Chip test seat suitable for PAD with test point at side edge

Abstract

The utility model relates to the technical field of chip testing devices, and discloses a chip testing seat suitable for a PAD with a testing point on a side edge, which comprises a base, a first probe station is arranged in the center of the top of the base, a chip placing seat is arranged on the outer side of the first probe station, a chip placing groove is formed in the top of the chip placing seat, and a chip is arranged in the chip placing groove. And the chip placing groove is located at the top of the first probe station. According to the utility model, when a bottom PAD point is detected, the first pressing block is directly descended through the propelling mechanism to complete the pressing of the bottom part of the chip and the probe, and when a side PAD point needs to be detected, the supporting block can be taken out to enable the second pressing block to be out of limitation, and at the moment, the second pressing block is pushed to move downwards through the propelling mechanism to complete the pressing of the bottom part of the chip and the probe. According to the device, the bevel edge of the second pressing block can drive the guide block to move, insertion of the second probe on the side face is achieved, detection of the PAD point on the side face is completed, and compared with the prior art, the device can meet detection of the bottom PAD point and the side face PAD point at the same time, and the use effect is extremely good.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing devices, in particular to a chip test socket applicable to a chip with test points PAD on the side. Background Technique

[0002] Integrated circuit testing mainly focuses on wafer testing and post-packaging testing at present, and the technology is mature. For wafer testing, an automatic probe station is mainly used for testing. A large wafer of several inches is fixed on a chuck, and a computer controls a stepping motor to drive a large probe card to move, and automatic testing is carried out on each chip on the wafer through hard elastic probes. However, for each single chip after wafer dicing and before packaging, due to the small chip size and small PAD points, it is very difficult to fix and align, and the testing difficulty is great. At present, there is no suitable testing method for a single bare chip.

[0003] Single chips are widely used in secondary integration or secondary packaging products. Due to the great difficulty in single chip testing, it is very difficult to test and evaluate single chips before the secondary integration products are put on the market. Therefore, once the performance of a batch of single chips is unqualified, it will cause quality losses in the secondary integration batch.

[0004] In the Chinese patent with the publication number CN 112345913 A, a multi-PAD single chip micro-testing device is provided, which is characterized in that: it includes a circuit board (1), on which a probe station (2), a chip accommodating board (3) and a support table (4) are sequentially arranged from bottom to top. An upper cover plate (5) is connected to the support table (4), and a pressing block (6) corresponding to and cooperating with the chip accommodating board (3) is connected to the upper cover plate (5). A knob (7) connected and cooperating with the pressing block (6) is further arranged on the upper cover plate (5). The invention has a simple structure, is convenient to use, and the testing process is more stable. Corresponding numbers of probes can be installed according to different testing requirements, and multi-needle testing can be completed simultaneously.

[0005] However, when the existing technology is used, it is not convenient to test a chip with side PADs. Based on this problem, this device is proposed. Content of the Utility Model

[0006] The purpose of the utility model is to solve the problems existing in the prior art, and a chip test socket applicable to a chip with test points PAD on the side is proposed.

[0007] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0008] A chip test socket suitable for PAD with test points on the side, comprising a base. A first probe table is installed in the center of the top of the base. A chip placement seat is installed outside the first probe table. A chip placement groove is formed at the top of the chip placement seat, and the chip placement groove is located on the top of the first probe table. An upper cover plate is arranged above the chip placement seat. A propulsion mechanism is arranged on the top of the upper cover plate. The driving end of the propulsion mechanism is connected to a first pressing block. Springs are installed on both sides of the top of the first pressing block, and the other ends of the springs are connected to the upper cover plate. The bottom end of the first pressing block is adapted to the position of the chip placement groove. A second pressing block is movably arranged outside the first pressing block. Support blocks are arranged on both sides of the top of the base, and the tops of the support blocks abut against the bottom of the second pressing block. The inner sides of both ends of the bottom of the second pressing block are inclined. Guide blocks are arranged on the inner sides of both ends of the bottom of the second pressing block. The guide blocks are connected to the outside of the chip placement seat through a guiding structure. Second probes are arranged on the inner sides of the guide blocks, and the second probes movably penetrate through the chip placement seat into the chip placement groove.

[0009] Preferably, the upper cover plate is detachably connected to the chip placement seat through a snap structure.

[0010] Preferably, the propulsion mechanism includes a knob. The knob is arranged on the top of the upper cover plate. A screw rod is installed at the bottom of the knob. The screw rod movably penetrates through the upper cover plate and is threadedly connected to the upper cover plate. The bottom end of the screw rod is rotatably connected to the first pressing block through a bearing.

[0011] Preferably, the support block is detachably connected to the top of the base through a bolt.

[0012] Preferably, the snap structure includes a snap seat and a snap member. The snap seat is installed on the outside, and the snap member is installed on the side of the upper cover plate. The snap seat and the snap member are adapted to each other.

