Semiconductor coating device based on CCP plasma technology

Abstract

The utility model discloses a semiconductor coating device based on a CCP plasma technology, which belongs to the technical field of semiconductor coating and comprises a box body, a hydraulic cylinder is arranged in the middle of the top of the box body, a side plate is fixedly connected to one side of the box body, an air blower is arranged at the top of the side plate, an air outlet pipe is arranged at the top of the air blower, and the air outlet pipe is connected with the hydraulic cylinder. An air inlet pipe is arranged on the other side of the air blower, a driving motor is arranged on the lower portion of the outer wall of the box body, and a bearing plate is fixedly connected to the lower portion of a back door of the box body. Secondary pollution caused by independent cleaning of the semiconductor can be avoided, the cleaning effect can be improved, the semiconductor coating effect can be improved, and the situation that the semiconductor needs to be taken out of the coating device to be cleaned again due to the fact that the surface of the semiconductor is contaminated in the placing process of the semiconductor, time and labor are wasted, and the coating efficiency is reduced is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor coating, and more specifically, to a semiconductor coating device based on CCP plasma technology. Background Art

[0002] CCP plasma is a kind of cold plasma, whose characteristic is that when the plasma is in a high-temperature state, the surrounding substances can maintain a relatively low temperature. This special property enables CCP plasma to have wide applications in fields such as semiconductor manufacturing and surface treatment.

[0003] In the prior art, the patent document with the authorization announcement number CN222219978U discloses "a coating device for semiconductor production"; it includes a support plate, on the upper surface of the support plate, a box body is fixedly connected. Inside the box body, there is a fixing plate. On the upper surface of the fixing plate, symmetric fixing blocks and a double-headed motor are fixedly connected respectively. On one side surface of each fixing block close to each other, a first bearing is fixedly embedded. On the upper surface of the fixing plate, two groups of symmetric slideways are opened.

[0004] Although the prior art can coat the semiconductor without manual flipping by the staff, this device does not have the CCP plasma cleaning function. If the semiconductor surface is contaminated during placement, the semiconductor needs to be taken out of the box body for re-cleaning, which is time-consuming and laborious. In addition, the coating of the prior art is mainly carried out on the semiconductor through a connecting pipe, and the position of the connecting pipe is fixed and cannot move, resulting in a limited coating range and reduced coating efficiency. Summary of the Utility Model

[0005] The main technical problem to be solved by the utility model is to provide a semiconductor coating device based on CCP plasma technology, which can solve the problems raised in the above background art.

[0006] To solve the above technical problem, according to one aspect of the utility model, more specifically, it is a semiconductor coating device based on CCP plasma technology, including a box body. In the middle of the top of the box body, a hydraulic cylinder is arranged. On the side of the box body, a side plate is fixedly connected. On the top of the side plate, a blower is arranged. On the top of the blower, an air outlet pipe is arranged. On the side of the blower, an air inlet pipe is arranged. At the lower part of the outer wall of the box body, a driving motor is arranged. At the lower part of the back door of the box body, a bearing plate is fixedly connected. On the top of the bearing plate, a liquid storage tank is arranged. On the side of the liquid storage tank, a delivery pipe is arranged. At one end of the delivery pipe located inside the box body, a spray head is arranged;

[0007] A cleaning cavity is arranged inside the box body. A coating cavity is arranged inside the box body. An opening is arranged between the coating cavity and the cleaning cavity. A sliding partition is slidably connected to the inner wall of the opening;

[0008] An electrode plate is arranged in the cleaning cavity, and a radio frequency power supply is arranged on the left side surface of the box body.

[0009] Furthermore, a filter screen is arranged at one end of the air inlet pipe located inside the box body.

[0010] Furthermore, a three-stage telescopic rod is arranged at the bottom of the hydraulic cylinder. An installation plate is arranged at the bottom of the three-stage telescopic rod. A fixing block is fixedly connected to the bottom of the installation plate. An installation groove is arranged inside the fixing block. A docking block is slidably connected inside the installation groove. A frame is fixedly connected to the bottom of the docking block. A threaded rod is threadedly connected inside the frame. A clamping plate is arranged at one end of the threaded rod located inside the frame.

[0011] Furthermore, a rotating shaft is arranged on the side surface of the driving motor. A transmission plate is fixedly connected to one end of the rotating shaft located inside the coating cavity. A first rotating rod is fixedly connected to one end of the transmission plate on one side. A second rotating rod is fixedly connected to the inner wall of the coating cavity. A driven plate is arranged at one end of the second rotating rod. A sliding groove is arranged inside the driven plate. A sliding block is arranged inside the sliding groove. Ball bearings are arranged inside the sliding block and at the bottom end of the driven plate.

[0012] Furthermore, a liquid injection port is arranged at the top of the liquid storage tank, and a sealing cover is arranged at the liquid injection port.

[0013] Furthermore, the delivery pipe is connected to the top end of the driven plate.

