Coating device

By using a vertical or inclined carrier table in the coating device, combined with evaporation and ALD technology, the problem of uncontrollable deformation of the substrate is solved, uniform film formation of the substrate is achieved, and the coating quality and efficiency are improved.

CN223087890UActive Publication Date: 2025-07-11SHANGHAI YUANLI XINCHEN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421985836.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-15
Publication Date
2025-07-11
Estimated Expiration
2034-08-15

AI Technical Summary

Technical Problem

The substrate deformation of existing coating equipment is uncontrollable in the ALD process, resulting in poor coating uniformity and the evaporation process is difficult to achieve the coating method, affecting the coating quality and efficiency.

Method used

A coating device is designed, using a vertical or inclined carrier table, combining the evaporation chamber and the ALD chamber, and evaporation and ALD processes are performed respectively through the evaporation and spray parts to reduce substrate deformation and ensure stable air flow, and achieve uniformity of film deposition.

Benefits of technology

Effectively reduce substrate deformation, improve coating uniformity and production efficiency, and improve coating quality.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model provides a coating device and relates to the technical field of photovoltaics and semiconductors. The coating device comprises an evaporation cavity, an ALD cavity, a material carrying table and a first conveying piece. Wherein an evaporation piece is arranged in the evaporation cavity, and the evaporation piece is used for carrying out an evaporation process on a substrate; a spraying piece is arranged in the ALD cavity, the ALD cavity is connected with the evaporation cavity, and the spraying piece is used for carrying out an ALD process on the substrate; the first conveying piece is arranged in the evaporation cavity and the ALD cavity and used for moving the material carrying table. The material carrying table is used for carrying a base, and the material carrying table is vertical, so that the base is vertically arranged; or the material carrying table is obliquely arranged, so that the substrate is obliquely arranged towards the evaporation piece or the spraying piece; according to the invention, the material loading table is arranged on the substrate, so that the substrate loaded on the material loading table is also vertically or obliquely arranged, the evaporation piece and the spraying piece are enabled to perform film layer deposition on the substrate horizontally or obliquely upwards, the deformation of the glass substrate can be reduced, the uniformity of integral film formation of the substrate can be ensured, and the production efficiency and quality of film coating are improved.
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Description

Technical Field

[0001] The utility model relates to the technical fields of photovoltaics and semiconductors, and more particularly, to a coating device. Background Art

[0002] In the field of perovskite batteries, the substrate is usually coated by evaporation and ALD (Atomic Layer Deposition) processes. To ensure the efficiency and quality of battery production, an integrated coating device is usually used for coating.

[0003] Currently, the coating device usually uses a bottom coating method for the evaporation process and an upper coating method for the ALD process. However, in the ALD process, the bottom coating method will cause uncontrollable deformation of the substrate, and the greater the deformation of the substrate, the worse the coating uniformity; in the evaporation process, it is difficult to implement the upper coating method while ensuring uniform and pollution-free coating of the substrate. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a coating device, which can reduce the deformation amount of the substrate and ensure the uniformity of the overall film formation.

[0005] The embodiments of the utility model are implemented as follows:

[0006] An evaporation element is arranged in the evaporation chamber, and the substrate is subjected to an evaporation process through the evaporation element; a spraying element is arranged in the ALD chamber, and the substrate is subjected to an ALD process through the spraying element; a first conveying element is arranged in the evaporation chamber and the ALD chamber for moving the loading platform. It can be understood that the ALD chamber is connected to the evaporation chamber, and the ALD chamber and the evaporation chamber are two independent cavities. Therefore, the first conveying element drives the loading platform and the substrate carried on the loading platform to move to the evaporation chamber, so that the substrate is subjected to an evaporation process through the evaporation element, and then the loading platform and the substrate are conveyed to the ALD chamber by the first conveying element, so that the substrate is subjected to an ALD process through the spraying element, thereby sequentially performing an evaporation process and an ALD process on the substrate. The loading platform is arranged vertically or obliquely, and the substrate is arranged on the bottom wall of the loading platform facing the evaporation element or the spraying, so as to minimize the deformation amount of the glass substrate to the greatest extent and ensure the smoothness of the air flow and the uniformity of the film formation.

