Gluing and developing equipment

Abstract

The utility model belongs to the technical field of semiconductor equipment, and provides gluing and developing equipment which comprises a developing chamber and a bearing assembly, a spraying assembly and a shielding assembly which are located in the developing chamber, the bearing assembly comprises a bearing base for placing a substrate and a rotating shaft for supporting the bearing base, and the spraying assembly comprises a nozzle for spraying a developing solution; the shielding assembly is arranged on the periphery of the rotating shaft in a sleeving mode and comprises a first shielding cover, a second shielding cover and a third shielding cover, the third shielding cover is arranged on the periphery of the first shielding cover in a sleeving mode, the first shielding cover can move up and down so as to be arranged on the periphery of the substrate in a sleeving mode, and the second shielding cover is located below the bearing base and connected to the bearing assembly; the first shade completely exposes the substrate along the axis direction of the rotating shaft, and the inner wall of the first shade is provided with the anti-sticking layer, so that atomized developing liquid can be prevented from condensing and dripping right above the substrate, and photoresist waste liquid thrown out from the substrate can be prevented from being stuck on the inner wall of the first shade, the product yield is improved, the maintenance frequency of equipment is reduced, and the enterprise cost is saved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor equipment, and particularly to a spin coater and developer. Background Art

[0002] The lithography process is an important step in the manufacturing process of semiconductor devices. In the lithography process, a pattern structure is engraved on the photoresist layer through spin coating, exposure, and development, and then the pattern structure is transferred to the substrate by an etching process. Among them, the spin coating process and the development process are usually carried out in a spin coater and developer. In the spin coater and developer, the development unit usually consists of four parts: a top cover, an upper mask, a middle mask, and a lower mask. When in use, the lower cover is located below the substrate, the middle cover is located between the substrate and the lower cover, the upper cover is sleeved on the outer periphery of the substrate, and the top cover is located above the upper cover.

[0003] During the development process, a nozzle above the substrate sprays a misty developer, and the developer is sprayed onto the surface of the substrate and scattered into the space surrounded by the top cover, the upper cover, the middle cover, and the lower cover. The misty developer will condense into beads on the surface of the top cover, and these beads will drip onto the surface of the substrate during the movement of the top cover, thereby affecting the development effect. In addition, due to the characteristics of the photoresist on the substrate, such as high viscosity, the waste liquid of the photoresist is likely to adhere to the upper cover and the middle cover, thereby affecting the normal use of the upper cover and the middle cover. Therefore, there is an urgent need for a new type of spin coater and developer to solve the above technical problems. Summary of the Utility Model

[0004] The purpose of the present application is to provide a spin coater and developer, which is used to solve the problems of the dripping of the developer beads and the adhesion of the photoresist waste liquid in the existing spin coater and developer, and can effectively avoid the dripping of the developer beads onto the substrate and prevent the adhesion of the photoresist waste liquid.

[0005] To achieve the above and other related purposes, the present application provides a spin coater and developer, including a development unit, and the development unit includes a carrying component, a spraying component, a shielding component, and a development chamber for performing a development process;

[0006] The carrying component is connected to the bottom of the development chamber, and includes a carrying base for placing a substrate and a rotating shaft connected below the carrying base, and the rotating shaft supports and drives the carrying base to rotate;

[0007] The spraying component includes a nozzle located above the substrate, and is used to spray the developer onto the substrate;

[0008] The shielding assembly is sleeved on the outer periphery of the rotating shaft and includes a first mask, a second mask, and a third mask. The third mask is located below the carrier base and connected to the bottom of the developing chamber, and is sleeved on the outer periphery of the first mask. The first mask can move up and down along the axis of the rotating shaft so that the first mask is sleeved on the outer periphery of the substrate. The second mask is located below the carrier base and connected to the carrier assembly.

[0009] Optionally, the spraying assembly further includes a movable arm, and the nozzle is connected to one end of the movable arm. The movable arm supports and drives the nozzle to move above the substrate.

[0010] Optionally, the shielding assembly further includes a mask support portion, and the mask support portion includes a first support portion and a second support portion;

[0011] The first support portion is connected to the first mask to support and drive the first mask to move up and down along the axis of the rotating shaft;

[0012] The second support portion is connected to the second mask to fixedly connect the second mask to the carrier assembly.

