Data acquisition equipment with multiple heat dissipation modes and vehicle thereof

Abstract

The utility model relates to the field of vehicle-mounted heat dissipation, and particularly discloses data acquisition equipment with multiple heat dissipation modes and a vehicle thereof. The first heat dissipation mechanism and the second heat dissipation mechanism are arranged in the data acquisition equipment with multiple heat dissipation modes, water-cooling heat dissipation is performed on the data acquisition mechanism through the first heat dissipation mechanism, and air-cooling heat dissipation is performed on the data acquisition mechanism through the second heat dissipation mechanism. The controller is provided with the first heat dissipation mechanism, so that the controller can be quickly subjected to water-cooling heat dissipation, and the situation that the controller is overheated and cannot be used is prevented. Meanwhile, the overall structure of the data acquisition mechanism further comprises a magnetic disk, and overall heat dissipation can be carried out by arranging a second heat dissipation mechanism. Through multiple heat dissipation of the first heat dissipation mechanism and the second heat dissipation mechanism, heat dissipation can be carried out on the data acquisition mechanism in all directions, and the situation that original parts cannot be used or data are lost is prevented.

Description

Technical Field

[0001] The utility model relates to the field of vehicle-mounted heat dissipation, and in particular discloses a data acquisition device with multiple heat dissipation modes and a vehicle thereof. Background Art

[0002] With the continuous development of intelligent driving, automobile data collection technology plays an important role. By collecting data such as vehicle status, road conditions, and environment, the intelligent driving system can achieve comprehensive monitoring and control of vehicle driving. With the continuous increase of data collection equipment, the heat generated by the equipment continues to increase. The heat generated by some data collection equipment continues to accumulate, which will cause the equipment to lose data or fail to work properly. Some methods are needed to solve the heat dissipation problem of some data collection equipment.

[0003] In the prior art, there are many heat dissipation methods for intelligent driving data collection equipment. Often, a single heat dissipation method or natural heat dissipation method is used to dissipate heat for the data collection equipment. However, for data collection equipment with multiple electronic components, a single heat dissipation method cannot accurately dissipate heat for each part, and some components are not suitable for water cooling, and some components are not suitable for air cooling. At this time, a single heat dissipation method results in insufficient heat dissipation, which may cause the data collection equipment to overheat and become unusable or data loss. Moreover, since the data collection equipment is generally arranged in a closed box, a single heat dissipation method will cause a large amount of heat to accumulate in the closed box, ultimately causing a large amount of heat to accumulate in the box, leading to overheating of other components. Utility Model Content

[0004] In order to solve the above problems, the utility model proposes a data acquisition device and a vehicle with multiple heat dissipation methods. By providing a first heat dissipation mechanism on the data acquisition mechanism for water cooling, the data acquisition mechanism can timely control the temperature when the amount of data calculation is large to prevent the vehicle from being paralyzed due to excessive temperature. A second heat dissipation mechanism is provided to input cold air through the second heat dissipation mechanism to cool down the equipment that is not suitable for water cooling, and drive the hot air in the equipment to be discharged by the exhaust fan to prevent the equipment from being overheated and causing the data of the equipment to be lost. Through two different heat dissipation structures, components with different heat dissipation requirements are heated respectively.

[0005] The purpose of the utility model is achieved through the following technical solutions:

[0006] On the one hand, a data acquisition device with multiple heat dissipation modes includes:

[0007] The data acquisition mechanism comprises a rack and a first circuit board assembly arranged on the rack, wherein the first circuit board assembly is provided with a water cooling controller;

[0008] The first heat dissipation mechanism includes a liquid cooler and a water pipe, one end of the water pipe is connected to the liquid cooler and the other end of the water pipe is connected to a water cooling controller;

[0009] The second heat dissipation mechanism includes an air conditioning pipe and an exhaust fan. The air inlet of the air conditioning pipe is connected to the vehicle air conditioner, and the air outlet of the air conditioning pipe is arranged on a side of the data acquisition mechanism and the air is discharged along the data acquisition mechanism; the exhaust fan is arranged on a side of the data acquisition mechanism and the exhaust fan and the air inlet pipe are not arranged in the same plane.