[0007] The beneficial effects of the coating device provided by the embodiments of the utility model include: in order to take into account the advantages and disadvantages of the evaporation process and the ALD process, the coating device of the utility model uses a vertically or obliquely arranged loading platform, so that the substrate carried on the loading platform is also arranged vertically or obliquely, so that the evaporation element and the spraying element can effectively deposit a film layer on the substrate, which can not only reduce the deformation amount of the glass substrate, but also ensure the uniformity of the overall film formation on the substrate, thereby improving the production efficiency and quality of the coating. Description of the Drawings

[0008] To more clearly illustrate the technical solutions of the embodiments of the present utility model, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following accompanying drawings only show some embodiments of the present utility model and should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related accompanying drawings can also be obtained based on these drawings.

[0009] Figure 1 Structural schematic diagram of the coating device provided by the embodiment of the present utility model;

[0010] Figure 2 Vertical structural schematic diagram of the evaporation chamber provided by the embodiment of the present utility model;

[0011] Figure 3 Vertical structural schematic diagram of the ALD chamber provided by the embodiment of the present utility model;

[0012] Figure 4 Inclined structural schematic diagram of the evaporation chamber provided by the embodiment of the present utility model;

[0013] Figure 5 Inclined structural schematic diagram of the ALD chamber provided by the embodiment of the present utility model.

[0014] Icons: 10 - coating device; 100 - evaporation chamber; 110 - evaporation element; 120 - driving element; 130 - first heater; 200 - ALD chamber; 210 - spraying element; 220 - second heater; 300 - material loading platform; 400 - conveying mechanism; 410 - first conveying element; 420 - second conveying element; 500 - heating chamber; 510 - first heating element; 600 - feeding and discharging mechanism; 610 - feeding chamber; 620 - discharging chamber; 700 - connecting platform; 800 - transition chamber; 810 - second heating element; 900 - loading and unloading element; 20 - substrate. Detailed implementation manners

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are some, but not all, of the embodiments of the present utility model. Usually, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the scope of protection of the present invention.

[0017] It should be noted that like reference numerals and letters denote like items in the following drawings. Therefore, once an item is defined in one drawing, it does not require further definition and explanation in subsequent drawings.

[0018] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship in which the product of the present invention is habitually placed during use. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive distinction and should not be construed as indicating or implying relative importance.

[0019] In addition, the terms "horizontal", "vertical", etc. do not mean that the components are required to be absolutely horizontal or hanging vertically, but may be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but may be slightly inclined.

[0020] In the description of the present invention, it should also be noted that unless otherwise clearly specified and defined, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] In the field of perovskite solar cells, vapor deposition and ALD processes are usually used to coat the substrate. In order to ensure the efficiency and quality of battery production, an integrated coating device is usually used for coating at present.

[0022] At present, the current coating equipment usually adopts the lower coating method for the evaporation coating process and the upper coating method for the ALD process. However, in the ALD process, the lower coating method will cause uncontrollable deformation of the substrate, and the greater the deformation of the substrate, the worse the coating uniformity. In the evaporation coating process, it is also very difficult to achieve the upper coating method while ensuring uniform coating and no pollution of the substrate. For the above problems, please refer to Figure 1 , the present utility model provides a coating device 10, which is applied to the fields of photovoltaic and semiconductor technologies, integrates the evaporation coating process and the ALD process, and can ensure as small a deformation amount of the glass substrate 20 as possible, ensure stable air flow and uniform film formation.

[0023] Specifically, the coating device 10 includes an evaporation coating chamber 100, an ALD chamber 200, a loading table 300, and a conveying mechanism 400. The conveying mechanism 400 includes a first conveying member 410 and a second conveying member 420 for conveying the loading table 300.