[0013] Optionally, the spin coating and developing equipment further includes a drain pipeline. One end of the drain pipeline is connected to the bottom of the third mask, and the opposite end extends to the outside of the developing chamber.

[0014] Optionally, when looking down at the developing chamber along the axis of the rotating shaft, the outer peripheral contour of the second mask is located within the outer peripheral contour of the substrate, and the height of the second mask along the axis of the rotating shaft is 30 mm to 60 mm.

[0015] Optionally, the first mask includes a first mask body having a cylindrical structure, and the third mask includes a third mask body having a cylindrical structure. Both the first mask body and the third mask body are coaxially arranged with the rotating shaft.

[0016] Optionally, the first mask further includes an anti-sticking layer, and the anti-sticking layer is located on the inner wall of the cylindrical structure of the first mask body. The thickness of the anti-sticking layer is 0.01 mm to 1 mm.

[0017] Optionally, the first mask is located below the nozzle, and the first mask further includes a top cover, and the top cover is connected to one end of the first mask body close to the nozzle;

[0018] Optionally, the outer diameter of the first cylindrical cover structure is 400 mm to 600 mm, and the height along the axis direction of the rotating shaft is 200 mm to 400 mm. The inner diameter of the third cylindrical cover structure is 405 mm to 605 mm, and the height along the axis direction of the rotating shaft is 200 mm to 400 mm. Moreover, the inner diameter of the third cylindrical cover structure is larger than the outer diameter of the first cylindrical cover structure.

[0019] As described above, the coating and developing equipment provided by this application has at least the following beneficial effects:

[0020] For the coating and developing equipment of this application, the first mask and the third mask can enclose a diffusion space for the foggy developing solution, so that the foggy developing solution is distributed in the diffusion space. A top cover is provided at one end of the first mask close to the nozzle, which improves the enclosure effect of the diffusion space on the foggy developing solution; along the axis direction of the rotating shaft, the first mask completely exposes the substrate, effectively preventing the atomized developing solution from condensing and dripping onto the substrate directly above the substrate, reducing the risk of poor developing effect caused by the condensation and dripping of the developing solution; an anti-adhesion layer is provided on the inner wall of the first mask, and the second mask is arranged below the substrate and is smaller than the substrate in size, effectively preventing the photoresist waste liquid thrown out by the substrate from adhering to the inner wall of the first mask or bonding to the second mask, effectively reducing the risk that the developing unit cannot be used normally due to the adhesion of the photoresist waste liquid. Therefore, compared with the prior art, the coating and developing equipment of this application effectively improves the product yield, reduces the maintenance frequency of the equipment, saves the enterprise cost, and has extremely high promotion value. Description of the Drawings

[0021] In order to more clearly illustrate the technical solutions of the embodiments of this application, the drawings required to be used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application, so they should not be regarded as limiting the scope. For those of ordinary skill in the art, without creative efforts, other related drawings can also be obtained based on these drawings.

[0022] Figure 1 It shows a schematic structural diagram of the coating and developing equipment in the prior art provided by this application.

[0023] Figure 2 It shows a schematic structural diagram of the coating and developing equipment provided by the specific embodiment of this application.

[0024] Figure 3 It shows a schematic structural diagram of the coating and developing equipment with an anti-adhesion layer provided by the specific embodiment of this application.

[0025] Figure 4 It shows a schematic structural diagram of the coating and developing equipment with a top cover provided by the specific embodiment of this application.

[0026] Figure 5 Shown is a schematic structural diagram of a spin coating and developing apparatus with a lubricating layer provided in a specific embodiment of the present application.

[0027] Figure 6 Shown is a schematic structural diagram of a spin coating and developing apparatus with a coating chamber provided in a specific embodiment of the present application.

[0028] Schematic illustration of reference numerals:

[0029] 1, developing unit; 11, developing chamber; 111, placement groove; 12, carrier assembly; 121, carrier base; 122, rotating shaft; 13, shielding assembly; 131, first mask; 1311, first cover; 1312, anti - sticking layer; 1313, top cover; 1314, cover through - hole; 132, second mask; 1321, second cover; 133, third mask; 1331, third cover; 1332, cover bottom plate; 1333, lubricating layer; 134, cover support portion; 1341, first support portion; 1342, second support portion; 14, spraying assembly; 141, nozzle; 142, movable arm; 15, liquid discharge pipeline; 2, coating unit. Specific Embodiment

[0030] To make the technical objectives, technical solutions and technical effects of the present application clearer, the technical solutions in the present application will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Usually, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the present application is not intended to limit the scope of the present application claimed, but merely represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts fall within the scope of protection of the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0032] In the description of the present application, it should be noted that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "up", "down", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present application.