[0013] Preferably, the guiding structure includes a guide rod and a second spring. The two ends of the second spring are respectively connected to the chip placement seat and the guide block. The guide rod movably penetrates through the guide block and is fixedly installed on the chip placement seat.

[0014] Compared with the prior art, the beneficial effects of the present utility model are:

[0015] In this utility model, by setting a first pressing block and a second pressing block, when detecting the bottom PAD points, the first pressing block is directly lowered through the pushing mechanism to complete the pressing of the bottom part of the chip and the probe. When it is necessary to detect the side PAD points, the supporting block can be taken out, so that the second pressing block loses its restriction. At this time, the second pressing block is pushed down by the pushing mechanism, and the hypotenuse of the second pressing block can drive the guiding block to move, realizing the insertion of the second probe on the side and completing the detection of the side PAD points. Compared with the prior art, this device can simultaneously meet the detection of the bottom PAD points and the side PAD points, and has excellent use effects. Description of the Drawings

[0016] Figure 1 An exploded schematic diagram of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0017] Figure 2 A front sectional view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0018] Figure 3 A side sectional view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0019] Figure 4 A front view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0020] Figure 5 A rear view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0021] Figure 6 A left view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0022] Figure 7 A right view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0023] Figure 8 A top view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0024] Figure 9 A bottom view of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0025] Figure 10 A sectional view of the position of the second probe of a chip test socket applicable to a chip with test points PAD on the side proposed by this utility model;

[0026] Figure 11 Schematic diagram of the comparative relationship of the positions of the second pressing block, guiding block and second probe of a chip test socket applicable to PADs with test points on the side

[0027] Figure 12 Enlarged schematic diagram of the position of the second probe of a chip test socket applicable to PADs with test points on the side proposed by the present utility model

[0028] Figure 13 Three-dimensional schematic diagram of a chip test socket applicable to PADs with test points on the side proposed by the present utility model

[0029] Figure 14 Three-dimensional sectional view schematic diagram of a chip test socket applicable to PADs with test points on the side proposed by the present utility model

[0030] Figure 15 Three-dimensional schematic diagram of the second pressing block of a chip test socket applicable to PADs with test points on the side proposed by the present utility model

[0031] Figure 16 Three-dimensional schematic diagram of the position of the second probe of a chip test socket applicable to PADs with test points on the side proposed by the present utility model

[0032] Figure 17 Three-dimensional schematic diagram of the chip placement groove of a chip test socket applicable to PADs with test points on the side proposed by the present utility model from a top-down perspective

[0033] Figure 18 Three-dimensional schematic diagram of the connection of the second probe and the chip placement seat of a chip test socket applicable to PADs with test points on the side proposed by the present utility model from a top-down perspective

[0034] Figure 19 Top view of a chip test socket applicable to PADs with test points on the side proposed by the present utility model

[0035] In the figure: 1. Base; 2. First probe table; 3. Chip placement seat; 4. Chip placement groove; 5. Upper cover plate; 6. First pressing block; 7. Second pressing block; 8. Spring; 9. Support block; 10. Guiding block; 11. Second probe; 12. Buckle structure; 13. Knob; 14. Screw rod; 15. Guide rod; 16. Second spring Detailed implementation manners

[0036] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments

[0037] Reference Figures 1 - 19 , a chip test socket applicable to the PAD with test points on the side, including a base 1. A first probe table 2 is installed at the center of the top of the base 1. The first probe table 2 is provided with a number of detection probes. A chip placement seat 3 is installed outside the first probe table 2. A chip placement groove 4 is formed at the top of the chip placement seat 3. The chip placement groove 4 is located at the top of the first probe table 2. An upper cover plate 5 is arranged above the chip placement seat 3. A propulsion mechanism is arranged at the top of the upper cover plate 5. The driving end of the propulsion mechanism is connected with a first pressing block 6. Springs 8 are installed on both sides of the top of the first pressing block 6, and the other ends of the springs 8 are connected with the upper cover plate 5. The bottom end of the first pressing block 6 is adapted to the position of the chip placement groove 4. A second pressing block 7 is movably arranged outside the first pressing block 6. Support blocks 9 are arranged on both sides of the top of the base 1, and the top of the support blocks 9 abuts against the bottom of the second pressing block 7. The inner sides of both ends of the bottom of the second pressing block 7 are inclined. Guide blocks 10 are arranged on the inner sides of both ends of the bottom of the second pressing block 7. The guide blocks 10 are connected with the outside of the chip placement seat 3 through a guiding structure. Second probes 11 are arranged on the inner sides of the guide blocks 10, and the second probes 11 movably penetrate through the chip placement seat 3 into the chip placement groove 4.

