Grid array assembly, circuit board, electronic equipment and movable platform

Abstract

The utility model provides a grid array assembly, a circuit board, electronic equipment and a movable platform, the grid array assembly comprises a first circuit board and a grid array device, and the first surface of the first circuit board is provided with a plurality of first bonding pads; the grid array device comprises a second circuit board, a second surface of the second circuit board is provided with a plurality of second bonding pads, and the plurality of first bonding pads and the plurality of second bonding pads are in one-to-one correspondence and are welded and fixed; wherein the first bonding pad is provided with a solder layer, in a plane parallel to the first circuit board, the projection area of the solder layer before welding is larger than that of the second bonding pad, and the projection area of the first bonding pad is larger than that of the second bonding pad corresponding to the first bonding pad. When the second bonding pad on the grid array device is warped, in the welding process of the first bonding pad and the second bonding pad, the welding flux layer is liquefied and then is influenced by surface tension to be filled between the first bonding pad and the second bonding pad, so that the welding area of the first bonding pad and the second bonding pad is increased, and the product reliability is improved.

Description

Technical Field

[0001] This application relates to circuit board technology, and particularly to a land grid array component, a circuit board, an electronic device, and a mobile platform. Background Art

[0002] A land grid array (LGA) device realizes signal transmission and power supply by directly connecting chip pins or pads to pads on a circuit board, which can solve the problem of limited layout and wiring of the circuit board of an electronic device.

[0003] In the solutions of related technologies, the surface flatness of the pads of the land grid array device is poor, and there may be a problem of insufficient welding area when welding with the pads of the circuit board, resulting in poor product reliability. Summary of the Utility Model

[0004] In order to overcome the above defects in related technologies, the purpose of this application is to provide a land grid array component, a circuit board, an electronic device, and a mobile platform. This application is beneficial to increasing the welding area between the land grid array device and the circuit board, thereby improving the reliability of the product.

[0005] On the one hand, this application provides a land grid array component, including:

[0006] A first circuit board, on the first surface of which there are a plurality of first pads;

[0007] A land grid array device, which includes a second circuit board, on the second surface of which there are a plurality of second pads, and the plurality of first pads correspond to the plurality of second pads one by one and are welded and fixed;

[0008] Wherein, a solder layer is provided on the first pad. In a plane parallel to the first circuit board, the projected area of the solder layer before welding is greater than the projected area of the second pad, and the projected area of the first pad is greater than the projected area of the corresponding second pad.

[0009] In a possible implementation, the second pads are arranged near the outer peripheral side of the second circuit board.

[0010] In a possible implementation, the width of the first pad is equal to the width of the second pad, and the length of the first pad is greater than the length of the second pad.

[0011] In a possible implementation, the first pad includes a connected welding area and a solder reserve area, and the second pad is welded and fixed to the welding area of the corresponding first pad.

[0012] In a possible implementation, the solder reserve area is located at one end of the first pad near the outer peripheral side of the first circuit board.

[0013] In a possible implementation, the area of the solder reserve area accounts for 20 - 35% of the area of the first pad.

[0014] In a possible implementation, in a plane parallel to the first circuit board, the projected shape of the second pad is similar to the projected shape of the first pad.

[0015] On the other hand, the present application provides a circuit board including a plurality of first pads. The first pad includes a connected welding area and a solder reserve area. The welding area is used for welding and fixing with the second pad of the grid array device, and the solder reserve area is located at one end of the first pad near the outer peripheral side of the circuit board.

[0016] In still another aspect, the present application provides an electronic device including the grid array component as described above.

[0017] In yet another aspect, the present application provides a movable platform including the electronic device as described above.