[0024] Among them, an evaporation member 110 is arranged in the evaporation coating chamber 100, and the evaporation member 110 is used for performing the evaporation coating process on the substrate 20; a spraying member 210 is arranged in the ALD chamber 200, the ALD chamber 200 is connected to the evaporation coating chamber 100, and the spraying member 210 is used for performing the ALD process on the substrate 20; the loading table 300 is used for carrying the substrate 20, and the substrate 20 is attached to the loading table 300. Therefore, the loading table 300 is vertical so that the substrate 20 is vertically arranged; or, the loading table 300 is inclined so that the substrate 20 is inclined towards the evaporation member 110 or the spraying member 210; the first conveying member 410 is arranged in the evaporation coating chamber 100 and the ALD chamber 200 for moving the loading table 300.

[0025] In this embodiment, an evaporation member 110 is disposed in the evaporation chamber 100, and a vapor deposition process is performed on the substrate 20 through the evaporation member 110; a spraying member 210 is disposed in the ALD chamber 200, and an ALD process is performed on the substrate 20 through the spraying member 210; a first conveying member 410 is disposed in the evaporation chamber 100 and the ALD chamber 200 for moving the carrier table 300. It can be understood that the ALD chamber 200 is connected to the evaporation chamber 100, and the ALD chamber 200 and the evaporation chamber 100 are two independent cavities. Therefore, the first conveying member 410 drives the carrier table 300 and the substrate 20 carried on the carrier table 300 to move into the evaporation chamber 100, so as to perform a vapor deposition process on the substrate 20 through the evaporation member 110, and then the first conveying member 410 conveys the carrier table 300 and the substrate 20 to the ALD chamber 200 to perform an ALD process on the substrate 20 through the spraying member 210, thereby sequentially performing a vapor deposition process and an ALD process on the substrate 20. The carrier table 300 is arranged vertically or obliquely, and the substrate 20 is arranged on the bottom wall of the carrier table 300 facing the evaporation member 110 or the spraying, so as to minimize the deformation amount of the glass substrate 20 and ensure the smoothness of the air flow and the uniformity of the film formation.

[0026] In order to take into account the advantages and disadvantages of the vapor deposition process and the ALD process, the coating device 10 adopts a vertically or obliquely arranged carrier table 300, so that the substrate 20 carried on the carrier table 300 is also arranged vertically or obliquely, so that the evaporation member 110 and the spraying member 210 deposit a film layer on the substrate 20 horizontally or obliquely upward, which can not only reduce the deformation amount of the glass substrate 20, but also ensure the uniformity of the film formation of the whole substrate 20, thereby improving the production efficiency and quality of the coating.

[0027] Further, a driving member 120 is further disposed in the evaporation chamber 100. The driving member 120 is connected to the evaporation member 110, and the movement path of the driving member 120 is arranged parallel to the carrier table 300. The driving member 120 is used to drive the evaporation member 110 to move up and down in a direction parallel to the carrier table 300.

[0028] In this embodiment, when performing the vapor deposition process, the driving member 120 drives the evaporation member 110 to move up and down reciprocally and uniformly in a direction parallel to the carrier table 300, further improving the film formation uniformity of the vapor deposition, thereby further improving the film formation quality.

[0029] It can be understood that when the carrier table 300 is arranged vertically, as Figure 2 and Figure 3 shown, the driving member 120 drives the evaporation member 110 to move up and down uniformly in the vertical direction; when the carrier table 300 is arranged obliquely, as Figure 4 and Figure 5 shown, the driving member 120 drives the evaporation member 110 to move up and down uniformly in an inclined direction parallel to the carrier table 300.

[0030] Of course, in other embodiments, the driving member 120 drives the evaporation member 110 to move in other directions. For example, it drives the evaporation member 110 to move horizontally laterally, or to move obliquely in other directions, or to drive the evaporation member 110 to move irregularly, as long as the movement of the evaporation member 110 can be achieved. The movement path of the evaporation member 110 can be controlled according to the process requirements of use, and no specific limitation is made here.

