Press type chip heat dissipation test seat
Through the elastic connection and limiting mechanism of the floating plate and the heat sink, the problem of intimate contact between the chip and the radiator is solved, ensuring the heat dissipation effect and chip safety during the test, and achieving simple structure and convenient operation.
Patent Information
- Application Number
- CN202421947227.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-13
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-08-13
AI Technical Summary
In existing heat dissipation testing devices, the contact between the chip and the radiator is not tight enough, and it is prone to gaps and may crush the chip, resulting in test failure.
A press-type chip heat dissipation test seat is designed, which is elastically connected to the heat dissipation block through the floating plate and the heat dissipation block, and combines the limiting mechanism to ensure balanced contact between the heat dissipation block and the chip, and maintain pressure through the limiting mechanism to avoid crushing the chip.
The heat dissipation block is fully in contact with the chip, ensuring the heat dissipation effect during the test, avoiding chip damage, simple structure and convenient operation.
Smart Images
Figure CN223092008U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of testing devices, and more specifically to a pressing type chip heat dissipation test seat. Background Art
[0002] A heat dissipation test device is a device that keeps a chip or other electronic components in a heat dissipation state during performance testing. In order to ensure that during the testing process, the chip or other electronic components will not fail the test due to heat dissipation problems, it is necessary to ensure that the pressing contact between the radiator and the chip or other electronic components is in place without gaps. At the same time, when the radiator is in pressing contact, it is also necessary to prevent damage to the chip or other electronic components. Content of the Utility Model
[0003] To solve the above problems, the utility model provides a pressing type chip heat dissipation test seat, which includes a first shell and a second shell that can be covered together up and down. A test seat for placing a chip to be tested is arranged in the second shell. A heat dissipation pressing block is arranged in the first shell. A floating plate is arranged in the first shell. The floating plate is located above the heat dissipation pressing block and is elastically connected to the heat dissipation pressing block. A limiting mechanism is arranged between both sides of the first shell and the floating plate. The limiting mechanism is used to keep the pressure on the heat dissipation pressing block when the floating plate is limited at a preset height.
[0004] Furthermore, the heat dissipation pressing block includes a pressing part and a first connecting part. The first connecting part is arranged on both sides of the pressing part.
[0005] Furthermore, the floating plate includes a wrapping part and a second connecting part. The wrapping part surrounds the upper part and the left and right side walls of the pressing part. The second connecting part is arranged on the left and right sides of the wrapping part and is located above the first connecting part. A spring is arranged between the first connecting part and the second connecting part.
[0006] Furthermore, the limiting mechanism includes limiting plates fixed on both sides of the wrapping part and moving baffles arranged on both sides of the first shell.
[0007] Furthermore, first through holes are arranged on both sides of the first shell. First guide rods are also arranged on both sides of the moving baffle.
[0008] Furthermore, second guide rods are also arranged between the first connecting part and the second connecting part.
[0009] Furthermore, a first rotating shaft is provided on the second housing, and the first housing and the second housing are rotatably connected through the first rotating shaft. A second rotating shaft is also provided on the first housing, and a pawl is rotatably mounted on the second rotating shaft. A fixing rod cooperating with the pawl is provided on the second housing.
[0010] Furthermore, heat dissipation fins are provided on the side of the pressing part away from the chip.
[0011] Compared with the prior art, the beneficial effects of the present utility model are as follows:
[0012] This application directly forms limits to the movement of the floating plate from both sides of the floating plate, making the pressure between the floating plate and the heat dissipation block more balanced, so as to ensure that the heat dissipation block and the test chip can be in full contact. At the same time, the overall structure is simpler and the operation is more convenient.
[0013] The additional aspects and advantages of the present utility model will be given in the following description part, some of which will become obvious from the following description, or will be understood through the practice of the present utility model. Description of the Drawings
[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0015] Figure 1 It is a schematic diagram of the overall structure of the present utility model;
[0016] Figure 2 It is an exploded view of the overall structure of the present utility model;
[0017] Figure 3 It is an assembly drawing of the structure of the first housing and the moving baffle of the present utility model;
[0018] Figure 4 It is a schematic diagram of the structure of the second housing of the present utility model.
[0019] The reference numerals and names in the drawings are as follows:
[0020] The first housing 100, the second housing 200, the test base 210, the heat dissipation pressing block 300, the floating plate 400, the pressing part 310, the first connecting part 320, the heat dissipation fins 311, the wrapping part 410, the second connecting part 420, the spring 430, the limiting plate 450, the moving baffle 110, the first through hole 120, the first guiding rod 130, the second guiding rod 440, the first rotating shaft 220, the second rotating shaft 140, the buckle 150, the fixing rod 230. Detailed implementation manners
[0021] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0022] A more detailed description of the present invention will be given. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. It should be noted that when an element is expressed as "fixed to" another element, it can be directly on the other element, or there can be one or more intermediate elements therebetween. When an element is expressed as "connected to" another element, it can be directly connected to the other element, or there can be one or more intermediate elements therebetween.
