Semiconductor wafer packaging mechanism

Abstract

The utility model provides a semiconductor wafer packaging mechanism which comprises a carrier plate, clamping plates are arranged at the two ends of the carrier plate, two second semi-circular grooves are formed in the face, facing the carrier plate, of each clamping plate, and two first semi-circular grooves matched with the second semi-circular grooves are formed in the face, facing the clamping plates, of the carrier plate. Two first connecting lugs are fixedly connected to the two side faces, adjacent to the first semicircular groove, of the carrying plate, second connecting lugs matched with the first connecting lugs are installed on the two side faces, adjacent to the second semicircular groove, of the clamping plate, and the first connecting lugs and the second connecting lugs are connected in the mode that screws are matched with second nuts. An air pipe is inserted in a circular space formed by the first semicircular groove and the second semicircular groove, a suction cup is installed at one end of the air pipe, two positioning nuts are in threaded connection with the air pipe, and a connecting piece used for being connected with the executing tail end of a mechanical arm is installed in the middle of the upper surface of the carrying plate. The utility model has the following beneficial effect that a spare dismounting mode is provided for separating the air pipe and the carrier plate.

Description

Technical Field

[0001] The utility model relates to a semiconductor wafer packaging mechanism, belonging to the field of semiconductor wafer packaging. Background Art

[0002] Since external dust can contaminate semiconductor wafers, in the current semiconductor industry, the finished wafers need to be externally covered with an aluminum foil bag and then evacuated to ensure that external dust particles can be isolated during transportation. During the packaging process, it is necessary to avoid friction damage to the aluminum foil bag as much as possible and place upper and lower foam pads for protection. To improve the packaging efficiency, an industrial robotic arm is often used to pick and place the foam pads. A carrier plate is installed at the end of the robotic arm. At least four through holes are provided in the carrier plate, and air pipes with external threads processed on the outer surface are inserted into the through holes. One end of the air pipe is equipped with a suction cup, the other end of the air pipe is equipped with a hose, and two positioning nuts are threadedly connected to the surface of the air pipe. Under the restriction of the two positioning nuts, the relative position of the air pipe and the carrier plate remains unchanged. After a period of use, there is a situation where the positioning nut and the air pipe cannot be normally separated due to reasons such as rust. Since the through holes on the carrier plate are closed, it is difficult to take out the air pipe from the through holes, resulting in great difficulty in replacing components such as the air pipe and the suction cup. Summary of the Utility Model

[0003] Aiming at the deficiencies of the prior art, the purpose of the utility model is to provide a semiconductor wafer packaging mechanism to solve the problems proposed in the above background art. The utility model provides a spare disassembly method for separating the air pipe and the carrier plate.

[0004] To achieve the above purpose, the utility model is realized by the following technical solutions: A semiconductor wafer packaging mechanism includes a carrier plate. Clamping plates are provided at both ends of the carrier plate. Two second semi-circular grooves are provided on the surface of the clamping plate facing the carrier plate. Two first semi-circular grooves are provided on the surface of the carrier plate facing the clamping plate and are matched with the second semi-circular grooves. Two first connecting ears are fixedly connected to the two side surfaces of the carrier plate adjacent to the first semi-circular grooves. Second connecting ears matched with the first connecting ears are installed on the two side surfaces of the clamping plate adjacent to the second semi-circular grooves. The first connecting ears and the second connecting ears are connected by a screw and a second nut. An air pipe is inserted into the circular space formed by the first semi-circular groove and the second semi-circular groove. One end of the air pipe is equipped with a suction cup. Two positioning nuts are threadedly connected to the air pipe. The two positioning nuts are respectively arranged on the upper side and the lower side of the carrier plate. A connecting piece for connecting the end of the robotic arm is installed at the middle position of the upper surface of the carrier plate.

[0005] Furthermore, the connecting member includes a plug-in frame. A plug-in frame is fixedly connected to the middle position of the upper surface of the carrier plate. An inner frame is inserted into the plug-in frame. A support plate is provided above the inner frame. A plurality of connecting plates are evenly and fixedly arranged on the lower surface of the support plate. The lower ends of the connecting plates are fixedly connected to the inner frame. A bottom plate that fits the support plate is provided above the support plate. A connecting seat is fixedly connected to the middle position of the upper surface of the bottom plate. The upper end of the connecting seat is fixedly connected to a docking plate for connecting the execution end of the robotic arm. A plurality of through holes are evenly formed in the area of the carrier plate covered by the plug-in frame. A plurality of first small holes aligned with the through holes are evenly formed on the upper surface of the support plate. A plurality of second small holes aligned with the first small holes are evenly formed on the upper surface of the bottom plate. An internal hexagonal bolt is inserted into the channel formed by the through holes, the first small holes, and the second small holes. One end of the internal hexagonal bolt is threadedly connected to a first nut. The first nut is arranged on the side of the bottom plate away from the support plate.

