Axial diode packaging structure

Abstract

The utility model provides an axial diode packaging structure, which belongs to the field of axial diode structure design and comprises a first pin, a second pin and a chip. The cross section of the first pin and the cross section of the second pin are each of a rectangular structure, the tail end of the first pin is bent in the thickness direction to form a first platform, the first platform is parallel to the first pin, the tail end of the second pin is bent in the thickness direction to form a second platform, and the second platform is parallel to the second pin; the chip is arranged between the first platform and the second platform, a packaging body is arranged outside the first platform and the second platform, and the first pin and the second pin are respectively arranged at two ends of the packaging body along the same straight line. According to the scheme, the assembly position precision of the chip and the connection strength between the chip and the pins can be effectively improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of structural optimization of axial diodes, and particularly relates to an axial diode packaging structure. Background Technique

[0002] Axial diodes are common components. As recorded in two patents with application numbers 202321697104.3 and 202321233865.3, axial diodes generally include two leads arranged coaxially. One end of each of the two leads has an installation platform, and the leads need to be perpendicular to the installation platform and ensure coaxiality with the installation platform. In some technologies, the installation platform is also called an "electrode". A chip is connected between the two installation platforms by soldering. An encapsulation body is formed outside the chip and the two installation platforms by plastic encapsulation. The ends of the two leads protrude from both ends of the encapsulation body along the same axis, thus forming an axial diode.

[0003] For the above-mentioned existing axial diodes, their installation platforms are usually formed by upsetting the ends of the leads. When forming the installation platform by upsetting, it is very easy for the installation platform to deviate or tilt relative to the axis of the lead, affecting the assembly position accuracy between the chip and the installation platform and the bonding strength between the chip and the installation platform. Summary of the Utility Model

[0004] To solve the deficiencies of the prior art, the utility model provides an axial diode packaging structure, which can effectively improve the assembly position accuracy of the chip and the connection strength between the chip and the pins.

[0005] To achieve the purpose of the utility model, the following scheme is proposed:

[0006] An axial diode packaging structure includes: a first pin, a second pin and a chip. The cross-sections of the first pin and the second pin are both rectangular structures. The end of the first pin is bent in the thickness direction to form a first platform, and the first platform is parallel to the first pin. The end of the second pin is bent in the thickness direction to form a second platform, and the second platform is parallel to the second pin;

[0007] The chip is arranged between the first platform and the second platform. An encapsulation body is arranged outside the first platform and the second platform. The first pin and the second pin are respectively arranged at both ends of the encapsulation body along the same straight line.

[0008] The beneficial effects of the utility model are as follows:

[0009] 1. Using pins with rectangular cross-sectional structures to bend and form platforms for installing chips, the process is simpler, and the size and position accuracy of the platforms can be effectively guaranteed, thereby effectively ensuring the installation accuracy and connection strength of the chips.

[0010] 2. The first platform, the second platform, and the chip are all rectangular structures, which can be better matched, helping to further improve the connection stability between the chip and the first pin and the second pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The drawings described herein are only for illustrating selected embodiments and not all possible implementation manners, let alone intended to limit the scope of the present utility model.

[0012] Figure 1 The external structural schematic diagram of the axial diode of the present application is shown.

[0013] Figure 2 The package structure schematic diagram of the axial diode of the present application is shown.

[0014] Reference numerals in the figures: first pin - 1, first platform - 11, second pin - 2, second platform - 21, chip - 3, package body - 4. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present utility model clearer, the following will describe the embodiments of the present utility model in detail with reference to the drawings. However, the embodiments described herein are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0016] As Figure 1 , Figure 2 shown, an axial diode package structure includes: a first pin 1, a second pin 2, and a chip 3.

[0017] Specifically, as Figure 2 shown, the cross-sections of the first pin 1 and the second pin 2 are both rectangular structures. The end of the first pin 1 is bent in the thickness direction to form a first platform 11, and the first platform 11 is parallel to the first pin 1. The end of the second pin 2 is bent in the thickness direction to form a second platform 21, and the second platform 21 is parallel to the second pin 2. The reason for bending in the thickness direction is to form a larger first platform 11 and second platform 21, so that the chip 3 has a larger mounting surface to improve the connection stability between the chip 3 and the first pin 1 and the second pin 2.

[0018] Specifically, as Figure 2 shown, the chip 3 is disposed between the first platform 11 and the second platform 21. A package body 4 is provided outside the first platform 11 and the second platform 21. The first pin 1 and the second pin 2 are respectively disposed at two ends of the package body 4 along the same straight line.

[0019] This solution bends the first pin 1 and the second pin 2 with a rectangular cross-section to form the first platform 11 and the second platform 21. This method is simpler than the method of upsetting the installation platform at the end of the lead, and it is easier to ensure the position and dimensional accuracy of the first platform 11 and the second platform 21, which is more conducive to improving the assembly position accuracy of the chip 3 and the bonding strength between the chip 3 and the first platform 11 and the second platform 21. Moreover, this solution uses the first pin 1 and the second pin 2 with a rectangular cross-section to be bent, and the formed first platform 11 and the second platform 21 will also be rectangular structures. Similarly, the structure of the chip 3 is also a rectangular structure. In this way, it makes the shapes of the first platform 11 and the second platform 21 easier to match the chip 3, which can not only ensure the connection stability but also reduce the package volume. Because for the existing axial diodes, their installation platforms are usually circular. In order to cover the entire chip 3, the diameter of the installation platform must be greater than or equal to the length of the diagonal of the chip 3, and the diameter of its external plastic package will necessarily be greater than the length of the diagonal of the chip 3. After adopting this solution, the package 4 of this application only needs to be larger than the side length of the chip 3 to wrap the first platform 11 and the second platform 21. To further reduce the outer diameter of the package 4, the thickness of the first pin 1 and the second pin 2 can be thinned to make the outer contour of the first platform 11 and the second platform 21 smaller after assembly, and this method will not affect the length dimension of the chip 3.

[0020] Preferably, the first pin 1 and the second pin 2 are made of copper sheet structure.

[0021] Preferably, the areas of the first platform 11 and the second platform 21 are larger than that of the chip 3.

[0022] Further preferably, the widths of the first pin 1 and the second pin 2 are the same as the minimum width dimension of the chip 3 to reduce the contour size of the package 4.

[0023] The above are only the preferred embodiments of the present invention and do not represent the only or limit the present invention. Those skilled in the art should understand that without departing from the scope of the present invention, various changes or equivalent substitutions made to the present invention all fall within the scope of protection of the present invention.

Claims

1. An axial diode packaging structure, comprising: The first pin (1), the second pin (2) and the chip (3), characterized in that the cross-sections of the first pin (1) and the second pin (2) are both rectangular structures, the end of the first pin (1) is bent in the thickness direction to form a first platform (11), the first platform (11) is parallel to the first pin (1), the end of the second pin (2) is bent in the thickness direction to form a second platform (21), and the second platform (21) is parallel to the second pin (2); The chip (3) is arranged between the first platform (11) and the second platform (21), an encapsulation body (4) is arranged outside the first platform (11) and the second platform (21), and the first pin (1) and the second pin (2) are respectively arranged at both ends of the encapsulation body (4) along the same straight line.

2. The axial diode packaging structure according to claim 1, characterized in that, The first pin (1) and the second pin (2) are copper sheet structures.

3. The axial diode package structure according to claim 1, characterized in that, The areas of the first platform (11) and the second platform (21) are greater than or equal to the area of the chip (3).

4. An axial diode packaging structure according to claim 1, characterized in that, The widths of the first pin (1) and the second pin (2) are consistent with the minimum width dimension of the chip (3).

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