TVS tube packaging structure

Abstract

The utility model discloses a TVS tube packaging structure, comprising a substrate, the top of the substrate is fixedly connected with a protective cover, two sides of the substrate are fixedly connected with soft rubber pads, one side, far away from the substrate, of each soft rubber pad is fixedly connected with a pin sheet, and the pin sheets are connected with the substrate through a plurality of leads. A plurality of round holes allowing wires to penetrate through are formed in the soft rubber mat, a protective shell is fixedly connected to the top of the pin piece, the protective shell is fixedly connected with the soft rubber mat, round grooves are evenly formed in the two sides of the protective cover, and first telescopic rods are fixedly connected to the interiors of the round grooves. The second telescopic rod on the connecting block is matched with the elastic force of the spring, so that the pressing piece can press the protective shell, the pin piece at the bottom of the protective shell can be perfectly attached to the welding area, the welding stability is guaranteed, meanwhile, the elastic force of the spring can guarantee that the pin piece is attached to the welding area when soldering tin is loosened, and the welding quality is improved. And the stability of diode connection is further improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of TVS tube packaging, and specifically relates to a TVS tube packaging structure. Background Technique

[0002] TVS tube packaging is also known as diode packaging. Diode packaging refers to leading the circuit pins on the silicon chip to the external joints by wires for connection with other devices. Its functions include: installation, fixation, sealing, protecting the chip, and enhancing electrothermal performance, etc.; connecting the contacts on the chip to the pins of the packaging shell through wires, and then connecting to other devices through the wires on the printed circuit board to realize the connection between the internal chip and the external circuit; preventing the impurities in the air from corroding the chip circuit and causing the decline of electrical performance; the chips encapsulated according to the unified specifications are also more convenient for installation and transportation.

[0003] In the prior art, Chinese Patent CN218972524U discloses a light-emitting diode packaging structure, specifically related to the technical field of light-emitting diode packaging structures, including a packaging seat for light-emitting diode packaging, and a diode component for emitting light is arranged at the top of the packaging seat; an encapsulation component for encapsulation is arranged outside the diode component; a fixing groove is opened at the bottom end of the packaging seat, and a plurality of heat-conducting components for dissipating heat of the diode component are arranged inside the fixing groove, and the plurality of heat-conducting components are evenly spaced; each heat-conducting component includes a plurality of heat-dissipating columns. By operating the mounting ring threadedly connected to the mounting groove, the mounting ring can be disassembled, so that the heat-dissipating columns can be separated from the packaging seat, thus facilitating the user to clean and maintain the heat-dissipating columns, avoiding the influence of heat dissipation and heat conduction effects due to more dust adhering to the surface of the heat-dissipating columns, and thereby improving the convenience of the user when disassembling and assembling the heat-dissipating columns.

[0004] However, in the actual application of the diode packaging structure provided in the above technical solution, there are still many shortcomings. For example, the pins of the diode packaging are welded to the external welding points through soldering, and there is no structure for pressing the pins on the diode, so that it is impossible to ensure perfect fitting between the pins and the welding points during welding, resulting in the pins being prone to looseness during long-term use and affecting the connection stability. Summary of the Utility Model

[0005] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part as well as in the abstract and the title of the utility model of this application to avoid obscuring the purpose of this part, the abstract, and the title of the utility model, and such simplifications or omissions shall not be used to limit the scope of the utility model.

[0006] To solve the problem that the pins of the diode package are welded to the external welding part through solder, and there is no structure for pressing the pins on the diode, which makes it impossible to ensure perfect fitting between the pins and the welding part during welding, resulting in easy loosening of the pins and affecting the connection stability during long-term use, the present utility model adopts the following technical solutions.

[0007] A TVS tube packaging structure includes a substrate. A protective cover is fixedly connected to the top of the substrate. Soft rubber pads are fixedly connected to both sides of the substrate. A pin piece is fixedly connected to the side of the soft rubber pad away from the substrate. The pin piece is connected to the substrate through multiple wires. The soft rubber pad is provided with multiple round holes for the wires to pass through. A protective shell is fixedly connected to the top of the pin piece. The protective shell is fixedly connected to the soft rubber pad. Circular grooves are evenly formed on both sides of the protective cover. A first telescopic rod is fixedly connected to the inside of the circular groove. A connecting block is fixedly connected to the end of the first telescopic rod. A second telescopic rod is fixedly connected to the bottom end of the connecting block. A pressing piece is arranged at the bottom end of the second telescopic rod. A spring is arranged outside the second telescopic rod. The pressing piece is pressed on the protective shell by the elastic force of the spring, and the bottom surface of the pressing piece fits with the top surface of the protective shell.