[0006] Furthermore, the cross-section of the plug-in frame is rectangular, and the cross-section of the inner frame is rectangular.

[0007] Furthermore, a plurality of strip-shaped openings are formed on the upper surface of the support plate, and the plurality of strip-shaped openings are evenly arranged on the upper surface of the support plate.

[0008] Furthermore, a plurality of fixing holes are formed on the upper surface of the docking plate, and the plurality of fixing holes are evenly arranged on the upper surface of the docking plate.

[0009] Furthermore, a plug board is fixedly connected to the middle position of the surface of the clamping plate facing the carrier plate. A slot matching the plug board is formed on the surface of the carrier plate facing the clamping plate. The plug board is inserted into the slot.

[0010] The beneficial effects of the present utility model:

[0011] 1. Install the air pipe in the space formed by the first semi-circular groove and the second semi-circular groove. Then, connect the first connecting ear and the second connecting ear by using the cooperation of the screw and the second nut to complete the assembly of the carrier plate and the clamping plate. Screw on two positioning nuts on the air pipe to complete the assembly of the structure formed by the air pipe, the clamping plate, and the carrier plate. When it is difficult to normally separate the positioning nut from the air pipe, separate the screw from the second nut, so that the clamping plate and the carrier plate are separated. At this time, the air pipe can be conveniently taken out from the space formed by the first semi-circular groove and the second semi-circular groove, reducing the difficulty of replacing parts in the later stage.

[0012] 2. Insert the inner frame into the insertion frame. Under the support of the connecting plate, there is a certain distance between the support plate and the carrier plate. At the same time, the support plate and the carrier plate form an insertion relationship, aligning the second small hole on the bottom plate with the first small hole on the support plate. Then, insert one end of the hexagon socket head bolt through the perforation, the first small hole, and the second small hole in sequence and screw on the first nut to complete the restriction of the relative positions of the docking plate, the support plate, and the carrier plate. At this time, a part of the rod of the hexagon socket head bolt is in an exposed state. When the first nut and the hexagon socket head bolt cannot be normally separated due to rust, the hexagon socket head bolt can be cut off using the gap between the support plate and the insertion frame, realizing the removal of the carrier plate from the execution end of the robotic arm without damaging the components other than the hexagon socket head bolt. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Other features, objects, and advantages of the present utility model will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0014] Figure 1 FIG. [Number] is a schematic structural diagram of a semiconductor wafer packaging mechanism of the present utility model;

[0015] Figure 2 FIG. [Number] is a perspective view of another angle of a semiconductor wafer packaging mechanism of the present utility model;

[0016] Figure 3 FIG. [Number] is an assembly schematic diagram of an air pipe, a positioning nut, and a suction cup in a semiconductor wafer packaging mechanism of the present utility model;

[0017] Figure 4 FIG. [Number] is an assembly schematic diagram of an insertion frame and a carrier plate in a semiconductor wafer packaging mechanism of the present utility model;

[0018] Figure 5 FIG. [Number] is an assembly schematic diagram of an insertion plate and a clamping plate in a semiconductor wafer packaging mechanism of the present utility model;

[0019] Figure 6 FIG. [Number] is an assembly schematic diagram of a docking plate, a bottom plate, a support plate, and an inner frame in a semiconductor wafer packaging mechanism of the present utility model;

[0020] Figure 7 FIG. [Number] is an assembly schematic diagram of another angle of a docking plate, a bottom plate, a support plate, and an inner frame in a semiconductor wafer packaging mechanism of the present utility model;

[0021] In the figure: 1 - carrier board, 2 - hexagon socket head bolt, 3 - suction cup, 4 - air tube, 5 - clamping plate, 6 - positioning nut, 7 - screw, 8 - docking plate, 9 - insertion frame, 10 - support plate, 11 - first nut, 12 - second nut, 13 - connecting seat, 14 - bottom plate, 15 - perforation, 16 - first semi-circular groove, 17 - slot, 18 - first connecting ear, 19 - second connecting ear, 20 - second semi-circular groove, 21 - insertion plate, 22 - inner frame, 23 - connecting plate, 24 - second small hole, 25 - first small hole, 26 - strip-shaped opening. Detailed implementation manner

[0022] In order to make the technical means, creative features, achieved purposes and functions of the present utility model easy to understand, the present utility model will be further described below in conjunction with the specific implementation manners.

