Heat dissipation device and display equipment

Abstract

The utility model discloses a heat dissipation device and display equipment, the heat dissipation device comprises a heat dissipation piece and an adjusting assembly, the heat dissipation piece is provided with a first face and a second face, the first face of the heat dissipation piece is used for making contact with a heating element, the second face of the heat dissipation piece is provided with a plurality of heat dissipation fins arranged in the first direction, and the adjusting assembly is arranged on the first face of the heat dissipation piece. The first direction is perpendicular to the center line of the heat dissipation piece; the adjusting assembly has a pressing state and an adjusting state, and when the adjusting assembly is in the pressing state, the adjusting assembly presses the heat dissipation piece so as to prevent the heat dissipation piece from rotating relative to the heating element; when the adjusting assembly is in the adjusting state, the adjusting assembly at least partially reduces the acting force applied to the heat dissipation piece, so that the heat dissipation piece can rotate relative to the heating element. According to the technical scheme, the direction of the fins can be adjusted according to the air flowing direction, so that the heat dissipation efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of heat dissipation, and particularly relates to a heat dissipation device and a display device. Background Art

[0002] In the related art, a heat sink is fixed on a circuit board, and the direction of the heat sink and the heat dissipation fins thereon is usually fixed.

[0003] When the direction of the heat dissipation fins is poorly matched with the air flow direction, or even perpendicular thereto, the heat dissipation fins will obstruct the air flow and reduce the contact area between the heat dissipation fins and the air, thereby affecting the heat dissipation effect and reducing the heat dissipation efficiency. Summary of the Utility Model

[0004] The purpose of this application is to provide a heat dissipation device and a display device, which can adjust the fin direction according to the air flow direction to improve the heat dissipation efficiency.

[0005] To achieve the above purpose, this application provides a heat dissipation device on the one hand. The heat dissipation device includes a heat dissipation member and an adjustment assembly. The heat dissipation member has a first surface and a second surface. The first surface of the heat dissipation member is used to contact a heat generating element. A plurality of heat dissipation fins arranged along a first direction are provided on the second surface of the heat dissipation member, wherein the first direction is perpendicular to the center line of the heat dissipation member; the adjustment assembly has a pressing state and an adjustment state. When the adjustment assembly is in the pressing state, the adjustment assembly presses the heat dissipation member to block the heat dissipation member from rotating relative to the heat generating element; when the adjustment assembly is in the adjustment state, the adjustment assembly at least partially reduces the acting force applied to the heat dissipation member, so that the heat dissipation member can rotate relative to the heat generating element.

[0006] The technical solution provided by this application is that different states of the adjustment assembly directly determine whether the heat dissipation member can rotate. In this way, compared with the heat dissipation member in the related art that cannot rotate and adjust relative to the heat generating element, this application can, when the alignment degree between the heat dissipation fins and the air flow direction is poor, by changing the state of the adjustment assembly, adjust the direction of the heat dissipation fins on the heat dissipation member, so that the direction of the heat dissipation fins on the heat dissipation member is roughly aligned with the air flow direction, thereby improving the heat dissipation efficiency.

[0007] Optionally, the heat dissipation device further includes a heat conduction base. The heat conduction base has a first surface and a second surface. The first surface of the heat conduction base contacts the heat generating element, and the second surface of the heat conduction base contacts the first surface of the heat dissipation member, so that the first surface of the heat dissipation member contacts the heat generating element through the heat conduction base.

[0008] Through the above solution, the heat dissipation component contacts the heat generating element through the heat conducting base. The heat conducting base does not need to be adjusted and rotated relative to the heat generating element, which can avoid the problem of contact gaps between the heat dissipation component and the heat generating element caused by multiple adjustments of the heat dissipation component, thus affecting heat transfer. That is, it can avoid affecting heat dissipation by adjusting the direction of the heat dissipation fins and ensure the heat dissipation effect.

[0009] Optionally, the adjusting assembly includes a pressing member; the pressing member is detachably connected to the heat conducting base and presses the heat dissipation component between the pressing member and the heat conducting base.

[0010] Through the above solution, different heat dissipation components with different thicknesses or different materials can be replaced according to different heat dissipation requirements to change the heat dissipation effect.

[0011] Optionally, the pressing member is a bolt; the heat conducting base is provided with a threaded hole matching the bolt, the bolt is locked with the threaded hole, and the heat dissipation component is located between the head of the bolt and the heat conducting base.