[0031] Furthermore, the spraying member 210 is arranged in parallel with the loading table 300.

[0032] In this embodiment, by arranging the spraying member 210 in parallel with the loading table 300, the gas sprayed by the spraying member 210 can form a film on the substrate 20 relatively more uniformly, thereby improving the film formation uniformity and film formation quality.

[0033] It can be understood that when the loading table 300 is arranged vertically, the spraying member 210 is also arranged vertically. At this time, the spraying member 210 sprays gas towards the substrate 20 in the horizontal direction; and when the loading table 300 is arranged obliquely, the spraying member 210 is also arranged obliquely, and the spraying member 210 sprays gas towards the substrate 20 in an inclined direction from bottom to top.

[0034] It should be noted that a first heater 130 is further arranged in the evaporation chamber 100 for heating when the substrate 20 is undergoing an evaporation process, and the first heater 130 is arranged in parallel with the loading table 300, so as to evaporate the coating material by heating evaporation and turn it into gas, and make the particles fly to the surface of the substrate and condense into a film. For example, the evaporation coating of C60 and BCP film layers is carried out; a second heater 220 is also arranged in the ALD chamber 200 for heating when the substrate 20 is undergoing an ALD process, and the second heater 220 is arranged in parallel with the loading table 300, so as to spray the oxygen source and metal source onto the substrate by spraying to realize film layer deposition on the surface of the substrate. For example, the formation of a novel aluminum-doped zinc oxide (AZO) film is carried out.

[0035] Furthermore, the inclination angle of the loading table 300 towards the evaporation member 110 or the spraying member 210 is 0° to 20°.

[0036] In this embodiment, the inclination angle of the loading table 300 is 0° to 20°. For example, the inclination angle of the loading table 300 can be 0°, 5°, 10°, 15°, and 20°. Of course, it is not limited thereto, and the inclination angle of the loading table 300 can also be other values as long as it is within the range of 0° to 20°.

[0037] It can be understood that the tilt angle is the angle between the plane where the material loading table 300 is located and the vertical plane. When the tilt angle of the material loading table 300 is 0°, the material loading table 300 is vertically arranged; when the tilt angle of the material loading table 300 is greater than 0°, the evaporation member 110 or the spraying member 210 is arranged on the side where the material loading table 300 forms an acute angle with the horizontal plane, so that the evaporation member 110 or the spraying member 210 is located obliquely below the material loading table 300. Therefore, if the evaporation member 110 or the spraying member 210 is arranged on the side where the material loading table 300 forms an obtuse angle with the horizontal plane, the evaporation member 110 and the spraying member 210 are equivalent to performing the evaporation and spraying processes from above the material loading table 300, which does not conform to the mechanism of the evaporation coating process; and when the tilt angle is greater than 20°, the deformation amount of the substrate 20 will increase during the ALD process, affecting the uniformity of film formation on the substrate 20.

[0038] Therefore, the tilt angle of the material loading table 300 is set to 0° to 20°, which can not only ensure the smooth progress of the evaporation coating process, but also reduce the deformation amount of the glass substrate 20, so as to ensure the uniformity of the overall film formation on the substrate 20, thereby improving the production efficiency and quality of the coating.

[0039] Furthermore, the coating device 10 further includes a heating chamber 500. The heating chamber 500 is provided with a first heating member 510. The heating chamber 500 is connected to the evaporation coating chamber 100. The first heating member 510 is used to heat the substrate 20 to a first preset temperature for the evaporation coating process.

[0040] In this embodiment, the heating chamber 500 is arranged before the evaporation coating chamber 100, that is, the substrate 20 is first transported into the heating chamber 500 for heating. After the temperature of the substrate 20 is heated to the first preset temperature required for the evaporation coating process, the substrate 20 is then transported to the evaporation coating chamber 100 for the evaporation coating process, so that the substrate 20 performs the evaporation coating process in the evaporation coating chamber 100, such as evaporating and forming films of C60 and BCP film layers. Of course, in other embodiments, other types of film layer evaporation coatings can also be performed, which are not specifically limited here.