[0023] Please refer to Figures 1-5 , the present utility model provides a technical solution: a semiconductor wafer packaging mechanism, including a carrier board 1. Clamping plates 5 are provided at both ends of the carrier board 1. Two second semi-circular grooves 20 are opened on the surface of the clamping plate 5 facing the carrier board 1. Two first semi-circular grooves 16 that are matched with the second semi-circular grooves 20 are opened on the surface of the carrier board 1 facing the clamping plate 5. Two first connecting ears 18 are fixedly connected to two adjacent side surfaces of the carrier board 1 adjacent to the first semi-circular groove 16. Second connecting ears 19 that are matched with the first connecting ears 18 are installed on two adjacent side surfaces of the clamping plate 5 adjacent to the second semi-circular groove 20. The first connecting ear 18 and the second connecting ear 19 are connected by means of a screw 7 and a second nut 12 in a matching manner. An air tube 4 is inserted into the circular space formed by the first semi-circular groove 16 and the second semi-circular groove 20. One end of the air tube 4 is provided with a suction cup 3. Two positioning nuts 6 are threadedly connected to the air tube 4. The two positioning nuts 6 are respectively arranged on the upper side and the lower side of the carrier board 1. The air tube 4 is installed in the space formed by the first semi-circular groove 16 and the second semi-circular groove 20, and then the first connecting ear 18 and the second connecting ear 19 are connected by means of a screw 7 and a second nut 12 in a matching manner to complete the assembly of the carrier board 1 and the clamping plate 5. Two positioning nuts 6 are screwed onto the air tube 4 to complete the assembly of the structure formed by the air tube 4, the clamping plate 5 and the carrier board 1. When it is difficult for the positioning nut 6 to be normally separated from the air tube 4, the screw 7 and the second nut 12 are separated, so that the clamping plate 5 and the carrier board 1 are separated. At this time, the air tube 4 can be conveniently taken out from the space formed by the first semi-circular groove 16 and the second semi-circular groove 20, reducing the difficulty of replacing parts in the later stage.

[0024] Refer to Figure 4 and Figure 5 , a connecting fixing insertion plate 21 is connected to the middle position of the surface of the clamping plate 5 facing the carrier board 1. A slot 17 that is matched with the insertion plate 21 is opened on the surface of the carrier board 1 facing the clamping plate 5, so that the insertion plate 21 is inserted into the slot 17 to improve the connection stability between the clamping plate 5 and the carrier board 1.

[0025] Refer toFigure 2 , Figure 4 , Figure 6 and Figure 7 , a socket frame 9 with a rectangular cross-section is fixedly connected to the middle position of the upper surface of the carrier plate 1. An inner frame 22 with a rectangular cross-section is inserted into the socket frame 9. A support plate 10 is provided above the inner frame 22. A plurality of connecting plates 23 are uniformly fixed on the lower surface of the support plate 10. The lower ends of the connecting plates 23 are fixedly connected to the inner frame 22. By providing a plurality of uniformly arranged strip-shaped openings 26 on the upper surface of the support plate 10, the production material consumption of the support plate 10 is reduced.

[0026] Refer to Figure 1 , Figure 2 , Figure 4 , Figure 6 and Figure 7 , a bottom plate 14 that fits the support plate 10 is provided above the support plate 10. A connecting seat 13 is fixedly connected to the middle position of the upper surface of the bottom plate 14. The upper end of the connecting seat 13 is fixedly connected to a docking plate 8 for connecting the execution end of the robotic arm. A plurality of uniformly arranged fixing holes are provided on the upper surface of the docking plate 8. A plurality of through holes 15 are uniformly provided in the area of the carrier plate 1 covered by the socket frame 9. A plurality of first small holes 25 aligned with the through holes 15 are uniformly provided on the upper surface of the support plate 10. A plurality of second small holes 24 aligned with the first small holes 25 are uniformly provided on the upper surface of the bottom plate 14. An internal hexagonal bolt 2 is inserted into the channel formed by the through hole 15, the first small hole 25, and the second small hole 24. One end of the internal hexagonal bolt 2 is threadedly connected to a first nut 11. The first nut 11 is provided on the side of the bottom plate 14 away from the support plate 10, so that the inner frame 22 is inserted into the socket frame 9. Supported by the connecting plates 23, there is a certain distance between the support plate 10 and the carrier plate 1. At the same time, the support plate 10 and the carrier plate 1 form a plug-in relationship, so that the second small hole 24 on the bottom plate 14 is aligned with the first small hole 25 on the support plate 10. Then, one end of the internal hexagonal bolt 2 is sequentially passed through the through hole 15, the first small hole 25, and the second small hole 24 and then the first nut 11 is screwed on to complete the limitation of the relative positions of the docking plate 8, the support plate 10, and the carrier plate 1. At this time, a part of the rod of the internal hexagonal bolt 2 is in an exposed state. When the first nut 11 and the internal hexagonal bolt 2 cannot be normally separated due to rust, the internal hexagonal bolt 2 can be cut off by using the gap between the support plate 10 and the socket frame 9, realizing the removal of the carrier plate 1 from the execution end of the robotic arm without damaging the components other than the internal hexagonal bolt 2.