[0008] Preferably, the bottom surface of the pin piece is flush with the bottom surface of the substrate. The pin pieces are symmetric about the vertical center line of the substrate. The top and both sides of the pin piece are in contact with the inner wall of the protective shell.

[0009] Preferably, the inner diameter of the round hole of the soft rubber pad matches the outer diameter of the wire. The multiple wires are evenly distributed about the horizontal center line of the soft rubber pad.

[0010] Preferably, the first telescopic rods are symmetric about the vertical center line of the protective cover. The outer diameter of the second telescopic rod matches the inner diameter of the spring. The central axis of the second telescopic rod coincides with the central axis of the pressing piece.

[0011] Preferably, a plurality of adhesive tapes are bonded to the bottom of the substrate. The bottom surface of the adhesive tape is flush with the bottom surface of the substrate. The multiple adhesive tapes are evenly distributed in a ring about the vertical center line of the substrate. The central axis of the protective cover coincides with the vertical center line of the substrate.

[0012] Preferably, a plurality of grooves are arranged on the outer side of the protective cover. The multiple grooves are evenly distributed in a ring about the central axis of the protective cover.

[0013] Preferably, a plurality of mesh holes are formed in the top of the protective cover. The mesh holes communicate with the inside of the protective cover. The multiple mesh holes are evenly distributed in a ring about the central axis of the protective cover.

[0014] Advantageous Effects

[0015] Compared with the prior art, the advantageous effects of the present utility model are as follows:

[0016] The utility model uses a pin piece to weld the diode to the welding area of the external circuit board. The protective shell can protect the pin piece. The protective shell and the substrate are connected by a soft rubber pad, and the soft rubber pad can protect the wire. Through the second telescopic rod on the connecting block and the elastic force of the spring, the pressing piece can press the protective shell, so that the pin piece at the bottom of the protective shell can perfectly fit the welding area, ensuring the stability of welding. At the same time, the elastic force of the spring can ensure that the pin piece is attached to the welding area when the solder becomes loose, further improving the stability of the diode connection. Description of the Drawings

[0017] Figure 1 is the overall three-dimensional structure schematic diagram of the utility model;

[0018] Figure 2 is the bottom three-dimensional structure schematic diagram of the utility model;

[0019] Figure 3 is the partial three-dimensional structure schematic diagram of the utility model;

[0020] Figure 4 is the overall top view structure schematic diagram of the utility model;

[0021] Figure 5 is the three-dimensional structure schematic diagram of the protective cover of the utility model.

[0022] The corresponding relationship between the labels in the drawings and the component names is as follows:

[0023] 1. Substrate; 2. Protective cover; 3. Soft rubber pad; 4. Pin piece; 5. Wire; 6. Protective shell; 7. First telescopic rod; 8. Connecting block; 9. Pressing piece; 10. Spring; 11. Second telescopic rod; 12. Adhesive tape; 13. Groove; 14. Mesh hole. Detailed Implementation Modes

[0024] To make the above objects, features and advantages of the utility model more obvious and understandable, the following detailed description of the specific implementation modes of the utility model will be given in conjunction with the drawings in the specification.

[0025] In the following description, many specific details are set forth to fully understand the utility model. However, the utility model can also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the connotation of the utility model. Therefore, the utility model is not limited by the specific embodiments disclosed below.

[0026] Secondly, the "one embodiment" or "embodiment" referred to herein means a specific feature, structure, or characteristic that may be included in at least one implementation manner of the present utility model. The "in one embodiment" that appears in different places in this specification does not all refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. The present utility model provides the following embodiments.

[0027] Please refer to Figures 1-5 , an embodiment provided by the present utility model: a TVS tube packaging structure, including a substrate 1, a protective cover 2 is fixedly connected to the top of the substrate 1, a plurality of grooves 13 are arranged on the outer side of the protective cover 2, and the plurality of grooves 13 are evenly distributed in a ring shape about the central axis of the protective cover 2. By using the substrate 1 and the protective cover 2 in cooperation, the semiconductor of the diode can be protected. By using the grooves 13 on the protective cover 2, the contact area between the side plate of the protective cover 2 and the air can be increased, which is beneficial to the heat dissipation of the diode. A plurality of mesh holes 14 are opened at the top of the protective cover 2, and the mesh holes 14 communicate with the inside of the protective cover 2. The plurality of mesh holes 14 are evenly distributed in a ring shape about the central axis of the protective cover 2. By providing the mesh holes 14, the heat dissipation performance of the diode can be further improved, and at the same time, the mesh structure of the mesh holes 14 can play a dust-proof role while dissipating heat.