[0010] The multi-heat dissipation acquisition device includes a rack and a first circuit board assembly for collecting calculations and exchanging data. The rack is used to carry the entire device body. The first circuit board assembly is arranged on the rack, and a water-cooling controller is arranged on the first circuit board assembly. The water-cooling controller is attached to the upper end of the first circuit board assembly, which can maximize the contact area between the water-cooling controller and the first circuit board assembly and reduce the distance between the water-cooling controller and the first circuit board, thereby improving the heat dissipation capacity of the water-cooling controller. The water-cooling controller cools and dissipates heat through a first heat dissipation mechanism, and mainly adopts a liquid cooling method. The water-cooling liquid is input into the water-cooling controller through a water pipe through a liquid cooler, and the water-cooling liquid is circulated in the water-cooling controller and returned to the liquid cooler. The water-cooling liquid absorbs the heat dissipated by the first circuit board assembly. The heat generated is brought out to the liquid cooler by the water-cooling liquid, and the heat circulation is realized by this reciprocating process. At the same time, since the data acquisition mechanism is generally arranged in a relatively closed box, a second heat dissipation mechanism is also provided. The second heat dissipation mechanism adopts an air-conditioning pipe and an exhaust fan to cool down the devices that can only be cooled by cold air. At the same time, the air-conditioning pipe and the exhaust fan are not arranged coplanarly, so that the air-conditioning pipe and the exhaust fan can be placed on two sides respectively, and then after the cold air is input through the air-conditioning pipe, it is blown to the exhaust fan on the other side of the data acquisition mechanism, so that the heat generated by the data acquisition mechanism can be discharged through the exhaust fan, further improving the heat dissipation capacity of the entire equipment. The non-coplanar arrangement can also make the cold air blown in by the air-conditioning pipe pass through a larger area of ​​the collection equipment, the heat dissipation is more sufficient, and more heat is taken away.

[0011] In some embodiments, the rack includes a bottom shell and a bracket, the bracket is fixed to the upper surface of the bottom shell and forms a first mounting layer and a second mounting layer, the bottom shell is provided with a mounting groove; the first mounting layer is provided with a first through groove, and the first circuit board assembly is arranged on the first mounting layer.

[0012] The bottom shell is provided with a plurality of mounting holes for fixing to the vehicle. The bracket is erected above the bottom shell and is provided with a first mounting layer and a second mounting layer for separating circuit components with different heat dissipation methods. A mounting groove is also provided for installing a water cooling device. By providing a first through groove, the water cooling device is extended from the mounting groove and connected to the mounting layer.

[0013] In some embodiments, the water-cooling controller is disposed on the first installation layer, and the liquid chiller is disposed in the installation groove; the water pipe passes through the through groove and is connected to the water-cooling controller and the liquid chiller.

[0014] The water-cooling controller is liquid-cooled by the liquid chiller, and the water pipe extends from the installation groove to the upper first installation layer through the first through groove for inputting the cooling liquid.

[0015] In some embodiments, the water-cooling controller includes a first housing, a second housing, and a controller assembly. The first housing is fixedly connected to the second housing, and the controller assembly is disposed inside the first housing and the second housing. The first housing is provided with a water inlet, a water outlet, and a water-cooling channel, and both ends of the water-cooling channel are respectively connected to the water inlet and the water outlet.

[0016] The water-cooling controller can be disassembled into a first housing and a second housing. The first housing is provided with a channel for the flow of the water-cooling liquid, and the second housing is used for placing the control assembly. The first housing and the second housing can be covered. When the first housing and the second housing are covered, the water-cooling liquid flow channel of the first housing is attached to a circuit board for data acquisition, such as a domain controller. The heat generated during data acquisition is carried away by the flow of the water-cooling liquid through the flow of the water-cooling liquid, so as to achieve the effect of heat dissipation.

[0017] In some embodiments, the water inlet and the water outlet are disposed on the same end face of the water-cooling controller; the water-cooling channel is arranged in a "U" shape, and the water-cooling channel is further provided with a plurality of heat sinks; a first boss is provided on the lower surface of the first housing, and the first boss is located below the heat sinks and abuts against the upper surface of the controller assembly.

[0018] The water-cooling channel is designed as a U-shaped structure, with one end as the water inlet and the other end as the water outlet. The water-cooling liquid flows out of the water outlet through the channel from the water inlet, so that the heat transferred from the bottom of the water-cooling channel is absorbed by the water-cooling liquid and carried away by the water-cooling liquid as the water flows. In order to further improve the water-cooling effect, a plurality of heat sinks are further arranged in the water-cooling channel. A first boss is arranged below the heat sinks, and the first boss can further make the distance between the first housing and the chips on the data acquisition circuit board in the first circuit board assembly closer, thereby further increasing the heat dissipation effect and improving the heat dissipation capacity, and further preventing the entire circuit from necrosis caused by the burnout of the chips during a large amount of data acquisition, which in turn causes the burnout of the entire domain controller and the first circuit board assembly or data loss.

[0019] In some embodiments, the cold controller further includes a first water-cooling controller and a second water-cooling controller. The water inlet of the first water-cooling controller is connected to the water outlet of the second water-cooling controller, the water inlet of the second water-cooling controller is connected to the water outlet of the liquid chiller, and the water outlet of the first water-cooling controller is connected to the water inlet of the liquid chiller.

[0020] To further improve the water-cooling effect, two or more water-cooling controllers can be set up. The water-cooling controllers are connected in such a way that the water inlet and the water outlet are connected. The liquid cooler discharges water and passes through multiple water-cooling controllers respectively, and finally flows into the liquid cooler through the last water-cooling controller. By using the same liquid cooler for heat dissipation at the same time, the number of liquid coolers can be reduced, and the occupied space of the first heat dissipation mechanism can be reduced.