[0041] Furthermore, the coating device 10 further includes an inlet and outlet mechanism 600. The inlet and outlet mechanism 600 includes a feed chamber 610 and a discharge chamber 620.

[0042] Among them, the feed chamber 610 is connected to the heating chamber 500. Adjusting devices are provided in both the feed chamber 610 and the discharge chamber 620 to evacuate or fill nitrogen backpressure through the adjusting devices, so as to provide a vacuum environment or an atmospheric environment for the substrate 20.

[0043] In this embodiment, the feed chamber 610 is arranged before the heating chamber 500, that is, the substrate 20 is first transported to the feed chamber 610, and the feed chamber 610 is evacuated to make the substrate 20 in a vacuum environment, so that the substrate 20 can be subsequently transported to the heating chamber 500, the evaporation chamber 100 and the ALD chamber which are also in a vacuum environment.

[0044] It can be understood that the feed chamber 610, the heating chamber 500, the evaporation chamber 100 and the ALD chamber 200 are connected in sequence. It can be understood that the feed chamber 610 can evacuate the heating chamber 500, the evaporation chamber 100 and the ALD chamber. Independent vacuuming devices can also be set in the feed chamber 610, the heating chamber 500, the evaporation chamber 100 and the ALD chamber to evacuate the feed chamber 610, the heating chamber 500, the evaporation chamber 100 and the ALD chamber respectively, so as to ensure that the substrate 20 completes the coating process in a vacuum environment.

[0045] Furthermore, the coating device 10 further includes a discharge chamber 620 , which is connected to the ALD chamber 200 , and the discharge chamber 620 is used to convert the vacuum environment into the atmospheric environment after the substrate 20 enters the chamber.

[0046] It can be understood that the discharge chamber 620 is also provided with a vacuum pumping device to ensure that the vacuum environment is maintained during the process of the carrier 300 transporting the substrate 20 from the ALD chamber to the discharge chamber 620. It should be noted that after this, the discharge chamber 620 is converted from a vacuum environment to an atmospheric environment, and in the atmospheric environment state, the carrier 300 transports the substrate 20 to the docking station 700. After completing this step, the discharge chamber 620 is closed and vacuumed again to provide a vacuum environment, so as to receive the substrate that has completed the process from the ALD chamber in a vacuum environment, and this cycle is carried out.

[0047] In this embodiment, the discharge chamber 620 is disposed after the ALD chamber 200 , and the discharge chamber 620 is pressurized back to the atmospheric environment to facilitate subsequent transportation of the loading platform 300 .

[0048] Furthermore, the coating device 10 further includes a docking platform 700 , which is connected to the discharge chamber 620 and is used to receive the loading platform 300 coming out of the discharge chamber 620 .

[0049] In this embodiment, the docking station 700 is arranged behind the discharge chamber 620. After the discharge chamber 620 is pressurized back to the atmospheric environment, the loading platform 300 is transferred to the docking station 700, and then the loading platform 300 is transferred to the conveying mechanism 400 by the docking station 700, and the conveying mechanism 400 transfers the loading platform 300 back to the loading and unloading parts 900 to perform loading and unloading operations, and this cycle is carried out.

[0050] Further, the coating apparatus 10 further includes a transition chamber 800 provided with a second heating element 810. The transition chamber 800 is disposed between the evaporation chamber 100 and the ALD chamber 200. The second heating element 810 is configured to heat the substrate 20 to a second preset temperature for performing the ALD process.

[0051] It should be noted that since the temperatures of the evaporation process and the ALD process are usually inconsistent, and the temperature of the evaporation process is usually lower than that of the ALD process, that is, the first preset temperature is lower than the second preset temperature. Therefore, by providing a transition chamber 800 between the evaporation chamber 100 and the ALD chamber 200, the temperature can be heated to the second preset temperature required for the ALD process through the transition chamber 800 after the substrate completes the evaporation process, so as to enable the substrate to enter the ALD chamber for the ALD process.