[0012] Through the above solution, the bolt can be arranged at the middle position of the heat dissipation component without affecting the rotational adjustment of the heat dissipation component, and there is no need to add additional structures outside the heat dissipation component, which can make the entire heat dissipation device more beautiful.

[0013] Optionally, a relief hole is formed on the heat dissipation component, and the bolt passes through the relief hole and is locked with the threaded hole.

[0014] Optionally, a relief hole is formed on the heat dissipation component; a connecting boss extending into the relief hole is provided on the second surface of the heat conducting base, and the threaded hole is formed at one end of the connecting boss away from the heat conducting base.

[0015] Through the above solution, when the bolt is loosened or disassembled, the connecting boss can play a limiting role on the heat dissipation component, thus preventing the heat dissipation component from directly falling off and facilitating the adjustment of the position of the heat dissipation component.

[0016] Optionally, the connecting boss does not protrude from the second surface of the heat dissipation component.

[0017] Optionally, the connecting boss protrudes from the second surface of the heat dissipation component; the adjusting assembly further includes an elastic member, the elastic member is sleeved on the connecting boss, and the elastic member is located between the head of the bolt and the heat dissipation component.

[0018] Through the above solution, when the bolt is loosened, there is still a partial elastic force of the elastic member on the heat dissipation component in this solution, and this partial elastic force can form a damping effect on the rotational adjustment of the heat dissipation component to facilitate the rotational adjustment of the heat dissipation component.

[0019] Optionally, the cross-section of the heat dissipation member is circular; the cross-section of the heat conduction base is square. The rotation axis of the heat dissipation member coincides with the center line of the heat conduction base, and the outer circular surface of the heat dissipation member is tangent to the four side surfaces of the heat conduction base.

[0020] Through the above solution, during the rotation adjustment of the heat dissipation member, the heat dissipation member will not exceed the heat conduction base, thus avoiding the problem of collision with other electronic components. At the same time, the heat dissipation member can be made as large as possible within the range of the heat conduction base to improve the heat dissipation effect.

[0021] Optionally, the heat dissipation fins extend in a direction perpendicular to the first direction and the center line of the heat dissipation member, and both ends of the heat dissipation fins extend to the edge of the heat dissipation member.

[0022] Through the above solution, the heat dissipation fins can fully cover the second surface of the heat dissipation member to increase the heat dissipation area of the heat dissipation member and improve the heat dissipation effect of the heat dissipation member.

[0023] Optionally, a plurality of connecting posts are provided on the first surface of the heat conduction base, and the heat conduction base is connected to the circuit board carrying the heating element through the plurality of connecting posts.

[0024] To achieve the above object, on the other hand, the present application further provides a display device, which at least includes a circuit board carrying a heating element and the above heat dissipation device; the heat conduction base is connected to the circuit board, and the heating element is in contact with the first surface of the heat conduction base.

[0025] Optionally, the display device further includes a housing having an air inlet and an air outlet, and the circuit board and the heat dissipation device are installed in the housing; the air entering the housing from the air inlet and flowing out from the air outlet forms a heat dissipation air flow at the heat dissipation device, and the flow direction of the heat dissipation air flow is substantially aligned with the length direction of the heat dissipation fins.

[0026] According to the technical solution provided by the present application, the heat dissipation device can adjust the direction of the heat dissipation fins according to the flow direction of the heat dissipation air flow, so that the direction of the heat dissipation fins is substantially aligned with the flow direction of the heat dissipation air flow, thereby ensuring the heat dissipation effect of the heat dissipation device on the heating element, avoiding overheating and damage of the heating element, and prolonging the service life of the display device. Description of the Drawings

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0028] Figure 1 It is a schematic structural diagram of a heat dissipation device in an implementation manner provided by the present application;

[0029] Figure 2 is Figure 1 a half-sectional view of;

[0030] Figure 3 It is a schematic structural diagram of a heat dissipation component in an implementation manner provided by the present application;

[0031] Figure 4 It is a schematic structural diagram of a heat dissipation device in another implementation manner provided by the present application;

[0032] Figure 5 It is a schematic structural diagram of a heat dissipation device in yet another implementation manner provided by the present application;

[0033] Figure 6 It is a half-sectional view of the connection between a bolt and a heat conduction base in an implementation manner provided by the present application;

[0034] Figure 7 It is a schematic structural diagram of a heat conduction base in an implementation manner provided by the present application;

[0035] Figure 8 It is a schematic structural diagram of the connection between a heat dissipation device and a circuit board in an implementation manner provided by the present application;

[0036] Figure 9 It is a partial structural sectional view of a display device in an implementation manner provided by the present application.

