Heat dissipation and conduction device for electronic equipment capable of replacing circuit board card on site

Abstract

The utility model discloses a heat dissipation conduction device for electronic equipment with a replaceable circuit board card on site. The heat conduction device is elastically installed between a heating device of an electronic equipment board card and a heat dissipation block on a cold plate. The heat conduction device comprises a contact piece, elastic supporting pieces, a first connecting piece and a second connecting piece, a pair of elastic supporting pieces are arranged at the two ends of the same side of the contact piece, the first connecting piece is located under the contact piece, and one side of the first connecting piece is connected with the bottom of one elastic supporting piece; the second supporting sheet is positioned below the side of the contact sheet and is connected with the bottom of the other elastic supporting sheet; and connecting holes are distributed on the first connecting sheet and the second connecting sheet. According to the utility model, the structure and the processing technology are simple, only the heat dissipation conduction device is added between the heat dissipation block and the heating device, the structure of the heat dissipation block does not need to be redesigned, the development efficiency is improved, and the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the field of heat dissipation structure design, and particularly relates to a heat dissipation conduction device for an electronic device with a field-replaceable circuit board card. Background Art

[0002] As Figure 1 shown, attaching the heat-generating device 1 of the electronic device board card to the heat dissipation block 2 on the cold plate, transferring the heat to the cold plate through the heat dissipation block, and then taking away the heat on the cold plate through air cooling, liquid cooling and other methods is one of the common heat dissipation methods for the heat-generating devices on the electronic device board card. In order to prevent interference between the heat dissipation block and the heat-generating device due to processing and assembly errors, a gap needs to be ensured between the two during design. Usually, materials such as thermal conductive resin and thermal conductive adhesive are used as a heat dissipation conduction device in the form of a thermal conductive gasket to compensate for the gap, so that the heat-generating device can be better attached to the heat dissipation block. The above heat dissipation conduction method is applicable to fixed electronic devices and does not require on-site plugging and unplugging of circuit board cards after installation.

[0003] In order to meet the requirement of on-site replaceability of the circuit board card of some electronic devices, the circuit board card usually adopts a locking and unplugging method, that is, the two sides of the circuit board card are clamped and fixed by a rear connector method, and the circuit board card is inserted and installed from front to back or from top to bottom. When the circuit board card fails, the screwdriver is used to loosen the lock, and the circuit board card can be unplugged to complete the replacement of the faulty circuit board card. However, for the heat dissipation conduction device made of materials such as thermal conductive resin and thermal conductive adhesive, due to its soft material, if it is too close to the heat-generating device, it will affect the plugging and unplugging of the electronic device board card; if there is a gap, it will affect the heat dissipation of the electronic device board card. Therefore, a heat dissipation conduction device is needed that can be better attached to the heat dissipation block and is convenient for the plugging and unplugging of the electronic device circuit board card. Summary of the Invention

[0004] The purpose of the utility model is to provide a heat dissipation conduction device for an electronic device with a field-replaceable circuit board card, which can achieve better attachment to the electronic device board card without affecting the plugging and unplugging of the electronic device board card, thereby facilitating heat dissipation.

[0005] In order to achieve the above task, the utility model adopts the following technical solutions:

[0006] A heat dissipation conduction device for an electronic device with a field-replaceable circuit board card, the heat conduction device is elastically installed between the heat-generating device of the electronic device board card and the heat dissipation block on the cold plate; the heat conduction device includes a contact piece, an elastic support piece, a first connection piece and a second connection piece, wherein:

[0007] A pair of elastic support pieces are arranged at both ends on the same side of the contact piece. The first connecting piece is located directly below the contact piece, and one side of the first connecting piece is connected to the bottom of one of the elastic support pieces; the second support piece is located below and to the side of the contact piece and is connected to the bottom of the other elastic support piece; connection holes are distributed on the first connecting piece and the second connecting piece.

[0008] Further, the first connecting piece is fixedly connected to the heat dissipation block through the connection holes and screws, the second connecting piece is fixed to the cold plate through the connection holes and screws, and the contact piece is in contact with the heat generating device under a compressed state.

[0009] Further, the overall position of the contact piece is pressed down by 0.5 mm after installation compared to before installation.

[0010] Further, the first connecting piece, the second connecting piece and the contact piece are arranged in parallel.

[0011] Further, the area of the first connecting piece is larger than the area of the second connecting piece.

[0012] Further, the first connecting piece and the second connecting piece are in the same installation plane or are arranged in parallel.

[0013] Further, the contact piece, the elastic support piece, the first connecting piece and the second connecting piece are all rectangular pieces.

[0014] Further, the included angle between the first connecting piece, the second connecting piece and the elastic support piece is an acute angle.