[0018] The present application provides a grid array component, a circuit board, an electronic device, and a movable platform. The grid array component includes a first circuit board and a grid array device. A plurality of first pads are provided on the first surface of the first circuit board; the grid array device includes a second circuit board, and a plurality of second pads are provided on the second surface of the second circuit board. The plurality of first pads and the plurality of second pads are in one-to-one correspondence and are welded and fixed; wherein, a solder layer is provided on the first pad. In a plane parallel to the first circuit board, the projected area of the solder layer before welding is larger than the projected area of the second pad, and the projected area of the first pad is larger than the projected area of the corresponding second pad. By setting the area of the first pad on the first circuit board to be larger than the area of the second pad on the second circuit board of the grid array device, and by providing the solder layer on the first pad, and the area of the solder layer before welding is also larger than the area of the second pad; when the second pad on the grid array device is warped, during the welding process of the first pad and the second pad, the liquefied solder layer is affected by the surface tension and fills between the first pad and the second pad, thereby increasing the welding area between the first pad and the second pad and improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or in the related art, the following will briefly introduce the drawings required for use in the description of the embodiments or the related art. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

[0020] Figure 1 It is a simplified diagram of the welding structure between the first pad and the second pad in the related art;

[0021] Figure 2 It is a top view of a ball grid array component provided by an embodiment of the present application;

[0022] Figure 3 It is a side view of a ball grid array component provided by an embodiment of the present application;

[0023] Figure 4 It is a simplified diagram of the welding structure between the first pad and the second pad provided by an embodiment of the present application;

[0024] Figure 5 It is a simplified diagram of the welding structure between the first pad and the second pad provided by another embodiment of the present application;

[0025] Figure 6 It is a simplified diagram of the welding structure between the first pad and the second pad provided by still another embodiment of the present application.

[0026] Reference numerals:

[0027] 100 - First circuit board; 110 - First pad; 111 - Welding area; 112 - Solder reserve area; 120 - Third pad;

[0028] 200 - Second circuit board; 210 - Second pad; 220 - Fourth pad;

[0029] 300 - Solder layer. Detailed implementation manners

[0030] To make the objectives, technical solutions, and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application.

[0031] All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without creative efforts shall fall within the protection scope of the present application. Without conflict, the following embodiments and the features in the embodiments may be combined with each other.

[0032] As described in the background art, in the solutions of the related art, there may be a problem of insufficient welding area when the pads of the grid array device are welded to the pads of the circuit board, resulting in poor reliability of the product. The reason for the above problem is that: there is a certain flatness fluctuation when the grid array device comes in, and since the sizes of the pads of the grid array device and the pads of the circuit board are exactly the same, after being welded to the pads of the circuit board by the Surface Mount Technology (SMT for short), there is warping between the pads at the edge of the grid array device and the pads of the circuit board, and the solder cannot completely fill the space between the pads of the grid array device and the pads of the circuit board, resulting in a reduced welding area, a reduced welding strength, and poor reliability of the product.

[0033] As Figure 1 shown, in the related art, a first circuit board 100 is provided with first pads 110, and the grid array device includes a second circuit board 200, and the second circuit board 200 is provided with second pads 210. When the incoming grid array device is warped, the first pads 110 are arranged obliquely to the second pads 210, so that the gap between the first pads 110 and the second pads 210 increases, and the solder layer 300 cannot completely fill the gap between the first pads 110 and the second pads 210, resulting in a reduced welding area between the first pads 110 and the second pads 210 and affecting the reliability of the product.

[0034] In view of this, the embodiments of the present application aim to provide a grid array component, a circuit board, an electronic device, and a movable platform. By setting the area of the first pads on the first circuit board to be larger than the area of the second pads on the second circuit board of the grid array device, and arranging the solder layer on the first pads, the area of the solder layer before welding is also larger than the area of the second pads; when the second pads on the grid array device are warped, during the welding process of the first pads and the second pads, after the solder layer liquefies, it is affected by the surface tension and fills the space between the first pads and the second pads, thereby increasing the welding area between the first pads and the second pads and improving the reliability of the product.

[0035] The content of the embodiments of the present application will be described in detail below with reference to the drawings, so that those skilled in the art can understand the content of the present application in more detail.

[0036] Please refer to Figures 2 - 5 , this embodiment provides a grid array component, including:

[0037] A first circuit board 100, a first surface of the first circuit board 100 is provided with an area for mounting a grid array device, and a plurality of first pads 110 are provided in this area; wherein, the first surface may be, for example, the upper surface of the first circuit board 100. Exemplarily, as Figure 2As shown, the multiple first pads 110 of this embodiment can be arranged around in a square shape; alternatively, the multiple first pads 110 can be arranged around in a circular shape, and the specific arrangement shape can be set according to the corresponding pad structure on the grid array device.