[0052] In this embodiment, the transition chamber 800 is disposed between the evaporation chamber 100 and the ALD chamber 200. After the substrate 20 completes the evaporation process, it is transported to the transition chamber 800, and the second heating element 810 heats the temperature of the substrate 20 to the temperature required for the ALD process, so as to facilitate directly performing the ALD process after transporting the substrate 20 from the transition chamber 800 to the ALD chamber 200.

[0053] Further, the coating apparatus 10 further includes a feeding chamber 610, a heating chamber 500, a second conveying member 420, and a loading and unloading member 900. The feeding chamber 610, the heating chamber 500, and the evaporation chamber 100 are connected in sequence. The second conveying member 420 is configured to transport the carrier stage 300 of the docking station 700 to the loading and unloading member 900. The loading and unloading member 900 is configured to unload and load the carrier stage 300 and move the loaded carrier stage 300 to the feeding chamber 610.

[0054] In this embodiment, the second conveying member 420 receives the carrier stage 300 of the docking station 700 and transports it to the loading and unloading member 900 to unload and load the coated substrate 20 on the carrier stage 300, and then the unloaded carrier stage 300 is again loaded with a new substrate 20 to complete the loading. Finally, the loaded carrier stage 300 is transported to the feeding chamber 610 to perform the coating process again, and this cycle is repeated.

[0055] It should be noted that the feeding chamber 610, the heating chamber 500, the evaporation chamber 100, the transition chamber 800, the ALD chamber 200, and the discharging chamber 620 are arranged in sequence, and multiple chambers are independent of each other; the number of the first conveying members 410 is multiple, and the multiple first conveying members 410 are respectively arranged in the feeding chamber 610, the heating chamber 500, the evaporation chamber 100, the transition chamber 800, the ALD chamber 200, and the discharging chamber 620, that is, the first conveying members 410 drive the substrate 20 to sequentially perform feeding, heating, evaporation coating process, transition heating, ALD process, and discharging actions in the corresponding chambers, so as to complete the coating operation of the substrate 20.

[0056] In addition, it should be noted that when the loading platform 300 is vertically arranged, the cavity structures of the feeding chamber 610, the heating chamber 500, the evaporation chamber 100, the transition chamber 800, the ALD chamber 200, and the discharging chamber 620 are all vertically arranged; when the loading platform 300 is inclined, the cavity structures of the feeding chamber 610, the heating chamber 500, the evaporation chamber 100, the transition chamber 800, the ALD chamber 200, and the discharging chamber 620 are also inclined.

[0057] In summary, the present utility model provides a coating device 10. An evaporation member 110 is arranged in the evaporation chamber 100, and the evaporation member 110 performs an evaporation coating process on the substrate 20; a spraying member 210 is arranged in the ALD chamber 200, and the spraying member 210 performs an ALD process on the substrate 20; the first conveying members 410 are arranged in the evaporation chamber 100 and the ALD chamber 200 and are used to move the loading platform 300. It can be understood that the ALD chamber 200 is connected to the evaporation chamber 100, and the ALD chamber 200 and the evaporation chamber 100 are two independent cavities. Therefore, the first conveying members 410 drive the loading platform 300 and the substrate 20 carried on the loading platform 300 to move to the evaporation chamber 100, so as to perform an evaporation coating process on the substrate 20 through the evaporation member 110, and then the first conveying members 410 convey the loading platform 300 and the substrate 20 to the ALD chamber 200, so as to perform an ALD process on the substrate 20 through the spraying member 210, thereby sequentially performing an evaporation coating process and an ALD process on the substrate 20. The loading platform 300 is arranged vertically or inclined, and the substrate 20 is arranged on the bottom wall of the loading platform 300 facing the evaporation member 110 or the spraying, so as to minimize the deformation amount of the glass substrate 20 to the greatest extent and ensure the smoothness of the air flow and the uniformity of film formation; taking into account the advantages and disadvantages of the evaporation coating process and the ALD process, the coating device 10 of the present utility model adopts a vertically or inclined loading platform 300, so that the substrate 20 carried on the loading platform 300 is also arranged vertically or inclined, so that the evaporation member 110 and the spraying member 210 can effectively complete the evaporation coating process and the ALD process, and thereby complete the film layer deposition on the substrate 20, which can not only reduce the deformation amount of the glass substrate 20, but also ensure the uniformity of the overall film formation of the substrate 20, thereby improving the production efficiency and quality of coating.