[0021] In some embodiments, the bracket further includes a second circuit board assembly and a third circuit board assembly; the second circuit board assembly is arranged on the second installation layer, and two third circuit board assemblies are arranged on the first installation layer and are respectively arranged on both sides of the first through groove.

[0022] Since the second circuit board assembly is a component that cannot use water cooling, such as a disk, but needs to frequently perform data exchange and storage, there is also a certain need for heat dissipation. Therefore, it is arranged above the first circuit board assembly and is separately cooled by the second heat dissipation mechanism. The air outlet of the air-conditioning pipe is aligned with the second circuit board assembly to blow cold air to cool the second circuit board assembly; the electronic components on the third circuit board assembly have lower heat dissipation requirements than the first circuit board assembly and the second circuit board assembly. Therefore, the third circuit board assembly is arranged on both sides of the first through groove and is respectively arranged at both ends of the first circuit board assembly. When the second heat dissipation mechanism dissipates heat from the second circuit board assembly, it can be cooled together by the second heat dissipation mechanism. By setting up the second heat dissipation mechanism, the heat dissipation capacity of the overall data acquisition mechanism is further improved. By setting up the air-conditioning pipe and the exhaust fan, the heat generated by the device is driven out, reducing the heat accumulation in the data acquisition mechanism and preventing problems such as abnormal operation or data loss caused by excessive internal heat in the data acquisition mechanism.

[0023] In some embodiments, the second circuit board assembly includes a disk, a splitter board, and an inverter; the air outlet of the air inlet pipe is arranged on one side of the disk, and the splitter board and the inverter are respectively arranged on both sides of the disk; the third circuit board assembly includes a lidar, an ethernet conversion box, a power supply, a switch, and an industrial router; the power supply and the switch are arranged on one side of the first through groove, and the industrial router, the lidar, and the ethernet conversion box are arranged on the other side of the first through groove.

[0024] The second circuit board assembly includes a disk. Since the disk will perform a large amount of data exchange and storage during use, the disk will generate a large amount of heat during use. However, the disk cannot use water cooling for heat dissipation. Therefore, the disk is cooled by blowing cold air. The components on the third circuit board assembly do not have such a large data requirement during operation, and there is no need to use a separate heat dissipation mechanism for heat dissipation, which can also reduce the energy consumption of the entire device.

[0025] In some embodiments, the air outlet of the air-conditioning pipe is disposed adjacent to the disk of the second circuit board assembly and blows air along the disk, and the two exhaust fans are respectively adjacent to the two third circuit board assemblies or are disposed at the two sides of the second installation layer farthest from the first circuit board assembly.

[0026] The air outlet of the air conditioner is arranged at the disk, which can improve the cooling capacity of the disk and prevent the disk from being unusable and data loss caused by overheating during a large amount of operations. The exhaust fan is arranged on one side of the third circuit board assembly or adjacent thereto. The exhaust fan can be arranged at one end of the third circuit board assembly far from the first circuit board assembly or at the vehicle exhaust air outlet, which can further make the air outlet and the exhaust air outlet of the air conditioner on both sides of the data acquisition mechanism. When blowing air, the cold air will pass through the air outlet and blow out through the entire data acquisition mechanism. And because the exhaust fan is arranged at one end of the third circuit board assembly far from the first circuit board assembly, when blowing air, after the cold air passes through the second circuit board assembly, it can also pass through the third circuit board assembly for cooling, thereby saving the cost of setting a cooling mechanism for the third circuit board assembly and realizing the further utilization of energy.

[0027] On the other hand, for a vehicle, the data acquisition device with multiple heat dissipation methods is arranged in the vehicle trunk or the front trunk or on the roof or the chassis.

[0028] In some embodiments, in intelligent driving, the data acquisition mechanism is generally arranged in the vehicle trunk and is used for data acquisition and storage of data such as the state, road conditions, and environment of the vehicle in intelligent driving, and for assisting in intelligent control.

[0029] A data acquisition device with multiple heat dissipation methods and its vehicle according to the present utility model have the following effects:

[0030] The controller of the data acquisition mechanism is used for data acquisition and storage of data such as the state, road conditions, and environment of the vehicle in intelligent driving. Because a large amount of heat is easily generated during its high-speed calculation process, by setting a first heat dissipation mechanism and a second heat dissipation mechanism in the data acquisition device with multiple heat dissipation methods, and respectively performing water-cooled heat dissipation on the data acquisition mechanism through the first heat dissipation mechanism and air-cooled heat dissipation on the data acquisition mechanism through the second heat dissipation mechanism, setting the first heat dissipation mechanism in the controller can quickly perform water-cooled heat dissipation on the controller, thereby preventing the controller from being unusable due to overheating. At the same time, the overall structure of the data acquisition mechanism also includes a disk, and the overall heat dissipation can be performed by setting the second heat dissipation mechanism. Through multiple heat dissipations of the first heat dissipation mechanism and the second heat dissipation mechanism, the data acquisition mechanism can be comprehensively cooled, thereby preventing the components from being unusable or data loss. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 is a three-dimensional schematic diagram of the present utility model;