[0038] When the device is in use, by setting the first pressing block 6 and the second pressing block 7, when detecting the bottom PAD points, first place the chip into the chip placement groove 4, and then fix the upper cover plate 5 on the chip placement seat 3. At this time, directly make the first pressing block 6 descend through the propulsion mechanism to complete the pressing of the bottom part of the chip and the probe. When it is necessary to detect the side PAD points, the support blocks 9 can be taken out, so that the second pressing block 7 is no longer restricted. At this time, by pushing the second pressing block 7 to move downward through the propulsion mechanism, the inclined sides of the second pressing block 7 can drive the guide blocks 10 to move, realizing the insertion of the second probes 11 on the side and completing the detection of the side PAD points. Compared with the prior art, the device can simultaneously meet the detection of the bottom PAD points and the side PAD points, and the use effect is excellent.

[0039] In this embodiment, the upper cover plate 5 is detachably connected with the chip placement seat 3 through a snap structure 12, which is convenient for installing the upper cover plate 5 onto the chip placement seat 3.

[0040] In this embodiment, the propulsion mechanism includes a knob 13. The knob 13 is arranged at the top of the upper cover plate 5. A screw rod 14 is installed at the bottom of the knob 13. The screw rod 14 movably penetrates through the upper cover plate 5 and is threadedly connected with the upper cover plate 5. The bottom end of the screw rod 14 is rotatably connected with the first pressing block 6 through a bearing. By rotating the knob 13, the screw rod 14 can be rotated to change the position of the screw rod 14, so as to change the position of the first pressing block 6.

[0041] In this embodiment, the support block 9 is detachably connected to the top of the base 1 by bolts, which facilitates the disassembly and assembly of the support block 9.

[0042] In this embodiment, the buckle structure 12 includes a clamping seat and a buckle member. The clamping seat is installed on the outside, and the buckle member is installed on the side of the upper cover plate 5. The clamping seat and the buckle member are adapted to each other.

[0043] In this embodiment, the guiding structure includes a guide rod 15 and a second spring 16. Two ends of the second spring 16 are respectively connected to the chip placement seat 3 and the guiding block 10. The guide rod 15 movably penetrates through the guiding block 10 and is fixedly installed on the chip placement seat 3. The guiding block 10 moves horizontally under the pressure of the second pressing block 7. The guide rod 15 keeps moving in a fixed direction. The spring 8 facilitates the reset of the guiding block 10 after the second pressing block 7 is unloaded.

[0044] In this embodiment, a handle is installed on the top of the knob 13, and there are two handles.

[0045] In this embodiment, the buckle member is made of hard plastic and is hook-shaped.

[0046] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution of the present invention and its inventive concept, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.

Claims

1. A chip test socket applicable to PADs with test points on the side, comprising a base, a first probe table is installed at the center of the top of the base, and a chip placement seat is installed outside the first probe table, characterized in that: A chip placement seat has a chip placement groove formed at its top. The chip placement groove is located at the top of the first probe table. An upper cover plate is provided above the chip placement seat. A propulsion mechanism is arranged at the top of the upper cover plate. The driving end of the propulsion mechanism is connected to a first pressing block. Springs are installed on both sides of the top of the first pressing block, and the other ends of the springs are connected to the upper cover plate. The bottom end of the first pressing block is adapted to the position of the chip placement groove. A second pressing block is movably arranged outside the first pressing block. Support blocks are arranged on both sides of the top of the base, and the tops of the support blocks abut against the bottom of the second pressing block. The inner sides of both ends of the bottom of the second pressing block are inclined. Guide blocks are arranged on the inner sides of both ends of the bottom of the second pressing block. The guide blocks are connected to the outside of the chip placement seat through a guiding structure. Second probes are arranged on the inner sides of the guide blocks, and the second probes movably penetrate through the chip placement seat into the chip placement groove.

2. The chip test socket applicable to the PAD with test points on the side according to claim 1, wherein: The upper cover plate is detachably connected to the chip placement seat through a snap structure.

3. The chip test socket applicable to the PAD with test points on the side according to claim 1, wherein: The propulsion mechanism includes a knob. The knob is arranged at the top of the upper cover plate. A screw rod is installed at the bottom of the knob. The screw rod movably penetrates through the upper cover plate and is threadedly connected to the upper cover plate. The bottom end of the screw rod is rotatably connected to the first pressing block through a bearing.

4. The chip test socket applicable to the PAD with test points on the side according to claim 2, wherein: The support block is detachably connected to the top of the base through a bolt.

5. A chip test socket applicable to side-band test point PADs according to claim 2, characterized in that: The snap structure includes a snap seat and a snap member. The snap seat is installed on the outside, and the snap member is installed on the side of the upper cover plate. The snap seat and the snap member are adapted to each other.

6. The chip test socket applicable to the PAD with test points on the side according to claim 1, characterized in that: The guiding structure includes a guide rod and a second spring. The two ends of the second spring are respectively connected to the chip placement seat and the guide block. The guide rod movably penetrates through the guide block and is fixedly installed on the chip placement seat.

7. A chip test socket applicable to a PAD with test points on the side, as claimed in claim 3, wherein: A handle is installed at the top of the knob, and there are two handles.

8. A chip test socket applicable to a PAD with test points on the side, as described in claim 5, characterized in that: The material of the snap member is hard plastic and is hook-shaped.

Images