[0015] Further, the elastic support piece is a copper sheet.

[0016] Compared with the prior art, the present utility model has the following technical features:

[0017] The structure and processing technology of the present utility model are simple. By only adding a heat dissipation conduction device between the heat dissipation block and the heat generating device, there is no need to redesign the structure of the heat dissipation block, which improves the research and development efficiency and reduces the cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the gap between the heat generating device of the electronic device board and the heat dissipation block on the cold plate;

[0019] Figure 2 It is a schematic diagram of the overall structure of the present utility model;

[0020] Figure 3 It is a schematic diagram of the dimensions in an embodiment of the present utility model;

[0021] Figure 4 It is an application schematic diagram of the present utility model;

[0022] Figure 5Figures (a) and (b) are schematic diagrams of different stages during the installation process of the present utility model.

[0023] Explanation of reference numerals in the figures: 1 heat generating device, 2 heat sink, 3 contact piece, 4 elastic support piece, 5 first connecting piece, 6 second connecting piece, 7 connecting hole, 8 screw. Specific embodiments

[0024] Referring to the accompanying drawings, the present utility model provides a heat conduction device for an electronic device with a field-replaceable circuit board card. The heat conduction device is an elastic structure and is elastically installed between the heat generating device 1 of the circuit board card of the electronic device and the heat sink 2 on the cold plate; the heat conduction device includes a contact piece 3, an elastic support piece 4, a first connecting piece 5 and a second connecting piece 6, wherein:

[0025] A pair of elastic support pieces 4 are arranged at both ends on the same side of the contact piece 3. The first connecting piece 5 is located directly below the contact piece 3, and one side of the first connecting piece 5 is connected to the bottom of one of the elastic support pieces 4; the second support piece is located below the side of the contact piece 3 and is connected to the bottom of the other elastic support piece 4; connecting holes 7 are distributed on the first connecting piece 5 and the second connecting piece 6.

[0026] Preferably, the first connecting piece 5 and the second connecting piece 6 are arranged parallel to the contact piece 3 for easy installation and to enable better contact between the contact piece 3 and the surface during heat generation.

[0027] The area of the first connecting piece 5 is smaller than the area of the contact piece 3, so that there is a gap between the first connecting piece 5 and the second connecting piece 6.

[0028] Optionally, the areas of the first connecting piece 5 and the second connecting piece 6 are different; for example, the area of the first connecting piece 5 is larger than the area of the second connecting piece 6. Refer to Figure 4 , in this embodiment, the first connecting piece 5 is fixed on the heat sink 2 of the cold plate. For better heat conduction and heat dissipation, the first connecting piece 5 should have a larger contact area; while the second connecting piece 6 only serves a fixing function at this time. The first connecting piece 5 should be fixed on the cold plate or the heat sink 2 of the cold plate depending on its specific installation situation. For easy arrangement, the first connecting piece 5 and the second connecting piece 6 are on the same installation plane or are arranged in parallel.

[0029] Preferably, the contact piece 3, the elastic support piece 4, the first connecting piece 5 and the second connecting piece 6 are all rectangular pieces; the included angle between the first connecting piece 5, the second connecting piece 6 and the elastic support piece 4 is an acute angle, for example 60°.

[0030] The elastic support piece 4 is a copper sheet and has elastic telescopic ability; when the contact piece 3 is pressed, the elastic support piece 4 deforms, and through the elastic force, the contact piece 3 can be in close contact with the heating device 1, and at the same time, it also plays a role in support and vibration buffering.

[0031] In the embodiment of the present utility model as Figure 4 shown, the whole device is made of QSn6.5-0.1 phosphor bronze material, which has the advantages of good heat conduction performance, high tensile strength and high elongation rate; the connecting hole 7 of the first connecting piece 5 is connected and fastened to the heat sink 2 by a screw 8, the second connecting piece 6 is fixed on the cold plate through the connecting hole 7 and the screw 8, and the contact piece 3 is in contact with the heating device 1; by longitudinally squeezing the contact piece 3, the elastic support piece 4 is compressed, so that the surface of the contact piece 3 is closely attached to the heating device 1, and the heat generated by the heating device 1 is transferred to the heat sink 2 through the contact piece 3, the elastic support piece 4 and the first connecting piece 5, so as to achieve the purpose of dissipating heat from the heating device 1. At the same time, due to the elasticity provided by the elastic support piece 4, there will be no interference when the electronic device board is inserted and removed; when the board is locked by a lock, due to the longitudinal extrusion, the copper elastic piece has an upward elastic force on the heating device 1, so as to support and buffer the vibration of the circuit board where the heating device 1 is located.

