Silicon wafer slotting and feeding structure

Abstract

The utility model discloses a silicon wafer slotting and feeding structure, which comprises a silicon wafer slotting and feeding mechanism main body, the silicon wafer slotting and feeding mechanism main body comprises a support frame, a fixed plate is welded and fixed at the middle position in the support frame, and a slotting table is arranged on the upper surface of the fixed plate through an air cylinder; by designing the circulating feeding mechanism, when a silicon wafer slotting and feeding mechanism body is stably placed for slotting and feeding of silicon wafers, the silicon wafers are placed at the joint of two movable vertical plates and located on the surface of a supporting and placing plate to be supported, placed and fixed, and a conveying belt drives the movable vertical plates to stably move forwards during conveying; the vertical plate is moved to drive the silicon wafer to be conveyed to the upper surface of the grooving table to be subjected to grooving treatment, the silicon wafer is continuously conveyed forwards to the conveying original position after being subjected to groove clamping, the grooved silicon wafer is detached, the ungrooved silicon wafer is fixed again, and the silicon wafer is circularly conveyed and subjected to grooving treatment in combination with the grooving staying time of the upper surface of the grooving table, so that operation is simpler and more convenient, time is saved, and efficiency is improved. And the feeding speed is increased.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer grooving and feeding mechanisms, and particularly relates to a silicon wafer grooving and feeding structure. Background Art

[0002] Silicon wafers are raw materials for manufacturing transistors and integrated circuits. When silicon wafers are processed and produced, grooving treatment is required. When grooving silicon wafers, feeding of silicon wafers is needed. Usually, a feeding mechanism is used to feed silicon wafers. The existing feeding mechanism is a device used for circularly conveying and feeding silicon wafers during grooving. The feeding mechanism facilitates circular feeding, saves time, is more simple and convenient to operate, speeds up the feeding rate, and improves the convenience and rate of feeding of the main body of the silicon wafer grooving and feeding mechanism during silicon wafer grooving.

[0003] When the existing feeding mechanism operates for grooving and feeding silicon wafers, the silicon wafers are directly fixed on the upper surface of the slider and slid to the grooving position for grooving treatment. Therefore, when grooving multiple silicon wafers, the slider needs to be reciprocated to groove the silicon wafers. At the same time, after one feeding is completed, another silicon wafer is fixedly placed for grooving again, which makes the operation during grooving and feeding cumbersome, reduces the feeding rate of grooving, and affects the convenience and rate of feeding of the feeding mechanism during silicon wafer grooving. For this reason, the utility model proposes a silicon wafer grooving and feeding structure. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a silicon wafer grooving and feeding structure to solve the problem that when the feeding mechanism operates for grooving and feeding silicon wafers, when grooving multiple silicon wafers, the slider needs to be reciprocated to groove the silicon wafers, and at the same time, after one feeding is completed, another silicon wafer is fixedly placed for grooving again, which makes the operation during grooving and feeding cumbersome and reduces the feeding rate of grooving as proposed in the above background art.

[0005] To achieve the above purpose, the utility model provides the following technical solution: A silicon wafer grooving and feeding structure includes a main body of a silicon wafer grooving and feeding mechanism. The main body of the silicon wafer grooving and feeding mechanism includes a support frame. A fixed plate is welded and fixed at the middle position inside the support frame. A grooving table is installed on the upper surface of the fixed plate through a cylinder. The main body of the silicon wafer grooving and feeding mechanism is further provided with:

[0006] A circular feeding mechanism, and the circular feeding mechanism includes driving components arranged at both ends of the support frame. A circular conveying component is arranged on both sides inside the support frame on the outer surface of the driving components. A control component is arranged between the outer side of the circular conveying component and the inside of the support frame.

[0007] A positioning and clamping mechanism, and the positioning and clamping mechanism includes a positioning and clamping component arranged inside the circular conveying component. A limiting component is arranged on the side of the positioning and clamping component.

[0008] Preferably, the driving assembly includes driving rollers rotatably mounted at both ends inside the support frame through bearings. A driving motor is mounted at one end of the front surface of the support frame at the end of the driving roller, and limiting rings are fixedly mounted at both ends of the driving roller through screws.

[0009] Preferably, the circulating conveying assembly includes two conveyor belts arranged at the ends of the connection between the two driving rollers. Moving vertical plates are fixedly mounted at equal intervals on the surface of the conveyor belt through screws, and a supporting placement plate is arranged at the inner bottom end of the moving vertical plate.

[0010] Preferably, the two moving vertical plates are symmetrically arranged, and the supporting placement plate and the moving vertical plate are of an integral structure.

