Spraying system and plate-type equipment

By designing the uniform arrangement of multi-stage buffer chambers and jet modules in plate-type equipment, the problem of uneven film formation of the spray system under large-area film formation is solved, and the uniform distribution of process gases and uniformity of film formation is achieved.

CN223087908UActive Publication Date: 2025-07-11SHANGHAI YUANLI XINCHEN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202421959377.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-13
Publication Date
2025-07-11
Estimated Expiration
2034-08-13

AI Technical Summary

Technical Problem

The spraying system of existing plate equipment cannot ensure uniformity of film formation under the demand for large-area film formation.

Method used

A spray system is designed, including a frame and a plurality of first jet modules. Each jet module is provided with multiple buffer chambers, which are connected in different directions. The process gas is evenly distributed in the jet module through the multi-stage buffer chamber design. The process gas is uniformly distributed in the jet module. The multiple jet modules are uniformly arranged in the first direction and the flow conductance difference of the multi-stage buffer chambers, so as to achieve uniform exhaust of the process gas.

Benefits of technology

Under the demand for large-area film formation, the uniform distribution of process gases and the uniformity of film formation are achieved, and the uniformity of film deposition is improved.

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Abstract

The utility model provides a spraying system and plate-type equipment, and relates to the technical field of semiconductor equipment. The spraying system comprises a frame and a plurality of first air spraying modules arranged on the frame, the first air spraying modules are evenly arranged at intervals in the first direction, each first air spraying module is internally provided with a plurality of first buffering cavities which are sequentially arranged, and the first buffering cavities are sequentially communicated; in the first direction, each first air injection module is provided with a first air inlet and a first air outlet, in the second direction, the first air inlets and the first air outlets communicate with the two first buffer cavities located at the two ends correspondingly, and the film forming uniformity can be well guaranteed.
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Description

Technical Field

[0001] This application relates to the technical field of semiconductor equipment, and more particularly, to a spray system, a spray system and a plate equipment. Background Art

[0002] The plate equipment, namely the plate reactor, is used in thin film deposition processes such as atomic layer deposition (ALD) and chemical vapor deposition (CVD). The plate-like structure in the equipment provides a uniform temperature distribution and gas distribution to facilitate the uniform deposition of the thin film.

[0003] Currently, the spray system of the plate equipment is formed by stacking multiple functional metal plates together. Under the demand for large-area film formation, it is difficult to ensure the uniformity of film formation. Summary of the Utility Model

[0004] The objectives of this application include, for example, providing a spray system that can better ensure the uniformity of film formation.

[0005] The objectives of this application also include providing a plate equipment that can better ensure the uniformity of film formation.

[0006] The embodiments of this application can be implemented as follows:

[0007] The embodiments of this application provide a spray system, which includes a frame and a plurality of first jet modules. The plurality of first jet modules are arranged on the frame, and the plurality of first jet modules are evenly spaced along a first direction. A plurality of first buffer chambers are arranged in each first jet module, and the plurality of first buffer chambers are arranged in sequence, and the plurality of first buffer chambers are communicated with each other in sequence. Each first jet module is provided with a first air inlet and a first air outlet. In a second direction, the first air inlet is communicated with the first buffer chamber at one end, and the first air outlet is communicated with the first buffer chamber at the other end; wherein, the second direction is the arrangement direction of the plurality of first buffer chambers, and the second direction is perpendicular to the first direction.

[0008] On the one hand, arranging the plurality of first jet modules evenly spaced along the first direction enables the uniform exhaust of process gas in the first direction; on the other hand, the plurality of first buffer chambers arranged in sequence along the second direction form a multi-stage first buffer chamber. The process gas entering the first jet module through the first air inlet flows through the multi-stage first buffer chambers in sequence. Since the conductance of the latter-stage first buffer chamber is smaller than that of the former-stage first buffer chamber, the process gas can be evenly distributed when it converges in the last-stage first buffer chamber, and has a high uniformity when discharged through the first air outlet located on the last-stage first buffer chamber, thus better ensuring the uniformity of film formation under the demand for large-area film formation.

[0009] The present application also provides a plate-type device, including the described spraying system, and the technical effect of this plate-type device is substantially the same as that of the described spraying system. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the accompanying drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present application and should not be regarded as limiting the scope. For those of ordinary skill in the art, other relevant drawings can be obtained based on these drawings without creative efforts.