[0032] In this solution, due to the design of the elastic support piece 4 structure, the influence of the gap caused by the error of different batches of products can be eliminated to a great extent, the electronic device board can be better fitted with the heat sink 2, and the heat dissipation conduction device for inserting and removing the electronic device board is not affected.

[0033] Embodiment:

[0034] In an embodiment of the present utility model, the contact piece 3, the elastic support piece 4, the first connecting piece 5 and the second connecting piece 6 are made by laser cutting and cold rolling processes, and the maximum outer dimension is 84mm * 54mm * 13.5mm, and this dimension can cover the main heating device 1 of the equipment board; the size of the contact piece 3 is 51mm * 68mm, which is convenient for the heat dissipation of the equipment board. The device is fixed on the heat sink 2 of the chassis by four screws 8. Since the circuit board is installed by inserting into the guide groove from front to back for installation and fixation, for the convenience of installation, there is an included angle of 60° between the first connecting piece 5, the second connecting piece 6 and the elastic support piece 4.

[0035] As Figure 5As shown in (a) and (b), the device is installed inside the chassis, below the electronic device board. The first connecting piece 5 and the second connecting piece 6 are fastened to the cold plate and the heat sink 2 of the chassis using screws 8. The contact piece 3 is in contact with the heat-generating device 1 that needs to be cooled. When installing, the electronic device board needs to be lifted so that the locking strip above the electronic device board is closely attached to the upper end of the installation slot. At this time, there is a 0.5 mm gap between the heat-generating device 1 and the surface of the contact piece 3. The electronic device board is installed from front to back along the installation slot. When encountering the plug connector at the rear of the electronic device board, the entire electronic device board is pressed down and pushed backward until the connector at the rear of the electronic device board is plugged and locked. After the locking strips on both sides of the electronic device board are locked, the heat-generating device 1 on the electronic device board contacts and presses down the contact piece 3, and the elastic support piece 4 is compressed and deformed, causing the entire contact piece 3 to be pressed down by 0.5 mm. At this time, since the contact piece 3 is compressed longitudinally, an upward force is generated on the heat-generating device 1, thus ensuring that the device is always in contact with the electronic device board and the heat sink 2 under a certain pressure. Since the electronic device board and the contact piece 3 are in a relatively static state, the acting force and the elastic force are equal in magnitude and opposite in direction.

[0036] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A heat conduction device for an electronic device with a field-replaceable circuit board card, characterized in that, The heat conduction device is elastically mounted between the heat-generating component (1) of the electronic device board and the heat dissipation block (2) on the cold plate; the heat conduction device includes a contact piece (3), an elastic support piece (4), a first connecting piece (5), and a second connecting piece (6), where: A pair of elastic support pieces (4) are arranged at both ends on the same side of the contact piece (3). The first connecting piece (5) is located directly below the contact piece (3), and one side of the first connecting piece (5) is connected to the bottom of one of the elastic support pieces (4); the second support piece is located below the side of the contact piece (3) and is connected to the bottom of the other elastic support piece (4); connection holes (7) are distributed on the first connecting piece (5) and the second connecting piece (6).

2. The heat conduction device for an electronic device with a field-replaceable circuit board card according to claim 1, characterized in that, The first connecting piece (5) is connected and fastened to the heat dissipation block (2) through the connection holes (7) and screws (8), the second connecting piece (6) is fixed to the cold plate through the connection holes (7) and screws (8), and the contact piece (3) contacts the heat-generating component (1) under a compressed state.

3. The heat conduction device for an electronic device with a field-replaceable circuit board card according to claim 1, characterized in that, The overall position of the contact piece (3) is pressed down by 0.5 mm after installation compared to before installation.

4. The heat conduction device of the electronic device for field-replaceable circuit board cards according to claim 1, wherein The first connecting piece (5) and the second connecting piece (6) are arranged in parallel with the contact piece (3).

5. The heat conduction device of the electronic device for the field-replaceable circuit board card according to claim 1, characterized in that, The area of the first connecting piece (5) is larger than the area of the second connecting piece (6).

6. The heat conduction device of the electronic device for field replaceable circuit board cards according to claim 1, characterized in that, The first connecting piece (5) and the second connecting piece (6) are in the same installation plane or are arranged in parallel.

7. The heat conduction device of the electronic device for field replaceable circuit board cards according to claim 1, characterized in that, The contact piece (3), the elastic support piece (4), the first connecting piece (5), and the second connecting piece (6) are all rectangular pieces.

8. The heat dissipation conduction device of the electronic device for field-replaceable circuit boards according to claim 1, characterized in that, The included angles between the first connecting piece (5), the second connecting piece (6) and the elastic support piece (4) are acute angles.

9. The heat conduction device of the electronic device for field-replaceable circuit boards according to claim 1, characterized in that The elastic support piece (4) is a copper sheet.

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