Adsorption device shared by 6-inch wafer and 8-inch wafer

Abstract

The utility model belongs to the technical field of semiconductor processing, and relates to an adsorption device shared by a 6-inch wafer and an 8-inch wafer, which comprises a first device body provided with a main air passage and an auxiliary air passage, and the main air passage is communicated with the auxiliary air passage; the second device body is connected to the first device body; a plurality of first air holes are formed in the second device body and are communicated with the corresponding auxiliary air channels; and a second air hole is formed in the second device body. After the structure is adopted, the wafer adsorption device has the beneficial effects that the first air hole, the main air passage and the auxiliary air passage are controlled within a reasonable range, so that a good adsorption effect can still be achieved under the condition that a 6-inch or 8-inch wafer is adsorbed, and the wafer adsorption device can be applied to equipment for moving the 6-inch or 8-inch wafer; and the applicability is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor processing, and specifically relates to an adsorption device shared by 6-inch and 8-inch wafers. Background Art

[0002] In the semiconductor industry, it is often necessary to adsorb and place wafers. A common adsorption method is to use the vacuum point adsorption method for fixation.

[0003] The wafer adsorption device in the prior art includes a device body, air holes and three adsorption holes provided on the device body. Since in the actual suction process, the three adsorption holes are in direct contact with the wafer, a relatively large distance needs to be maintained between the three adsorption holes to achieve a good adsorption effect on the wafer. On the premise of satisfying the distance between the three adsorption holes, the adsorption device can generally only be used to adsorb wafers of a specific size, such as 6-inch or 8-inch wafers, and there is a problem of low applicability. Therefore, it is necessary to make improvements. Summary of the Utility Model

[0004] In order to solve the above problems of the prior art, the utility model provides an adsorption device shared by 6-inch and 8-inch wafers, which has strong practicability and solves the problem of replacing the adsorption device when adsorbing 6-inch and 8-inch wafers.

[0005] To achieve the above object, the utility model adopts the following technical solutions:

[0006] As one aspect of the utility model, an adsorption device shared by 6-inch and 8-inch wafers is proposed, which includes: a first device body, on which a main air duct and auxiliary air ducts are provided, and the main air duct is communicated with the auxiliary air ducts; there are two groups of auxiliary air ducts, and the two groups of auxiliary air ducts are symmetrically arranged with the center of the first device body, and the two groups of auxiliary air ducts are respectively communicated with the corresponding two ends of the main air duct;

[0007] A second device body, which is connected to the first device body, and the second device body seals the main air duct and the auxiliary air ducts on the first device body to form a closed vacuum air duct; a plurality of first air holes are provided on the second device body, and the plurality of first air holes are communicated with the corresponding auxiliary air ducts; a suction cup is connected to each first air hole; a second air hole is provided on the second device body, the second air hole is communicated with the main air duct, and the second air hole is connected to the air extraction hole of the vacuum device.

[0008] Optionally, the first device body is U-shaped, and the second device body is U-shaped.

[0009] Optionally, a suction cup mounting groove is formed on the upper surface of the first air hole.

[0010] Optionally, it further includes an intermediate air duct, which is arc-shaped, and the main air duct is connected to the corresponding auxiliary air duct through the intermediate air duct.

[0011] Optionally, a buffer groove is formed in the middle of the main air duct, the depth of the buffer groove is greater than that of the main air duct, and the width of the buffer groove is greater than that of the main air duct.

[0012] Optionally, the diameter of the first air hole is 0.6 mm, and the distance between the centers of two adjacent first air holes is 3.0 - 4.5 mm.

[0013] Optionally, the auxiliary air duct is composed of a first branch air duct and a second branch air duct. The first branch air duct and the second branch air duct are connected, and the first branch air duct is connected to the main air duct.

[0014] Optionally, the width of the first branch air duct is the same as that of the second branch air duct, and the length of the first branch air duct is less than that of the second branch air duct.

[0015] Optionally, the first branch air duct and the second branch air duct are connected through a transition air duct, and the width of the transition air duct is less than that of the first branch air duct.

[0016] Optionally, both the second device body and the first device body are made of PEEK material.

[0017] The adsorption device shared by 6-inch and 8-inch wafer sheets of the present utility model has the following beneficial effects: By controlling the first air holes, the main air duct, and the auxiliary air duct within a reasonable range, it is possible to still have a good adsorption effect when sucking 6-inch or 8-inch wafer sheets. Furthermore, the wafer adsorption device can be applied to equipment for moving 6-inch or 8-inch wafer sheets, improving the applicability, and thus enabling the shared adsorption of 6-inch and 8-inch wafer sheets. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The specification drawings forming a part of this application are used to provide a further understanding of the present utility model. The schematic embodiments of the present utility model and their descriptions are used to explain the present utility model and do not constitute an improper limitation of the present utility model.