[0011] Preferably, the control assembly includes control chutes opened at the edges on both sides of the support frame. A control slider is arranged inside the control chute, and the end of the control slider is fixedly connected to the outside of the moving vertical plate through a bolt.

[0012] Preferably, the positioning and clamping assembly includes a threaded rod rotatably mounted at the top end inside the moving vertical plate through a threaded structure. A pressing clamping plate is arranged at the middle position inside the moving vertical plate. A rotating ring is rotatably arranged inside the pressing clamping plate, and the bottom end of the threaded rod is fixedly connected to the top end of the rotating ring by welding.

[0013] Preferably, the limiting assembly includes a limiting groove opened at the middle position inside the moving vertical plate. A limiting block is arranged inside the limiting groove, and the end of the limiting block is fixedly connected to the end of the pressing clamping plate through a screw.

[0014] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0015] By designing a circulating feeding mechanism, when the silicon wafer grooving and feeding mechanism main body is stably placed for grooving and feeding the silicon wafer, the silicon wafer is placed on the surface of the supporting placement plate at the connection of the two moving vertical plates for support and fixation. When the conveyor belt conveys, it drives the moving vertical plate to move forward stably. The moving vertical plate drives the silicon wafer to be conveyed to the upper surface of the grooving table for grooving treatment. After grooving, it continues to move forward until it is conveyed back to the original position. Combining with the grooving and staying time on the upper surface of the grooving table, the grooved silicon wafer is disassembled at the same time, and the ungrooved silicon wafer is fixed again, and the grooving treatment is circulated and conveyed. The operation is simpler and more convenient, saving time, accelerating the feeding rate, and improving the convenience and rate of feeding when the silicon wafer grooving and feeding mechanism main body grooves the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present utility model;

[0017] Figure 2 for the present utility model Figure 1Schematic diagram of the enlarged structure of part A;

[0018] Figure 3 Schematic diagram of the side sectional structure of the present utility model;

[0019] Figure 4 The present utility model Figure 3 Schematic diagram of the enlarged structure of part B;

[0020] In the figure: 100, main body of the silicon wafer grooving and loading mechanism; 101, support frame; 1011, driving motor; 1012, driving roller; 1013, conveyor belt; 1014, limiting ring; 1015, moving vertical plate; 1016, support and placement plate; 1017, control chute; 1018, control slider; 102, grooving table; 103, lower pressing clamping plate; 1031, threaded rod; 1032, limiting groove; 1033, limiting block; 1034, rotating ring. Detailed implementation manner

[0021] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0022] Please refer to Figures 1 to 4 , the present utility model provides a technical solution: a silicon wafer grooving and loading structure, including a main body 100 of the silicon wafer grooving and loading mechanism. The main body 100 of the silicon wafer grooving and loading mechanism includes a support frame 101. A fixed plate is welded and fixed at the middle position inside the support frame 101. A grooving table 102 is installed on the upper surface of the fixed plate through a cylinder. The following are also provided on the main body 100 of the silicon wafer grooving and loading mechanism:

[0023] A circulating loading mechanism, and the circulating loading mechanism includes driving components arranged at both ends of the support frame 101. A circulating conveying component is arranged on the outer surface of the driving components on both sides inside the support frame 101. A control component is arranged between the outer side of the circulating conveying component and the inside of the support frame 101. When the main body 100 of the silicon wafer grooving and loading mechanism processes the silicon wafer for grooving and loading, the circulating loading mechanism can perform circulating loading and grooving on the silicon wafer, making the operation simpler and more convenient. The circulating process saves time, speeds up the loading rate, and improves the convenience and rate of loading when the main body 100 of the silicon wafer grooving and loading mechanism grooves the silicon wafer.

[0024] In order to facilitate driving the two conveyor belts 1013 to convey through the driving component, and the conveyor belt 1013 drives the movable vertical plate 1015 to convey and load materials. In this embodiment, preferably, the driving component includes driving rollers 1012 rotatably mounted at both ends inside the support frame 101 through bearings. At one end of the front surface of the support frame 101, a driving motor 1011 is installed at the end of the driving roller 1012. Limit rings 1014 are fixedly installed at both ends of the driving roller 1012 through screws. The driving motor 1011 can be energized to operate and drive the driving roller 1012 to rotate. When the driving roller 1012 rotates, it drives the conveyor belt 1013 to convey and is limited by the limit ring 1014, facilitating the cyclic feeding and grooving treatment of silicon wafers by the conveyor belt 1013.

