Sucking disc

Abstract

The utility model belongs to the technical field of semiconductor detection, and discloses a sucker which is used for sucking wafers. The sucker comprises an adsorption part and a mounting part. The adsorption part is provided with an adsorption surface, and the wafer is placed on the adsorption surface. The installation part is connected to the side, away from the adsorption face, of the adsorption part and is configured to be connected with an installation base. An extraction opening is formed in the mounting part, and the extraction opening is configured to be connected with an extraction mechanism; a plurality of concentric circle grooves are formed in the adsorption surface, a sealing piece is embedded in each concentric circle groove, a plurality of adsorption holes are formed in each sealing piece at intervals in the circumferential direction, an airflow channel is formed between every two adjacent concentric circle grooves, each adsorption hole is communicated with the airflow channel, and the airflow channel is communicated with the extraction opening. Under the suction action of the air suction mechanism, the wafer can be stably adsorbed. The suction cup can be connected to the mounting base, and when the mounting base rotates at a high speed, the suction cup can also ensure the stability of wafer adsorption.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor detection, in particular to a suction cup. Background Art

[0002] During semiconductor production and testing, wafers need to be fixed on a support platform to ensure the stability of the wafers. During the wafer testing process, the wafers sometimes need to be rotated at high speed, which requires a higher stability of wafer placement.

[0003] Suction cups disclosed in the prior art include vacuum suction cups, direct insertion suction cups, and electrostatic suction cups, which are used to pick up and transport wafers. However, the above suction cups cannot ensure safe and stable high-speed rotation while adsorbing the wafer. Utility Model Content

[0004] The utility model aims to provide a suction cup which can absorb the wafer and ensure the stability of wafer placement under high-speed rotation.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A suction cup is provided for adsorbing a wafer, comprising:

[0007] An adsorption part, wherein the adsorption part is provided with an adsorption surface, and the wafer is placed on the adsorption surface; a plurality of concentric grooves are provided on the adsorption surface, a sealing member is embedded in each of the concentric grooves, a plurality of adsorption holes are provided on each sealing member at intervals along the circumferential direction, an air flow channel is provided between two adjacent concentric grooves, and each of the adsorption holes is communicated with the air flow channel;

[0008] A mounting portion connected to a side of the adsorption portion away from the adsorption surface, the mounting portion being configured to be connected to a mounting seat; an air extraction port is provided on the mounting portion, the air extraction port is connected to the air flow channel, and the air extraction port is configured to be connected to an air extraction mechanism;

[0009] Under the suction action of the suction mechanism, the wafer can be adsorbed on the adsorption surface.

[0010] As an optional solution for the suction cup, a through hole is provided on the adsorption portion, and the through hole is provided between two adjacent concentric circular grooves.

[0011] As an optional solution of the suction cup, a plurality of through holes are provided, and the plurality of through holes are arranged at intervals along the circumference of the adsorption portion.

[0012] As an optional solution for the suction cup, the sealing element is made of PTFE.

[0013] As an optional solution for the suction cup, the adsorption surface is polished.

[0014] As an optional solution for the suction cup, a plurality of first weight-reducing grooves are provided on the adsorption portion, and the plurality of first weight-reducing grooves are arranged at intervals along the circumference of the adsorption portion.

[0015] As an optional solution for the suction cup, a plurality of second weight-reducing grooves are provided on the mounting portion, and the plurality of second weight-reducing grooves are arranged at intervals along the circumference of the mounting portion.

[0016] As an alternative to the suction cup, a fastener is also included;

[0017] The mounting portion is provided with a first connection hole, the mounting seat is provided with a second connection hole, and the fastener is sequentially passed through the second connection hole and the first connection hole.

[0018] As an optional solution for the suction cup, the size of the mounting portion is smaller than the size of the adsorption portion.

[0019] As an optional solution for the suction cup, the air suction port is provided with a guiding inclined surface.

[0020] Beneficial effects of the utility model:

[0021] The utility model provides a suction cup for adsorbing a wafer. The suction cup comprises a suction part and a mounting part. A suction surface is provided on the suction part, and the wafer is placed on the suction surface. The mounting part is connected to the side of the suction part away from the suction surface, and the mounting part is configured to be connected to the mounting seat. An air extraction port is provided on the mounting part, and the air extraction port is configured to be connected to an air extraction mechanism; a plurality of concentric circular grooves are provided on the suction surface, and a sealing member is embedded in each concentric circular groove, and a plurality of adsorption holes are arranged at intervals along the circumferential direction on each sealing member, and an air flow channel is provided between two adjacent concentric circular grooves, and each adsorption hole is connected to the air flow channel, and the air flow channel is connected to the air extraction port. Under the suction action of the air extraction mechanism, the wafer can be stably adsorbed on the adsorption surface. The provision of a plurality of concentric circular grooves can ensure the stable adsorption of the wafer by the suction cup, and can also be applicable to the stable adsorption of wafers of various sizes. In addition, the suction cup can be connected to the mounting seat, and when the mounting seat rotates at a high speed, the suction cup can also ensure the stability of wafer adsorption. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a top view of the suction cup provided in the specific implementation example of the utility model;

[0023] Figure 2 It is a cross-sectional view of a suction cup provided in an embodiment of the present utility model;

[0024] Figure 3 It is a bottom view of the suction cup provided in the specific implementation example of the utility model.