[0032] Figure 2 Schematic diagram of the first heat dissipation device of the present utility model;

[0033] Figure 3 Top view of the water cooling channel of the present utility model;

[0034] Figure 4 Top view of the present utility model;

[0035] Figure 5 Bottom view of the first housing of the present utility model;

[0036] Figure 6 Schematic perspective view of the frame of the present utility model;

[0037] Reference numerals:

[0038] 100, frame; 110, bottom case; 120, bracket; 121, first installation layer; 122, second installation layer; 123, first through groove;

[0039] 200, first heat dissipation mechanism; 210, liquid chiller; 220, water pipe; 230, water cooling controller; 231, first housing; 232, water cooling channel; 233, heat sink; 234, first boss;

[0040] 300, second heat dissipation mechanism; 310, air conditioning pipe; 320, exhaust fan;

[0041] 400, disk; 410, shunt board; 420, inverter; 430, lidar; 440, Ethernet conversion box; 450, power supply; 460, switch; 470, industrial router. Detailed implementation manners

[0042] It should be noted that, without conflict, the embodiments in the present utility model and the technical features in the embodiments can be combined with each other. The detailed description in the detailed implementation manners should be understood as an explanatory illustration of the gist of the present utility model and should not be regarded as an improper limitation of the present utility model.

[0043] To make the objectives, technical solutions and advantages of the embodiments of the present utility model clearer, the following will further describe the specific technical solutions of the present utility model in detail with reference to the accompanying drawings in the embodiments of the present utility model. The following embodiments are used to illustrate the present utility model but are not used to limit the scope of the present utility model.

[0044] In the embodiments of the present utility model, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present utility model, unless otherwise stated, the meaning of "a plurality" is two or more.

[0045] In addition, in the embodiments of the present utility model, orientation terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification, and they may change accordingly with the change of the orientation of the components placed in the drawings.

[0046] In the embodiments of the present utility model, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one; it can be directly connected or indirectly connected through an intermediate medium.

[0047] In the embodiments of the present utility model, the terms "include", "comprise", or any other variant thereof are intended to cover non-exclusive inclusion. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, method, article, or device including the element.

[0048] In the embodiments of the present utility model, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present utility model should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant in a specific manner.

[0049] Embodiment 1:

[0050] As Figure 1 shown, a data acquisition device with multiple heat dissipation methods includes

[0051] a data acquisition mechanism, including a frame 100 and a first circuit board assembly disposed on the frame 100, and a water-cooling controller 230 is disposed on the first circuit board assembly;

[0052] a first heat dissipation mechanism 200, including a liquid chiller 210 and a water pipe 220, one end of the water pipe 220 is connected to the liquid chiller 210 and the other end of the water pipe 220 is connected to the water-cooling controller 230;

[0053] The second heat dissipation mechanism 300 includes an air-conditioning pipe 310 and an exhaust fan 320. The air inlet of the air-conditioning pipe 310 is connected to the vehicle-mounted air conditioner, and the air outlet of the air-conditioning pipe 310 is arranged on one side of the data acquisition mechanism and discharges air along the data acquisition mechanism. The exhaust fan 320 is arranged on one side of the data acquisition mechanism, and the exhaust fan 320 and the air-conditioning pipe 310 are arranged non-coplanarly.

[0054] Specifically, a surface formed by a circuit board is erected on the frame 100. The first circuit board assembly is arranged on the surface formed by the frame 100, and a water-cooling control assembly is arranged to fit on the surface of the first circuit board assembly, and fixing seat screws extend out at the four corners for fixing. The liquid cooler 210 of the first heat dissipation mechanism 200 is arranged in the frame 100, and the liquid cooler 210 is limited and fixed in the frame 100 by arranging multiple cross bars on the frame 100. And the water outlet and water inlet of the water-cooling controller 230 are connected through a water pipe 220. When the water-cooling controller 230 is installed, both the water outlet and water inlet face the liquid cooler 210 for convenient installation. One end of the second heat dissipation mechanism 300 is installed at the air outlet of the air conditioner, and the other end extends to the top of the frame 100, so that the air outlets of the exhaust fan 320 and the air-conditioning pipe 310 are not in the same plane. There is also a beneficial effect of arranging the air outlet of the air conditioner at a higher position. After the cold air blows out, it is easy to sink downward, and then contact and absorb the heat of the hot air of the devices generating heat below, and is discharged through the exhaust fan 320.