[0011] Figure 1 Schematic diagram of the first spraying system in an optional embodiment;

[0012] Figure 2 Cross-sectional view of the first jetting module in the first optional embodiment;

[0013] Figure 3 Cross-sectional view of the first jetting module in the second optional embodiment;

[0014] Figure 4 Cross-sectional view of the first jetting module in the third optional embodiment;

[0015] Figure 5 Structural schematic diagram of the first jetting module in the first optional embodiment;

[0016] Figure 6 Structural schematic diagram of the first jetting module in the second optional embodiment;

[0017] Figure 7 Schematic diagram of the second spraying system in an optional embodiment;

[0018] Figure 8 Schematic diagram of the third spraying system in an optional embodiment;

[0019] Figure 9 Schematic diagram of the fourth spraying system in an optional embodiment.

[0020] Reference signs: 1 - frame; 2 - first jetting module; 21 - first buffer chamber; 22 - first air inlet; 23 - first air outlet; 24 - partition; 241 - through hole; 3 - air path; 4 - second jetting module; 5 - gas mixing unit. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will clearly and completely describe the technical solutions in the embodiments of this application with reference to the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are part of the embodiments of this application, rather than all of them. Components of the embodiments of this application usually described and illustrated in the accompanying drawings here can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of this application claimed, but merely represents selected embodiments of this application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of this application without creative efforts belong to the scope of protection of this application.

[0023] It should be noted that similar reference numerals and letters indicate similar items in the following drawings. Therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0024] In the description of this application, it should be noted that if terms such as "upper", "lower", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, or the orientations or positional relationships in which the inventive product is usually placed during use, it is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0025] In addition, terms such as "first", "second", etc. are only used for descriptive distinction and cannot be understood as indicating or implying relative importance.

[0026] It should be noted that, without conflict, the features in the embodiments of this application can be combined with each other.

[0027] The inventors of this application found that the current spray systems of plate-type ALD devices or plate-type CVD devices are formed by stacking multiple layers of functional metal plates into one body. The air inlets of the stacked multiple layers of functional metal plates are generally located in the middle of the metal plates, and the air outlets are distributed on the plate surfaces of the metal plates. Under the demand for large-area film formation, it is difficult to ensure the uniformity of film formation well. The embodiments of this application provide a spray system, which is at least used to solve the above technical problems.

[0028] Please refer to Figure 1 、 Figure 2, the spraying system provided by the embodiments of the present application includes a frame 1 and a plurality of first jet modules 2 arranged on the frame 1. The plurality of first jet modules 2 are evenly spaced along the first direction x. Each first jet module 2 is provided with a plurality of first buffer chambers 21 arranged in sequence. The plurality of first buffer chambers 21 are communicated with each other in sequence. Each first jet module 2 is provided with a first air inlet 22 and a first air outlet 23. In the second direction y, the first air inlet 22 and the first air outlet 23 are respectively communicated with two first buffer chambers 21 located at both ends; wherein, the second direction y is the arrangement direction of the plurality of first buffer chambers 21, and the second direction y is perpendicular to the first direction x.

[0029] The first jet module 2 is in the shape of a cuboid. The first direction x is the width direction of the first jet module 2, and the second direction y is the height direction of the first jet module 2; the first air inlet 22 on each first jet module 2 is used to introduce process gas, and the first air outlet 23 is used to discharge the process gas; in the second direction y, the first air inlet 22 is communicated with the first buffer chamber 21 at one end, and the first air outlet 23 is communicated with the first buffer chamber 21 at the other end.

[0030] The spraying system is provided with a plurality of first jet modules 2, and the plurality of first jet modules 2 are evenly spaced along the first direction x, so as to achieve uniform exhaust of the process gas in the first direction x; in addition, a plurality of first buffer chambers 21 arranged in sequence in the second direction y form a multi-stage first buffer chamber 21. The process gas entering the first jet module 2 through the first air inlet 22 flows through the multi-stage first buffer chamber 21 in sequence, and the conductance of the latter first buffer chamber 21 is smaller than that of the former first buffer chamber 21. Furthermore, the process gas can be more evenly distributed in the last first buffer chamber 21 and discharged through the first air outlet 23, so as to achieve uniform exhaust of the process gas in the length direction of the first jet module 2, and better ensure the uniformity of film formation under the demand of large-area film formation.

[0031] In an alternative embodiment, each first jet module 2 is provided with a plurality of partitions 24 arranged in sequence. The plurality of partitions 24 divide the interior of the first jet module 2 into a plurality of first buffer chambers 21. Each partition 24 is provided with a through hole 241; the number of the first air outlets 23 on each first jet module 2 is multiple, and the multiple first air outlets 23 are evenly spaced along the third direction z on the first jet module 2, wherein, the third direction z is the length direction of the first jet module 2.

