Computing device with preheating of discrete graphics cards

By setting a heater and temperature sensor around the independent graphics card, the graphics card temperature is monitored in real time and heated to the working temperature, the problem of the independent graphics card not being started at low temperatures is solved, ensuring the normal display of the fast start and driving functions.

CN223092380UActive Publication Date: 2025-07-11INTEL CORP
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Patent Information

Application Number
CN202421907187.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-08-07
Publication Date
2025-07-11
Estimated Expiration
2034-08-07

AI Technical Summary

Technical Problem

The independent graphics card cannot start normally in a low temperature environment, and the startup time is long, which affects the user experience and the rapid start of driving functions.

Method used

Set up a heater around the graphics card die, heat it through a resistor coil, and combine it with a temperature sensor and controller to monitor the graphics card temperature in real time to ensure that the graphics card is started after heating to the working temperature at low temperatures.

Benefits of technology

It realizes the normal startup of the independent graphics card in a low temperature environment, reduces the startup time, and improves the user experience and fast response speed of driving functions.

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Abstract

Provided is a computing device, comprising: a processor and a first graphics card device disposed in the same package; the second display card device comprises a substrate, a tube core located on the substrate, a heater located on the substrate and surrounding the tube core, and a temperature sensor located on the tube core, and the second display card device and the processor are arranged in different packages and are in communication coupling with each other; the controller is configured to control the temperature sensor to measure the temperature of the second graphics card device in response to a received startup instruction; if the temperature of the second display card device is lower than the working temperature, starting the heater; and if the temperature of the second display card device reaches the working temperature, starting the second display card device.
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Description

Technical Field

[0001] The present disclosure generally relates to a computing device, and more particularly, to a computing device having preheating of a discrete graphics card. Background Art

[0002] With the continuous development and popularization of automobiles, the computing power requirements for the automotive cockpit are getting higher and higher. For this reason, consumer discrete graphics cards that meet large 3A games and AI operations are gradually applied in automotive cockpits. In this case, the central processing unit (CPU) and integrated graphics card in the automotive computing system can be configured to meet the display needs of basic driving operations, while the discrete graphics card can meet the entertainment needs of passengers such as games. However, in automotive application scenarios, low temperatures are usually encountered, for example, a low temperature of minus 40 degrees. At low temperatures, the discrete graphics card may not be able to start and run properly. In addition, the time required for the discrete graphics card to load itself may be longer than the time required for the CPU and integrated graphics card to start, so the use of the discrete graphics card may cause the user to wait longer when starting the vehicle, thereby reducing the user experience.

[0003] Therefore, a solution that can start the discrete graphics card at low temperatures is needed, and at the same time, a solution that can achieve fast startup when the user starts the vehicle is also needed. Summary of the Utility Model

[0004] In view of the above problems, the present disclosure provides a computing device, which includes: a processor and a first graphics card device, disposed in the same package; a second graphics card device, which includes a substrate, a die located on the substrate, a heater located on the substrate and surrounding the die, and a temperature sensor located on the die, the second graphics card device is disposed in a different package from the processor and is communicatively coupled therewith; and a controller, which is configured to: in response to receiving a power-on instruction, control the temperature sensor to measure the temperature of the second graphics card device; if the temperature of the second graphics card device is lower than the operating temperature, start the heater; and if the temperature of the second graphics card device reaches the operating temperature, start the second graphics card device.

[0005] In an embodiment, the controller is further configured to: in response to receiving the power-on instruction, start the processor and the first graphics card device before controlling the temperature sensor to measure the temperature of the second graphics card device.

[0006] In an embodiment, the controller is further configured to: after starting the heater, continuously control the temperature sensor to measure the temperature of the second graphics card device, and after the temperature of the second graphics card device reaches the operating temperature, deactivate the heater and start the second graphics card device.

[0007] In an embodiment, starting the second graphics card device includes: the controller notifying the processor and the first graphics card device to start the second graphics card device to load the second graphics card device.

[0008] In an embodiment, the heater is a resistance coil.