[0037] Explanation of reference numerals:

[0038] 100, heat dissipation component; 110, heat dissipation fins; 120, relief holes;

[0039] 200, adjustment component; 210, bolt; 220, elastic member; 230, L-shaped pressing block;

[0040] 300, heat conduction base; 310, threaded hole; 320, connection boss; 330, connection post;

[0041] 400, circuit board;

[0042] 500, housing; 510, air inlet; 520, air outlet. Detailed implementation manners

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the following will further describe the embodiments of this application in detail with reference to the accompanying drawings. Terms indicating relative spatial positions used in this application, such as "upper", "above", "lower", "below", "first end", "second end", "one end", "the other end", etc., are used for the purpose of facilitating description to describe the relationship of one unit or feature relative to another unit or feature as shown in the accompanying drawings. The terms of relative spatial positions may be intended to include different orientations of the device in use or operation other than the orientations shown in the figures. For example, if the device in the figure is flipped, the unit described as being "below" or "beneath" other units or features will be located "above" other units or features. Therefore, the exemplary term "below" can encompass both the upper and lower orientations. The device can be oriented in other ways (rotated 90 degrees or other orientations), and the spatially related descriptive terms used herein can be interpreted accordingly.

[0044] In addition, the terms "installed", "set up", "provided with", "connected", "slidingly connected", "fixed", "socketed" should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or there can be internal communication between two devices, components, or parts. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] With the development of display device technology and the wide application of high-performance processors and other electronic components, the heat generated during their operation also increases accordingly. If the heat dissipation is insufficient, it will not only reduce the performance of electronic components but also may cause damage. Therefore, heat sinks play a crucial role in the TV heat dissipation system.

[0046] However, in the related art, the heat sink is fixed on the circuit board, and the direction of the heat sink and the heat dissipation fins thereon is usually fixed, and it is impossible or difficult to adjust according to the specific assembly direction of the circuit board and the actual situation of air flow. The matching degree between the direction of the heat dissipation fins (usually referring to the length direction of the heat dissipation fins) and the air flow direction directly affects the heat dissipation effect. Therefore, in some cases, this design limits the heat dissipation efficiency, making the heat sink design have limitations.

[0047] For example, when there are two assembly methods, vertical assembly and horizontal assembly, for the circuit board of a display device, these two assembly methods will result in obvious differences in the heat dissipation effect of the heat sink. Specifically, when the circuit board is vertically assembled, the fin direction of the heat sink is horizontal, while the air flow direction is vertical. The fins of the heat sink will block the flowing air, so that the air flow cannot efficiently pass through the fins and carry away the heat on the fins. Moreover, the contact area between the air flow and the fins is small, resulting in poor heat dissipation effect.

[0048] When the circuit board is horizontally assembled, both the fin direction of the heat sink and the air flow direction are vertical, which can reduce the blockage of fin convection, enabling the air flow to efficiently pass through the fins and carry away the heat on the fins. Moreover, the air flow can flow through the grooves formed by adjacent two fins, increasing the effective heat dissipation area of the heat sink, thereby increasing the surface area in contact with the air and further improving the heat exchange efficiency to achieve a better heat dissipation effect.

[0049] Based on this, the present application proposes an improved heat dissipation solution, aiming to adjust the fin direction on the heat sink to adapt to different motherboard assembly and air flow conditions, thereby optimizing the heat dissipation performance and ensuring the stable operation and long-term reliability of the main chip on the TV circuit board. The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments of the present application are only a part of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without creative efforts belong to the scope of protection of the present application.

[0050] The present application provides a heat dissipation device, which is mainly used to contact with a heating element, conduct the heat dissipated by the heating element to the heat dissipation device by means of heat conduction, and dissipate the heat to an external medium (which can be a liquid, a gas or other conductive media) through the heat dissipation device, and the external medium takes away the heat to achieve the heat dissipation effect. When the external medium is air, the heat dissipation device of the present application can adjust the fin direction according to the air flow direction to improve the heat dissipation efficiency. When the external medium is a liquid, the heat dissipation device of the present application can adjust the fin direction according to the liquid flow direction. For the sake of easy understanding, the following mainly describes with the external medium being air. Among them, the heating element can be at least one or more of a CPU, a GPU, a power converter, a resistor, etc. on the circuit board, and the present application does not make specific limitations on this.