[0032] Each partition 24 divides two adjacent first buffer chambers 21. The through holes 241 formed in each partition 24 communicate with two adjacent first buffer chambers 21. The through holes 241 can be elongated holes, and the extending direction of the elongated holes is consistent with the length direction of the first jet module 2. Alternatively, the through holes 241 can be round holes or square holes, and the number of round holes or square holes is multiple. The multiple round holes or square holes are evenly spaced along the third direction z. It can be understood that the shape of the through holes 241 can be determined according to the actual working conditions and is not limited thereto.

[0033] Multiple first air outlets 23 are all communicated with the last-stage first buffer chamber 21. The multiple first air outlets 23 are evenly spaced along the third direction z, which can further ensure the uniform exhaust of the process gas in the third direction z.

[0034] Please refer to Figure 3 , in an alternative embodiment, in the first direction x, each partition 24 has a first end and a second end. The through holes 241 formed in one of the partitions 24 are located at the first end of the partition 24, and the through holes 241 formed in the other partition 24 adjacent to the partition 24 are located at the second end of the partition 24.

[0035] The first direction x is also the width direction of the first jet module 2. For two adjacent partitions 24, in the first direction x, the through holes 241 formed in one of the partitions 24 are located at the first end of the partition 24, and the through holes 241 formed in the other partition 24 are located at the second end of the partition 24. This makes the flow distance of the process gas longer during the process of the process gas flowing between two adjacent first buffer chambers 21, which is more conducive to achieving the purpose of buffering and uniform air outlet.

[0036] Please refer to Figure 4 , in another alternative embodiment, in the first direction x, through holes 241 are formed at both ends of one of the partitions 24, and the through holes 241 formed in the other partition 24 adjacent to the partition 24 are located in the middle of the partition 24.

[0037] For two adjacent partitions 24, in the first direction x, through holes 241 are formed at both ends of one of the partitions 24, and the through holes 241 formed in the other partition 24 are located in the middle of the partition 24. The process gas flowing into the next-stage first buffer chamber 21 from the through holes 241 located at both ends of the partition 24 will continue to flow into the next-stage first buffer chamber 21 through the through holes 241 located in the middle of the partition 24, and the process gas flowing into the next-stage first buffer chamber 21 from the through holes 241 located in the middle of the partition 24 will flow into the next-stage first buffer chamber 21 through the through holes 241 located at both ends of the partition 24. In the above process, the process gas will be buffered in the first buffer chamber 21, and then the process gas converging in the last-stage first buffer chamber 21 will be evenly distributed.

[0038] Of course, it can be understood that the opening position of the through hole 241 on the partition plate 24 is not limited to the above manner, as long as it can increase the flow distance of the process gas and is conducive to achieving the purposes of buffering and uniform gas outlet.

[0039] Please refer to Figure 5 、 Figure 6 In an alternative embodiment, the number of the first air inlets 22 on each first jet module 2 is two, and the two first air inlets 22 are arranged on both sides of the first jet module 2 along the third direction z; alternatively, the number of the first air inlets 22 on each first jet module 2 is multiple, and the multiple first air inlets 22 are evenly spaced along the third direction z on the first jet module 2.

[0040] Both of the two first air inlets 22 are communicated with the first-stage first buffer chamber 21. Of course, the number of the first air inlets 22 can also be an even number such as four, six, etc. For example, when the number of the first air inlets 22 is four, two first air inlets 22 are arranged on one side of the first jet module 2 in the third direction z.

[0041] When the number of the first air inlets 22 is multiple and the multiple first air inlets 22 are evenly spaced along the third direction z on the first jet module 2, the number of the first air inlets 22 is not limited. At this time, the first air inlets 22 and the first air outlets 23 are respectively arranged on two opposite surfaces of the first jet module 2 along the second direction y, and the multiple first air inlets 22 are all communicated with the first-stage first buffer chamber 21.

[0042] Whether the first air inlets 22 are arranged on both sides of the first jet module 2 or on the surface of the first jet module 2 opposite to the first air outlets 23, the process gas can be more quickly evenly distributed when passing into the first jet module 2 compared with the method of only arranging one air inlet.