[0009] In an embodiment, the second graphics card device further includes a metal heat sink located on the die and the heater.

[0010] In an embodiment, the operating temperature is zero degrees. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings are incorporated herein and form a part of the specification, illustrating embodiments of the present disclosure and, together with the specification, further serving to explain the principles of the present disclosure and enabling those skilled in the relevant art to make and use the present disclosure.

[0012] Figure 1 A schematic cross-sectional view of a discrete graphics card with preheating according to an embodiment is shown.

[0013] Figure 2 A schematic diagram of a computing device according to an embodiment is shown.

[0014] The embodiments will be described with reference to the drawings. DETAILED DESCRIPTION

[0015] The subject matter described herein will now be discussed with reference to example embodiments. It should be understood that the discussion of these embodiments is only to enable those skilled in the art to better understand and thus implement the subject matter described herein, and is not a limitation on the scope of protection, applicability, or examples set forth in the claims. The functions and arrangements of the elements discussed may be changed without departing from the scope of the present disclosure. Each example may omit, substitute, or add various processes or components as needed. For example, the methods described may be performed in an order different from that described, and each step may be added, omitted, or combined. Additionally, the features described relative to some examples may be combined in other examples.

[0016] It should be noted that references to "an embodiment", "embodiments", "some embodiments", etc. in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but not necessarily every embodiment includes such specific features, structures, or characteristics. Moreover, such phrasings do not necessarily refer to the same embodiment. Additionally, when combining specific features, structures, or characteristics with an embodiment, implementing such features, structures, or characteristics in combination with other embodiments, whether explicitly or implicitly described, should be within the knowledge of those skilled in the relevant art.

[0017] As is known in the art, a discrete graphics card refers to a display chip, video memory, and its related circuits being separately made on a circuit board, existing as an independent board card, and it needs to occupy an expansion slot (ISA, PCI, AGP, or PCI-E) of the motherboard. A discrete graphics card has powerful graphics processing capabilities, far exceeding integrated graphics in performance. It is not only suitable for general work but also has perfect 2D effects and powerful 3D capabilities, so it is more suitable for entertainment purposes such as gaming. Currently, discrete graphics cards have started to be used in automotive computing devices to meet various entertainment needs of passengers, while still using integrated graphics to serve various driving-related display requirements.

[0018] However, a discrete graphics card cannot start properly at low temperatures (e.g., -40°C). In addition, the loading of a discrete graphics card during startup may take a large amount of startup time. Therefore, in a vehicle computing system that has a CPU, an integrated graphics card, and a discrete graphics card, to avoid interference with driving caused by the inability of the discrete graphics card to start or excessive loading time, this application proposes a technical solution for preheating the discrete graphics card. At the same time, a startup scheme is also proposed to improve the startup speed of a vehicle computing system that has a CPU, an integrated graphics card, and a discrete graphics card.

[0019] Figure 1 FIG. shows a schematic cross-sectional view of a discrete graphics card device 100 with preheating according to an embodiment. As shown, it can be seen that the graphics card die 150 of the discrete graphics card device 100 is disposed on a substrate 130. In an embodiment, the graphics card die 150 can be any commercially available graphics card chip. In an embodiment, the substrate 130 can include silicon (e.g., single-crystalline silicon), silicon germanium (SiGe), gallium arsenide (GaAs), germanium (Ge), silicon on insulator (SOI), germanium on insulator (GOI), or any other suitable material. In some embodiments, the substrate 130 can be any suitable heat-conducting material. As Figure 1 shown, the graphics card die 150 and the substrate 130 are disposed on a PCB board. In an embodiment, the PCB board can be the motherboard of the computing device, and the CPU or other devices can also be disposed on this motherboard.

[0020] As Figure 1 shown, a heater 110 is disposed above the substrate 130 and surrounds the graphics card die 150. In some embodiments, the heater 110 can be a resistance coil disposed around the graphics card die 150. In this example, by energizing the resistance coil, the resistance coil generates heat, thereby heating the graphics card die 150. In other embodiments, the heater 110 can be any other suitable material that can generate heat.

