Cooling system based on phase change heat transfer and stage lamp with cooling system

Abstract

The utility model discloses a cooling system based on phase change heat transfer and a stage lamp with the cooling system, and the cooling system based on phase change heat transfer comprises a heat absorption substrate which is tightly attached to a heat source and absorbs heat of the heat source, and a heat release substrate which is sealed with the heat absorption substrate to form a phase change cavity, the inner side face of the heat absorption substrate and the inner side face of the heat release substrate jointly separate the phase change cavity to form a first cavity, the cooling system further comprises a phase change working medium located in the first cavity, and a radiator connected to one side face of the heat release substrate and used for dissipating heat; a plurality of microstructures are arranged on the inner side wall of the first cavity, at least part of the microstructures are immersed in the phase change working medium, and heat absorbed by the heat absorption substrate is transferred to the heat release substrate through mutual cooperation of the microstructures and the phase change working medium and finally dissipated through the radiator. The phase change working medium absorbs heat of the microstructures and then is subjected to phase change vaporization, heat transfer is conducted again when the phase change working medium makes contact with the low-temperature inner side wall, liquid is formed through liquefaction, and backflow is conducted again for circulation.

Description

Technical Field

[0001] The utility model relates to the technical field of stage lights, and more specifically, to a cooling system based on phase change heat transfer and a stage light having the same. Background Art

[0002] In order to meet the requirements of multi-function and high brightness of stage lights, the power of the lamps is gradually increasing. At the same time, the pursuit of lightweight lamps in the market has led to the extreme compression of the internal cavity of the lamp body, and the structure is more compact, resulting in more difficult heat dissipation during the operation of the lamp. If the inside of the lamp body cannot be effectively cooled, it will accelerate the aging of the chip, affect the luminous intensity and light conversion efficiency, and even may cause the soldering tin to melt, thus leading to product failure. Especially nowadays, the light source power mostly adopted in the market has also increased. As one of the main heat sources of the lamp, in order to effectively control its temperature during the working state, the mainstream air-cooled heat dissipation method is to achieve it by increasing the fan and the volume of the fins, and this method does not conform to the requirement of lightweight.

[0003] At the same time, the heat conduction ability of the traditional air-cooled radiator is limited and it is difficult to meet the heat dissipation requirements of lamps with higher power. However, replacing it with a copper plate or a VC heat pipe radiator will inevitably increase the weight and cost. Therefore, while ensuring high heat dissipation ability, exploring a lighter and more economical heat dissipation structure has high research and development value. Summary of the Utility Model

[0004] The utility model aims to overcome at least one of the above-mentioned defects in the prior art, and provides a cooling system based on phase change heat transfer and a stage light having the same, so as to solve the problems that the existing stage light radiator has a large volume, heavy mass, and is difficult to quickly dissipate heat for high-power devices.

[0005] To solve the above technical problems, the technical solution adopted by the utility model is: a cooling system based on phase change heat transfer and a stage light having the same. Among them, a cooling system based on phase change heat transfer includes a heat absorption substrate for closely contacting with a heat source and absorbing its heat, and a heat dissipation substrate that forms a phase change cavity in a sealed manner with the heat absorption substrate. The inner side surface of the heat absorption substrate and the inner side surface of the heat dissipation substrate jointly divide the phase change cavity to form a first cavity. The cooling system further includes a phase change working medium located in the first cavity, and a radiator connected to one side surface of the heat absorption substrate and used for dissipating heat. The inner side wall of the first cavity is provided with a plurality of microstructures, and at least part of the microstructures are immersed in the phase change working medium. Through the mutual cooperation of the microstructures and the phase change working medium, the heat absorbed by the heat absorption substrate is transferred to the heat dissipation substrate, and finally dissipated through the radiator.

[0006] During the operation of the cooling system, the microstructures make the inner wall surface of the first cavity rough enough. On the one hand, it greatly increases the effective heat transfer area and promotes the formation of more vaporization nuclei. On the other hand, it reduces the local pressure, and the boiling point of the phase change working fluid also decreases accordingly, making it easier to vaporize. Compared with a smooth surface, when the phase change working fluid evaporates, the microstructured surface can better control the fluctuation of the liquid, and the influence of surface tension on the stability of small bubbles is reduced, thereby increasing the generation and shedding frequency of bubbles. When the heat absorption substrate contacts the heat source surface to absorb heat and transfer the heat to several of the microstructures, the phase change working fluid absorbs the heat of the microstructures and then vaporizes by phase change. The gaseous phase change working fluid quickly diffuses in the phase change cavity. When it contacts the inner wall with a lower temperature, it conducts heat transfer again, releases heat, and liquefies to form a working fluid in a liquid state, and then flows back to the first cavity again to achieve an effective cycle. Compared with the existing air-cooled heat dissipation method, while ensuring good heat dissipation efficiency, it also achieves the effect of effective noise reduction.