[0043] Please continue to refer to Figure 1 In an alternative embodiment, the spraying system includes an air path 3. The air path 3 at least includes a first air path and a second air path. The first air path is used to introduce a first process gas, and the second air path is used to introduce a second process gas. The first air path is communicated with some of the first jet modules 2, and the second air path is communicated with some of the first jet modules 2.

[0044] The first air path and the second air path are respectively used to introduce the first process gas and the second process gas. The first process gas and the second process gas are two different process gases. All the first jet modules 2 communicated with the first air path are used to uniformly discharge the first process gas, and all the first jet modules 2 communicated with the second air path are used to uniformly discharge the second process gas.

[0045] Exemplarily, when the number of gas paths 3 is three, the gas path 3 includes a first gas path, a second gas path, and a third gas path. The first gas path, the second gas path, and the third gas path are respectively an oxygen source gas path, a nitrogen source gas path, and a metal source gas path. The oxygen source gas path, the nitrogen source gas path, and the metal source gas path are respectively used to introduce oxygen, nitrogen, and metal source gas. All parts of the first jet module 2 connected to the oxygen source gas path are used to uniformly discharge oxygen. All parts of the first jet module 2 connected to the nitrogen source gas path are used to uniformly discharge nitrogen. All parts of the first jet module 2 connected to the metal source gas path are used to uniformly discharge metal source gas. The direct connection mode of the first gas path, the second gas path, or the third gas path to the jet module is applicable to plate-type ALD equipment.

[0046] It can be understood that the number of gas paths can be determined according to the number of types of process gases to be introduced. For example, when four process gases need to be introduced, the number of gas paths is four, and the four gas paths respectively introduce four process gases.

[0047] In other embodiments, the nitrogen source gas path can be replaced with other inert gas paths. For example, the nitrogen source gas path is replaced with an argon source gas path, and the argon source gas path is used to introduce argon.

[0048] Please refer to Figure 7 , in another alternative embodiment, the spray system includes a gas mixing unit 5 and a gas path 3. The gas path 3 includes at least a first gas path and a second gas path. The first gas path is used to introduce a first process gas, and the second gas path is used to introduce a second process gas. The first gas path and the second gas path are both connected to the gas mixing unit 5, and the gas mixing unit 5 is simultaneously connected to a plurality of first jet modules 2.

[0049] The spray system provided with the gas mixing unit 5 is applicable to plate-type CVD equipment. The gas mixing unit 5 mixes the process gases in the first gas path and the second gas path and then introduces them into a plurality of first jet modules 2.

[0050] Exemplarily, the first gas path and the second gas path are respectively used to introduce ammonia gas and silane gas. The first gas path and the second gas path are respectively connected to the gas mixing unit 5. The gas mixing unit 5 mixes ammonia gas and silane gas and then introduces them into a plurality of first jet modules 2. At this time, the gas flowing in any first jet module 2 is a mixed gas of ammonia gas and silane gas. After the mixed gas is sent into the cavity of the plate-type equipment by the spray system, a SiNx film layer is formed under the excitation conditions such as radio frequency and microwave.

[0051] Or, the first gas path is used to introduce silane gas, and the second gas path is used to introduce phosphine gas or diborane gas. The gas mixing unit 5 mixes silane gas and phosphine gas or diborane gas and then introduces them into a plurality of first jet modules 2. After the mixed gas is sent into the cavity of the plate-type equipment by the spray system, a polysilicon or microcrystalline silicon film layer is formed under the excitation conditions such as radio frequency and microwave.

[0052] It can be understood that when only one process gas needs to be introduced, only one gas path is set; when more than three process gases need to be introduced, the corresponding number of gas paths is set.

[0053] Please refer to Figure 8 、 Figure 9 In an alternative embodiment, to meet the film forming requirements for a larger area, the spraying system further includes a plurality of second jet modules 4. The plurality of second jet modules 4 are arranged at intervals along a third direction z. Each second jet module 4 is provided with a second air inlet and a plurality of second air outlets. The plurality of second air outlets on each second jet module 4 are in one-to-one communication with the first air inlets 22 on the plurality of first jet modules 2, so that the second jet module 4 is fixed on the first jet module 2. Herein, the third direction z is the length direction of the first jet module 2.

[0054] One of the second air outlets is in communication with one of the first air inlets 22 on a single first jet module 2.

[0055] The plurality of second jet modules 4 are arranged along the third direction z. The second jet module 4 is in the shape of a cuboid, and the length direction of the second jet module 4 is the first direction x. The second jet module 4 is used to supply gas to the first jet module 2. A plurality of second buffer chambers arranged in sequence are provided inside the second jet module 4. The plurality of second buffer chambers are in communication with each other in sequence. Each second jet module 4 is provided with a second air inlet and a second air outlet. In the arrangement direction of the plurality of second buffer chambers, the second air inlet and the second air outlet are respectively in communication with two second buffer chambers located at both ends.

