Pick-up clamp for sorting mechanism of high-speed silicon wafer sorting machine
By designing the structure of placing grooves, clamping blocks and guide plates on the silicon wafer sorting machine, the scratch problem when the robotic arm clamps the silicon wafer is solved, and the smooth pick-up and efficient handling of the silicon wafer is achieved, reducing the risk of silicon wafer damage.
Patent Information
- Application Number
- CN202422328325.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-23
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-23
AI Technical Summary
Existing robotic arms are prone to scratch the silicon wafer when clamping it, affecting the quality of the silicon wafer.
A pickup clip for high-speed silicon wafer sorting machine is designed, using a placement groove, clamping block and guide plate structure, guiding the silicon wafer into the placement groove through guide bars and arc surfaces, using electric telescopic rods to accurately apply pressure, and forming a rolling fit with the silicon wafer through clamping pads to reduce the risk of friction and damage.
It effectively reduces friction and potential damage to the silicon wafer during the pickup process, ensures the stability and safety of the silicon wafer during the handling process, and minimizes the risk of scratches.
Smart Images
Figure CN223087074U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of fixture devices, and particularly to a pick-up clip for a sorting mechanism of a high-speed silicon wafer sorter. Background Art
[0002] A high-speed silicon wafer sorter is an automated device mainly used for quality inspection and sorting of silicon wafers in the photovoltaic industry. The application of this device greatly improves the efficiency and accuracy of silicon wafer inspection, and at the same time reduces the labor intensity and subjective error of manual inspection.
[0003] The working principle of a high-speed silicon wafer sorter mainly includes the following steps: feeding, inspection, sorting, and discharging. Silicon wafers enter the sorter through the feeding port. When passing through a series of inspection modules, the silicon wafers are inspected for indicators such as thickness, surface flatness, invisible cracks, dirt, size, and warpage. According to the inspection results, the silicon wafers are automatically sorted into different grades or categories. The sorted silicon wafers leave the sorter through the discharging port.
[0004] Currently, in the sorting mechanism, mainly a robotic arm is used to pick up the sorted silicon wafers from the sorting conveyor belt and place them on the conveyor belt of the subsequent process. The existing robotic arm mainly includes two opposite jaws that clamp the silicon wafers by clamping. When clamping the silicon wafers, sometimes the jaws may scratch the silicon wafers, affecting the quality of the silicon wafers. Summary of the Utility Model
[0005] In order to reduce the possibility of the silicon wafers being scratched when being clamped, this application provides a pick-up clip for a sorting mechanism of a high-speed silicon wafer sorter.
[0006] The pick-up clip for a sorting mechanism of a high-speed silicon wafer sorter provided by this application adopts the following technical solutions:
[0007] A pick-up clip for a sorting mechanism of a high-speed silicon wafer sorter, the pick-up clip is installed on a robotic arm, and the pick-up clip includes:
[0008] A placement block, on the side wall of which there is a placement groove for placing silicon wafers, and it is installed on the robotic arm;
[0009] A clamping block, several of which are provided, and are ball-jointed to the top of the inner wall of the placement groove for pressing the silicon wafers against the bottom of the inner wall of the placement groove;
[0010] A guide plate, installed at a position of the placement block close to the notch of the placement groove, and on one side of the guide plate close to the notch of the placement groove, there are several guide strips along the length direction of the guide plate for guiding the silicon wafers.
[0011] Optionally, an inclined surface for guiding the silicon wafer into the interior of the placement groove is provided at the side position of the inner wall of the placement groove.
[0012] Optionally, mounting posts with variable overall length are provided on the inner wall of the placement groove, and the clamping block is ball-jointed to the bottom of the mounting posts.
[0013] Optionally, the clamping block includes:
[0014] A mounting block, which is ball-jointed to the inner wall of the placement groove;
[0015] A clamping pad, which is installed at the bottom of the mounting block, and the bottom of the clamping pad is used to press the silicon wafer against the bottom of the inner wall of the placement groove.
[0016] Optionally, the thickness of the clamping pad gradually increases from the position close to the notch of the placement groove to the position far from the notch of the placement groove.
[0017] Optionally, the bottom of the clamping pad is arranged in an arc shape, and the bottom of the clamping pad is in rolling fit with the silicon wafer.
[0018] Optionally, a guide rod is provided at the top of the inner wall of the placement groove, and a guide groove for inserting the guide rod is provided in the vertical direction at the top of the clamping block. The guide rod is used to restrict the rotation of the clamping block along the vertical axis.
[0019] Optionally, a number of mounting holes for connecting with the robotic arm are opened at the top of the inner wall of the placement groove, and the number of mounting holes is located between adjacent two mounting blocks.