[0028] In this embodiment, soft rubber pads 3 are fixedly connected to both sides of the substrate 1, a pin piece 4 is fixedly connected to the side of the soft rubber pad 3 away from the substrate 1, and the pin piece 4 is connected to the substrate 1 through a plurality of wires 5. The soft rubber pad 3 is provided with a plurality of round holes through which the wires 5 can pass. The inner diameter of the round holes of the soft rubber pad 3 matches the outer diameter of the wires 5. The plurality of wires 5 are evenly distributed about the horizontal center line of the soft rubber pad 3. A protective shell 6 is fixedly connected to the top of the pin piece 4. The bottom surface of the pin piece 4 is flush with the bottom surface of the substrate 1. The pin piece 4 is symmetric about the vertical center line of the substrate 1. The top and both sides of the pin piece 4 are in contact with the inner wall of the protective shell 6. The protective shell 6 is fixedly connected to the soft rubber pad 3. By using the pin piece 4, the diode can be welded to the welding area of the external circuit board. The setting of the protective shell 6 can protect the pin piece 4. The protective shell 6 is connected to the substrate 1 through the soft rubber pad 3, and the soft rubber pad 3 can protect the wires 5.

[0029] In this embodiment, circular grooves are evenly formed on both sides of the protective cover 2. A first telescopic rod 7 is fixedly connected inside the circular groove. A connecting block 8 is fixedly connected to the end of the first telescopic rod 7. A second telescopic rod 11 is fixedly connected to the bottom end of the connecting block 8. A pressing piece 9 is arranged at the bottom end of the second telescopic rod 11. A spring 10 is arranged outside the second telescopic rod 11. The elastic force of the spring 10 makes the pressing piece 9 press on the protective shell 6, and the bottom surface of the pressing piece 9 is in contact with the top surface of the protective shell 6. Through the second telescopic rod 11 on the connecting block 8, with the cooperation of the elastic force of the spring 10, the pressing piece 9 can press the protective shell 6, so that the pin piece 4 at the bottom of the protective shell 6 can be perfectly attached to the welding area, ensuring the stability of welding. At the same time, the elastic force of the spring 10 can ensure that the pin piece 4 is attached to the welding area when the solder becomes loose, further improving the stability of the diode connection. The first telescopic rod 7 is symmetric about the vertical center line of the protective cover 2. The outer dimension of the second telescopic rod 11 is consistent with the inner diameter dimension of the spring 10. The central axis of the second telescopic rod 11 coincides with the central axis of the pressing piece 9. By using the first telescopic rod 7, the distance between the connecting block 8 and the protective cover 2 can be adjusted, so that the position of the pressing piece 9 can be adjusted, and whether the pressing piece 9 presses the protective shell 6 can be controlled.

[0030] In this embodiment, a plurality of adhesive tapes 12 are bonded to the bottom of the substrate 1. The bottom surface of the adhesive tape 12 is flush with the bottom surface of the substrate 1. The plurality of adhesive tapes 12 are evenly distributed in a ring shape about the vertical center line of the substrate 1. The central axis of the protective cover 2 coincides with the vertical center line of the substrate 1. Through the adhesive tape 12, the bottom surface of the substrate 1 can be bonded to the external circuit board, enhancing the stability of the connection between the substrate 1 and the circuit board, and making the device not prone to deviation during transportation before welding.