[0019] Figure 1 It is a schematic structural diagram of the adsorption device shared by 6-inch and 8-inch wafer sheets of the present utility model;

[0020] Figure 2 It is a reference diagram of the adsorption state of the adsorption device shared by 6-inch and 8-inch wafer sheets of the present utility model. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0021] To make the objectives, technical solutions and advantages of the present utility model clearer, the technical solutions of the present utility model will be clearly and completely described below in conjunction with specific embodiments of the present utility model and the corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts shall fall within the scope of protection of the present utility model.

[0022] An adsorption device shared by a 6-inch wafer and an 8-inch wafer according to an embodiment of the present application, as Figure 1 shown, which includes:

[0023] A first device body 1, the first device body 1 is U-shaped, and is provided with a main air duct 11 and an auxiliary air duct 12 thereon, and the main air duct 11 is communicated with the auxiliary air duct 12; in this embodiment, there are two groups of auxiliary air ducts 12, and the two groups of auxiliary air ducts 12 are symmetrically arranged with respect to the center of the first device body 1, and the two groups of auxiliary air ducts 12 are respectively communicated with the corresponding two ends of the main air duct 11;

[0024] A second device body 2, the second device body 2 is U-shaped, the second device body 2 is connected to the first device body 1, and the second device body 2 seals the main air duct 11 and the auxiliary air duct 12 on the first device body 1 to form a closed vacuum air duct; a plurality of first air holes 21 are provided on the second device body 2, and the plurality of first air holes 21 are communicated with the corresponding auxiliary air ducts 12; a suction cup is connected to each first air hole 21; a second air hole 22 is provided on the second device body 2, the second air hole 22 is communicated with a buffer groove 14 of the main air duct 11, and the second air hole 22 is connected to an air extraction hole of a vacuum device 3. It should be noted that the structure and working principle of the vacuum device 3 are both prior arts and will not be elaborated here.

[0025] In one embodiment, as Figure 1 shown, a suction cup mounting groove 211 is formed on the upper surface of the first air hole 21 to facilitate the connection of the suction cup.

[0026] In one embodiment, both the second device body 2 and the first device body 1 are made of PEEK material, and the thickness of the device is 2.5 mm. During processing, first process the first air holes of the second device body 2, then process the air ducts of the first device body 1, and then bond the second device body 2 and the first device body 1, and the glue is cured for 24 hours to complete the finished product.

[0027] In one embodiment, as Figure 1As shown, it further includes an intermediate air duct 13. The intermediate air duct 13 is arc-shaped. The main air duct 11 is connected to the corresponding auxiliary air duct 12 through the intermediate air duct 13. The arc-shaped intermediate air duct 13 can increase the intensity of the vacuum and has a stronger adsorption force.

[0028] In one embodiment, as Figure 1 shown, a buffer groove 14 is formed in the middle of the main air duct 11. The depth of the buffer groove 14 is greater than that of the main air duct 11, and the width of the buffer groove 14 is greater than that of the main air duct 11. The buffer groove 14 is used for vacuum buffering so that the vacuum at the connection of the two main air ducts 11 can be balanced.

[0029] In one embodiment, as Figure 1 shown, the diameter of the first air hole 21 is 0.6 mm, and the distance between the centers of two adjacent first air holes 21 is 3.0 - 4.5 mm. During vacuum adsorption, they can be evenly distributed on the wafer to avoid excessive or insufficient adsorption.

[0030] In one embodiment, as Figure 1 shown, the auxiliary air duct 12 is composed of a first branch air duct 121 and a second branch air duct 122. The first branch air duct 121 and the second branch air duct 122 are connected. The first branch air duct 121 is connected to the main air duct 11. The width of the first branch air duct 121 is the same as that of the second branch air duct 122, and the length of the first branch air duct 121 is less than that of the second branch air duct 122. That is, the number of the first air holes 21 corresponding to the first branch air duct 121 is less than the number of the first air holes 21 corresponding to the second branch air duct 122. With such a design, the first air holes 21 achieve the best balance when adsorbing 6-inch and 8-inch wafers, and the adsorption effect is the best.

[0031] In one embodiment, as Figure 1 shown, the first branch air duct 121 and the second branch air duct 122 are connected through a transition air duct 123. The width of the transition air duct 123 is less than that of the first branch air duct 121, making the air pressure during vacuum pumping more stable and the adsorption effect better.