[0021] As Figure 1As shown, the radiator 120 can be disposed above the graphics card die 150 and the heater 110. In one example, the radiator 120 can completely cover the graphics card die 150 and the heater 110. However, those skilled in the art can understand that in another example, the radiator 120 can cover the graphics card die 150 and a part of the heater 110. In Figure 1 the example shown, the radiator 120 can contact the heater 110, so as to conduct the heat generated by the heater 110 to the entire upper surface of the graphics card die 150 in contact therewith, thereby making the heating of the die 150 more uniform and increasing the heating speed. In one example, the radiator 120 can be a metal radiator, for example, a metal sheet. In some examples, the metal radiator can be a copper metal sheet.

[0022] On the other hand, the substrate 130 of the graphics card die 150 can also play a role in heat conduction. In the example, the substrate 130 contacts the heater 110 and the lower surface of the graphics card die 150, so as to uniformly conduct the heat generated by the heater 110 to the lower surface of the graphics card die 150. In this way, the upper surface, the lower surface, and the periphery of the graphics card die 150 can all be heated, thereby increasing the heating speed and obtaining a good heating effect.

[0023] In Figure 1 the embodiment, by disposing a heater such as a resistance coil around the graphics card die and between the radiator and the substrate, and contacting the radiator and the substrate respectively, the heat conductivity of the radiator and the substrate can be used to quickly heat the graphics card die, so as to achieve the heating effect when needed.

[0024] Figure 2 FIG. shows a schematic diagram of a computing device 200 according to an embodiment. In the embodiment, the computing device 200 can be an in-vehicle computing device configured to be used in any intelligent vehicle. As Figure 2 shown, the computing device 200 can include a CPU and an integrated graphics device 210 and an Figure 1 independent graphics device 100 as

[0025] In Figure 2In the illustrated embodiment, the integrated graphics device may be a graphics processing unit disposed in the same package as the CPU. It does not have a separate video memory, but uses the memory of the CPU as the video memory. In contrast, the discrete graphics device 100 may be located in a separate package, separated from the CPU and the integrated graphics device 210, but the discrete graphics device 100, the CPU, and the integrated graphics device 210 are all disposed on or plugged into the PCB board. In the embodiment, the CPU, the integrated graphics device 210, and the discrete graphics 100 may be communicatively coupled through an interconnect. In some examples, the interconnect may include PCIE (PCI-Express, Peripheral Component Interconnect Express). In other examples, other types of interconnects may also be used.

[0026] As Figure 2 shown, the discrete graphics device 100 may include a discrete graphics die 150, a heater 110 disposed around the die 150, and a temperature sensor 160 disposed on the die 150. As described above, the heater 110 may include a resistance coil that self-heats when powered on. The temperature sensor 160 may be located on the surface of the die 150 and can measure the temperature of the die 150 in real time.

[0027] As Figure 2 shown, the computing device 200 may further include a controller 220, for example, an embedded controller. In the embodiment, the controller 220 may be connected to the CPU, the integrated graphics device 210, and the discrete graphics device 100 respectively to control their operations.

[0028] In one example, when a user or driver starts the vehicle, the controller 220 first receives a power-on instruction. In response to the power-on instruction, the controller 220 may control the temperature sensor 160 to measure the temperature of the discrete graphics die 150. Since the vehicle may be in a low-temperature environment (e.g., minus 40 degrees), the temperature of the discrete graphics die 150 may also be low, for example, below its operating temperature, which may cause the discrete graphics die 150 to fail to start normally. At this time, the controller 220 may start the heater 110, for example, power on the resistance coil to start heating the die 150. During the process of the heater 110 heating the die 150, the controller 220 may always control the temperature sensor 160 to measure the temperature of the die 150, so as to monitor the temperature of the die 150 in real time. In this way, when the temperature of the discrete graphics die 150 reaches its operating temperature, the controller 220 may turn off the heater 110 and send a command signal to start / enable the discrete graphics 110 to the CPU and the integrated graphics device 210. In response to the start command, the CPU and the integrated graphics device 210 may initialize the PCIE bus line, enumerate the discrete graphics card, and load the discrete graphics driver to make the discrete graphics work properly.