[0007] Further, a plurality of support columns are arranged in the first cavity to simultaneously abut against the heat absorption substrate and the heat dissipation substrate. The arrangement of the support columns provides sufficient supporting force to prevent the heat absorption substrate or the heat dissipation substrate from collapsing into the first cavity or bulging outward; at the same time, it can also increase the heat exchange area and further improve the heat dissipation efficiency.

[0008] Further, a capillary ring is wrapped around the periphery of the support column. The arrangement of the capillary ring can guide the liquid phase change working fluid to the microstructures and make full contact with them, which can overcome the problem that the liquid phase change working fluid is always located at the bottom due to gravity and cannot contact the microstructures, and accelerates the phase change cycle of the phase change working fluid.

[0009] Further, the material of the heat absorption substrate and / or the heat dissipation substrate is an aluminum-based material. Compared with the commonly used copper-based materials, the aluminum-based material can effectively reduce the weight and cost of the entire cooling system.

[0010] Further, a plurality of diversion channels communicating with the first cavity are arranged between the heat absorption substrate and the heat dissipation substrate, and each of the diversion channels forms a second cavity in the phase change cavity. Increasing the volume of the phase change cavity can fill more of the phase change working fluid. At the same time, the inner wall of each of the diversion channels greatly increases the heat exchange area, and as the direction away from the first cavity, the temperature of the inner wall of the diversion channel gradually decreases. When the phase change working fluid absorbs heat and vaporizes, part of it enters the diversion channel for heat transfer, further equalizing the surface temperature of the heat absorption substrate and the heat dissipation substrate and improving the heat transfer speed.

[0011] Further, in a direction away from the first cavity, the width of the diversion channel gradually increases. When the heat absorption substrate is placed horizontally, the gradually widening diversion channel provides a corresponding phase change space above the liquid level of the phase change working fluid.

[0012] Further, the ratio of the width of the end of the diversion channel close to the first cavity to the width of its other end is between 1:2 and 1:7.

[0013] Further, in a direction away from the first cavity, the bottom of the diversion channel gradually moves away from the heat release substrate. When the heat absorption substrate is placed horizontally and is located above in the direction of gravity, part of the gaseous phase change working fluid diffuses to the end of the diversion channel away from the first cavity. When it releases heat and re - forms into a liquid state, the sloped bottom of the diversion channel can effectively guide the liquid phase change working fluid back to the first cavity to form a cycle.

[0014] Further, the first cavity is located at the center of the heat absorption substrate, and a plurality of the diversion channels are radially connected to the first cavity. Such an arrangement can provide more diversion channels and effectively equalize the temperature of the heat absorption substrate or the heat release substrate, avoiding the situation of excessive heat concentration.

[0015] Further, the diversion channel is of a Tesla valve structure, and further includes an annular groove and a plurality of shunt grooves communicating with the outer circumference of the annular groove. The annular groove simultaneously communicates with the ends of each diversion channel away from the first cavity, and the phase change working fluid flows back to the first cavity through the Tesla valve after liquefying in the annular groove and / or the shunt grooves. Utilizing the unidirectional flow guiding characteristic of the Tesla valve structure, the liquefied phase change working fluid can be effectively guided back to the first cavity.

[0016] Further, the liquid filling rate inside the phase change cavity is a, and the range of a is: 40% < a < 85%. With such a ratio setting, when the heat absorption substrate is placed in different directions, at least part of the microstructures can be immersed in the phase change working fluid, reducing the probability of significant reduction in heat transfer efficiency caused by dry burning inside the first cavity.

[0017] Further, the inner sidewall of the first cavity provided with the microstructures protrudes towards the inside of the first cavity. With such a setting, more of the microstructures are in full contact with the liquid phase change working fluid.