[0023] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by orientation words such as "front, rear, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, so it cannot be understood as a limitation on the protection scope of the present invention; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself. In the description of the present invention, it should be noted that the use of words such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Without additional statement, the above words have no special meaning, so it cannot be understood as a limitation on the protection scope of the present invention. In the description of the embodiments of the present application, the meaning of "a plurality" is two or more, unless otherwise specifically defined.
[0024] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those of ordinary skill in the technical field to which this utility model pertains. The terms used in this specification in the description of the utility model are only for the purpose of describing specific embodiments and are not intended to limit the utility model.
[0025] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.
[0026] Now, a preferred embodiment of the present utility model will be further described in conjunction with the accompanying drawings. As Figure 1 and Figure 2 shown, a push-type chip heat dissipation test seat includes a first housing 100 and a second housing 200 that can be covered together up and down. A test seat 210 for placing a chip to be tested is provided in the second housing 200. A heat dissipation pressing block 300 is provided in the first housing 100. The heat dissipation pressing block 300 can move up and down in the first housing 100. A floating plate 400 is provided in the first housing 100. The floating plate 400 can also move up and down in the first housing 100. The floating plate 400 is located above the heat dissipation pressing block 300 and is elastically connected to the heat dissipation pressing block 300. When the floating plate 400 is pressed down to a preset height, the floating plate 400 will drive the heat dissipation pressing block 300 to move synchronously downward under the action of elastic force. A limiting mechanism is provided between both sides of the first housing 100 and the floating plate 400. The limiting mechanism is used to limit the floating plate 400 at the preset height to keep the pressure on the heat dissipation pressing block 300.
[0027] When a test needs to be performed, the chip is placed on the test seat 210, and then the first housing 100 and the second housing 200 are covered together up and down. Contact is formed between the heat dissipation pressing block 300 and the chip. Subsequently, the floating plate 400 is pressed down to the preset height, causing the heat dissipation pressing block 300 to generate pressure so that it can be pressed down synchronously, thereby enabling the heat dissipation pressing block 300 to form a pressing on the chip. Then, the limiting mechanism is operated to limit the floating plate 400 at the preset height to maintain the pressure on the heat dissipation pressing block 300. After the test is completed, the limiting mechanism is operated again to release the limit on the height of the floating plate 400. Since the floating plate 400 and the heat dissipation pressing block 300 are elastically connected, the floating plate 400 will reset upward under the action of elastic force, thereby releasing the pressure on the heat dissipation pressing block 300, and further enabling the heat dissipation pressing block 300 not to press on the chip. The present application directly limits the movement of the floating plate 400 from both sides of the floating plate 400, making the pressure between the floating plate 400 and the heat dissipation pressing block 300 more balanced, thereby ensuring that the heat dissipation pressing block 300 and the test chip can be in full contact, and at the same time, the overall structure is simpler and the operation is more convenient.
[0028] Furthermore, on the basis of the above embodiments, as Figure 2 shown, the heat dissipation pressing block 300 includes a pressing part 310 and a first connecting part 320. The first connecting part 320 is arranged on both sides of the pressing part 310. When the first housing 100 and the second housing 200 are covered up and down, the pressing part 310 is located directly above the test seat 210. When the heat dissipation pressing block 300 contacts the chip, the pressing part 310 is used to press on the chip. In some embodiments, heat dissipation fins 311 are arranged on the side of the pressing part 310 away from the chip.
[0029] Furthermore, on the basis of the above embodiments, as Figure 2 shown, the floating plate 400 includes a wrapping part 410 and a second connecting part 420. The wrapping part 410 is arranged around the upper part and the left and right side walls of the pressing part 310. The second connecting part 420 is arranged on the left and right sides of the wrapping part 410 and above the first connecting part 320. A spring 430 is arranged between the first connecting part 320 and the second connecting part 420. The spring 430 props up the second connecting part 420 upward relative to the first connecting part 320, so that there is a gap between the wrapping part 410 and the pressing part 310. When the wrapping part 410 of the floating plate 400 is pressed down, the downward movement of the wrapping part 410 will drive the second connecting part 420 to move downward, so that the spring 430 between the first connecting part 320 and the second connecting part 420 is compressed, and the first connecting part 320 drives the pressing part 310 to press on the chip.