[0025] In the figure:

[0026] 1. Adsorption part; 11. Sealing member; 111. Outer sealing member; 112. Middle sealing member; 113. Inner sealing member; 12. Air flow channel; 13. Through hole; 14. First weight reduction groove;

[0027] 2. Installation part; 21. Air extraction port; 22. Second weight reduction groove; 23. First connection hole. Detailed implementation manners

[0028] The following further describes the present utility model in detail with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present utility model, rather than limiting the present utility model. Additionally, it should be noted that for the convenience of description, only the parts related to the present utility model rather than all the structures are shown in the drawings.

[0029] In the description of the present utility model, unless otherwise clearly defined and limited, the terms "connected", "connected to", and "fixed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0030] In the present utility model, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through other features between them. Moreover, the first feature being "above", "above the", and "on the" second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below the", and "under the" second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0031] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationships shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0032] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0033] like Figures 1 to 3 As shown, this embodiment provides a suction cup for adsorbing a wafer. The suction cup includes a suction portion 1 and a mounting portion 2. The suction portion 1 is provided with a suction surface, and the wafer is placed on the suction surface. The mounting portion 2 is connected to the side of the suction portion 1 away from the suction surface, and the mounting portion 2 is configured to be connected to the mounting seat. An exhaust port 21 is provided on the mounting portion 2, and the exhaust port 21 is configured to be connected to an exhaust mechanism; a plurality of concentric grooves are provided on the suction surface, and a sealing member 11 is embedded in each concentric groove, and a plurality of adsorption holes are provided on each sealing member 11 at intervals along the circumferential direction, and an air flow channel 12 is provided between two adjacent concentric grooves, and each adsorption hole is connected to the air flow channel 12, and the air flow channel 12 is connected to the exhaust port 21. Under the suction action of the exhaust mechanism, the wafer can be stably adsorbed on the adsorption surface. The provision of a plurality of concentric grooves can ensure the stable adsorption of the wafer by the suction cup, and can also be applicable to the stable adsorption of wafers of various sizes.

[0034] In addition, the suction cup can be connected to the mounting seat. Specifically, the mounting seat is connected to the output end of the rotating mechanism. Driven by the rotating mechanism, the mounting seat can rotate at high speed (2000 rpm). When the mounting seat rotates at high speed, the suction cup can also ensure that the wafer is stably adsorbed on the adsorption surface.

[0035] Exemplarily, the rotating mechanism is a rotating motor that has been disclosed in the prior art.

[0036] Optionally, the suction cup further comprises a fastener (not shown). Figure 2 and Figure 3 As shown, a first connecting hole 23 is formed on the mounting portion 2, a second connecting hole is formed on the mounting seat, and a fastener is sequentially passed through the second connecting hole and the first connecting hole 23 to detachably connect the suction cup to the mounting seat.

[0037] Specifically, the first connection hole 23 is a threaded hole, the second connection hole is a threaded hole, and the fastener is a bolt or a screw commonly used in the art.

[0038] Illustratively, in this embodiment, three first connection holes 23 are provided in total; in other embodiments, the number of first connection holes 23 can be set as needed.

[0039] Specifically, Figure 1 As shown, in the present embodiment, three concentric grooves are provided on the adsorption surface, and a seal 11 is embedded in each concentric groove, namely an outer seal 111, a middle seal 112 and an inner seal 113; in other embodiments, the number of concentric grooves and seals 11 can be set as needed and is not specifically limited here.

[0040] Exemplarily, the air extraction mechanism is a vacuum pump already disclosed in the prior art, and its specific structure and principle are referred to the prior art and will not be elaborated herein.

[0041] Optionally, through holes 13 are provided on the adsorption part 1, and through holes 13 are provided between adjacent two concentric circular grooves. With the above setting, when the wafer is adsorbed on the adsorption surface, it can ensure that the pressures on both sides of the wafer located between adjacent two concentric circular grooves are both atmospheric pressures, so as to prevent the wafer from deforming and ensure the quality of the wafer.

