, A sealing strip (34) is embedded in the bottom surface of the mold frame (3).
5. The electromagnetic suction molding die for UHPC wallboard according to claim 4, wherein, The sealing strip (34) is a hollow strip with a "T"-shaped cross-section.
6. The electromagnetic suction die forming mold for UHPC wallboard according to claim 1, characterized in that, Embedded parts (5) distributed in an array are placed in the mold frame body.
7. The electromagnetic suction die forming mold for UHPC wallboard according to claim 6, characterized in that, The embedded parts (5) are ferromagnetic embedded parts, and the electromagnetic adsorption device (2) is used to adsorb the embedded parts (5).