[0030] Furthermore, on the basis of the above embodiments, as Figure 2 and Figure 3 shown, the limiting mechanism includes limiting plates 450 fixed on both sides of the wrapping part 410 and moving baffles 110 arranged on both sides of the first housing 100. The moving baffles 110 can move towards the wrapping part 410. When the floating plate 400 is pressed down to a preset height, the moving baffles 110 are operated to move towards the wrapping part 410 so as to block above the limiting plates 450, thereby blocking the elastic force of the floating plate 400 to reset upward under the action of the spring 430, so that the floating plate 400 cannot be reset, and thus the pressure on the heat dissipation pressing block 300 can be maintained. When resetting is needed, the moving baffles 110 are operated to move away from the wrapping part 410. Since the moving baffles 110 do not block the limiting plates 450 at this time, the floating plate 400 will reset upward under the action of the spring 430.
[0031] Furthermore, on the basis of the above embodiments, as Figure 2 and Figure 3As shown, first through holes 120 are provided on both sides of the first housing 100. The movable baffle 110 can continue to move towards the wrapping portion 410 through the first through holes and pass through the first housing 100. In some embodiments, first guide rods 130 are further provided on both sides of the movable baffle 110. The first guide rods 130 are used to guide the movable baffle 110 when it moves towards the wrapping portion 410.
[0032] Furthermore, on the basis of the above-mentioned embodiments, as Figure 2 and Figure 3 shown, a second guide rod 440 is further provided between the first connecting portion 320 and the second connecting portion 420. The second guide is used to guide when the second connecting portion 420 presses down relative to the first connecting portion 320.
[0033] Furthermore, on the basis of the above-mentioned embodiments, as Figure 4 shown, a first rotating shaft 220 is provided on the second housing 200. The first housing 100 and the second housing 200 are rotatably connected through the first rotating shaft 220. A second rotating shaft 140 is still provided on the first housing 100. A claw 150 is rotatably mounted on the second rotating shaft 140. A fixing rod 230 cooperating with the claw 150 is provided on the second housing 200. After the heat dissipation block 300 is pressed down as a whole to complete the pressing contact with the test chip, the claw 150 is rotated and fastened to the fixing rod 230, so that the contact state between the heat dissipation block 300 and the test chip can be maintained.
[0034] Details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, in any regard, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present invention.
Claims
1. A pressing type chip heat dissipation test seat, comprising a first housing (100) and a second housing (200) that can be covered together up and down. A test seat (210) for placing a chip to be tested is arranged in the second housing (200), a heat dissipation pressing block (300) is arranged in the first housing (100), and a floating plate (400) is arranged in the first housing (100), characterized in that, The floating plate (400) is located above the heat dissipation pressing block (300) and is elastically connected to the heat dissipation pressing block (300). A limiting mechanism is provided between both sides of the first housing (100) and the floating plate (400). The limiting mechanism is used to keep the pressure on the heat dissipation pressing block (300) when the floating plate (400) is limited at a preset height.
2. The pressing type chip heat dissipation test socket according to claim 1, wherein The heat dissipation pressing block (300) includes a pressing portion (310) and a first connecting portion (320). The first connecting portion (320) is provided on both sides of the pressing portion (310).
3. The push-button chip heat dissipation test socket according to claim 2, characterized in that, The floating plate (400) includes a wrapping portion (410) and a second connecting portion (420). The wrapping portion (410) is disposed around the upper and left and right side walls of the pressing portion (310). The second connecting portion (420) is provided on the left and right sides of the wrapping portion (410) and above the first connecting portion (320). A spring (430) is provided between the first connecting portion (320) and the second connecting portion (420).
4. The pressing type chip heat dissipation test socket according to claim 3, characterized in that The limiting mechanism includes limiting plates (450) fixed to both sides of the wrapping portion (410) and moving baffles (110) provided on both sides of the first housing (100).
5. The pressing-type chip heat dissipation test socket according to claim 4, characterized in that, First through holes (120) are provided on both sides of the first housing (100). First guide rods (130) are further provided on both sides of the moving baffle (110).
6. The pressing type chip heat dissipation test socket according to claim 3, wherein A second guide rod (440) is further provided between the first connecting portion (320) and the second connecting portion (420).
7. The pressing type chip heat dissipation test socket according to claim 1, wherein A first rotating shaft (220) is provided on the second housing (200). The first housing (100) and the second housing (200) are rotatably connected through the first rotating shaft (220). A second rotating shaft (140) is also provided on the first housing (100). A claw (150) is rotatably mounted on the second rotating shaft (140). A fixing rod (230) cooperating with the claw (150) is provided on the second housing (200).
8. The pressing type chip heat dissipation test socket according to claim 2, wherein Heat dissipation fins (311) are provided on the side of the pressing portion (310) away from the chip.