[0038] Grid array device, the grid array device includes a second circuit board 200, the second surface of the second circuit board 200 is provided with multiple second pads 210, and the second pads 210 are arranged close to the outer peripheral side of the second circuit board 200; wherein, the second surface can be, for example, the lower surface of the second circuit board 200 (the surface facing the first circuit board 100). The multiple first pads 110 correspond to the multiple second pads 210 one by one and are welded and fixed, so that the grid array device is arranged on the first circuit board 100 through surface mount technology. It can be understood that in this embodiment, in order to show the structures of the first pads 110 and the second pads 210, the second circuit board 200 is Figure 2 treated with perspective. In the plane parallel to the first circuit board 100, the projected shape of the second pad 210 is similar to the projected shape of the first pad 110. For example, the projections of the first pad 110 and the second pad 210 can both be rectangular, circular or oval.

[0039] Please continue to refer to Figures 3 - 5 , a solder layer 300 is provided on the first pad 110 of this embodiment. In the plane parallel to the first circuit board 100, the projected area of the solder layer 300 before welding is larger than the projected area of the second pad 210, that is to say, the second pad 210 completely falls within the range of the solder layer 300. In the plane parallel to the first circuit board 100, the projected area of the first pad 110 is larger than the projected area of the corresponding second pad 210.

[0040] As Figure 4 shown, when the flatness of the incoming grid array device is good and there is no warping, the second pads 210 located on the outer peripheral side of the second circuit board 200 are parallel to the corresponding first pads 110, and the gap between the first pads 110 and the second pads 210 is within a preset range. Since the area of the solder layer 300 is larger than the area of the second pad 210, the solder layer 300 located outside the projected area of the second pad 210 is welded to the first pad 110 after melting, and will not affect the welding quality of the first pad 110 and the second pad 210.

[0041] As Figure 5As shown, when the flatness of the incoming grid array device is poor and there is warping, the second pads 210 on the outer peripheral side of the second circuit board 200 will be inclined with respect to the corresponding first pads 110, increasing the gap between the first pads 110 and the second pads 210. Since the area of the solder layer 300 before welding is larger than the area of the second pads 210, when the first pads 110 and the second pads 210 are welded, the solder layer 300 outside the projected area of the second pads 210 is filled between the first pads 110 and the second pads 210 under the influence of surface tension after melting, filling part of the gap, thereby increasing the welding area between the first pads 110 and the second pads 210, improving the welding quality of the first pads 110 and the second pads 210, and being conducive to enhancing the reliability of the product.

[0042] As Figure 2 shown, in a possible implementation, the first circuit board 100 of this embodiment is further provided with a plurality of third pads 120, and a plurality of first pads 110 are arranged around the plurality of third pads 120. Correspondingly, the second circuit board 200 is further provided with a plurality of fourth pads 220, and a plurality of second pads 210 are arranged around the plurality of fourth pads 220. The plurality of third pads 120 and the plurality of fourth pads 220 are in one-to-one correspondence and are welded and fixed, thereby enhancing the stability of the connection between the grid array device and the first circuit board 100.

[0043] In this embodiment, in the plane parallel to the first circuit board 100, the projected area of the solder layer 300 before welding is equal to the projected area of the first pads 110, and both are larger than the projected area of the second pads 210. That is to say, the solder layer 300 before welding in this embodiment completely covers the first pads 110. By adopting the above scheme, the difficulty of evaluating the amount of solder printed and the input time can be further reduced.

[0044] Please continue to refer to Figure 2 , in this embodiment, the width D1 of the first pads 110 is equal to the width D2 of the second pads 210, and the length L1 of the first pads 110 is greater than the length L2 of the second pads 210. Since the first pads 110 are arranged at intervals in the width direction thereof, with the above structure, it is possible to prevent two adjacent first pads 110 from being connected together and short-circuiting and failing; at the same time, setting the length L1 of the first pads 110 to be greater than the length L2 of the second pads 210 can make the area of the first pads 110 larger than the area of the second pads 210, combined with the solder layer 300 provided on the first pads 110, so as to achieve the purpose of increasing the welding area between the first pads 110 and the second pads 210 and improving the welding quality of the first pads 110 and the second pads 210.