[0020] Optionally, a plug-in groove is opened at the top of the guide plate, and the guide strip is in plug-in fit with the plug-in groove.
[0021] Optionally, an arc surface for contacting the silicon wafer is provided on one side of the guide strip close to the notch of the placement groove.
[0022] In summary, the present application includes at least one of the following beneficial technical effects:
[0023] 1. The robotic arm carries the pick-up clip and moves above the silicon wafer to be picked up. At this time, the guide strip and the arc surface of the guide plate cooperate to ensure that the silicon wafer can smoothly slide into the placement groove, effectively reducing friction and potential damage. As the silicon wafer further penetrates along the inclined surface of the inner wall of the placement groove and completely enters the groove, the clamping block precisely applies pressure through the electric telescopic rod, and the arc-shaped bottom of the clamping pad contacts the silicon wafer to form a rolling fit, further reducing the friction and damage risk during the clamping process. At the same time, the guide rod at the top of the inner wall of the placement groove and the guide groove at the top of the clamping block cooperate with each other to ensure the stability of the clamping block when applying pressure and avoid unnecessary movement, thereby minimizing the possibility of damaging the silicon wafer during the picking process. Description of the Drawings
[0024] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.
[0025] Figure 2 It is a schematic diagram showing the positional relationship between the mounting post and the placement groove in an embodiment of the present application.
[0026] Figure 3 It is a schematic diagram showing the structure of the clamping block in an embodiment of the present application.
[0027] Figure 4 is Figure 2 an enlarged schematic diagram of part A in
[0028] Explanation of reference numerals:
[0029] 1. Placement block; 11. Placement groove; 12. Guide rod; 13. Mounting hole; 2. Clamping block; 21. Mounting block; 22. Clamping pad; 23. Mounting post; 24. Guide groove; 3. Guide plate; 31. Insertion slot; 32. Guide strip. Detailed implementation manners
[0030] The following Figures 1-4 further elaborates on the present application in conjunction with the attached
[0031] An embodiment of the present application discloses a pick-up clamp for a sorting mechanism of a high-speed wafer sorter.
[0032] A pick-up clamp for a sorting mechanism of a high-speed wafer sorter includes a placement block 1, a clamping block 2, and a guide plate 3. The placement block 1 is the base of the pick-up clamp and is fixed to the robotic arm. A specially designed placement groove 11 is provided on its side wall for carrying wafers. The function of the clamping block 2 is to apply appropriate pressure to the top inner wall of the placement groove 11 to ensure the stability of the wafer during picking and handling. The guide plate 3 is located near the notch of the placement groove 11, and its main function is to guide the wafer smoothly into the placement groove 11 and keep it in the correct direction during handling.
[0033] The inner side of the inner wall of the placement groove 11 is designed with an inclined surface, which not only helps to guide the wafer during placement, enabling it to slide smoothly into the groove, but also reduces friction and potential damage to the wafer. The clamping block 2 is closely fitted with the top inner wall of the placement groove 11 through the mounting post 23 to ensure stability when applying pressure. The mounting post 23 is designed as an electric telescopic rod and can be telescoped to clamp wafers of different thicknesses. The clamping block 2 is mounted at the bottom end of the mounting post 23 by a ball joint, and the clamping block 2 can be finely adjusted when needed to adapt to wafers of different sizes.
[0034] The clamping block 2 is composed of a mounting block 21 and a clamping pad 22. The mounting block 21 is fixed to the bottom of a mounting post 23 on the inner wall of the placement groove 11, while the clamping pad 22 is installed at the bottom of the mounting block 21. The thickness of the clamping pad 22 gradually increases from the position near the notch of the placement groove 11 to the position far from the notch. The bottom of the clamping pad 22 is designed to be arc-shaped, forming a rolling fit with the contact surface of the silicon wafer, which not only reduces the friction during the clamping process of the silicon wafer but also reduces the risk of damage caused by friction.
[0035] To ensure the stability of the clamping block 2 in the vertical direction, a guide rod 12 is provided at the top of the inner wall of the placement groove 11, and a guide groove 24 is provided at the top of the clamping block 2. The guide rod 12 is inserted into the guide groove 24 to restrict the rotation of the clamping block 2. This design ensures that the clamping block 2 will not move unnecessarily when pressure is applied, thereby improving the clamping accuracy.
[0036] A number of mounting holes 13 are also provided at the top of the inner wall of the placement groove 11. These mounting holes 13 are used to fix the pick-up clip to the robotic arm. The layout of the mounting holes 13 takes into account the position of the clamping block 2, ensuring a firm and convenient connection between the robotic arm and the pick-up clip.