[0033] In the description of the present application, it should be noted that, unless otherwise clearly specified and defined, the terms "installation", "connection", and "attachment" should be understood in a broad sense. For example, it can be a fixed connection or a detachable connection. In addition, the description with reference to terms such as "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiments or examples are included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0034] Referring to Figure 1 , in the prior art, the glue coating and developing equipment includes a top cover, an upper mask, a middle mask, a lower mask, and a nozzle. During the developing process, the lower mask is located below the substrate, the middle mask is located between the lower mask and the substrate, the upper mask is sleeved around the outer periphery of the substrate, and the nozzle is located above the substrate and the upper mask to spray the developing solution onto the substrate. The top cover is located above the upper mask. The top cover, the upper mask, the middle mask, and the lower mask enclose a diffusion space for the fog-like developing solution. As the developing process progresses, the fog-like developing solution will condense on the top cover to form condensate beads. The developing solution condensate beads will drip onto the substrate during the movement of the top cover, thereby affecting the developing effect. In addition, due to the high viscosity of the photoresist on the substrate, the photoresist waste liquid from the substrate is extremely likely to adhere and accumulate on the upper mask and the middle mask, thereby affecting the normal use of the equipment.

[0035] Based on the above technical problems, the present embodiment provides a glue coating and developing equipment. Referring to Figure 2 , it includes a developing unit 1. The developing unit 1 includes a developing chamber 11, a carrying component 12, a spraying component 14, and a shielding component 13. Among them, the developing chamber 11 is a place where the developing process is carried out. The carrying component 12, the spraying component 14, and the shielding component 13 are all arranged in the developing chamber 11.

[0036] In the present embodiment, the carrying component 12 is connected to the bottom of the developing chamber 11. The carrying component 12 includes a carrying base 121 and a rotating shaft 122. The carrying base 121 is used to place the substrate. The rotating shaft 122 is located below the carrying base 121 and is connected to the carrying base 121. The rotating shaft 122 is used to support the rotating base and drive the rotating base to rotate. Optionally, the carrying base 121 can also adsorb the substrate to fix the substrate on the carrying base 121.

[0037] The spraying component 14 includes a nozzle 141. The nozzle 141 is located above the substrate and is used to spray the developing solution onto the surface of the substrate.

[0038] The shielding assembly 13 is sleeved on the outer periphery of the rotating shaft 122, and includes a first mask 131, a second mask 132, and a third mask 133. The third mask 133 is located below the carrier base 121, is connected to the bottom of the developing chamber 11, and is sleeved on the outer periphery of the first mask 131. The first mask 131 can move up and down along the axis of the rotating shaft 122, so that the first mask 131 can be sleeved on the outer periphery of the substrate. The second mask 132 is disposed between the carrier base 121 and the third mask 133 and is connected to the carrier assembly 12.

[0039] When the developing process is not performed, the first mask 131 is sleeved on the outer periphery of the rotating shaft 122 and is located within the third mask 133. The third mask 133 is located below the carrier base 121, and the second mask 132 is located between the carrier base 121 and the third carrier base 121, which greatly facilitates the loading and unloading of the substrate. When the developing process is performed, the first mask 131 is controlled to move upward so that the first mask 131 is sleeved on the outer periphery of the substrate, and a diffusion space for the developing solution is formed with the third mask 133 and the second mask 132. Moreover, the size of the top opening of the first mask 131 is larger than the size of the substrate, which can effectively prevent the condensed beads of the developing solution from dripping onto the surface of the substrate. And during the developing process, the photoresist waste liquid flung out by the rotation of the substrate moves to the inner wall of the first mask 131 and slides down along the inner wall of the first mask 131 into the third mask 133, which can prevent the photoresist waste liquid from sticking to the second mask 132 and reduce the accumulation of the photoresist waste liquid.