[0051] Specifically, please refer to Figures 1 to 4, in an implementable embodiment, the heat dissipation device may include a heat dissipation member 100. Among them, the heat dissipation member 100 has a first surface and a second surface. The first surface of the heat dissipation member 100 is used to contact the heat generating element, so that the heat generated by the heat generating element can be conducted to the heat dissipation member 100 through the first surface of the heat dissipation member 100, and then the heat dissipation member 100 is used to dissipate the heat to the air to achieve heat dissipation. In this embodiment, a plurality of heat dissipation fins 110 arranged along the first direction may be provided on the second surface of the heat dissipation member 100 to increase the contact area between the heat dissipation member 100 and the air through the heat dissipation fins 110, or in other words, increase the heat dissipation area of the heat dissipation member 100, thereby improving the heat dissipation effect of the heat dissipation member 100. It should be noted that as Figure 3 shown, the first direction is perpendicular to the center line of the heat dissipation member 100. When the heat dissipation member 100 is cylindrical, the center line of the heat dissipation member 100 is the axis of the heat dissipation member 100.

[0052] In practical applications, the first surface of the heat dissipation member 100 and the second surface of the heat dissipation member 100 may be adjacent to each other. Preferably, the first surface of the heat dissipation member 100 and the second surface of the heat dissipation member 100 may also be opposite to each other. In this way, the heat dissipation member 100 can be made into a plate-like structure, and the first surface and the second surface of the heat dissipation member 100 can be the two surfaces with the largest area of the heat dissipation member 100, so as to increase the area of the first surface and the second surface of the heat dissipation member 100, thereby increasing the contact area between the heat dissipation member 100 and the heat generating element, and increasing the heat dissipation area of the heat dissipation member 100, and further improving the heat dissipation effect of the heat dissipation member 100.

[0053] In an implementable embodiment, the heat dissipation device may further include an adjustment assembly 200, and the adjustment assembly 200 has a pressing state and an adjustment state. Among them, when the adjustment assembly 200 is in the pressing state, the adjustment assembly 200 presses the heat dissipation member 100 to prevent the heat dissipation member 100 from rotating relative to the heat generating element. When the adjustment assembly 200 is in the adjustment state, the adjustment assembly 200 can reduce at least part of the acting force applied to the heat dissipation member 100, so that the heat dissipation member 100 can rotate relative to the heat generating element. In other words, different states of the adjustment assembly 200 directly determine whether the heat dissipation member 100 can rotate. In this way, compared with the related art in which the heat dissipation member 100 cannot rotate and adjust relative to the heat generating element, in this application, when the alignment degree between the heat dissipation fins 110 and the air flow direction is poor, by changing the state of the adjustment assembly 200, the direction of the heat dissipation fins 110 on the heat dissipation member 100 can be adjusted so that the direction of the heat dissipation fins 110 on the heat dissipation member 100 is substantially aligned with the air flow direction, thereby improving the heat dissipation efficiency.

[0054] In practical applications, the adjustment component 200 can be connected to the circuit board 400 that carries the heating element. Of course, the adjustment component 200 can also be connected to other components, and can also achieve pressing the heat dissipation component 100 or reducing the effect applied to the heat dissipation component 100. For example, the adjustment component 200 can be connected to the backplane or the carrier that carries the circuit board 400, etc. The present application does not make specific limitations here. However, in order to simplify the assembly difficulty, the present application preferably adopts the connection of the adjustment component 200 to the circuit board 400 that carries the heating element.

[0055] As Figure 4 shown, in an implementable embodiment, the first surface of the heat dissipation component 100 can be directly in contact with the heating element. Correspondingly, the adjustment component 200 can be directly connected to the circuit board 400 that carries the heating element.

[0056] As Figure 1 and Figure 2 shown, in another alternative embodiment, the heat dissipation device can further include a heat conduction base 300. The heat dissipation component 100 contacts the heating element through the heat conduction base 300. Correspondingly, the adjustment component 200 is connected to the circuit board 400 that carries the heating element through the heat conduction base 300. Specifically, the heat conduction base 300 has a first surface and a second surface. The first surface of the heat conduction base 300 contacts the heating element and is connected to the circuit board 400 that carries the heating element. The second surface of the heat conduction base 300 contacts the first surface of the heat dissipation component 100, so that the heat dissipation component 100 contacts the heating element through the heat conduction base 300.