[0018] Further, the microstructures are vaporization holes and / or grooves formed by the inner surface of the heat absorption substrate being recessed. The fine grooves and the plurality of vaporization hole structures contribute to the capillary action of the liquid, making it easier for the liquid phase change working medium to be redistributed and cover the inner wall surface of the heat absorption substrate, and facilitating the rapid replenishment of the liquid after the local vaporization of the phase change working medium, maintaining continuous boiling, and avoiding dry burning inside the first cavity.

[0019] Further, the microstructures are a number of abutting columns arranged in a dot matrix, and the abutting columns simultaneously abut the heat absorption substrate and the heat dissipation substrate. This simplifies the processing technology and provides sufficient supporting force. In addition, the supporting columns arranged in a dot matrix have better heat dissipation effect due to having a larger condensation space.

[0020] Further, the phase change working medium is an organic working medium. This type of phase change working medium is compatible with most metal materials and has a good heat transfer effect.

[0021] Further, the radiator includes a number of fins tightly connected to the heat dissipation substrate. The fins not only provide a large heat exchange surface, but also form air ducts between adjacent fins, which can orderly guide the air flow and improve the heat dissipation efficiency.

[0022] The present utility model also provides a stage light, which includes a lamp head having a light outlet, having any one of the foregoing cooling systems, the heat source includes a light source, the light source is disposed close to the heat absorption substrate, and both the light source and the cooling system are located at one end of the lamp head away from the light outlet. The heat of the stage light mainly comes from the light source. By effectively dissipating the heat of the light source using the cooling system, the light source can work at a suitable temperature, increasing its service life. Description of the Drawings

[0023] Figure 1 is an exploded structural schematic diagram of the heat absorption substrate and the heat dissipation substrate of the present utility model.

[0024] Figure 2 is Figure 1 a partial enlarged structural schematic diagram of part A in

[0025] Figure 3 a structural schematic diagram of the inner side surface of the heat absorption substrate and a sectional structural schematic diagram along B-B'.

[0026] Figure 4 is an internal structural schematic diagram when the heat source is located above and below along the gravity direction.

[0027] Figure 5 is an internal structural schematic diagram when the heat absorption substrate is vertically installed.

[0028] Figure 6 It is a schematic assembly structure diagram of the cooling system described in the present utility model.

[0029] Figure 7 It is a schematic inner structure diagram of the heat absorption substrate when the diversion channel is in the Tesla valve structure in the second embodiment of the present utility model.

[0030] Figure 8 It is a schematic inner structure diagram of the heat absorption substrate when the microstructures are the abutting columns arranged in a dot matrix in the third embodiment of the present utility model.

[0031] Figure 9 It is a schematic structure diagram of a stage light equipped with the cooling system described in the present utility model.

[0032] In the figure:

[0033] 100, cooling system; 200, heat absorption substrate; 210, microstructures; 220, support columns; 230, diversion channel; 231, bottom; 240, annular groove; 250, shunt groove; 260, abutting columns; 300, heat release substrate; 400, phase change cavity; 410, first cavity; 420, second cavity; 500, phase change working fluid liquid level line; 600, radiator; 610, fins; 620, fan; 700, lamp head; 710, light source; 720, effect module; 730, chassis; 740, support arm; 750, light outlet; 800, heat source. Specific embodiments

[0034] The accompanying drawings are only for illustrative purposes and should not be construed as a limitation of this patent; for better illustrating this embodiment, some components in the accompanying drawings will be omitted, enlarged or reduced, which do not represent the dimensions of the actual product; for those skilled in the art, it is understandable that some well-known structures and their descriptions in the accompanying drawings may be omitted. The positional relationships described in the accompanying drawings are only for illustrative purposes and should not be construed as a limitation of this patent.

[0035] Such as Figure 1 , Figure 2 and Figure 6As shown, a cooling system 100 based on phase change heat transfer and a stage light having the same. Among them, a cooling system 100 based on phase change heat transfer includes a heat absorption substrate 200 for closely contacting with a heat source 800 and absorbing its heat, and a heat release substrate 300 that forms a phase change cavity 400 in a sealed manner with the heat absorption substrate 200. The inner side surface of the heat absorption substrate 200 and the inner side surface of the heat release substrate 300 jointly divide the phase change cavity 400 to form a first cavity 410. The cooling system 100 further includes a phase change working fluid 500 located in the first cavity 410, and a radiator 600 connected to one side surface of the heat absorption substrate 200 and used for dissipating heat. A plurality of microstructures 210 are provided on the inner side wall of the first cavity 410, and at least part of the microstructures 210 are immersed in the phase change working fluid 500. Through the mutual cooperation of the microstructures 210 and the phase change working fluid 500, the heat absorbed by the heat absorption substrate 200 is transferred to the heat release substrate 300, and finally dissipated through the radiator 600.

