Chip taking device of photoetching machine

Abstract

The utility model discloses a wafer taking device of a photoetching machine, which belongs to the technical field of photoetching machines and comprises a positioning table, a sliding groove is formed in the top surface of the positioning table, a sliding block and a first driving component for driving the sliding block to move are arranged in the sliding groove, and a placing plate for placing a silicon wafer is fixedly connected to the top surface of the sliding block. Mounting grooves are formed in the positions, on the two sides of one end of the sliding groove, of the positioning table, and two parallel rotating shafts are rotationally arranged in the positioning table. According to the wafer taking device of the photoetching machine, the sliding block is matched with the first driving assembly to realize the movement of the placing plate and the silicon wafer, and then the second driving assembly drives the rotating shaft to move, so that the synchronous rotation of the four rotating rods is realized, and the wafer taking plate lifts the silicon wafer, keeps horizontal and moves. Compared with an existing device, contact with the top face of the silicon wafer is avoided, frictional wear to the bottom face of the silicon wafer is also avoided, and the quality and stability of silicon wafer production are improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of photolithography machines, and in particular relates to a film taking device for a photolithography machine. Background Art

[0002] The existing lithography machine wafer removal devices are roughly divided into three types: clamping translation, suction cup translation, and placement translation. Since the lithography machine needs to perform extremely high-precision lithography on the top surface of the silicon wafer, the flatness of the top surface of the silicon wafer is very high. Both clamping translation and suction cup translation require contact and pressure on the top surface of the silicon wafer, which may affect the flatness of the silicon wafer surface and may also affect the circuits on the silicon wafer surface that have been lithographically processed.

[0003] The existing placement and translation type devices, such as a wafer removal device for a photolithography machine shown in the authorization publication number CN212749519U, include a support frame plate, a photolithography machine positioning table and a top shell. When the above patent is in use, the electric slide drives the shifting block to move, and then the silicon wafer moves. During the removal process, the silicon wafer is prone to wear, which may cause damage to the silicon wafer and increase production costs.

[0004] To this end, we propose a lithography machine film removal device to solve the above problems. Utility Model Content

[0005] The utility model aims to solve the problem of wear and tear during the silicon wafer taking-out process in the prior art, and proposes a wafer taking-out device for a photolithography machine.

[0006] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A wafer taking device for a photolithography machine comprises a positioning platform and a silicon wafer, wherein a slide groove is provided on the top surface of the positioning platform, a slider and a first driving component for driving the slider to move are provided in the slide groove, and a placement plate for placing the silicon wafer is fixedly connected to the top surface of the slider;

[0008] The positioning platforms on both sides of one end of the slide slot are provided with mounting slots, and two parallel rotating shafts are rotatably arranged inside the positioning platform, and the two rotating shafts pass through the two mounting slots, and both ends of the rotating shafts are fixedly sleeved with rotating rods located in the mounting slots, and the upper ends of the two rotating rods in the same mounting slot are hinged together with a horizontal film-taking plate, and a second driving component that drives the two rotating shafts to rotate synchronously is provided inside the positioning platform, and the top surface of the film-taking plate is lower than the top surface of the placing plate in the initial state;

[0009] The middle part of the slideway is symmetrically provided with return components for returning the position of the silicon wafer.

[0010] Preferably, the first driving assembly includes a lead screw rotatably connected in the sliding groove and a first motor for driving the lead screw to rotate. The slider is threadedly sleeved outside the lead screw, and both sides of the slider are in contact with both sides of the sliding groove.

[0011] Preferably, the second driving assembly includes a worm rotatably arranged inside the positioning table and a second motor for driving the worm to rotate. A worm gear is fixedly sleeved on one of the rotating shafts, and the worm gear meshes with the worm.

[0012] Preferably, an anti-slip layer is fixedly arranged on the top surface of the wafer picking plate, and the top surface of the anti-slip layer is lower than the top surface of the placement plate in the initial state.

[0013] Preferably, the alignment component includes a limiting plate rotatably connected at one end to the positioning table, and a locking component is arranged at the other end of the limiting plate.

[0014] Preferably, a baffle is fixedly connected to one side of the placement plate facing the sliding groove and located at the end of the wafer picking plate.

[0015] In summary, the technical effects and advantages of the present invention: For this wafer picking device of the lithography machine, the movement of the placement plate and the silicon wafer is realized through the cooperation of the slider and the first driving assembly, and then the rotating shaft is driven to move by the second driving assembly, so as to realize the synchronous rotation of the four rotating rods, thereby realizing the wafer picking plate to lift the silicon wafer, keep it horizontal and move. Compared with the existing devices, it avoids contacting the top surface of the silicon wafer and also avoids frictional wear on the bottom surface of the silicon wafer, improving the quality and stability of silicon wafer production. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of the present invention;

[0017] Figure 2 is a front view of the cross-section at the sliding groove of the present invention;

[0018] Figure 3 is a front view of the cross-section at the installation groove of the present invention;

[0019] Figure 4 is a top view of the structure of the present invention;

[0020] Figure 5 is a top view of the cross-section at the worm of the present invention after removing the rotating rod.