[0031] Working principle: When using this device, first, through the cooperation of the substrate 1 and the protective cover 2, the semiconductor of the diode can be protected. By using the groove 13 on the protective cover 2, the contact area between the side plate of the protective cover 2 and the air can be increased, which is beneficial to the heat dissipation of the diode. Through the setting of the mesh holes 14, the heat dissipation performance of the diode can be further improved. At the same time, the mesh structure of the mesh holes 14 can play a dust-proof role while dissipating heat. By using the pin piece 4, the diode can be welded to the welding area of the external circuit board. The setting of the protective shell 6 can protect the pin piece 4. The protective shell 6 is connected to the substrate 1 through the soft rubber pad 3, and the soft rubber pad 3 can protect the wire 5. Through the second telescopic rod 11 on the connecting block 8, with the elastic force of the spring 10, the pressing piece 9 can press the protective shell 6, so that the pin piece 4 at the bottom of the protective shell 6 can perfectly fit the welding area, ensuring the stability of welding. At the same time, the elastic force of the spring 10 can ensure that the pin piece 4 is attached to the welding area when the solder becomes loose, further improving the stability of the diode connection. By using the first telescopic rod 7, the distance between the connecting block 8 and the protective cover 2 can be adjusted, so that the position of the pressing piece 9 can be adjusted, and whether the pressing piece 9 presses the protective shell 6 can be controlled. Through the adhesive tape 12, the bottom surface of the substrate 1 can be bonded to the external circuit board, enhancing the connection stability between the substrate 1 and the circuit board, so that the device is not prone to deviation during transportation before welding.

[0032] The above content further elaborates on the present utility model in combination with specific implementation manners. It cannot be determined that the specific implementation of the present utility model is only limited to these descriptions. For those of ordinary skill in the technical field to which the present utility model belongs, without departing from the concept of the present utility model, several simple deductions or substitutions can still be made, and all should be regarded as belonging to the protection scope determined by the claims submitted for the present utility model.

Claims

1. A TVS tube packaging structure, including a substrate (1), and a protective cover (2) is fixedly connected to the top of the substrate (1), characterized in that: Soft rubber pads (3) are fixedly connected to both sides of the substrate (1). A pin piece (4) is fixedly connected to the side of the soft rubber pad (3) away from the substrate (1). The pin piece (4) and the substrate (1) are connected by a plurality of wires (5). The soft rubber pad (3) is provided with a plurality of round holes for the wires (5) to pass through. A protective shell (6) is fixedly connected to the top of the pin piece (4). The protective shell (6) and the soft rubber pad (3) are fixedly connected. Round grooves are evenly formed on both sides of the protective cover (2). A first telescopic rod (7) is fixedly connected to the inside of the round groove. A connecting block (8) is fixedly connected to the end of the first telescopic rod (7). A second telescopic rod (11) is fixedly connected to the bottom end of the connecting block (8). A pressing piece (9) is arranged at the bottom end of the second telescopic rod (11). A spring (10) is arranged on the outside of the second telescopic rod (11). The pressing piece (9) is pressed on the protective shell (6) by the elastic force of the spring (10), and the bottom surface of the pressing piece (9) is in contact with the top surface of the protective shell (6).

2. The TVS tube packaging structure according to claim 1, characterized in that: The bottom surface of the pin piece (4) is flush with the bottom surface of the substrate (1). The pin piece (4) is symmetric about the vertical center line of the substrate (1). The top and both sides of the pin piece (4) are in contact with the inner wall of the protective shell (6).

3. The TVS tube packaging structure according to claim 2, wherein: The inner diameter of the round hole of the soft rubber pad (3) is in line with the outer diameter of the wire (5). The plurality of wires (5) are evenly distributed about the horizontal center line of the soft rubber pad (3).

4. The TVS tube packaging structure according to claim 3, characterized in that: The first telescopic rod (7) is symmetric about the vertical center line of the protective cover (2). The outer dimension of the second telescopic rod (11) is in line with the inner diameter of the spring (10). The central axis of the second telescopic rod (11) coincides with the central axis of the pressing piece (9).

5. The TVS tube packaging structure according to claim 4, characterized in that: A plurality of adhesive tapes (12) are bonded to the bottom of the substrate (1). The bottom surface of the adhesive tape (12) is flush with the bottom surface of the substrate (1). The plurality of adhesive tapes (12) are evenly distributed in a ring about the vertical center line of the substrate (1). The central axis of the protective cover (2) coincides with the vertical center line of the substrate (1).

6. The TVS tube packaging structure according to claim 1, wherein: A plurality of grooves (13) are arranged on the outside of the protective cover (2). The plurality of grooves (13) are evenly distributed in a ring about the central axis of the protective cover (2).

7. The TVS tube packaging structure according to claim 6, wherein: A plurality of mesh holes (14) are formed in the top of the protective cover (2). The mesh holes (14) communicate with the inside of the protective cover (2). The plurality of mesh holes (14) are evenly distributed in a ring about the central axis of the protective cover (2).

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