[0056] The setting manner of the second air inlet of the second jet module 4 is substantially the same as the setting manner of the first air inlet 22 of the first jet module 2. The number of second air inlets on each second jet module 4 is two, and the two second air inlets are arranged on both sides of the second jet module 4 along the first direction x.

[0057] Both of the two second air inlets are in communication with the first-stage second buffer chamber. Of course, the number of second air inlets can also be an even number such as four, six, etc. For example, when the number of second air inlets is four, two second air inlets are arranged on one side of the second jet module 4 in the first direction x.

[0058] Of course, in another embodiment, the number of second air inlets on each second jet module 4 can also be multiple, and the multiple second air inlets are evenly arranged at intervals on the second jet module 4 along the first direction x.

[0059] When the number of the second air inlets is multiple and the multiple second air inlets are arranged on the second jet module 4 at uniform intervals along the first direction x, the number of the second air inlets is not limited. At this time, the second air inlets and the second air outlets are respectively arranged on two opposite surfaces of the second jet module 4 along its height direction, and the multiple second air inlets are all communicated with the first-stage second buffer chamber.

[0060] When the number of the gas paths 3 is multiple, for example, the gas path 3 includes a first gas path, a second gas path and a third gas path, and the gas mixing unit 5 is not provided, the first gas path, the second gas path and the third gas path respectively communicate with multiple second jet modules 4, and the first gas path, the second gas path or the third gas path is communicated with multiple second air inlets of a single second jet module 4.

[0061] The setting mode of the second air outlet of the second jet module 4 is the same as that of the first air outlet 23 of the first jet module 2. The number of the second air outlets on each second jet module 4 is multiple. The multiple second air outlets are arranged on the second jet module 4 at uniform intervals along the first direction x. The multiple second air outlets are all communicated with the last-stage second buffer chamber. The multiple second air outlets of a single second jet module 4 are respectively communicated with multiple first air inlets 22 located on the same straight line of multiple first jet modules 2, so as to play the role of the second jet module 4 supplying gas to the first jet module 2.

[0062] When process gas flows through the gas path 3, the process gas will first enter the second jet module 4. After being buffered by multiple second buffer chambers in the second jet module 4, the gas distribution is made uniform in the first direction x. The process gas buffered by the multiple second buffer chambers then enters the first jet module 2. After being buffered by multiple first buffer chambers 21 in the first jet module 2, the gas distribution is made uniform in the third direction z, so as to ensure better uniformity when the process gas is discharged.

[0063] The multiple second jet modules 4 communicated with the same gas path are arranged at uniform intervals in the third direction z, so that the multiple second jet modules 4 supply gas to the first jet module 2 uniformly, and the first air outlet 23 of the first jet module 2 is arranged on the side facing away from the second jet module 4.

[0064] When the number of the gas paths 3 is multiple, for example, the gas path 3 includes a first gas path, a second gas path and a third gas path, and the gas mixing unit 5 is provided, the first gas path, the second gas path and the third gas path are respectively communicated with the gas mixing unit 5, and the gas mixing unit 5 is simultaneously communicated with multiple second jet modules 4. At this time, the gas introduced into any second jet module 4 is mixed gas.

[0065] The technical effects of the spray system provided by the embodiments of the present application at least include: multiple first jet modules 2 are arranged at equal intervals along the first direction x, so as to achieve uniform exhaust of process gas in the first direction x; a multi-stage buffer chamber is provided to buffer the process gas and make the process gas evenly distributed in the jet module, thereby achieving uniform exhaust; by limiting the positions of the through holes 241 on the partition plate 24, the flow distance of the process gas is longer during the process of flowing between two adjacent buffer chambers, which is more conducive to achieving the purpose of buffering and uniform gas outlet; by stacking the second jet module 4 on the first jet module 2, it is possible to ensure better uniformity of the process gas in both the first direction x and the third direction z.

[0066] The embodiments of the present application also provide a plate-type device, including a cavity and the above-mentioned spray system, and the spray system is arranged in the cavity. The technical effects of this plate-type device are roughly the same as those of the above-mentioned spray system, and will not be elaborated here.