[0040] In this embodiment, referring to Figure 2 , the spraying assembly 14 further includes a movable arm 142. The nozzle 141 is located at one end of the movable arm 142 and is connected to the movable arm 142. The movable arm 142 is used to support the nozzle 141 and drive the nozzle 141 to move. Optionally, the nozzle 141 is fixedly connected to the movable arm 142, and the movable arm 142 can drive the nozzle 141 to move above the substrate. Further, the spraying assembly 14 further includes a transfer pipe. The transfer pipe is connected to the nozzle 141 and is used to convey the developing solution flowing in the transfer pipe to the nozzle 141. The transfer pipe is also connected to the movable arm 142 so that the movable arm 142 supports and fixes the transfer pipe.

[0041] In an alternative embodiment, a placement groove 111 is provided on the inner wall of the developing chamber 11. The placement groove 111 is used to place the nozzle 141. The movable arm 142 can drive the nozzle 141 to move into the placement groove 111. Optionally, the placement groove 111 can also be used to place the movable arm 142. The placement groove 111 extends along the circumferential direction of the inner wall of the developing chamber 11. When the movable arm 142 drives the nozzle 141 to move into the placement groove 111, the part of the movable arm 142 close to the nozzle 141 is located within the placement groove 111.

[0042] In this embodiment, referring to Figure 3, the shielding component 13 further includes a cover body support portion 134, and the cover body support portion 134 includes a first support portion 1341 and a second support portion 1342; the first support portion 1341 is connected to the first mask 131, and is used to support the first mask 131 and drive the first support portion 1341 to move up and down along the axis of the rotation shaft 122; the second support portion 1342 is connected to the second mask 132, and is used to connect the second mask 132 to the carrier assembly 12 to support the second mask 132.

[0043] In an alternative embodiment, the first support portion 1341 includes a first connecting rod and a transmission shaft. The opposite ends of the first connecting rod are respectively connected to the first mask 131 and the transmission shaft. The transmission shaft can drive the first connecting rod to move up and down along the axis of the rotation shaft 122, so that the first mask 131 can move up and down. The second support portion 1342 includes a second connecting rod. The opposite ends of the second connecting rod are respectively connected to the second mask 132 and the rotation shaft 122 to connect the second mask 132 to the carrier assembly 12. Optionally, the first support portion 1341 and the first mask 131 are fixedly connected, and the second support portion 1342 and the carrier assembly 12 are detachably fixedly connected.

[0044] In this embodiment, referring to Figure 3 , the glue coating and developing device further includes a liquid discharge pipeline 15. One end of the liquid discharge pipeline 15 is connected to the bottom of the third mask 133, and the opposite end extends to the outside of the developing chamber 11, and is used to discharge the liquid in the third mask 133 from the developing chamber 11. Optionally, there are two liquid discharge pipelines 15, and the two liquid discharge pipelines 15 are respectively connected to the opposite sides of the bottom of the third mask 133.

[0045] In this embodiment, the first mask 131 includes a first cover body 1311, the second mask 132 includes a second cover body 1321, both the first cover body 1311 and the second cover body 1321 are in a cylindrical structure, and the first cover body 1311 and the second cover body 1321 are both coaxially arranged with the rotation shaft 122.

[0046] In an alternative embodiment, referring to Figure 3The first mask 131 also includes an anti-sticking layer 1312, which is located on the inner wall of the cylindrical structure of the first cover body 1311. The material of the anti-sticking layer 1312 is an anti-sticking material, which is used to prevent the photoresist waste liquid from sticking. Optionally, the material of the anti-sticking layer 1312 is Teflon material, and the anti-sticking layer 1312 is a Teflon coating. Teflon material is a polymer material that uses fluorine to replace hydrogen atoms in polyethylene. Teflon material has the characteristics of acid and alkali resistance, organic solvent resistance, etc., and is insoluble in almost all solvents, so that it can better adapt to the development environment, does not react with various solvents in the development process, and will not cause adverse effects on the development process. In addition, Teflon material has excellent high temperature resistance and extremely low friction coefficient, which can effectively prevent the photoresist waste liquid thrown off the substrate surface from sticking to the inner wall of the first mask 131, and make the photoresist waste liquid slide into the third mask 133 and be discharged through the drainage pipeline 15. Furthermore, the thickness of the anti-sticking layer 1312 is 0.05 mm to 1 mm, for example, 0.05 mm, 0.07 mm, 0.08 mm, 1 mm or other suitable values.