[0055] The multi-heat dissipation acquisition device includes a frame 100 and a first circuit board assembly for acquiring, calculating and exchanging data. The frame 100 is used to carry the entire device body. The first circuit board assembly is arranged on the frame 100, and a water-cooling controller 230 is arranged on the first circuit board assembly. The water-cooling controller 230 fits on the upper end of the first circuit board assembly, which can maximize the contact area between the water-cooling controller 230 and the first circuit board assembly and reduce the distance between the water-cooling controller 230 and the first circuit board, thereby improving the heat dissipation capacity of the water-cooling controller 230. The water-cooling controller 230 is cooled and dissipated heat through the first heat dissipation mechanism 200, mainly by the liquid cooling method. The liquid cooler 210 inputs the water-cooling liquid into the water-cooling controller 230 through the water pipe 220, and makes the water-cooling liquid circulate in the water-cooling controller 230 and return to the liquid cooler 210. The water-cooling liquid absorbs the heat dissipated by the first circuit board assembly and is taken out to the liquid cooler 210 by the water-cooling liquid, and the heat cycle is realized reciprocally in this way. At the same time, since the data acquisition mechanism is generally arranged in a relatively enclosed box, a second heat dissipation mechanism 300 is also provided. The second heat dissipation mechanism 300 adopts the method of an air-conditioning pipe 310 and an exhaust fan 320. The cold air is input through the air-conditioning pipe 310 and blown into the exhaust fan 320 on the other side of the data acquisition mechanism, so that the heat dissipated by the data acquisition mechanism can be discharged through the exhaust fan 320, further improving the heat dissipation capacity of the entire device.

[0056] Embodiment 2:

[0057] Based on Embodiment 1, as Figures 2 to 6 shown, this embodiment further describes and optimizes the heat dissipation mechanism and the bracket 120;

[0058] In some embodiments, the frame 100 includes a bottom case 110 and a bracket 120. The bracket 120 is fixed on the upper surface of the bottom case 110 and forms a first mounting layer 121 and a second mounting layer 122. The bottom case 110 is provided with a mounting groove; the first mounting layer 121 is provided with a first through slot 123, and the first circuit board assembly is disposed on the first mounting layer 121.

[0059] In some embodiments, the water-cooling controller 230 is disposed on the first mounting layer 121, and the liquid chiller 210 is disposed in the mounting groove; the water pipe 220 passes through the through slot and is connected to the water-cooling controller 230 and the liquid chiller 210.

[0060] Specifically, the frame 100 is provided with a bottom case 110 and a bracket 120. The bracket 120 is erected above the bottom case 110 and fixed around the bottom case 110. A first mounting layer 121 and a second mounting layer 122 are provided above the bracket 120. The mounting layer is a circuit board for directly connecting to the circuit board assembly. A rectangular first through slot 123 is provided between the first mounting layers 121. The first through slot 123 enables the water pipe 220 to connect the liquid chiller 210 disposed in the mounting groove to the water-cooling controller 230 on the first circuit board assembly disposed on the surface of the first mounting layer 121. The water-cooling controller 230 is fixed on the first mounting layer 121 through the periphery of the first circuit board assembly. Thus, the water-cooling controller 230 is indirectly mounted on the first mounting layer 121. The first mounting layer 121 surrounds the rectangular first through slot 123 and on one side and the adjacent two sides of the first through slot 123 close to the second heat dissipation mechanism 300; the first circuit board assembly is disposed on the surface of the first mounting layer 121 close to the second heat dissipation mechanism 300. A second mounting layer 122 is provided above the first mounting layer 121 where the first circuit board assembly is located. The height of the second mounting layer 122 corresponds to the height of the air outlet of the air-conditioning pipe 310, so that the cold air from the air outlet can blow over the surface of the second mounting layer 122. By providing the first through slot 123, the liquid chiller 210 can be limited in the mounting groove below the first mounting layer 121, and the water pipe 220 is connected through the first through slot 123, which can prevent the problems of collision caused by the shaking of the liquid chiller 210 and the failure of the heat dissipation mechanism caused by the shaking of the water pipe 220 during vehicle driving. The establishment of the first mounting layer 121 and the second mounting layer 122 can separate the first heat dissipation mechanism 200 and the second heat dissipation mechanism 300, so that it can prevent the equipment that is not suitable for water cooling from being cooled separately.

[0061] In some embodiments, the water-cooling controller 230 includes a first housing 231, a second housing, and a controller assembly. The first housing 231 is fixedly connected to the second housing. The controller assembly is disposed inside the first housing 231 and the second housing. The first housing 231 is provided with a water inlet, a water outlet, and a water-cooling channel 232. Both ends of the water-cooling channel 232 are connected to the water inlet and the water outlet respectively.

[0062] Specifically, since the controller assembly is disposed inside the first housing 231 and the second housing and is the main heat source, when fixing, the controller assembly is limited below the water-cooling channel 232 to ensure the water-cooling effect during water-cooling. The water-cooling channel 232 is provided with a water inlet and a water outlet. The water-cooling liquid flows from the water inlet to the water outlet, and the water inlet and the water outlet are on the same side.