[0025] In order to facilitate the cyclic feeding and grooving of silicon wafers by supporting and placing them through the cyclic conveying component. In this embodiment, preferably, the cyclic conveying component includes two conveyor belts 1013 arranged at the end of the connection between the two driving rollers 1012. Movable vertical plates 1015 are fixedly installed on the surface of the conveyor belt 1013 at equal intervals through screws. At the inner bottom end of the movable vertical plate 1015, a support and placement plate 1016 is provided. The two conveyor belts 1013 are driven to convey by the driving roller 1012. When the conveyor belt 1013 conveys, it drives the movable vertical plate 1015 and the support and placement plate 1016 to convey, thereby driving the silicon wafers to be fed cyclically for grooving through the support and placement plate 1016.

[0026] In order to facilitate the more stable conveyance of the movable vertical plate 1015 driven by the conveyor belt 1013 through the control component. In this embodiment, preferably, the control component includes control chutes 1017 opened at the edges on both sides of the support frame 101. Inside the control chutes 1017, control sliders 1018 are provided. The end of the control slider 1018 is fixedly connected to the outside of the movable vertical plate 1015 through bolts. When the movable vertical plate 1015 conveys, it drives the control slider 1018 to slide inside the control chute 1017 for control, enabling more stable feeding and grooving treatment of silicon wafers.

[0027] A positioning and clamping mechanism, and the positioning and clamping mechanism includes a positioning and clamping component arranged inside the cyclic conveying component. A limiting component is arranged on the side of the positioning and clamping component. After the silicon wafer grooving and feeding mechanism main body 100 grooves and supports and places the silicon wafers, the silicon wafers can be fixedly placed and conveyed through the positioning and clamping mechanism, facilitating more secure cyclic feeding and grooving. When the grooving is subjected to external forces, it is more stable and less likely to produce grooving errors, improving the fixing performance of the silicon wafer grooving and feeding mechanism main body 100 during the cyclic feeding and supporting of silicon wafers.

[0028] In order to facilitate the fixed support placement of the silicon wafer on the surface of the support placement plate 1016 through the positioning and clamping assembly, in this embodiment, preferably, the positioning and clamping assembly includes a threaded rod 1031 that rotates at the inner top end of the moving vertical plate 1015 through a threaded structure. A lower pressing clamping plate 103 is arranged at the middle position inside the moving vertical plate 1015. A rotating ring 1034 is rotatably arranged inside the lower pressing clamping plate 103. The bottom end of the threaded rod 1031 is fixedly connected to the top end of the rotating ring 1034 by welding. After the silicon wafer is supported and placed on the surface of the support placement plate 1016, it is convenient to rotate the threaded rod 1031 to drive the lower pressing clamping plate 103 to move downward through the rotation of the rotating ring 1034 until the lower pressing clamping plate 103 moves downward and tightly presses on the upper surface of the silicon wafer for clamping and grooving treatment.

[0029] In order to facilitate the stable downward movement and clamping fixation of the lower pressing clamping plate 103 through the limiting assembly, in this embodiment, preferably, the limiting assembly includes a limiting groove 1032 opened at the middle position inside the moving vertical plate 1015. A limiting block 1033 is arranged inside the limiting groove 1032. The end of the limiting block 1033 is fixedly connected to the end of the lower pressing clamping plate 103 by screws. When the lower pressing clamping plate 103 moves downward, it can drive the limiting block 1033 to slide limit inside the limiting groove 1032, and the lower pressing clamping plate 103 moves downward stably to fix the silicon wafer on the surface of the support placement plate 1016 for stable feeding and grooving.

[0030] The working principle and usage process of the present utility model: For this kind of silicon wafer grooving and feeding structure, before use, first place it at the processing and production position through the bottom end of the support frame 101. When grooving and feeding the silicon wafer after the silicon wafer grooving and feeding mechanism main body 100 is stably placed, at this time, place the silicon wafer on the surface of the support placement plate 1016 at the connection of the two moving vertical plates 1015 for support placement and fixation. After the silicon wafer is supported and fixed, the driving motor 1011 operates to drive the driving roller 1012 to rotate. When the driving roller 1012 rotates, it drives the two conveyor belts 1013 to convey simultaneously. When the conveyor belts 1013 convey, they drive the moving vertical plates 1015 to move forward. The movement of the moving vertical plates 1015 drives the control sliding groove 1017 to slide and control inside the control slider 1018, so as to move the two moving vertical plates 1015 simultaneously to drive the silicon wafer to be conveyed to the upper surface of the grooving table 102. The air cylinder drives the grooving table 102 to move upward to make the upper surface of the grooving table 102 contact the lower surface of the silicon wafer for grooving treatment, and continue to convey forward after grooving until the grooved silicon wafer is conveyed back to the original position. At the same time, combined with the time of staying for grooving on the upper surface of the grooving table 102, the grooved silicon wafer is disassembled, and the non-grooved silicon wafer is fixed again, and it is convenient to perform cyclic conveying and grooving treatment when grooving the silicon wafer. The operation is simpler and more convenient. The cyclic treatment saves time, speeds up the feeding rate, and improves the convenience and rate of feeding when the silicon wafer grooving and feeding mechanism main body 100 grooves the silicon wafer.