[0047] In an alternative embodiment, reference Figure 4 The first mask 131 also includes a top cover 1313. The first mask 131 is located below the nozzle 141. The top cover 1313 is connected to one end of the first cover body 1311 close to the nozzle 141. In addition, a cover through hole 1314 is provided in the top cover 1313. When the developing chamber 11 is viewed from the axial direction of the rotating shaft 122, the outer contour of the substrate is located in the cover through hole 1314. Optionally, the cover through hole 1314 is a circular through hole. The diameter of the cover through hole 1314 is larger than the diameter of the substrate, so that the cover through hole 1314 can completely expose the substrate. By setting the top cover 1313, the blocking effect of the mist developer can be improved, so that the mist developer is located in the diffusion space surrounded by the first mask 131 and the third mask 133. The size of the cover through hole 1314 is larger than the size of the substrate, which can prevent the mist developer from condensing into liquid directly above the substrate and then dripping onto the substrate surface.

[0048] In an alternative embodiment, the outer diameter of the cylindrical structure of the first cover 1311 is 400 mm to 600 mm. For example, the outer diameter of the first cover 1311 can be 400 mm, 450 mm, 500 mm, 550 mm, 600 mm or other suitable values; the height of the first cover 1311 in the axial direction of the rotation axis 122 is 200 mm to 400 mm. For example, it can be 200 mm, 250 mm, 300 mm, 350, 400 mm or other suitable values. The inner diameter of the cylindrical structure of the third cover 1331 is 405 mm to 605 mm. For example, it can be 405 mm, 450 mm, 500 mm, 550 mm, 6005 mm or other suitable values; the height of the third cover 1331 in the axial direction of the rotation axis 122 is 200 mm to 400 mm. For example, it can be 200 mm, 250 mm, 300 mm, 350, 400 mm or other suitable values. Optionally, the inner diameter of the cylindrical structure of the third cover 1331 is greater than the outer diameter of the cylindrical structure of the first cover 1311.

[0049] In an alternative embodiment, referring to Figure 5 , the third mask 133 further includes a lubricating layer 1333. The lubricating layer 1333 is located on the inner wall of the third cover 1331 and is used to prevent the adhesion of the photoresist waste liquid, avoid the accumulation of the photoresist waste liquid between the third mask 133 and the first mask 131, and thus affect the normal use of the third mask 133 and the first mask 131. Optionally, the lubricating layer 1333 is a Teflon coating, and the thickness of the lubricating layer 1333 is 0.05 mm to 1 mm.

[0050] In an alternative embodiment, the third mask 133 further includes a cover bottom plate 1332. The cover bottom plate 1332 is connected to the bottom of the third cover 1331 and is located at one end of the third cover 1331 away from the nozzle 141. The drain pipe 15 is connected to the cover bottom plate 1332 and communicates with the diffusion space formed by the third cover 1331 and the first cover 1311, so that the liquid on the cover bottom plate 1332 flows out of the development chamber 11 through the drain pipe 15.

[0051] In an alternative embodiment, the second mask 132 is located below the carrier base 121. Looking down at the development chamber 11 in the axial direction of the rotation axis 122, the outer contour of the second mask 132 is located within the outer contour of the substrate; optionally, the height of the second mask 132 in the axial direction of the rotation axis 122 is 30 mm to 60 mm. For example, it can be 30 mm, 40 mm, 50 mm, 60 mm or other suitable values; further, the second mask 132 includes a second cover 1321. The second cover 1321 has a cylindrical structure, and the diameter of the cylindrical structure of the second cover 1321 is smaller than the diameter of the substrate.

[0052] In this embodiment, referring to Figure 6, the coating and developing apparatus further includes a coating unit 2 for performing a coating process. Optionally, the coating unit 2 is located above the developing chamber 11. Further, the coating and developing apparatus may further include a plurality of coating units 2 and a plurality of developing units 1. For example, it includes two coating units 2 and two developing units 1, and the coating units 2 are all located above the developing chamber 11.

[0053] In summary, for the coating and developing apparatus of this embodiment, the first mask 131 and the third mask 133 can enclose a diffusion space for the fog-like developing solution, preventing the large-scale outward diffusion of the developing solution. The first mask 131 completely exposes the substrate along the axis direction of the rotation axis 122, which can effectively prevent the atomized developing solution from condensing and dripping onto the surface of the substrate directly above the substrate, thereby reducing the risk of poor developing effect caused by the additional dripping of the developing solution. The inner wall of the first mask 131 is provided with an anti-adhesion layer 1312, and the inner wall of the third mask 133 is provided with a lubricating layer. The second mask 132 is located below the substrate and has a size smaller than that of the substrate, which can effectively prevent the photoresist waste liquid thrown out by the substrate from adhering to the second mask 132 or accumulating by adhesion on the inner walls of the first mask 131 and the third mask 133, effectively reducing the risk that the developing unit 1 cannot be used normally due to the adhesion of the photoresist waste liquid. Therefore, compared with the prior art, the coating and developing apparatus of this embodiment effectively improves the product yield, reduces the maintenance frequency of the equipment, saves the enterprise cost, and has great popularization value.