[0057] It is worth mentioning that, compared with the heat dissipation component 100 directly contacting the heating element, when the heat dissipation component 100 contacts the heating element through the heat conduction base 300, the heat conduction base 300 does not need to be adjusted and rotated relative to the heating element, which can avoid the problem of contact gaps between the heat dissipation component 100 and the heating element due to multiple adjustments of the heat dissipation component 100, which affects heat transfer, that is, avoid affecting heat dissipation by adjusting the direction of the heat dissipation fins 110, and ensure the heat dissipation effect.

[0058] Furthermore, a heat conduction material can be filled between the heating element and the heat conduction base 300, and a heat conduction material can also be filled between the heat dissipation component 100 and the heat conduction base 300 to promote heat transfer between the two contacting components. Among them, the heat conduction material can be a high thermal conductivity material such as thermal grease or liquid metal.

[0059] In practical applications, the first surface and the second surface of the heat-conducting base 300 can be arranged adjacent to each other. Preferably, the first surface and the second surface of the heat-conducting base 300 can also be arranged opposite to each other. In this way, the heat-conducting base 300 can be made into a plate-like structure, and the first surface and the second surface of the heat-conducting base 300 can be the two surfaces with the largest area of the heat-conducting base 300, so as to increase the areas of the first surface and the second surface of the heat-conducting base 300, thereby increasing the contact area between the heat-conducting base 300 and the heating element, and increasing the contact area between the heat-conducting base 300 and the heat sink 100, and further improving the heat dissipation effect.

[0060] In an implementable embodiment, the adjusting assembly 200 can include a pressing member. The pressing member is detachably connected to the heat-conducting base 300, and presses the heat sink 100 between the pressing member and the heat-conducting base 300. That is to say, the heat sink 100 is pressed on the heat-conducting base 300 through the pressing member. When the pressing member is disassembled, the heat sink 100 can be removed from the heat-conducting base 300 to achieve disassembly and replacement. In this way, different thickness heat sinks 100 can be replaced according to different heat dissipation requirements, or heat sinks 100 made of different materials can be replaced to change the heat dissipation effect.

[0061] As Figure 1 shown, the pressing member can be located at the middle position of the heat sink 100. As Figure 5 shown, the pressing member can also be located at the edge of the heat sink 100, and the present application does not make specific limitations here.

[0062] Regarding the specific structure of the pressing member, the present application provides a variety of implementable embodiments for reference.

[0063] As Figure 2 shown, in an implementable embodiment, the pressing member can be a bolt 210. The heat-conducting base 300 is provided with a threaded hole 310 matching the bolt 210. The bolt 210 is locked with the threaded hole 310, and the heat sink 100 is located between the head of the bolt 210 and the heat-conducting base 300, so as to press the heat sink 100 through the head of the bolt 210.

[0064] In another alternative embodiment, the pressing member can also be an L-shaped pressing block 230, a Z-shaped pressing block or an elastic pressing block, etc. Taking the pressing member being an L-shaped pressing block 230 as an example, as Figure 5 shown, the vertical section of the L-shaped pressing block 230 is detachably connected to the heat-conducting base 300, and the horizontal section of the L-shaped pressing block 230 extends towards the inside of the heat sink 100, and presses the heat sink 100 between the horizontal section of the L-shaped pressing block 230 and the heat-conducting base 300.

[0065] It should be noted that when the pressing member adopts the bolt 210, the bolt 210 can be arranged at the middle position of the heat dissipation member 100 without affecting the rotational adjustment of the heat dissipation member 100, and there is no need to add a structure outside the heat dissipation member 100, which can make the entire heat dissipation device more beautiful. Therefore, the pressing member of the present application preferably adopts the bolt 210, and the following description will be based on this.

[0066] Regarding the specific connection manner between the bolt 210 and the heat conduction base 300, the present application provides two implementable embodiments for reference.

[0067] As Figure 6 shown, in an implementable embodiment, a relief hole 120 is formed on the heat dissipation member 100, and the relief hole 120 penetrates through the first surface and the second surface of the heat dissipation member 100. The bolt 210 passes through the relief hole 120 and is locked with the threaded hole 310.