[0036] During the operation of the cooling system 100, the microstructures 210 make the inner side wall surface of the first cavity 410 rough enough. On the one hand, it greatly increases the effective heat transfer area and promotes the formation of more vaporization nuclei. On the other hand, it reduces the local pressure, and the boiling point of the phase change working fluid 500 also decreases accordingly, making it easier to vaporize. Compared with a smooth surface, when the phase change working fluid 500 evaporates, the surface of the microstructures 210 can better control the fluctuation of the liquid, and the influence of surface tension on the stability of small bubbles is reduced, thereby increasing the generation and shedding frequency of bubbles. When the heat absorption substrate 200 is in surface contact with the heat source 800 to absorb heat and transfer the heat to a plurality of the microstructures 210, the phase change working fluid 500 absorbs the heat of the microstructures 210 and then vaporizes by phase change. The gaseous phase change working fluid 500 rapidly diffuses in the phase change cavity 400. When it contacts the inner side wall with a lower temperature, it conducts heat transfer again, releases heat, and liquefies to form a working fluid in a liquid state, and then flows back to the first cavity 410 again to achieve an effective cycle. Compared with the existing air-cooled heat dissipation method, while ensuring good heat dissipation efficiency, it also achieves the effect of effective noise reduction.

[0037] Preferably, the inner side surface of the first cavity 410 forms a rough surface, which can play a role in strengthening boiling. The microstructures 210 can be selected by material removal methods, such as sandblasting and etching, etc.; or additive methods can also be selected, such as welding or sintering a layer of porous materials on the original smooth surface, such as capillary nets and metal foams, etc.

[0038] Preferably, both the heat-absorbing substrate 200 and the heat-releasing substrate 300 are made of an aluminum-based material. The microstructures 210 are disposed on the inner side surface of the heat-absorbing substrate 200. The heat-absorbing substrate 200 is recessed to form the first cavity 410. At the same time, in order to enable the phase change working fluid 500 to contact the microstructures 210 as much as possible, the part having the microstructures 210 protrudes into the first cavity 410; while the heat-releasing substrate 300 is a plate body with a uniform thickness and is welded to the heat-absorbing substrate 200 by means of brazing, diffusion welding, soldering, laser welding or the like.

[0039] Preferably, after the heat-absorbing substrate 200 and the heat-releasing substrate 300 are hermetically connected, a liquid filling port is reserved. After changing the internal pressure of the first cavity 410 to a certain value, the phase change working fluid 500 is then filled into the interior, and finally the liquid filling port is sealed.

[0040] In a preferred embodiment of the present invention, a plurality of support columns 220 that simultaneously abut against the heat-absorbing substrate 200 and the heat-releasing substrate 300 are disposed in the first cavity 410. The provision of the support columns 220 provides sufficient support force to prevent the heat-absorbing substrate 200 or the heat-releasing substrate 300 from collapsing into the first cavity 410 or bulging outward; at the same time, the heat transfer area can also be increased to further improve the heat dissipation efficiency.

[0041] Preferably, the support columns 220 and the heat-absorbing substrate 200 are integrally formed.

[0042] In a preferred embodiment of the present invention, a capillary ring is disposed around the support columns 220. The provision of the capillary ring can guide the liquid phase change working fluid 500 to the microstructures 210 and make full contact therewith, and can overcome the problem that the liquid phase change working fluid 500 is always located at the bottom 231 due to gravity and cannot contact the microstructures 210, thereby accelerating the phase change cycle of the phase change working fluid 500.

[0043] Preferably, the capillary ring is a ring-shaped capillary structure that is wrapped around the support columns 220 and can be formed of a powder-like or net-like structure.