[0042] Further, a plurality of through holes 13 are provided, and the plurality of through holes 13 are arranged at intervals along the circumferential direction of the adsorption part 1 to ensure the flatness of the wafer along the circumferential direction and further avoid the wafer from deforming.

[0043] Optionally, the sealing member 11 is made of PTFE material, which has good temperature resistance, and at the same time, has good lubricity and excellent electrical insulation.

[0044] Optionally, the adsorption surface is polished to ensure the flatness of the adsorption surface and the roughness of the concentric circular grooves. In addition, the whole chuck needs to be surface-treated to ensure the insulation of the whole chuck.

[0045] Optionally, a plurality of first weight reduction grooves 14 are formed on the adsorption part 1, and the plurality of first weight reduction grooves 14 are arranged at intervals along the circumferential direction of the adsorption part 1. With the above setting, the self-weight of the chuck can be reduced, and at the same time, the manufacturing materials can be saved.

[0046] Optionally, as Figure 3 shown, a plurality of second weight reduction grooves 22 are formed on the mounting part 2, and the plurality of second weight reduction grooves 22 are arranged at intervals along the circumferential direction of the mounting part 2. With the above setting, the self-weight of the chuck is also reduced, and the use of manufacturing materials is reduced.

[0047] Specifically, in this embodiment, the first weight reduction groove 14 is trapezoidal, and the second weight reduction groove 22 is triangular; in other embodiments, the number and shape of the first weight reduction groove 14 and the second weight reduction groove 22 can be set as required.

[0048] Optionally, the size of the mounting part 2 is smaller than the size of the adsorption part 1. With the above setting, the self-weight of the chuck can be reduced, and the use of manufacturing materials can be reduced; at the same time, it is also convenient for the taking and installation of the chuck.

[0049] Optionally, a guiding inclined surface is provided at the air extraction port 21 to facilitate the connection with the air extraction mechanism, and thus is beneficial to improving the installation efficiency of the chuck.

[0050] Obviously, the above embodiments of the present utility model are merely examples for clearly illustrating the present utility model, rather than limitations on the implementation manners of the present utility model. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present utility model. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the claims of the present utility model.

Claims

1. A suction cup for adsorbing a wafer, characterized in that, include: An adsorption portion (1), wherein the adsorption portion (1) is provided with an adsorption surface, and the wafer is placed on the adsorption surface; a plurality of concentric circular grooves are provided on the adsorption surface, a sealing member (11) is embedded in each of the concentric circular grooves, a plurality of adsorption holes are provided on each sealing member (11) at intervals along the circumferential direction, an air flow channel (12) is provided between two adjacent concentric circular grooves, and each of the adsorption holes is communicated with the air flow channel (12); A mounting portion (2) connected to a side of the adsorption portion (1) facing away from the adsorption surface, the mounting portion (2) being configured to be connected to a mounting seat; an air extraction port (21) is provided on the mounting portion (2), the air extraction port (21) is connected to the air flow channel (12), and the air extraction port (21) is configured to be connected to an air extraction mechanism; Under the suction action of the suction mechanism, the wafer can be adsorbed on the adsorption surface.

2. The suction cup according to claim 1, wherein The adsorption portion (1) is provided with a through hole (13), and the through hole (13) is provided between two adjacent concentric circular grooves.

3. The suction cup according to claim 2, wherein, A plurality of through holes (13) are provided, and the plurality of through holes (13) are arranged at intervals along the circumferential direction of the adsorption portion (1).

4. The suction cup according to any one of claims 1 to 3, characterized in that, The sealing element (11) is made of PTFE material.

5. The suction cup according to any one of claims 1-3, characterized in that, The adsorption surface is polished.

6. The suction cup according to any one of claims 1-3, characterized in that The adsorption portion (1) is provided with a plurality of first weight-reducing grooves (14), and the plurality of first weight-reducing grooves (14) are arranged at intervals along the circumference of the adsorption portion (1).

7. The suction cup according to any one of claims 1-3, characterized in that A plurality of second weight-reducing grooves (22) are provided on the mounting portion (2), and the plurality of second weight-reducing grooves (22) are arranged at intervals along the circumference of the mounting portion (2).

8. The suction cup according to any one of claims 1-3, characterized in that Also included are fasteners; The mounting portion (2) is provided with a first connection hole (23), the mounting seat is provided with a second connection hole, and the fastener is sequentially inserted through the second connection hole and the first connection hole (23).

9. The suction cup according to any one of claims 1-3, characterized in that, The size of the mounting portion (2) is smaller than the size of the adsorption portion (1).

10. The suction cup according to any one of claims 1 to 3, characterized in that, The air suction port (21) is provided with a guiding inclined surface.

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