[0021] In the figure: 1, positioning table; 2, silicon wafer; 3, sliding groove; 4, slider; 5, placement plate; 6, installation groove; 7, rotating shaft; 8, rotating rod; 9, wafer picking plate; 10, lead screw; 11, worm; 12, worm gear; 13, anti-slip layer; 14, limiting plate; 15, locking component; 16, baffle. DETAILED DESCRIPTION OF THE INVENTION

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments.

[0023] Referring to Figures 1-3 , a wafer picking device for a lithography machine, including a positioning table 1 of the lithography machine and a silicon wafer 2. A chute 3 is opened on the top surface of the positioning table 1. A slider 4 and a first driving component for driving the slider 4 to move are arranged in the chute 3. A placement plate 5 for placing the silicon wafer 2 is fixedly connected to the top surface of the slider 4.

[0024] On both sides of one end of the chute 3 on the positioning table 1, mounting grooves 6 are provided. Two parallel rotating shafts 7 are rotatably arranged inside the positioning table 1, and both rotating shafts 7 penetrate through the two mounting grooves 6. Rotating rods 8 located in the mounting grooves 6 are fixedly sleeved at both ends of the rotating shafts 7. The upper ends of the two rotating rods 8 in the same mounting groove 6 are jointly hinged to a horizontal wafer picking plate 9. A second driving component for driving the two rotating shafts 7 to rotate synchronously is arranged inside the positioning table 1. The top surface of the wafer picking plate 9 is lower than the top surface of the placement plate 5 in the initial state.

[0025] On both sides of the end of the chute 3 far from the mounting groove 6, a rectifying component for rectifying the position of the silicon wafer 2 is symmetrically provided.

[0026] For this wafer picking device of the lithography machine, after the silicon wafer 2 is positioned and lithographed on the placement plate 5 of the positioning table 1, when wafer picking is required, the first driving component can be turned on. The first driving component drives the slider 4 and the placement plate 5 to move. Until the slider 4 moves directly above the two wafer picking plates 9, the first driving component is turned off and the second driving component is turned on. The second driving component drives the rotating shafts 7 to rotate, and the two wafer picking plates 9 thus drive the silicon wafer 2 to move outside the positioning table 1, realizing the wafer picking of the silicon wafer 2.

[0027] After wafer picking is completed, the second driving component is turned on and the rotating shafts 7 are driven to reverse, and the two wafer picking plates 9 thus return to the mounting grooves 6. Then the first driving component is turned on and the slider 4 is driven back to its original position. The above steps can also realize feeding the silicon wafer 2 from the outside to the positioning table 1 for positioning lithography. At this time, the rectifying component can rectify the position of the silicon wafer 2 and make it in the middle of the placement plate 5 when the silicon wafer 2 follows the placement plate 5 away from the wafer picking plate 9.

[0028] The first driving component includes a lead screw 10 rotatably connected in the chute 3 and a first motor for driving the lead screw 10 to rotate. The slider 4 is threadedly sleeved outside the lead screw 10. The first motor drives the lead screw 10 to rotate, thereby driving the slider 4 and the placement plate 5 to move. The two sides of the slider 4 are in contact with the two sides of the chute 3. In this way, the limit of the slider 4 is realized, avoiding its rotation following the lead screw 10. Improving the stability of the device.

[0029] Referring to Figure 5, a cavity is provided inside the positioning table 1. The second driving assembly includes a worm 11 rotatably arranged inside the positioning table 1 and a second motor for driving the worm 11 to rotate. A worm gear 12 is fixedly sleeved at the end of the rotating shaft 7, and the worm 11 meshes with the two worm gears 12 simultaneously. The worm 11 and the worm gears 12 are both located inside the cavity. By rotating the worm 11 to drive the worm gears 12 to rotate, the rotation of the rotating shaft 7 is realized. Since the two rotating rods 8 always remain parallel, when the worm 11 only meshes with and drives one of the rotating shafts 7 to rotate, the above effect can also be achieved, but the force borne by a single worm gear 12 is relatively large. When the worm 11 drives the two rotating shafts 7 to rotate simultaneously, the two worm gears 12 share the acting force. The stability and service life of the device are improved.