[0031] Finally, after the main body 100 of the silicon wafer grooving and loading mechanism is supported on the surface of the support placement plate 1016 during loading, hold the threaded rod 1031 by hand and drive the rotating ring 1034 to rotate inside the lower pressing clamp 103, so as to screw the threaded rod 1031 into the lower pressing clamp 103 for extrusion and downward adjustment. When the lower pressing clamp 103 moves downward, it drives the limit block 1033 to slide in the limit groove 1032 in a limited manner, so as to stably move the lower pressing clamp 103 downward and position it to clamp the end surface of the silicon wafer, which is convenient for quick fixing and installation. Compared with the existing installation, it is more firmly fixed. When the grooving is subjected to external force, it is more stable, not easy to produce grooving errors, improving the fixing of the main body 100 of the silicon wafer grooving and loading mechanism during the cyclic loading and support of the silicon wafer grooving, and making the grooving more accurate.

[0032] Although the embodiments of the present invention have been shown and described (see the above detailed description), for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer grooving and loading structure, comprising a main body (100) of a silicon wafer grooving and loading mechanism. The main body (100) of the silicon wafer grooving and loading mechanism includes a support frame (101). A fixing plate is welded and fixed at the middle position inside the support frame (101). A grooving table (102) is installed on the upper surface of the fixing plate through a cylinder. It is characterized in that: On the main body (100) of the silicon wafer grooving and loading mechanism, there are also provided: A circulating loading mechanism, and the circulating loading mechanism includes drive components arranged at both ends of the support frame (101). On the outer surfaces of the drive components, circulating conveying components are arranged on both sides inside the support frame (101), and a control component is arranged between the outer sides of the circulating conveying components and the inside of the support frame (101); A positioning and clamping mechanism, and the positioning and clamping mechanism includes a positioning and clamping component arranged inside the circulating conveying component, and a limiting component is arranged on the side of the positioning and clamping component.

2. The silicon wafer grooving and loading structure according to claim 1, characterized in that: The drive component includes drive rollers (1012) rotatably mounted at both ends inside the support frame (101) through bearings. At one end of the front surface of the support frame (101), a drive motor (1011) is installed at the end of the drive roller (1012), and limiting rings (1014) are fixedly installed at both ends of the drive roller (1012) by screws.

3. The silicon wafer grooving and loading structure according to claim 2, characterized in that: The circulating conveying component includes two conveyor belts (1013) arranged at the end of the connection between the two drive rollers (1012). On the surface of the conveyor belt (1013), moving vertical plates (1015) are fixedly installed at equal intervals by screws, and a support and placement plate (1016) is arranged at the inner bottom end of the moving vertical plate (1015).

4. A silicon wafer grooving and loading structure according to claim 3, characterized in that: The two moving vertical plates (1015) are symmetrically arranged, and the support and placement plate (1016) and the moving vertical plate (1015) are of an integral structure.

5. A silicon wafer grooving and loading structure according to claim 3, characterized in that: The control component includes control chutes (1017) opened at the edges on both sides of the support frame (101). Inside the control chutes (1017), control sliders (1018) are arranged, and the end of the control slider (1018) is fixedly bolted to the outer side of the moving vertical plate (1015).

6. The wafer grooving and loading structure according to claim 3, wherein: The positioning and clamping component includes a threaded rod (1031) rotatably arranged at the inner top end of the moving vertical plate (1015) through a threaded structure. A pressing lower plate (103) is arranged at the middle position inside the moving vertical plate (1015). A rotating ring (1034) is rotatably arranged inside the pressing lower plate (103), and the bottom end of the threaded rod (1031) is fixedly welded to the top end of the rotating ring (1034).

7. The silicon wafer grooving and loading structure according to claim 6, characterized in that: The limiting component includes a limiting groove (1032) opened at the middle position inside the moving vertical plate (1015). Inside the limiting groove (1032), a limiting block (1033) is arranged, and the end of the limiting block (1033) is fixedly screwed to the end of the pressing lower plate (103).

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