[0044] In a preferred embodiment of the present invention, the material of the heat-absorbing substrate 200 and / or the heat-releasing substrate 300 is an aluminum-based material. Compared with the commonly used copper-based materials, the aluminum-based material can effectively reduce the weight and cost of the entire cooling system 100. Preferably, a pure aluminum material or an aluminum alloy material can be selected.

[0045] Preferably, due to the processing technology of the aluminum-based material, when both the endothermic substrate 200 and the exothermic substrate 300 are made of aluminum-based materials, the microstructures 210 are array grooves or porous structures formed by laser etching or sandblasting on the inner side of the endothermic substrate 200.

[0046] As Figures 1 to 5 shown, in a preferred embodiment of the present invention, a plurality of flow guide channels 230 communicating with the first cavity 410 are provided between the endothermic substrate 200 and the exothermic substrate 300, and each of the flow guide channels 230 forms a second cavity 420 in the phase change cavity 400. Increasing the volume of the phase change cavity 400 can fill more of the phase change working fluid 500. At the same time, the inner side walls of the flow guide channels 230 greatly increase the heat transfer area, and as the direction away from the first cavity 410, the temperature of the inner side walls of the flow guide channels 230 gradually decreases. When the phase change working fluid 500 absorbs heat and vaporizes, part of it enters the flow guide channels 230 for heat transfer, further equalizing the surface temperatures of the endothermic substrate 200 and the exothermic substrate 300 and improving the heat transfer speed.

[0047] Preferably, the flow guide channels 230 can be made by processes such as machining, chemical etching, plasma etching, laser etching, etc. These processes are convenient for parameter adjustment and have lower costs.

[0048] In a preferred embodiment of the present invention, along the direction away from the first cavity 410, the width of the flow guide channels 230 gradually increases. When the endothermic substrate 200 is placed horizontally, the gradually widening flow guide channels 230 still have a corresponding phase change space above the liquid level of the phase change working fluid 500.

[0049] In a preferred embodiment of the present invention, the ratio of the width of the flow guide channels 230 at one end close to the first cavity 410 to the width at the other end is between 1:2 and 1:7. Preferably, the ratio of the two is 1:5.

[0050] As Figure 1 、 Figure 4 and Figure 5 shown, in a preferred embodiment of the present invention, along the direction away from the first cavity 410, the bottom 231 of the flow guide channels 230 gradually moves away from the exothermic substrate 300. As Figure 4As shown in the upper figure above, when the heat absorption substrate 200 is placed horizontally and the heat absorption substrate 200 is located above along the direction of gravity, part of the gaseous phase change working fluid 500 diffuses to one end of the diversion channel 230 far from the first cavity 410. When it releases heat and reforms into a liquid state, the bottom 231 of the sloped diversion channel 230 is located above, which can effectively guide the liquid phase change working fluid 500 attached to its surface back into the first cavity 410 to form a cycle. However, as Figure 4 As shown in the lower figure below, along the direction of gravity, when the heat absorption substrate 200 is located below, the liquid level of the phase change working fluid 500 can still contact the microstructures 210 to ensure the heat transfer efficiency.

[0051] In a preferred embodiment of the present invention, the first cavity 410 is located at the center of the heat absorption substrate 200, and several diversion channels 230 are radially connected to the first cavity 410. Such an arrangement can set more diversion channels 230 and effectively equalize the temperature of the heat absorption substrate 200 or the heat release substrate 300, avoiding the situation of excessive heat concentration.

[0052] As Figure 7 shown, in a second preferred embodiment of the present invention, the diversion channel 230 is a Tesla valve structure, and further includes an annular groove 240 and several diversion grooves 250 communicating with the outer circumference of the annular groove 240. The annular groove 240 simultaneously communicates with one end of each diversion channel 230 far from the first cavity 410. After the phase change working fluid 500 liquefies in the annular groove 240 and / or the diversion grooves 250, it flows back to the first cavity 410 through the Tesla valve. Utilizing the unidirectional diversion characteristic of the Tesla valve structure, the liquefied phase change working fluid 500 can be effectively guided back to the first cavity 410.

[0053] Preferably, the first cavity 410 is located at the center of the heat release substrate 300, and the diversion channels 230 are radially distributed around the center.