[0029] Those skilled in the art can understand that in one example, the operating temperature of the discrete graphics die 150 can be zero degrees Celsius. However, in other examples, the discrete graphics die 150 can adopt different operating temperatures.

[0030] On the other hand, as mentioned above, since discrete graphics cards are usually used for entertainment needs such as gaming, while integrated graphics cards are still used for displays related to driving functions, for example, instrument screens and center console screens. Therefore, when the user starts the vehicle, it is very necessary to quickly start the screen display function related to the driving function. In some examples, when the user starts the reverse function, it is necessary to quickly turn on the reverse camera and quickly display the image of the reverse camera on the center console screen. Therefore, as mentioned above, the loading of the discrete graphics card takes a certain amount of time. Thus, if the CPU waits for the discrete graphics card to start, it will cause a delay in the display related to the driving function, resulting in a reduction in the user experience.

[0031] In an embodiment of the present disclosure, when the controller 220 receives a power-on instruction, it can first start / activate the CPU and the integrated graphics card to meet the screen display function related to driving. Meanwhile, or after that, the controller 220 can control the temperature sensor 160 to measure the temperature of the discrete graphics die 150, and as described above, when the temperature of the discrete graphics die 150 is lower than the operating temperature, the heater can be turned on to heat the die, and after the temperature of the die 150 reaches the operating temperature, the heater 110 can be turned off and the CPU and the integrated graphics card can be notified to start the discrete graphics card.

[0032] Through the above startup method, not only can the normal startup of the discrete graphics card be ensured in a low-temperature environment by using the heater, but also the startup speed of the display related to the driving function can be ensured not to be affected by the loading speed of the discrete graphics card by starting the CPU and the integrated graphics card first and then starting the discrete graphics card, so as to meet the requirement of quick startup.

[0033] The above description of the present disclosure is provided to enable any ordinary person skilled in the art to implement or use the present disclosure. For ordinary persons skilled in the art, various modifications to the present disclosure are obvious, and the general principles defined herein can also be applied to other variations without departing from the protection scope of the present disclosure. Therefore, the present disclosure is not limited to the examples and designs described herein, but is consistent with the broadest scope that conforms to the principles and novel features disclosed herein.

Claims

1. A computing device, comprising: a processor and a first graphics card device, disposed in the same package; a second graphics card device, which includes a substrate, a die located on the substrate, a heater located on the substrate and surrounding the die, and a temperature sensor located on the die, the second graphics card device and the processor are disposed in different packages and are communicatively coupled to each other; and a controller, which is configured to: in response to receiving a power-on instruction, control the temperature sensor to measure the temperature of the second graphics card device; if the temperature of the second graphics card device is lower than the operating temperature, start the heater; and if the temperature of the second graphics card device reaches the operating temperature, start the second graphics card device.

2. The computing device according to claim 1, wherein, The controller is further configured to: in response to receiving the power-on instruction, start the processor and the first graphics card device before controlling the temperature sensor to measure the temperature of the second graphics card device.

3. The computing device according to claim 1 or 2, wherein, The controller is further configured to: after starting the heater, continuously control the temperature sensor to measure the temperature of the second graphics card device, and after the temperature of the second graphics card device reaches the operating temperature, deactivate the heater and start the second graphics card device.

4. The computing device according to claim 3, wherein, Starting the second graphics card device includes: the controller notifying the processor and the first graphics card device to start the second graphics card device to load the second graphics card device.

5. The computing device according to claim 1 or 2, wherein The heater is a resistance coil.

6. The computing device according to claim 1 or 2, wherein The second graphics card device further includes a metal heat sink located on the die and the heater.

7. The computing device according to claim 1 or 2, wherein, The operating temperature is zero degrees.