[0068] In this embodiment, when the bolt 210 is tightened, the bolt 210 is in a pressed state, and the head of the bolt 210 cooperates with the heat conduction base 300 to press the heat dissipation member 100, thereby preventing the heat dissipation member 100 from rotating relative to the heat conduction base 300, and further preventing the heat dissipation member 100 from rotating relative to the heating element. When the bolt 210 is loosened or removed, the bolt 210 is in an adjustment state. At this time, the pressure of the head of the bolt 210 on the heat dissipation member 100 is reduced, so that the heat dissipation member 100 can rotate relative to the heat conduction base 300, and further the heat dissipation member 100 can rotate relative to the heating element.

[0069] As Figure 1 and Figure 2 shown, in another alternative embodiment, a relief hole 120 is formed on the heat dissipation member 100, and the relief hole 120 penetrates through the first surface and the second surface of the heat dissipation member 100. A connecting boss 320 extending into the relief hole 120 is provided on the second surface of the heat conduction base 300, and the threaded hole 310 is formed at one end of the connecting boss 320 away from the heat conduction base 300. In this way, the bolt 210 can also be locked with the threaded hole 310 without completely passing through the relief hole 120. Moreover, when the bolt 210 is loosened or removed, the connecting boss 320 can also limit the heat dissipation member 100, thereby preventing the heat dissipation member 100 from directly falling off and facilitating the adjustment of the position of the heat dissipation member 100.

[0070] Among them, the connecting boss 320 may not protrude from the second surface of the heat dissipation member 100. In other words, in Figure 2From the perspective of , the top surface of the connecting boss 320 is lower than the second surface of the heat dissipation member 100. In this way, when the bolt 210 is tightened, the bolt 210 is in a compressed state, the head of the bolt 210 contacts the second surface of the heat dissipation member 100 and cooperates with the heat conduction base 300 to compress the heat dissipation member 100, thereby preventing the heat dissipation member 100 from rotating relative to the connecting boss 320, and further preventing the heat dissipation member 100 from rotating relative to the heat generating element. When the bolt 210 is loosened or removed, the bolt 210 is in an adjustment state. At this time, the pressure of the head of the bolt 210 on the heat dissipation member 100 is reduced, so that the heat dissipation member 100 can rotate relative to the connecting boss 320, and further the heat dissipation member 100 can rotate relative to the heat generating element.

[0071] Of course, the connecting boss 320 can also protrude from the second surface of the heat dissipation member 100. Specifically, as Figure 2 shown, when the connecting boss 320 protrudes from the second surface of the heat dissipation member 100, the adjusting assembly 200 should further include an elastic member 220. The elastic member 220 is sleeved on the connecting boss 320, and the elastic member 220 is located between the head of the bolt 210 and the heat dissipation member 100. In this way, when the bolt 210 is tightened, the bolt 210 is in a compressed state, and the head of the bolt 210 compresses the elastic member 220, thereby compressing the heat dissipation member 100 through the elastic member 220, so as to prevent the heat dissipation member 100 from rotating relative to the connecting boss 320, and further preventing the heat dissipation member 100 from rotating relative to the heat generating element. When the bolt 210 is loosened, the bolt 210 is in an adjustment state. At this time, the elastic force of the elastic member 220 on the heat dissipation member 100 is reduced, so that the heat dissipation member 100 can rotate relative to the connecting boss 320, and further the heat dissipation member 100 can rotate relative to the heat generating element.

[0072] It should be noted that when the bolt 210 is loosened, there is still a partial elastic force of the elastic member 220 on the heat dissipation member 100 in this solution. This partial elastic force can form a damping effect on the rotation adjustment of the heat dissipation member 100 to facilitate the rotation adjustment of the heat dissipation member 100.

[0073] In this embodiment, the elastic member 220 can be located outside the relief hole 120. Of course, in order to improve the overall aesthetics of the heat dissipation device, the relief hole 120 can also be configured as a countersunk hole, wherein the countersunk part can be formed on some of the heat dissipation fins 110. In this way, the elastic member 220 can be at least partially received in the countersunk part of the relief hole 120 to reduce the external leakage of the elastic member 220 and improve the aesthetics.

[0074] In practical applications, the elastic member 220 can be a spring or an elastic sleeve, etc. The present application does not make specific limitations on this.

[0075] Further, the cross-section of the connecting boss 320 and the cross-section of the relief hole 120 are circular, or the inner contour dimension of the relief hole 120 is much larger than the outer contour dimension of the connecting boss 320, so that when the bolt 210 is loosened or removed, the heat sink 100 can rotate around the connecting boss 320.

[0076] Preferably, the cross-sections of both the connecting boss 320 and the relief hole 120 should be circular, and the connecting boss 320 is located on the center line of the heat-conducting base 300, and the relief hole 120 is located on the center line of the heat sink 100.