[0054] As Figures 1 to 6 shown, in a preferred embodiment of the present invention, the liquid filling rate inside the phase change cavity 400 is a, and the range of a is: 40% < a < 85%. With such a ratio setting, when the heat absorption substrate 200 is placed in different directions, at least part of the microstructures 210 can be immersed in the phase change working fluid 500, reducing the probability that dry burning occurs inside the first cavity 410 and resulting in a significant reduction in the heat transfer efficiency. Preferably, the liquid filling rate inside the phase change cavity 400 is 60%.

[0055] In a preferred embodiment of the present utility model, the inner side wall of the microstructures 210 provided on the first cavity 410 protrudes towards the inside of the first cavity 410. Such a setting enables more of the microstructures 210 to be in full contact with the liquid phase change working fluid 500.

[0056] Preferably, the microstructures 210 are provided on the inner side surface of the heat absorption substrate 200, and the inner side surface of the heat absorption substrate 200 protrudes towards the direction close to the heat release substrate 300, or the whole substrate is recessed towards the heat release substrate 300.

[0057] In a preferred embodiment of the present utility model, the microstructures 210 are vaporization holes and / or grooves formed by the depression of the inner side surface of the heat absorption substrate 200. The fine grooves and the plurality of vaporization hole structures contribute to the capillary action of the liquid, making it easier for the liquid phase change working fluid 500 to be redistributed and cover the surface of the inner side wall of the heat absorption substrate 200, and facilitating the rapid replenishment of the liquid after the local vaporization of the phase change working fluid 500, maintaining continuous boiling, and avoiding the occurrence of dry burning inside the first cavity 410.

[0058] As Figure 8 shown, in the third embodiment of the present utility model, the microstructures 210 are a number of abutting columns arranged in a dot matrix, and the abutting columns simultaneously abut the heat absorption substrate 200 and the heat release substrate 300. This simplifies the processing technology and provides sufficient supporting force. In addition, the supporting columns 220 arranged in a dot matrix have a better heat dissipation effect due to a larger condensation space.

[0059] Preferably, in a gravity scenario, that is, due to gravity, the microstructures 210 inside the heat absorption substrate 200 are always in contact with the liquid phase change working fluid 500, and the heat source 800 is always installed close to the microstructures 210. The abutting columns arranged in a dot matrix enable the phase change cavity 400 to have a larger condensation space, thereby enhancing the heat dissipation effect.

[0060] As Figures 1 to 3 shown, in a preferred embodiment of the present utility model, the phase change working fluid 500 is an organic working fluid. This type of phase change working fluid 500 is compatible with most metal materials and has a good heat transfer effect. Preferably, the phase change working fluid 500 is R1233zd, acetone or R134a. This type of phase change working fluid 500 is an organic working fluid that is compatible with aluminum.

[0061] Optionally, when the heat absorption substrate 200 and the heat release substrate 300 are made of other metal materials, a working fluid adapted to them can be selected according to actual needs.

[0062] In a preferred embodiment of the present utility model, the radiator 600 includes a plurality of fins 610 tightly connected to the heat-releasing substrate 300. The fins 610 not only provide a large heat exchange surface area, but also form air ducts between adjacent fins 610, which can orderly guide the air flow and improve the heat dissipation efficiency.

[0063] Preferably, each of the fins 610 is disposed closely against a side surface of the heat-releasing substrate 300 away from the heat-absorbing substrate 200. At the same time, the fins 610 are arranged in parallel with each other and form a uniform air guiding channel.

[0064] More preferably, the radiator 600 further includes a fan 620 for agitating the air flow in the air guiding channel.

[0065] As Figure 1 and Figure 9 shown, the present utility model also provides a stage light, which includes a lamp head 700 having a light outlet 750 and having any one of the foregoing cooling systems 100. The heat source 800 includes a light source 710, the light source 710 is disposed closely against the heat-absorbing substrate 200, and both the light source 710 and the cooling system 100 are located at one end of the lamp head 700 away from the light outlet 750. The heat of the stage light mainly comes from the light source 710. By using the cooling system 100 to effectively dissipate the heat of the light source 710, the light source 710 can work at a suitable temperature, thereby increasing its service life.

[0066] Preferably, the stage light further includes a support arm 740 for pivotally connecting the lamp head 700 and a chassis 730 for pivotally connecting the support arm 740, so that the lamp head 700 can rotate relative to the chassis 730 around at least two dimensions.

[0067] Preferably, the heat source 800 further includes a special effect module 720 having a control board, and the control board is disposed closely against the heat-absorbing substrate 200.