[0054] The above embodiments are only illustrative of the principles and effects of the present application and are not intended to limit the present application. Any person familiar with this technology can modify, change or combine the above embodiments without departing from the spirit and scope of the present application. Therefore, all equivalent modifications or changes completed by those with ordinary knowledge in the technical field without departing from the spirit and technical idea disclosed by the present application should still be covered by the claims of the present application.

Claims

1. A glue coating and developing device, characterized in that It includes a developing unit, and the developing unit includes a carrying component, a spraying component, a shielding component, and a developing chamber for performing a developing process; The carrying component is connected to the bottom of the developing chamber, and includes a carrying base for placing a substrate and a rotating shaft connected below the carrying base, and the rotating shaft supports and drives the carrying base to rotate; The spraying component includes a nozzle located above the substrate for spraying a developing solution onto the substrate; The shielding component is sleeved on the outer periphery of the rotating shaft, and includes a first mask, a second mask, and a third mask. The third mask is located below the carrying base and connected to the bottom of the developing chamber, and is sleeved on the outer periphery of the first mask. The first mask can move up and down along the axis of the rotating shaft so that the first mask is sleeved on the outer periphery of the substrate. The second mask is located below the carrying base and connected to the carrying component.

2. The glue coating and developing device according to claim 1, wherein, The spraying component further includes a movable arm, and the nozzle is connected to one end of the movable arm, and the movable arm supports and drives the nozzle to move above the substrate.

3. The glue coating and developing device according to claim 2, characterized in that, A placement groove is provided on the inner wall of the developing chamber, and the movable arm can drive the nozzle to move into the placement groove.

4. The glue coating and developing device according to claim 1, characterized in that, The shielding component further includes a mask support part, and the mask support part includes a first support part and a second support part; The first support part is connected to the first mask to support and drive the first mask to move up and down along the axis of the rotating shaft; The second support part is connected to the second mask to fixedly connect the second mask to the carrying component.

5. The glue coating and developing device according to claim 1, wherein It further includes a drainage pipeline, one end of the drainage pipeline is connected to the bottom of the third mask, and the opposite end extends to the outside of the developing chamber.

6. The glue coating and developing device according to claim 1, wherein Looking down at the developing chamber along the axis of the rotating shaft, the outer peripheral contour of the second mask is located within the outer peripheral contour of the substrate, and the height of the second mask along the axis of the rotating shaft is 30 mm to 60 mm.

7. The glue coating and developing device according to claim 1, characterized in that, The first mask includes a first cover body in a cylindrical structure, and the third mask includes a third cover body in a cylindrical structure. Both the first cover body and the third cover body are coaxially arranged with the rotating shaft.

8. The glue coating and developing device according to claim 7, characterized in that The first mask further includes an anti-sticking layer, and the anti-sticking layer is located on the inner wall of the cylindrical structure of the first cover body, and the thickness of the anti-sticking layer is 0.01 mm to 1 mm.

9. The glue coating and developing device according to claim 7 or 8, characterized in that, The first mask is located below the nozzle, and the first mask further includes a top cover, and the top cover is connected to one end of the first cover body close to the nozzle; Wherein, a cover body through hole is provided on the top cover. Looking down at the developing chamber along the axis of the rotating shaft, the outer peripheral contour of the substrate is located within the cover body through hole.

10. The glue coating and developing device according to claim 7, characterized in that, The outer diameter of the cylindrical structure of the first cover body is 400 mm to 600 mm, and the height along the axis of the rotating shaft is 200 mm to 400 mm. The inner diameter of the cylindrical structure of the third cover body is 405 mm to 605 mm, and the height along the axis of the rotating shaft is 200 mm to 400 mm. And the inner diameter of the cylindrical structure of the third cover body is larger than the outer diameter of the cylindrical structure of the first cover body.

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