[0032] As an example, the length of the chuck for a 6-inch wafer on the market is 110 mm, and the length of the chuck for an 8-inch wafer is 150 mm. In this embodiment, the total length of the chucks installed on several first air holes 21 is 124 mm, which can realize the common use of the chuck for 6-inch and 8-inch wafers, as Figure 2 shown.

[0033] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they specify the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0034] Unless otherwise specifically stated, the relative arrangements of the components and steps, numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present application. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the specification. In all the examples shown and discussed herein, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters denote like items in the following drawings, and thus, once an item is defined in one drawing, further discussion thereof is not required in subsequent drawings.

[0035] In the description of the present application, it should be understood that the orientation or positional relationships indicated by orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal", and "top, bottom" are generally based on the orientation or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description. Without contrary description, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and thus should not be construed as limiting the protection scope of the present application; the orientation words "inside, outside" refer to the inside and outside relative to the contour of each component itself.

[0036] For ease of description, spatial relative terms such as "above", "over", "on the upper surface", "upper", etc. can be used here to describe the spatial positional relationship of a device or feature shown in the figure with other devices or features. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation described in the figure of the device. For example, if the device in the attached drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned as "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above" can include both the orientations of "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding interpretations should be made for the spatial relative descriptions used here.

[0037] In addition, it should be noted that the use of terms such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above terms have no special meanings, and thus should not be construed as limiting the protection scope of this application.

[0038] In the description of the present utility model, it should be noted that unless otherwise clearly defined and limited, terms such as "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0039] The above are only the preferred embodiments of the present utility model, and all equivalent changes and modifications made according to the scope of the patent application of the present utility model shall fall within the scope covered by the present utility model.

Claims

1. An adsorption device shared by 6-inch and 8-inch wafers, characterized in that, It includes: A first device body, on which a main air duct and auxiliary air ducts are provided, and the main air duct is communicated with the auxiliary air ducts; there are two groups of auxiliary air ducts, and the two groups of auxiliary air ducts are symmetrically arranged with the center of the first device body as the center, and the two groups of auxiliary air ducts are respectively communicated with the corresponding two ends of the main air duct; A second device body, which is connected to the first device body. The second device body seals the main air duct and the auxiliary air ducts on the first device body to form a closed vacuum air duct; several first air holes are provided on the second device body, and the several first air holes are communicated with the corresponding auxiliary air ducts; a suction cup is connected to each first air hole; a second air hole is provided on the second device body, and the second air hole is communicated with the main air duct.

2. The adsorption device shared by the 6-inch and 8-inch wafers as described in claim 1, wherein The first device body is U-shaped, and the second device body is U-shaped.

3. The adsorption device shared by the 6-inch wafer and the 8-inch wafer as described in claim 1, characterized in that, A suction cup mounting groove is formed on the upper surface of the first air hole.

4. The adsorption device shared by the 6-inch wafer and the 8-inch wafer according to claim 1, wherein It further includes an intermediate air duct, the intermediate air duct is arc-shaped, and the main air duct is communicated with the corresponding auxiliary air duct through the intermediate air duct.

5. The adsorption device shared by the 6-inch wafer and the 8-inch wafer as claimed in claim 1, wherein A buffer groove is formed in the middle of the main air duct, the depth of the buffer groove is greater than the depth of the main air duct, and the width of the buffer groove is greater than the width of the main air duct.

6. The adsorption device shared by the 6-inch wafer and the 8-inch wafer according to claim 1, characterized in that, The diameter of the first air hole is 0.6 mm, and the distance between the centers of two adjacent first air holes is 3.0 - 4.5 mm.

7. The adsorption device shared by the 6-inch and 8-inch wafers as claimed in claim 1, wherein The auxiliary air duct is composed of a first branch air duct and a second branch air duct, the first branch air duct and the second branch air duct are communicated, and the first branch air duct is communicated with the main air duct.

8. The adsorption device shared by the 6-inch wafer and the 8-inch wafer according to claim 7, characterized in that, The width of the first branch air duct is the same as that of the second branch air duct, and the length of the first branch air duct is less than that of the second branch air duct.

9. The adsorption device shared by the 6-inch wafer and the 8-inch wafer as claimed in claim 8, characterized in that, The first branch air duct and the second branch air duct are communicated through a transition air duct, and the width of the transition air duct is less than that of the first branch air duct.

10. The adsorption device shared by the 6-inch and 8-inch wafers as described in claim 1, characterized in that, Both the second device body and the first device body are made of PEEK material.

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