[0045] Please continue to refer to Figure 4 and Figure 5, the first pad 110 of this embodiment includes a welding area 111 and a solder reserve area 112 connected to each other. The second pad 210 is fixedly welded to the welding area 111 of the corresponding first pad 110. It can be understood that the area of the second pad 210 is equal to the area of the welding area 111 on the corresponding first pad 110. The solder reserve area 112 is the area where the first pad 110 is more than the second pad 210. Before welding, a solder layer 300 is provided on both the welding area 111 and the solder reserve area 112. The second pad 210 is inclined with respect to the corresponding first pad 110. When welding, the solder layer 300 on the solder reserve area 112 melts and fills between the first pad 110 and the second pad 210, thereby increasing the welding area between the first pad 110 and the second pad 210 and improving the welding quality of the first pad 110 and the second pad 210.

[0046] In a possible implementation manner, the solder reserve area 112 of this embodiment may be located at one end of the first pad 110 close to the outer peripheral side of the first circuit board 100. Since the gap between the edge of the grid array device and the first circuit board 100 will increase when the grid array device warps, the gap between the end of the second pad 210 close to the center of the first circuit board 100 and the first pad 110 will become smaller, while the gap between the end of the second pad 210 far from the center of the first circuit board 100 and the first pad 110 will become larger. Setting the solder reserve area 112 at one end of the first pad 110 close to the outer peripheral side of the first circuit board 100 can better utilize the solder layer 300 on the solder reserve area 112 to fill the gap between the first pad 110 and the second pad 210.

[0047] As Figure 6 shown, in other possible implementation manners, the solder reserve area 112 may also be two discontinuous segments, respectively located on both sides of the welding area 111 in the length direction of the first pad 110. With the above structure, no matter how the grid array device warps, when welding, the solder layer 300 on the solder reserve areas 112 on both sides of the welding area 111 melts and is filled between the welding area 111 and the second pad 210 under the influence of surface tension, filling part of the gap, thereby increasing the welding area between the first pad 110 and the second pad 210 and improving the welding quality of the first pad 110 and the second pad 210, which is beneficial to improving the reliability of the product.

[0048] In this embodiment, the area of the solder reserve area 112 accounts for 20-35% of the area of the first pad 110, so as to ensure that when the grid array device warps, there is sufficient solder layer 300 on the first pad 110 to fill the gap between the first pad 110 and the second pad 210.

[0049] In other embodiments, the grid array component includes a first circuit board and a plurality of grid array devices. A plurality of areas for mounting the grid array devices are provided on the first surface of the first circuit board, and a plurality of first pads are provided on each area. Each grid array component is correspondingly welded to an area for mounting a grid array device. A plurality of second pads are provided on the second surface of the second circuit board of each grid array component. The second pads are arranged close to the outer peripheral side of the second circuit board. The plurality of first pads and the plurality of second pads correspond to each other one by one and are welded and fixed. Among them, a solder layer is provided on the first pad. In a plane parallel to the first circuit board, the projected area of the solder layer before welding is larger than the projected area of the second pad, and the projected area of the first pad is larger than the projected area of the corresponding second pad. By adopting the above structure, the first circuit board can satisfy the welding of a plurality of grid array devices at the same time, and the welding quality of the plurality of grid array devices and the first circuit board can be improved, and the reliability of the grid array component can be enhanced.

[0050] This embodiment also provides a circuit board, which can be, for example, the above-mentioned first circuit board 100. The circuit board includes a grid array device welding area, and a plurality of first pads 110 are provided in the grid array device welding area. The first pad 110 includes a connected welding area 111 and a solder reserve area 112. The welding area 111 is used for welding and fixing with the second pad 210 of the grid array device. The solder reserve area 112 is located at one end of the first pad 110 close to the outer peripheral side of the first circuit board 100. When using the surface mount technology to mount the grid array device on the circuit board, a solder layer 300 can be first provided on the first pad 110 of the circuit board, and the area of the solder layer 300 can be equal to the area of the first pad 110. In this way, when the grid array device is warped, the solder layer 300 in the solder reserve area 112 can be melted and filled between the first pad 110 and the second pad 210, thereby increasing the welding area between the first pad 110 and the second pad 210, improving the welding quality of the first pad 110 and the second pad 210, and enhancing the reliability of the connection between the grid array device and the circuit board.