[0030] An anti-slip layer 13 is fixedly provided on the top surface of the wafer picking plate 9, and the anti-slip layer 13 can be pasted on the surface of the wafer picking plate 9 using anti-slip rubber. Since it is necessary to prevent the silicon wafer 2 from sliding relative to the wafer picking plate 9, the top surface of the anti-slip layer 13 is lower than the top surface of the placement plate 5 in the initial state. The stability during the picking and placing of the silicon wafer 2 is improved. Similarly, a rubber pad for anti-slip can also be provided on the top surface of the placement plate 5.

[0031] It should be noted that as Figure 4 shown, when the wafer picking plate 9 moves to the rightmost end, the top surface of the anti-slip layer 13 should not be lower than the top surface of the placement plate 5, so as to avoid colliding with the silicon wafer 2. The picking safety and stability are improved.

[0032] The alignment component includes a limiting plate 14 rotatably connected at one end to the positioning table 1, and the other end of the limiting plate 14 faces the wafer picking plate 9 and is provided with a locking component 15. An arc-shaped groove is formed on the top surface of the positioning table 1. The locking component 15 is a prior art and includes a locking block arranged in the arc-shaped groove and moving along with the limiting plate 14. The locking of the limiting plate 14 is achieved through the friction fixation between the locking block and the arc-shaped groove. This will not be elaborated here. The two limiting plates 14 are arranged in a V shape, and the distance between the ends close to the wafer picking plate 9 is greater than the distance between the ends far from the wafer picking plate 9. This is because when the silicon wafer 2 is transferred from other positions to the wafer picking plate 9, it may not be exactly in the middle of the two wafer picking plates 9. At this time, the alignment component is needed to align it. After the silicon wafer 2 is positioned and lithographed on the positioning table 1, its position has been determined. At this time, the assistance of the alignment component is not required.

[0033] In order to prevent the limiting plate 14 from taking the silicon wafer 2 away from the wafer picking plate 9, a baffle 16 is fixedly connected to the placement plate 5 on the side of the end of the wafer picking plate 9 facing the sliding groove 3.

[0034] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and the inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered within the protection scope of the present invention.

Claims

1. A wafer pickup device for a lithography machine, comprising a positioning table (1) and a silicon wafer (2), characterized in that, The top surface of the positioning table (1) is provided with a sliding groove (3). A slider (4) and a first driving assembly for driving the slider (4) to move are arranged in the sliding groove (3). A placing plate (5) for placing a silicon wafer (2) is fixedly connected to the top surface of the slider (4). Installation grooves (6) are provided on the positioning table (1) on both sides at one end of the sliding groove (3). Two parallel rotating shafts (7) are rotatably arranged inside the positioning table (1), and both of the rotating shafts (7) penetrate through the two installation grooves (6). Rotating rods (8) located in the installation grooves (6) are fixedly sleeved at both ends of the rotating shaft (7). The upper ends of the two rotating rods (8) in the same installation groove (6) are jointly hinged to a horizontal wafer picking plate (9). A second driving assembly for driving the two rotating shafts (7) to rotate synchronously is arranged inside the positioning table (1). The top surface of the wafer picking plate (9) is lower than the top surface of the placing plate (5) in the initial state. Alignment assemblies for aligning the position of the silicon wafer (2) are symmetrically arranged on both sides in the middle of the sliding groove (3).

2. The wafer picking device of a lithography machine according to claim 1, characterized in that The first driving assembly includes a lead screw (10) rotatably connected in the sliding groove (3) and a first motor for driving the lead screw (10) to rotate. The slider (4) is threadedly sleeved outside the lead screw (10), and both sides of the slider (4) are in contact with both sides of the sliding groove (3).

3. The wafer pickup device of a lithography machine according to claim 1, characterized in that, The second driving assembly includes a worm (11) rotatably arranged inside the positioning table (1) and a second motor for driving the worm (11) to rotate. A worm gear (12) is fixedly sleeved on one of the rotating shafts (7), and the worm gear (12) meshes with the worm (11).

4. The wafer pick-up device of a lithography machine according to claim 1, characterized in that, An anti-slip layer (13) is fixedly provided on the top surface of the wafer picking plate (9), and the top surface of the anti-slip layer (13) is lower than the top surface of the placing plate (5) in the initial state.

5. A wafer pick-up device for a lithography machine according to claim 1, characterized in that, The alignment assembly includes a limiting plate (14) with one end rotatably connected to the positioning table (1), and a locking assembly (15) is provided at the other end of the limiting plate (14).

6. The wafer pick-up device of a lithography machine according to claim 5, wherein A baffle (16) is fixedly connected to the side of the placing plate (5) facing the end of the wafer picking plate (9) in the sliding groove (3).

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