[0077] The cross-sections of the heat sink 100 and the heat-conducting base 300 described above can be circular, quadrilateral, pentagonal, elliptical or other shapes. Among them, the cross-section shapes of the heat sink 100 and the heat-conducting base 300 can be the same or different.

[0078] In view of the problem that during the process of adjusting the rotation of the heat sink 100, the heat sink 100 may rotate out of the range of the heat-conducting base 300 and interfere with other electronic components on the circuit board 400. For this reason, as Figure 1 shown, in a feasible implementation, the cross-section of the heat sink 100 can be circular, the cross-section of the heat-conducting base 300 is square, the rotation axis of the heat sink 100 coincides with the center line of the heat-conducting base 300, and the outer circular surface of the heat sink 100 is tangent to the four side surfaces of the heat-conducting base 300. In this way, the heat sink 100 is equivalent to the inscribed circle of the heat-conducting base 300. During the rotation adjustment process of the heat sink 100, the heat sink 100 will not exceed the heat-conducting base 300, thus avoiding the problem of colliding with other electronic components. At the same time, the heat sink 100 can be made as large as possible within the range of the heat-conducting base 300 to improve the heat dissipation effect.

[0079] In practical applications, the axis of the relief hole 120, the axis of the heat sink 100 and the center line of the heat-conducting base 300 coincide. At this time, the rotation axis of the heat sink 100 is the axis of the heat sink 100, so that the heat sink 100 is always tangent to the four side surfaces of the heat-conducting base 300 during the rotation process and does not exceed the range of the heat-conducting base 300.

[0080] In another alternative implementation, the cross-sections of both the heat sink 100 and the heat-conducting base 300 can be circular and have the same size. In this way, during the rotation adjustment process of the heat sink 100, the heat sink 100 can also not exceed the heat-conducting base 300, thus avoiding the problem of colliding with other electronic components. And the heat sink 100 can be made as large as possible within the range of the heat-conducting base 300 to improve the heat dissipation effect.

[0081] It should be noted that the "cross-section" defined in this application refers to the surface presented after the component is cut on a plane perpendicular to its center line.

[0082] Furthermore, regardless of the shape of the above-mentioned heat dissipation component 100, the heat dissipation fins 110 located on the second surface of the heat dissipation component 100 extend in a direction perpendicular to the first direction and the center line of the heat dissipation component 100, and both ends of the heat dissipation fins 110 extend to the edges of the heat dissipation component 100 respectively, so as to ensure that the heat dissipation fins 110 fully cover the second surface of the heat dissipation component 100, increase the heat dissipation area of the heat dissipation component 100, and improve the heat dissipation effect of the heat dissipation component 100.

[0083] As Figure 7 and Figure 8 shown, in a feasible implementation manner, a plurality of connecting columns 330 may also be provided on the first surface of the heat conduction base 300, and the heat conduction base 300 is connected to the circuit board 400 carrying the heating element through the plurality of connecting columns 330.

[0084] In practical applications, the connecting columns 330 can be connected to the circuit board 400 by means of screw fastening, snap connection or hot melting. When the cross-section of the heat conduction base 300 is square, there may be four connecting columns 330, and the four connecting columns 330 are respectively located at the four corners of the heat conduction base 300.

[0085] Based on the same inventive concept, as Figure 9 shown, this application also provides a display device. The display device at least includes a circuit board 400 carrying a heating element and the above-mentioned heat dissipation device. The heat conduction base 300 of the heat dissipation device is connected to the circuit board 400, and the heating element is in contact with the first surface of the heat conduction base (300). Among them, the display device can be an interactive flat panel, a display screen, a TV set, a smart blackboard, etc.

[0086] Furthermore, the display device further includes a housing 500 having an air inlet 510 and an air outlet 520, and the circuit board 400 and the heat dissipation device are installed in the housing 500. The air entering the housing 500 from the air inlet 510 and flowing out from the air outlet 520 forms a heat dissipation air flow at the heat dissipation device, and the flow direction of the heat dissipation air flow (as shown by the arrow direction in Figure 9 ) is substantially aligned with the length direction of the heat dissipation fins 110.

[0087] It should be noted that the specific structure of the heat dissipation device can refer to the content described in the above-mentioned implementation manner, and this application will not repeat it here.

[0088] The above are only the preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of this application shall be included within the protection scope of this application.