[0027] Although this specification is described according to the embodiments, not each embodiment only contains an independent technical solution. This narrative way of the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor wafer packaging mechanism, comprising a carrier plate (1), characterized in that: Both ends of the carrier plate (1) are provided with clamping plates (5); a side of the clamping plate (5) facing the carrier plate (1) is provided with two second semicircular grooves (20); a side of the carrier plate (1) facing the clamping plate (5) is provided with two first semicircular grooves (16) matching with the second semicircular grooves (20); two side surfaces of the carrier plate (1) adjacent to the first semicircular grooves (16) are connected and fixed with two first connecting ears (18); and two side surfaces of the clamping plate (5) adjacent to the second semicircular grooves (20) are provided with second connecting ears (19) matching with the first connecting ears (18). The first connecting ear (18) and the second connecting ear (19) are connected by means of a screw (7) and a second nut (12) in cooperation with each other; an air pipe (4) is inserted into a circular space formed by the first semicircular groove (16) and the second semicircular groove (20); a suction cup (3) is installed at one end of the air pipe (4); two positioning nuts (6) are threadedly connected to the air pipe (4); the two positioning nuts (6) are respectively arranged on the upper side of the carrier plate (1) and the lower side of the carrier plate (1); a connecting piece for connecting to the execution end of the robot arm is installed in the middle of the upper surface of the carrier plate (1).

2. A semiconductor wafer packaging mechanism according to claim 1, characterized in that: The connecting member comprises a plug-in frame (9), the plug-in frame (9) is connected and fixed at the middle position of the upper surface of the carrier plate (1), an inner frame (22) is inserted in the plug-in frame (9), a support plate (10) is provided on the upper side of the inner frame (22), a plurality of connecting plates (23) are evenly fixed on the lower surface of the support plate (10), the lower ends of the connecting plates (23) are connected and fixed to the inner frame (22), a bottom plate (14) which fits the support plate (10) is provided on the upper side of the support plate (10), a connecting seat (13) is connected and fixed at the middle position of the upper surface of the bottom plate (14), and a docking plate (23) for connecting to the execution end of the robot arm is connected and fixed to the upper end of the connecting seat (13). 8), a plurality of through holes (15) are evenly formed in the area of ​​the carrier (1) covered by the plug-in frame (9), a plurality of first small holes (25) are evenly formed on the upper surface of the support plate (10) and are aligned with the through holes (15), a plurality of second small holes (24) are evenly formed on the upper surface of the base plate (14) and are aligned with the first small holes (25), a hexagon socket bolt (2) is inserted into the channel formed by the through holes (15), the first small holes (25) and the second small holes (24), one end of the hexagon socket bolt (2) is threadedly connected to a first nut (11), and the first nut (11) is arranged on a side of the base plate (14) away from the support plate (10).

3. A semiconductor wafer packaging mechanism according to claim 2, characterized in that: The plug-in frame (9) has a rectangular cross-section, and the inner frame (22) has a rectangular cross-section.

4. A semiconductor wafer packaging mechanism according to claim 2, characterized in that: The upper surface of the support plate (10) is provided with a plurality of strip-shaped openings (26), and the plurality of strip-shaped openings (26) are evenly arranged on the upper surface of the support plate (10).

5. A semiconductor wafer packaging mechanism according to claim 2, characterized in that: A plurality of fixing holes are provided on the upper surface of the butt joint plate (8), and the plurality of fixing holes are evenly arranged on the upper surface of the butt joint plate (8).

6. The semiconductor wafer packaging mechanism according to claim 1, wherein: A middle position on one side of the clamping plate (5) facing the carrier plate (1) is fixedly connected with an insertion plate (21). A slot (17) matching the insertion plate (21) is formed on one side of the carrier plate (1) facing the clamping plate (5). The insertion plate (21) is inserted into the slot (17).

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