[0063] The beneficial effects achieved above are that the water-cooling controller 230 can be disassembled into a first housing 231 and a second housing. The first housing 231 is provided with a channel for the water-cooling liquid to flow. The second housing is used to place the control assembly. The first housing 231 and the second housing can be covered. When the second housing is covered, the water-cooling liquid flow channel of the first housing 231 is attached to the circuit board for data acquisition. The heat generated during data acquisition is taken away by the flow of the water-cooling liquid to achieve the heat dissipation effect.

[0064] In some embodiments, the water inlet and the water outlet are disposed on the same end face of the water-cooling controller 230; the water-cooling channel 232 is arranged in a "U" shape, and the water-cooling channel 232 is further provided with a plurality of heat sinks 233; a first boss 234 is provided on the lower surface of the first housing 231, and the first boss 234 is located below the heat sinks 233, and the first boss 234 abuts against the upper surface of the controller assembly.

[0065] Specifically, the water-cooling channel 232 is arranged in a "U" shape, which can make the water-cooling liquid flow a longer distance on the surface of the controller assembly, thereby improving the overall heat dissipation effect. Moreover, there is a certain gap in the middle of the "U" - shaped channel, which can also make the heat dissipate further. Three rectangular heat sinks 233 are arranged in the water-cooling channel 232, which can increase the air contact area at this place and further increase the heat dissipation level of the area where the heat sinks 223 are located. A first boss 234 is provided below the channel where the heat sinks 233 are located. The first boss 234 makes the distance between the first housing 231 and the controller assembly shorter, further improving the heat conduction ability of the controller assembly at this place. The first boss 234 is specifically set to further improve the heat dissipation ability of parts such as chips or parts with larger heat - generating parts, preventing the controller from overheating and causing abnormal use or data loss.

[0066] The beneficial effects achieved above are as follows: The water-cooling channel 232 is designed as a U-shaped structure, with one end being the water inlet and the other end being the water outlet. The water-cooling liquid flows out of the channel through the water inlet and then out of the water outlet, so that the heat transferred from the bottom of the water-cooling channel 232 is absorbed by the water-cooling liquid and carried away by the flowing water. To further enhance the water-cooling effect, a plurality of heat sinks 233 are provided in the water-cooling channel 232. A first boss 234 is provided below the heat sink 233. The first boss 234 can further reduce the distance between the first housing 231 and the chip on the data acquisition circuit board in the control board assembly, thereby further increasing the heat dissipation effect and improving the heat dissipation capacity, and preventing the chip from burning out during a large amount of data acquisition, which may lead to the necrosis of the entire circuit, and further cause the entire domain controller and the first circuit board assembly to burn out or data loss.

[0067] In some embodiments, the cold controller further includes a first water-cooling controller 230 and a second water-cooling controller 230. The water inlet of the first water-cooling controller 230 is connected to the water outlet of the second water-cooling controller 230. The water inlet of the second water-cooling controller 230 is connected to the water outlet of the liquid chiller 210. The water outlet of the first water-cooling controller 230 is connected to the water inlet of the liquid chiller 210.

[0068] The beneficial effects achieved above are as follows: The water-cooling controllers 230 are connected in such a way that the water inlet and the water outlet are connected. The liquid chiller 210 discharges water, which passes through a plurality of water-cooling controllers 230 respectively and finally flows into the liquid chiller 210 through the last water-cooling controller 230. By using the same liquid chiller 210 for heat dissipation at the same time, the number of liquid chillers 210 can be reduced, and the occupied space of the first heat dissipation mechanism 200 can be reduced.

[0069] In some embodiments, the bracket 120 further includes a second circuit board assembly and a third circuit board assembly; the second circuit board assembly is fixedly installed on the second installation layer 122. After installation, the air outlet of the second heat dissipation mechanism 300 is fixed on one side of the second circuit board assembly through a fixing seat. By aligning the air outlet with some components of the second circuit board assembly, the components on the second circuit board assembly can be cooled. The two third circuit board assemblies are arranged on the first installation layer 121 and are respectively arranged on both sides of the first through groove 123.

[0070] The beneficial effects achieved above are as follows. Since the second circuit board assembly is a component that cannot use water cooling, such as the disk 400, but it needs to frequently perform data exchange and storage, the second circuit board assembly also has a certain demand for heat dissipation. Therefore, it is arranged on top of the first circuit board assembly and is separately cooled by the second heat dissipation mechanism 300. The air outlet of the air-conditioning pipe 310 is aligned with the second circuit board assembly to blow cold air to cool the second circuit board assembly. The electronic components on the third circuit board assembly have a lower priority for heat dissipation than those on the first and second circuit board assemblies. Therefore, they are arranged on both sides of the first through slot 123 and at both ends of the first circuit board assembly respectively, and can be cooled together by the second heat dissipation mechanism 300 when the second heat dissipation mechanism 300 cools the second circuit board assembly. By setting the second heat dissipation mechanism 300, the heat dissipation capacity of the overall data acquisition mechanism is further improved. By setting the air-conditioning pipe 310 and the exhaust fan 320, the heat generated by the device is driven out, reducing the heat accumulation in the data acquisition mechanism and preventing problems such as abnormal operation or data loss caused by excessive internal heat in the data acquisition mechanism.