[0014] The beneficial effects of the semiconductor coating device based on CCP plasma technology of the present utility model are as follows:

[0015] By arranging the radio frequency power supply and the electrode plate, CCP plasma cleaning of the semiconductor is realized before coating the semiconductor. It can not only avoid secondary pollution caused by separate cleaning of the semiconductor, but also improve the cleaning effect, which is beneficial to improving the semiconductor coating effect. It also avoids the need to take out the semiconductor from the coating device for re-cleaning due to contamination on the surface of the semiconductor during placement, which is time-consuming and laborious and also reduces the coating efficiency.

[0016] By arranging the driven plate and the transmission plate, the rotating shaft is driven to rotate by the driving motor, thereby driving the transmission plate to rotate. Then, the slider is driven to move back and forth in the sliding groove through the first rotating rod, so that the driven plate swings regularly, increasing the spraying range of the liquid by the delivery pipe, making the semiconductor coating more uniform and improving the coating efficiency. Description of the Drawings

[0017] The following further elaborates on the present utility model in detail in conjunction with the drawings and specific implementation methods.

[0018] Figure 1Front schematic view of a semiconductor coating device based on CCP plasma technology of the present utility model;

[0019] Figure 2 Back schematic view of a semiconductor coating device based on CCP plasma technology of the present utility model;

[0020] Figure 3 Internal schematic view of a semiconductor coating device based on CCP plasma technology of the present utility model;

[0021] Figure 4 Schematic view of the swing of the driven plate of a semiconductor coating device based on CCP plasma technology of the present utility model;

[0022] Figure 5 Overall structural schematic view of the frame of a semiconductor coating device based on CCP plasma technology of the present utility model.

[0023] In the figure: 1, box body; 2, hydraulic cylinder; 3, side plate; 4, blower; 5, air outlet pipe; 6, air inlet pipe; 7, drive motor; 8, bearing plate; 9, liquid storage tank; 10, delivery pipe; 11, cleaning chamber; 12, opening; 13, coating chamber; 14, sliding partition; 15, three-section telescopic rod; 16, mounting plate; 17, fixed block; 18, docking block; 19, frame; 20, threaded rod; 21, clamping plate; 22, rotating shaft; 23, transmission plate; 24, first rotating rod; 25, ball bearing; 26, driven plate; 27, chute; 28, slider; 29, electrode plate; 30, spray head; 31, second rotating rod; 32, radio frequency power supply. Specific embodiments

[0024] To make the technical solutions of the present utility model clearer, the following further describes the present utility model in detail with reference to the accompanying drawings and specific embodiments.

[0025] Embodiment

[0026] As Figures 1 - 5 shown, according to one aspect of the present utility model, there is provided a semiconductor coating device based on CCP plasma technology, including a box body 1, a hydraulic cylinder 2 is arranged in the middle of the top of the box body 1, a side plate 3 is fixedly connected to the side of the box body 1, a blower 4 is arranged on the top of the side plate 3, an air outlet pipe 5 is arranged on the top of the blower 4, an air inlet pipe 6 is arranged on the side of the blower 4, a drive motor 7 is arranged on the lower part of the outer wall of the box body 1, a bearing plate 8 is fixedly connected to the lower part of the back door of the box body 1, a liquid storage tank 9 is arranged on the top of the bearing plate 8, a delivery pipe 10 is arranged on the side of the liquid storage tank 9, and a spray head 30 is arranged at one end of the delivery pipe 10 located inside the box body 1;

[0027] A cleaning chamber 11 is provided inside the box body 1, a coating chamber 13 is provided inside the box body 1, an opening 12 is provided between the coating chamber 13 and the cleaning chamber 11, and a sliding partition 14 is slidably connected to the inner wall of the opening 12;

[0028] An electrode plate 29 is provided inside the cleaning chamber 11, a radio frequency power supply 32 is provided on the left side surface of the box body 1, and the radio frequency power supply 32 can apply radio frequency power between the electrode plates 29 to form an alternating electric field, accelerate free electrons, make them collide with gas molecules or atoms, generate ions and more free electrons, and then form a stable plasma. The active species in the plasma can chemically react with the impurities on the surface of the semiconductor to be cleaned in the cleaning chamber 11 or make them detach by physical bombardment, realizing efficient cleaning, avoiding the need to take out the semiconductor from the coating device and re - clean it due to contamination on the semiconductor surface during placement, which is time - consuming and laborious, and also reducing the coating efficiency.

[0029] In this embodiment, a filter screen is provided at one end of the air inlet pipe 6 inside the box body 1 for filtering the air entering the box body 1 to prevent impurities from affecting the coating quality.

[0030] In this embodiment, a three - section telescopic rod 15 is provided at the bottom of the hydraulic cylinder 2, an installation plate 16 is provided at the bottom of the three - section telescopic rod 15, a fixing block 17 is fixedly connected to the bottom of the installation plate 16, an installation groove is provided inside the fixing block 17, a docking block 18 is slidably connected inside the installation groove, a frame 19 is fixedly connected to the bottom of the docking block 18, a threaded rod 20 is threadedly connected inside the frame 19, and a clamping plate 21 is provided at one end of the threaded rod 20 inside the frame 19 for clamping the semiconductor to be coated to keep it stable during coating. At the same time, the adjustable position of the threaded rod 20 adapts to the coating requirements of semiconductors of different sizes, making it more convenient to use.