[0067] In summary, the embodiments of the present application provide a spray system and a plate-type device. Multiple first jet modules 2 are arranged at equal intervals, so as to achieve uniform exhaust of process gas in the first direction x. In addition, multiple sequentially arranged first buffer chambers 21 form a multi-stage first buffer chamber 21. The process gas entering the first jet module 2 through the first air inlet 22 flows sequentially in the multi-stage first buffer chamber 21. Since the flow conductance of the latter-stage first buffer chamber 21 is smaller than that of the former-stage first buffer chamber 21, the process gas can be more evenly distributed in the last-stage first buffer chamber 21 and discharged through multiple first air outlets 23, so as to achieve uniform exhaust of the process gas in the third direction z and better ensure the uniformity of film formation under the demand for large-area film formation. In order to meet the demand for larger-area film formation, the second jet module 4 is stacked on the first jet module 2. The second jet module 4 can supply gas to the first jet module 2. Since the second jet module 4 is perpendicular to the first jet module 2, the process gas can be evenly distributed in the first direction x first when flowing through the second jet module 4, and then enter the first jet module 2 and be evenly distributed in the third direction z, further improving the uniformity of the distribution of the process gas.

[0068] The above is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed by the present application should be covered by the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A spraying system, characterized in that, It includes a frame (1) and a plurality of first jet modules (2) arranged on the frame (1). The plurality of first jet modules (2) are arranged at equal intervals along a first direction. Each first jet module (2) is provided with a plurality of first buffer chambers (21) arranged in sequence. The plurality of first buffer chambers (21) are communicated with each other in sequence. Each first jet module (2) is provided with a first air inlet (22) and a first air outlet (23). In a second direction, the first air inlet (22) and the first air outlet (23) are respectively communicated with two first buffer chambers (21) located at both ends. Wherein, the second direction is the arrangement direction of the plurality of first buffer chambers (21), and the second direction is perpendicular to the first direction.

2. The spray system according to claim 1, wherein, Each first jet module (2) is provided with a plurality of partitions (24) arranged in sequence. The plurality of partitions (24) divide the interior of the first jet module (2) into a plurality of first buffer chambers (21). Each partition (24) is provided with a through hole (241). The number of the first air outlets (23) on each first jet module (2) is multiple. The multiple first air outlets (23) are arranged at equal intervals along a third direction on the first jet module (2). Wherein, the third direction is the length direction of the first jet module (2).

3. The spray system according to claim 2, wherein In the first direction, each partition (24) has a first end and a second end. The through hole (241) opened on one of the partitions (24) is located at the first end of the partition (24), and the through hole (241) opened on another partition (24) adjacent to the partition (24) is located at the second end of the partition (24).

4. The spray system according to claim 2, wherein In the first direction, through holes (241) are opened at both ends of one of the partitions (24), and the through hole (241) opened on another partition (24) adjacent to the partition (24) is located in the middle of the partition (24).

5. The spray system according to claim 1, characterized in that, The number of the first air inlets (22) on each first jet module (2) is two. The two first air inlets (22) are arranged on both sides of the first jet module (2) along the third direction. Or, the number of the first air inlets (22) on each first jet module (2) is multiple. The multiple first air inlets (22) are arranged at equal intervals along the third direction on the first jet module (2). Wherein, the third direction is the length direction of the first jet module (2).

6. The spray system according to claim 1, characterized in that, The spraying system includes a plurality of second jet modules (4). The plurality of second jet modules (4) are arranged at intervals along the third direction. Each second jet module (4) is provided with a second air inlet and a plurality of second air outlets. The plurality of second air outlets on each second jet module (4) are communicated with the first air inlets (22) on the plurality of first jet modules (2). Wherein, the third direction is the length direction of the first jet module (2).

7. The spray system according to any one of claims 1-6, characterized in that, The spray system includes a gas path (3), and the gas path (3) includes at least a first gas path and a second gas path. The first gas path is used for introducing a first process gas, and the second gas path is used for introducing a second process gas. The first gas path is communicated with part of the first jetting module (2), and the second gas path is communicated with part of the first jetting module (2). Alternatively, the spray system includes a gas mixing unit (5) and a gas path (3). The gas path (3) includes at least a first gas path and a second gas path. The first gas path is used for introducing a first process gas, and the second gas path is used for introducing a second process gas. Both the first gas path and the second gas path are communicated with the gas mixing unit (5), and the gas mixing unit (5) is simultaneously communicated with a plurality of the first jetting modules (2).

8. A plate-type device, characterized in that, including the spray system according to any one of claims 1-7.