[0071] In some embodiments, the second circuit board assembly includes a disk 400, a shunt board 410, and an inverter 420. The air outlet of the air inlet pipe is arranged on one side of the disk 400, and the shunt board 410 and the inverter 420 are respectively arranged on both sides of the disk 400. The third circuit board assembly includes a lidar 430, an Ethernet conversion box 440, a power supply 450, a switch 460, and an industrial router 470. The power supply 450 and the switch 460 are arranged on one side of the first through slot 123, and the industrial router 470, the lidar 430, and the Ethernet conversion box 440 are arranged on the other side of the first through slot 123.

[0072] Specifically, the disk 400 is arranged at the air outlet of the air-conditioning pipe 310 to dissipate heat from the disk 400 through the air outlet. The shunt board 410 and the inverter 420 are arranged on both sides of the disk 400. The disk 400, the shunt board 410, and the inverter 420 are all fixed to the second installation layer 122 with screws through a fixing seat provided with fixing screws. The third circuit board assembly is respectively arranged on both sides of the first through slot 123, adjacent to the first circuit board assembly, and the power supply 450 and the switch 460 are arranged on one side of the first through slot 123 through the bottom screw seat, while the industrial router 470, the lidar 430, and the Ethernet conversion box 440 are arranged on the other side of the first through slot 123.

[0073] The beneficial effects achieved above are as follows. The second circuit board assembly includes a disk 400. Since a large amount of data exchange and storage occurs when the disk 400 is in use, the disk 400 will generate a large amount of heat during use. However, the disk 400 cannot use water cooling for heat dissipation, so the disk 400 is cooled by blowing cold air. The components on the third circuit board assembly do not have such a large data requirement during operation and do not require a separate heat dissipation mechanism for heat dissipation, which can also reduce the energy consumption of the entire device. Moreover, by separately arranging the third circuit board assemblies that interfere with each other on both sides of the first through groove 123, interference between components can be reduced. At the same time, the components on both sides are arranged longitudinally, and an exhaust fan 320 is arranged at the position farthest from the first circuit board assembly. After the exhaust fan 320 blows air at the air outlet of the air conditioning pipe 310, the internal air flow can be guided, dividing the air flow inside the entire data acquisition mechanism into two sides for discharge. When discharging, each component in the third circuit board assembly can be cooled.

[0074] In some embodiments, the air outlet of the air conditioning pipe 310 is adjacent to the disk 400 of the second circuit board assembly and blows air along the disk 400, and the two exhaust fans 320 are respectively adjacent to the third circuit board assembly.

[0075] The beneficial effects achieved above are as follows. The air outlet of the air conditioner is arranged at the disk 400, which can improve the heat dissipation ability of the disk 400 and prevent the disk 400 from being unable to be used and data loss caused by overheating during a large amount of operations. The exhaust fan 320 is arranged on one side of the third circuit board assembly or adjacent to it. The exhaust fan 320 can be arranged at one end of the third circuit board assembly far from the first circuit board assembly or at the vehicle exhaust air outlet, which can further make the air outlet and the exhaust air outlet of the air conditioner on both sides of the data acquisition mechanism. When blowing air, the cold air will pass through the air outlet and pass through the entire data acquisition mechanism for air outlet. And because the exhaust fan 320 is arranged at one end of the third circuit board assembly far from the first circuit board assembly, when blowing air, after the cold air passes through the second circuit board assembly, it can also pass through the third circuit board assembly for heat dissipation, thereby saving the cost of setting up a heat dissipation mechanism for the third circuit board assembly and realizing further utilization of energy.

[0076] Embodiment 3:

[0077] Based on Embodiment 1, this embodiment further describes the specific usage scenarios of the embodiment;

[0078] A vehicle, in which a data acquisition device with multiple heat dissipation methods is arranged in the vehicle trunk or front trunk or on the roof or chassis.

[0079] In some embodiments, the data acquisition device with multiple heat dissipation methods is disposed in the vehicle trunk, and the air inlet of the air-conditioning pipe 310 is connected to the vehicle air-conditioning port. Air outlets are provided on both sides of the vehicle trunk, and the air outlets are correspondingly arranged with the exhaust fans 320 of the device. The base of the data acquisition device with multiple heat dissipation methods is fixed to the vehicle trunk.

[0080] Through the above embodiments, in intelligent driving, the data acquisition mechanism is generally disposed in the vehicle trunk to collect and store data on the status, road conditions, environment, etc. of the vehicle in intelligent driving and assist in intelligent control.