[0037] A number of guide strips 32 are provided on one side of the guide plate 3 close to the notch of the placement groove 11. These guide strips 32 help to guide the silicon wafer into the placement groove 11 smoothly. An arc surface is provided on one side of the guide strip 32 close to the notch of the placement groove 11. This arc surface can reduce friction when contacting the silicon wafer, protecting the surface of the silicon wafer from damage. The design of the arc surface also helps the smooth transition of the silicon wafer during the guiding process, ensuring an efficient and safe handling process of the silicon wafer.
[0038] A plug-in slot 31 is provided at the top of the guide plate 3, and the guide strip 32 and the plug-in slot 31 are in plug-in fit. After the guide strip 32 is worn, the guide strip 32 can be directly replaced, improving the convenience of installing and replacing the guide strip 32.
[0039] The implementation principle of a pick-up clip of a sorting mechanism for a high-speed silicon wafer sorter in an embodiment of the present application is as follows: The robotic arm carries the pick-up clip and moves above the silicon wafer to be picked up. At this time, the guide strips 32 and the arc surface of the guide plate 3 work together to ensure that the silicon wafer can smoothly slide into the placement groove 11, effectively reducing friction and potential damage. As the silicon wafer further deepens along the inclined surface of the inner wall of the placement groove 11 and completely enters the groove, the clamping block 2 precisely applies pressure through an electric telescopic rod, and the arc-shaped bottom of the clamping pad 22 contacts the silicon wafer, forming a rolling fit, further reducing the friction and damage risk during the clamping process. At the same time, the guide rod 12 at the top of the inner wall of the placement groove 11 and the guide groove 24 at the top of the clamping block 2 cooperate with each other to ensure the stability of the clamping block 2 when pressure is applied, avoiding unnecessary movement, thereby minimizing the possibility of damaging the silicon wafer during the picking process.
[0040] The above are all preferred embodiments of the present application, and do not limit the protection scope of the present application. Therefore, all equivalent changes made according to the structure, shape and principle of the present application shall be covered within the protection scope of the present application.
Claims
1. A pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter, the pick-up clip being installed on a robotic arm, characterized in that: The pick-up clip includes: A placement block (1) is provided with a placement groove (11) on its side wall for placing silicon wafers and is installed on a robotic arm. There are several clamping blocks (2), which are ball-jointed to the top of the inner wall of the placement groove (11) for pressing the silicon wafer against the bottom of the inner wall of the placement groove (11). A guide plate (3) is installed at the position of the placement block (1) close to the notch of the placement groove (11). On one side of the guide plate (3) close to the notch of the placement groove (11), several guide bars (32) are provided along the length direction of the guide plate (3) for guiding the silicon wafer.
2. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 1, wherein: At the side position of the inner wall of the placement groove (11), there is an inclined surface for guiding the silicon wafer into the interior of the placement groove (11).
3. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 1, wherein: On the inner wall of the placement groove (11), there is an installation post (23) whose overall length can be changed, and the clamping block (2) is ball-jointed to the bottom of the installation post (23).
4. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 1, wherein: The clamping block (2) includes: An installation block (21) is ball-jointed to the inner wall of the placement groove (11). A clamping pad (22) is installed at the bottom of the installation block (21), and the bottom of the clamping pad (22) is used to press the silicon wafer against the bottom of the inner wall of the placement groove (11).
5. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 4, wherein: The thickness of the clamping pad (22) gradually increases from the position close to the notch of the placement groove (11) to the position far from the notch of the placement groove (11).
6. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 5, wherein: The bottom of the clamping pad (22) is arranged in an arc shape, and the bottom of the clamping pad (22) is in rolling fit with the silicon wafer.
7. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 1, wherein: At the top of the inner wall of the placement groove (11), there is a guide rod (12). At the top of the clamping block (2), there is a guide groove (24) for the guide rod (12) to insert along the vertical direction. The guide rod (12) is used to limit the rotation of the clamping block (2) along the vertical axis.
8. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 4, wherein: At the top of the inner wall of the placement groove (11), several mounting holes (13) for connecting with the robotic arm are provided, and several of the mounting holes (13) are located between adjacent two mounting blocks (21).
9. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 1, wherein: At the top of the guide plate (3), there is a plug-in slot (31), and the guide bar (32) is in plug-in fit with the plug-in slot (31).
10. The pick-up clip for the sorting mechanism of a high-speed silicon wafer sorter according to claim 1, wherein: One side of the guiding strip (32) close to the notch of the placing groove (11) is provided with an arc surface for abutting against the silicon wafer.