[0031] In this embodiment, a rotating shaft 22 is provided on the side of the driving motor 7, a transmission plate 23 is fixedly connected to one end of the rotating shaft 22 inside the coating chamber 13, a first rotating rod 24 is fixedly connected to one end of the transmission plate 23 on one side, a second rotating rod 31 is fixedly connected to the inner wall of the coating chamber 13, a driven plate 26 is provided at one end of the second rotating rod 31, a sliding groove 27 is provided inside the driven plate 26, a sliding block 28 is provided inside the sliding groove 27, and ball bearings 25 are provided inside the sliding block 28 and at the bottom end of the driven plate 26. The driving motor 7 drives the rotating shaft 22 to rotate, and then drives the transmission plate 23 fixedly connected to the rotating shaft 22 to rotate. While rotating, the transmission plate 23 drives the sliding block 28 to move up and down inside the sliding groove 27 through the first rotating rod 24, and then makes the driven plate 26 swing regularly. While the driven plate 26 swings, it drives the conveying pipe 10 connected to it to swing together, increasing the area where the conveying pipe 10 sprays liquid during coating and improving the efficiency.

[0032] In this embodiment, a liquid injection port is provided at the top of the liquid storage tank 9, and a sealing cover is provided at the liquid injection port, which facilitates the addition of the coating liquid into the liquid storage tank 9 and ensures the sealing performance of the liquid storage tank 9.

[0033] In this embodiment, the delivery pipe 10 is connected to the top end of the driven plate 26, so that the liquid outlet of the delivery pipe 10 and the driven plate 26 swing together, increasing the area when the liquid is ejected and improving the coating efficiency.

[0034] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the appended claims.

Claims

1. A semiconductor coating device based on CCP plasma technology, comprising a box body (1), characterized in that: In the middle of the top of the box body (1), a hydraulic cylinder (2) is provided. On the side of the box body (1), a side plate (3) is fixedly connected. On the top of the side plate (3), a blower (4) is provided. On the top of the blower (4), an air outlet pipe (5) is provided. On the side of the blower (4), an air inlet pipe (6) is provided. At the lower part of the outer wall of the box body (1), a driving motor (7) is provided. At the lower part of the back door of the box body (1), a bearing plate (8) is fixedly connected. On the top of the bearing plate (8), a liquid storage tank (9) is provided. On the side of the liquid storage tank (9), a delivery pipe (10) is provided. At one end of the delivery pipe (10) located inside the box body (1), a spray head (30) is provided; A cleaning chamber (11) is provided inside the box body (1). A coating chamber (13) is provided inside the box body (1). An opening (12) is provided between the coating chamber (13) and the cleaning chamber (11). A sliding partition plate (14) is slidably connected to the inner wall of the opening (12); An electrode plate (29) is provided inside the cleaning chamber (11). A radio frequency power supply (32) is provided on the left side of the box body (1).

2. The semiconductor coating device based on CCP plasma technology according to claim 1, characterized in that: A filter screen is provided at one end of the air inlet pipe (6) located inside the box body (1).

3. A semiconductor coating device based on CCP plasma technology according to claim 1, characterized in that: At the bottom of the hydraulic cylinder (2), a three-section telescopic rod (15) is provided. At the bottom of the three-section telescopic rod (15), a mounting plate (16) is provided. At the bottom of the mounting plate (16), a fixing block (17) is fixedly connected. An installation groove is provided inside the fixing block (17). A docking block (18) is slidably connected inside the installation groove. At the bottom of the docking block (18), a frame (19) is fixedly connected. A threaded rod (20) is threadedly connected inside the frame (19). At one end of the threaded rod (20) located inside the frame (19), a clamping plate (21) is provided.

4. A semiconductor coating device based on CCP plasma technology according to claim 1, characterized in that: A rotating shaft (22) is provided on the side of the driving motor (7). At one end of the rotating shaft (22) located inside the coating chamber (13), a transmission plate (23) is fixedly connected. At one end of one side of the transmission plate (23), a first rotating rod (24) is fixedly connected. The inner wall of the coating chamber (13) is fixedly connected with a second rotating rod (31). At one end of the second rotating rod (31), a driven plate (26) is provided. A chute (27) is provided inside the driven plate (26). A slider (28) is provided inside the chute (27). Ball bearings (25) are provided inside the slider (28) and at the bottom end of the driven plate (26).

5. A semiconductor coating device based on CCP plasma technology according to claim 4, characterized in that: A liquid injection port is provided on the top of the liquid storage tank (9). A sealing cover is provided at the liquid injection port.

6. The semiconductor coating device based on CCP plasma technology according to claim 4, characterized in that: The delivery pipe (10) is connected to the top end of the driven plate (26).

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