[0081] The serial numbers of the utility model embodiments are only for description and do not represent the superiority or inferiority of the embodiments. The above are only the preferred embodiments of the present utility model, and do not limit the patent scope of the present utility model accordingly. Any equivalent device or equivalent process transformation made by using the specification and drawings of the present utility model, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of the present utility model.

Claims

1. A data acquisition device with multiple heat dissipation methods, characterized in that, including a data acquisition mechanism, including a frame (100) and a first circuit board assembly disposed on the frame (100), wherein a water-cooling controller (230) is provided on the first circuit board assembly; a first heat dissipation mechanism (200), including a liquid chiller (210) and a water pipe (220), one end of the water pipe (220) is connected to the liquid chiller (210), and the other end of the water pipe (220) is connected to the water-cooling controller (230); a second heat dissipation mechanism (300), including an air-conditioning pipe (310) and an exhaust fan (320), an air inlet of the air-conditioning pipe (310) is connected to a vehicle-mounted air conditioner, an air outlet of the air-conditioning pipe (310) is disposed on one side surface of the data acquisition mechanism and discharges air along the data acquisition mechanism; the exhaust fan (320) is disposed on one side surface of the data acquisition mechanism, and the exhaust fan (320) and the air-conditioning pipe (310) are not coplanar.

2. The data acquisition device with multiple heat dissipation methods according to claim 1, characterized in that The frame (100) includes a bottom case (110) and a bracket (120), the bracket (120) is fixed on the upper surface of the bottom case (110) and forms a first installation layer (121) and a second installation layer (122), and the bottom case (110) is provided with an installation groove; the first installation layer (121) is provided with a first through groove (123), and the first circuit board assembly is disposed on the first installation layer (121).

3. The data acquisition device with multiple heat dissipation methods according to claim 2, characterized in that, The water-cooling controller (230) is disposed on the first installation layer (121), the liquid chiller (210) is disposed in the installation groove; the water pipe (220) passes through the first through groove (123) and is connected to the water-cooling controller (230) and the liquid chiller (210).

4. The data acquisition device with multiple heat dissipation methods according to claim 3, characterized in that, The water-cooling controller (230) includes a first housing (231), a second housing, and a controller assembly, the first housing (231) is fixedly connected to the second housing, the controller assembly is disposed inside the first housing (231) and the second housing, the first housing (231) is provided with a water inlet, a water outlet, and a water-cooling channel (232), and two ends of the water-cooling channel (232) are respectively connected to the water inlet and the water outlet.

5. The data acquisition device with multiple heat dissipation methods according to claim 4, characterized in that, The water inlet and the water outlet are disposed on the same end surface of the water-cooling controller (230); the water-cooling channel (232) is arranged in a "U" shape, and the water-cooling channel (232) is further provided with a plurality of heat dissipation fins (233); a first boss (234) is provided on the lower surface of the first housing (231), and the first boss (234) is located below the heat dissipation fins (233), and the first boss (234) abuts against the upper surface of the controller assembly.

6. The data acquisition device with multiple heat dissipation methods according to claim 4, characterized in that, The water-cooling controller (230) further includes a first water-cooling controller (230) and a second water-cooling controller (230), the water inlet of the first water-cooling controller (230) is connected to the water outlet of the second water-cooling controller (230), the water inlet of the second water-cooling controller (230) is connected to the water outlet of the liquid chiller (210), and the water outlet of the first water-cooling controller (230) is connected to the water inlet of the liquid chiller (210).

7. The data acquisition device with multiple heat dissipation methods according to claim 2, characterized in that, The bracket (120) further includes a second circuit board assembly and a third circuit board assembly; the second circuit board assembly is disposed on the second installation layer (122), and the two third circuit board assemblies are disposed on the first installation layer (121) and are respectively disposed on both sides of the first through slot (123).

8. The data acquisition device with multiple heat dissipation methods according to claim 7, characterized in that The second circuit board assembly includes a magnetic disk (400), a shunt board (410), and an inverter (420); the air outlet of the air inlet pipe is disposed on one side of the magnetic disk (400), and the shunt board (410) and the inverter (420) are respectively disposed on both sides of the magnetic disk (400); the third circuit board assembly includes a lidar (430), an Ethernet conversion box (440), a power supply (450), a switch (460), and an industrial router (470); the power supply (450) and the switch (460) are disposed on one side of the first through slot (123), and the industrial router (470), the lidar (430), and the Ethernet conversion box (440) are disposed on the other side of the first through slot (123).

9. The data acquisition device with multiple heat dissipation methods according to claim 8, characterized in that, The air outlet of the air-conditioning pipe (310) is adjacently disposed to the magnetic disk (400) of the second circuit board assembly and blows air along the magnetic disk (400), and the two exhaust fans (320) are respectively adjacently disposed to the two third circuit board assemblies.

10. A vehicle, characterized in that, A data acquisition device with multiple heat dissipation methods according to any one of claims 1-9, the data acquisition device with multiple heat dissipation methods is disposed in the vehicle trunk or the front trunk or on the roof or the chassis.

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