Claims

1. A heat dissipation device, characterized in that, Comprising: A heat dissipation member (100), the heat dissipation member (100) having a first surface and a second surface, the first surface of the heat dissipation member (100) being adapted to contact a heat generating element, and a plurality of heat dissipation fins (110) arranged in a first direction being provided on the second surface of the heat dissipation member (100), wherein the first direction is perpendicular to the center line of the heat dissipation member (100); An adjustment assembly (200), the adjustment assembly (200) having a pressing state and an adjustment state, wherein when the adjustment assembly (200) is in the pressing state, the adjustment assembly (200) presses the heat dissipation member (100) to prevent the heat dissipation member (100) from rotating relative to the heat generating element; when the adjustment assembly (200) is in the adjustment state, the adjustment assembly (200) at least partially reduces the acting force applied to the heat dissipation member (100) so that the heat dissipation member (100) can rotate relative to the heat generating element.

2. The heat dissipation device according to claim 1, wherein Further comprising: A heat conducting base (300), the heat conducting base (300) having a first surface and a second surface, the first surface of the heat conducting base (300) contacting the heat generating element, and the second surface of the heat conducting base (300) contacting the first surface of the heat dissipation member (100) so that the first surface of the heat dissipation member (100) contacts the heat generating element through the heat conducting base (300).

3. The heat dissipation device according to claim 2, wherein The adjustment assembly (200) includes a pressing member; The pressing member is detachably connected to the heat conducting base (300) and presses the heat dissipation member (100) between the pressing member and the heat conducting base (300).

4. The heat dissipation device according to claim 3, wherein, The pressing member is a bolt (210); The heat conducting base (300) is provided with a threaded hole (310) matching the bolt (210), the bolt (210) is locked with the threaded hole (310), and the heat dissipation member (100) is located between the head of the bolt (210) and the heat conducting base (300).

5. The heat dissipation device according to claim 4, wherein, A relief hole (120) is formed on the heat dissipation member (100), and the bolt (210) passes through the relief hole (120) and is locked with the threaded hole (310).

6. The heat dissipation device according to claim 4, characterized in that, A relief hole (120) is formed on the heat dissipation member (100); A connecting boss (320) extending into the relief hole (120) is provided on the second surface of the heat conducting base (300), and the threaded hole (310) is formed at one end of the connecting boss (320) away from the heat conducting base (300).

7. The heat dissipation device according to claim 6, characterized in that, The connecting boss (320) does not protrude from the second surface of the heat dissipation member (100).

8. The heat dissipation device according to claim 6, wherein The connecting boss (320) protrudes from the second surface of the heat dissipation member (100); The adjustment assembly (200) further includes an elastic member (220), the elastic member (220) is sleeved on the connecting boss (320), and the elastic member (220) is located between the head of the bolt (210) and the heat dissipation member (100).

9. The heat dissipation device according to any one of claims 2 to 8, characterized in that The cross section of the heat dissipation member (100) is circular; The cross-section of the heat-conducting base (300) is square. The rotation axis of the heat dissipation member (100) coincides with the center line of the heat-conducting base (300), and the outer circumferential surface of the heat dissipation member (100) is tangent to the four side surfaces of the heat-conducting base (300).

10. The heat dissipation device according to claim 9, characterized in that, The heat dissipation fins (110) extend in a direction perpendicular to the first direction and the center line of the heat dissipation member (100), and both ends of the heat dissipation fins (110) extend to the edges of the heat dissipation member (100) respectively.

11. The heat dissipation device according to claim 2, wherein, A plurality of connecting posts (330) are provided on the first surface of the heat-conducting base (300). The heat-conducting base (300) is connected to a circuit board (400) carrying the heating element through the plurality of connecting posts (330).

12. A display device, characterized in that, The display device at least includes a circuit board (400) carrying a heating element and the heat dissipation device according to any one of claims 2 to 10. The heat-conducting base (300) is connected to the circuit board (400), and the heating element is in contact with the first surface of the heat-conducting base (300).

13. The display device according to claim 12, wherein The display device further includes a housing (500) having an air inlet (510) and an air outlet (520). The circuit board (400) and the heat dissipation device are installed in the housing (500). The air entering the housing (500) from the air inlet (510) and flowing out from the air outlet (520) forms a heat dissipation air flow at the heat dissipation device, and the flow direction of the heat dissipation air flow is substantially aligned with the length direction of the heat dissipation fins (110).

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