[0058] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. For those skilled in the art, various modifications and variations can be made to the present utility model. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A coating device, characterized in that, Including: An evaporation chamber (100), an evaporation element (110) is arranged in the evaporation chamber (100), and the evaporation element (110) is used for performing an evaporation process on a substrate (20); An ALD chamber (200), a spraying element (210) is arranged in the ALD chamber (200), the ALD chamber (200) is connected to the evaporation chamber (100), and the spraying element (210) is used for performing an ALD process on the substrate (20); A material loading table (300), the material loading table (300) is used for carrying the substrate (20), the material loading table (300) is arranged vertically or obliquely, and the substrate (20) is attached to the material loading table (300); A first conveying element (410), the evaporation chamber (100) and the ALD chamber (200) are both provided with the first conveying element (410), and the first conveying element (410) is used for conveying the material loading table (300).

2. The coating device according to claim 1, wherein A driving element (120) is further arranged in the evaporation chamber (100), the driving element (120) is connected to the evaporation element (110), and the driving element (120) is used for driving the evaporation element (110) to move.

3. The coating device according to claim 1, wherein The spraying element (210) is arranged parallel to the material loading table (300).

4. The coating device according to any one of claims 1 to 3, characterized in that, The inclination angle of the material loading table (300) is 0° to 20°.

5. The coating device according to claim 1, characterized in that When the inclination angle of the material loading table (300) is greater than 0°, the evaporation element (110) or the spraying element (210) is arranged on the side where the material loading table (300) forms an acute angle with the horizontal plane.

6. The coating device according to claim 1, characterized in that, The coating device further includes a heating chamber (500), a first heating element (510) is arranged in the heating chamber (500), the heating chamber (500) is connected to the evaporation chamber (100), and the first heating element (510) is used for heating the substrate (20) to a first preset temperature for performing an evaporation process.

7. The coating device according to claim 1, characterized in that The coating device further includes a feeding chamber (610), the feeding chamber (610) is located on the side of the evaporation chamber (100) away from the ALD chamber (200), the feeding chamber (610) is provided with an adjusting device, and the adjusting device is used for evacuating the air after the substrate (20) enters the feeding chamber (610).

8. The coating device according to claim 1, characterized in that, The coating device further includes a discharging chamber (620), the discharging chamber (620) is connected to the ALD chamber (200), and the discharging chamber (620) is provided with an adjusting device.

9. The coating device according to claim 8, wherein The coating device further includes a feeding chamber (610), a connecting table (700), a second conveying member (420) and a loading and unloading member (900). The connecting table (700), the second conveying member (420) and the loading and unloading member (900) are arranged in sequence, and the loading and unloading member (900) is further connected to the feeding chamber (610), and the connecting table (700) is further connected to the discharging chamber (620). The second conveying member (420) is used to convey the material-carrying table (300) of the connecting table (700) to the loading and unloading member (900). The loading and unloading member (900) is used to unload and load the material-carrying table (300), and move the loaded material-carrying table (300) to the feeding chamber (610).

10. The coating device according to claim 1, characterized in that, The coating device further includes a transition chamber (800). The transition chamber (800) is provided with a second heating member (810). The transition chamber (800) is arranged between the evaporation coating chamber (100) and the ALD chamber (200). The second heating member (810) is used to heat the substrate (20) to a second preset temperature for performing the ALD process.