[0051] In other possible implementation manners, a plurality of grid array device welding areas can be simultaneously provided on the circuit board. Each grid array device welding area is used for welding a grid array device, and a plurality of first pads 110 are provided in each grid array device welding area. The first pad 110 includes a connected welding area 111 and a solder reserve area 112. The welding area 111 is used for welding and fixing with the second pad 210 of the grid array device. The solder reserve area 112 is located at one end of the first pad 110 close to the outer peripheral side of the first circuit board 100. It can be understood that adopting the above structure can enable the circuit board to satisfy the welding of a plurality of grid array devices at the same time, and can improve the welding quality of the plurality of grid array devices and the circuit board, and enhance the reliability of the connection between the grid array device and the circuit board.

[0052] This embodiment also provides an electronic device, including the above grid array component.

[0053] Specifically, the electronic device can be any device including a circuit board and a grid array device, such as a mobile phone, a smart watch, a computer, an air conditioner, a vehicle controller, etc. Since the above grid array component is adopted, the reliability and product stability of the electronic device can be improved, which is beneficial to extending the service life of the electronic device.

[0054] This embodiment provides a movable platform, including the above electronic device.

[0055] Specifically, the movable platform of this embodiment can be, for example, a vehicle, a drone, a robot, etc. Since the above electronic device is adopted, the reliability and product stability of the movable platform can be improved, which is beneficial to extending the service life of the movable platform.

[0056] In the description of this application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to this application.

[0057] In this application, unless otherwise clearly specified and limited, terms such as "install", "connect", "connection", "fix" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

[0058] It should be noted that in the description of this application, the terms "first" and "second" are only used for conveniently describing different components, and cannot be understood as indicating or implying a sequential relationship, relative importance, or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features.

[0059] In the embodiments or implementation manners of this application, a progressive description is adopted. Each embodiment focuses on the differences from other embodiments. For the same or similar parts among the embodiments, reference can be made to each other.

[0060] In the description of this application, the description with reference to terms such as "one implementation manner", "some implementation manners", "illustrative implementation manner", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the implementation manner or example are included in at least one implementation manner or example of this application. In this application, the illustrative expression of the above terms does not necessarily refer to the same implementation manner or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more implementation manners or examples.

[0061] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of this application, rather than to limit them; although this application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A grid array component, characterized in that, Comprising: A first circuit board, on a first surface of the first circuit board, a plurality of first pads are provided; A grid array device, the grid array device includes a second circuit board, on a second surface of the second circuit board, a plurality of second pads are provided, and the plurality of first pads and the plurality of second pads correspond to each other one by one and are welded and fixed; Wherein, a solder layer is provided on the first pad, in a plane parallel to the first circuit board, before welding, a projected area of the solder layer is larger than a projected area of the second pad, and a projected area of the first pad is larger than a projected area of the corresponding second pad.

2. The grid array component according to claim 1, characterized in that The second pad is disposed near an outer peripheral side of the second circuit board.

3. The grid array component according to claim 1 or 2, characterized in that, A width of the first pad is equal to a width of the second pad, and a length of the first pad is greater than a length of the second pad.

4. The grid array component according to claim 3, characterized in that The first pad includes a welded area and a solder reserve area connected to each other, and the second pad is welded and fixed to the welded area of the corresponding first pad.

5. The grid array component according to claim 4, wherein The solder reserve area is located at one end of the first pad near an outer peripheral side of the first circuit board.

6. The grid array component according to claim 4 or 5, characterized in that, An area of the solder reserve area accounts for 20-35% of an area of the first pad.

7. The grid array component according to claim 1, characterized in that, In a plane parallel to the first circuit board, a projected shape of the second pad is similar to a projected shape of the first pad.

8. A circuit board, characterized in that, Comprising a plurality of first pads, the first pad includes a welded area and a solder reserve area connected to each other, the welded area is used for being welded and fixed to a second pad of a grid array device, and the solder reserve area is located at one end of the first pad near an outer peripheral side of the circuit board.

9. An electronic device, characterized in that, Comprising the grid array component according to any one of claims 1-7.

10. A movable platform, characterized in that, Comprising the electronic device according to claim 9.

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