[0068] Optionally, the heat source 800 further includes a control element located inside the chassis 730.

[0069] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limiting the implementation manners of the present utility model. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. A cooling system based on phase change heat transfer, comprising an endothermic substrate (200) for closely adhering to a heat source (800) and absorbing its heat, and an exothermic substrate (300) that forms a sealed phase change cavity (400) with the endothermic substrate (200), characterized in that, The inner side of the heat-absorbing substrate (200) and the inner side of the heat-releasing substrate (300) jointly divide the phase-change cavity (400) to form a first cavity (410). The cooling system (100) further includes a phase-change working fluid located in the first cavity (410), and a radiator (600) connected to one side of the heat-releasing substrate (300) for dissipating heat. A plurality of microstructures (210) are provided on the inner sidewall of the first cavity (410), and at least part of the microstructures (210) are immersed in the phase-change working fluid. The heat absorbed by the heat-absorbing substrate (200) is transferred to the heat-releasing substrate (300) through the cooperation between the microstructures (210) and the phase-change working fluid, and finally dissipated through the radiator (600).

2. The cooling system according to claim 1, wherein, A plurality of support columns (220) that simultaneously abut against the heat-absorbing substrate (200) and the heat-releasing substrate (300) are provided in the first cavity (410).

3. The cooling system according to claim 2, wherein A capillary ring is wrapped around the periphery of the support column (220).

4. The cooling system according to claim 1, characterized in that, The material of the heat-absorbing substrate (200) and / or the heat-releasing substrate (300) is an aluminum-based material.

5. The cooling system according to claim 1, characterized in that A plurality of flow guide channels (230) communicating with the first cavity (410) are provided between the heat-absorbing substrate (200) and the heat-releasing substrate (300). Each of the flow guide channels (230) forms a second cavity (420) in the phase-change cavity (400).

6. The cooling system according to claim 5, characterized in that, In the direction away from the first cavity (410), the width of the flow guide channel (230) gradually increases.

7. The cooling system according to claim 6, wherein, The ratio of the width of the flow guide channel (230) at one end close to the first cavity (410) to the width of the other end is between 1:2 and 1:

7.

8. The cooling system according to claim 5, characterized in that, In the direction away from the first cavity (410), the bottom (231) of the flow guide channel (230) gradually moves away from the heat-releasing substrate (300).

9. The cooling system according to claim 5, characterized in that, The first cavity (410) is located at the center of the heat-absorbing substrate (200), and a plurality of the flow guide channels (230) are radially connected to the first cavity (410).

10. The cooling system according to claim 5, characterized in that, The flow guide channel (230) is a Tesla valve structure, and further includes an annular groove (240) and a plurality of diversion grooves (250) communicating with the outer circumference of the annular groove (240). The annular groove (240) simultaneously communicates with one end of each of the flow guide channels (230) away from the first cavity (410). After the phase-change working fluid liquefies in the annular groove (240) and / or the diversion grooves (250), it flows back to the first cavity (410) through the Tesla valve.

11. The cooling system according to claim 1 or 7, characterized in that, The liquid filling rate inside the phase-change cavity (400) is a, and the range of a is: 40% < a < 85%.

12. The cooling system according to claim 1, wherein The inner sidewall of the first cavity (410) provided with the microstructures (210) protrudes into the interior of the first cavity (410).

13. The cooling system according to claim 1, characterized in that, The microstructures (210) are vaporization holes and / or grooves formed by the depression of the inner surface of the heat-absorbing substrate (200).

14. The cooling system according to claim 1, characterized in that, The microstructure (210) is a plurality of abutting columns (260) arranged in a dot matrix, and the abutting columns (260) abut the heat absorption substrate (200) and the heat release substrate (300) simultaneously.

15. The cooling system according to claim 1, characterized in that, The phase change working fluid is an organic working fluid.

16. The cooling system according to claim 1, wherein, The radiator (600) includes a plurality of fins (610) tightly connected to the heat release substrate (300).

17. A stage light, comprising a lamp head (700) having a light outlet (750), characterized in that, There is also a cooling system (100) as described in any one of claims 1 to 16. The heat source (800) includes a light source (710). The light source (710) is disposed close to the heat absorption substrate (200), and both the light source (710) and the cooling system (100) are located at one end of the lamp head (700) away from the light outlet (750).

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