Anti-bending welding support for photoelectric coupler

Abstract

The embodiment of the utility model provides an anti-bending welding bracket for a photoelectric coupler. The anti-bending welding bracket for the photoelectric coupler comprises an optical coupler upper bracket with a plurality of first welding parts and an optical coupler lower bracket with a plurality of second welding parts, the first welding part comprises a plurality of first protruding structures and a plurality of first sunken structures, the front ends of the first protruding structures are provided with inclined planes, and the front ends of the first sunken structures are provided with inclined planes opposite to the first protruding structures; the second welding part comprises a plurality of second protruding structures and a plurality of second sunken structures, the plurality of second sunken structures are provided with inclined surfaces corresponding to the inclined surfaces of the plurality of first protruding structures, and the plurality of second protruding structures are provided with inclined surfaces corresponding to the inclined surfaces of the plurality of first sunken structures; and the first welding part and the second welding part of the optocoupler upper bracket and the optocoupler lower bracket are welded. The first welding part and the second welding part are correspondingly welded, so that the bending resistance of the photoelectric coupler bracket is improved, and the stability of the photoelectric coupler in the packaging process is improved.

Description

Technical Field

[0001] This application relates to the field of optocouplers, and particularly to an anti-bending welding bracket for an optoelectronic coupler. Background Art

[0002] An optoelectronic coupler is an important optoelectronic device that electrically isolates two circuit parts by converting an electrical signal into an optical signal and then back into an electrical signal. During the manufacturing process of an optoelectronic coupler, packaging is a very crucial step, and the role of the bracket is of vital importance.

[0003] When packaging an optocoupler, a bracket is needed to support the optocoupler. The bracket mainly undertakes three basic functions in the packaging process: one is to provide mechanical support for the chip to ensure that the chip can be stably fixed in the specified position during the packaging process; the second is to serve as a bridge for electrical connection to realize signal transmission between the chip and the external circuit; the third is to help the chip dissipate heat to prevent the chip from deteriorating or being damaged due to overheating.

[0004] However, in the actual packaging process, due to process complexity and the existence of various uncertain factors, some problems may be encountered. For example, when the upper and lower frames of the bracket are subjected to pressure or vibration, they are prone to deformation, resulting in a decrease in its structural stability. Once the bracket collapses or deforms, it will directly affect the position accuracy of the chip. Such deviation may cause poor contact or short circuit between the bonding wire (used to connect the chip and the pin) and the chip, and even make the chip unable to be accurately placed on the upper and lower base islands, thus affecting the overall performance and reliability of the optoelectronic coupler. Summary of the Utility Model

[0005] The main purpose of the embodiments of this application is to propose an anti-bending welding bracket for an optoelectronic coupler to improve the stability and reliability of the optoelectronic coupler during the production process.

[0006] To achieve the above object, a first aspect of the embodiments of this application proposes an anti-bending welding bracket for an optoelectronic coupler, and the anti-bending welding bracket for an optoelectronic coupler includes:

[0007] An upper optocoupler bracket, the upper optocoupler bracket includes a plurality of first welding parts, the first welding parts include a plurality of first protruding structures and a plurality of first recessed structures, the front end of the first protruding structure has a first protruding inclined surface, and the front end of the first recessed structure has a first recessed inclined surface opposite to the first protruding inclined surface;

[0008] Opto - coupler lower bracket, the opto - coupler lower bracket includes a plurality of second welding parts, the second welding parts include a plurality of second protruding structures and a plurality of second recessed structures, the plurality of second recessed structures have second recessed inclined surfaces corresponding to the plurality of first protruding inclined surfaces, and the plurality of second protruding structures have second protruding inclined surfaces corresponding to the plurality of first recessed inclined surfaces;

[0009] Wherein, the first welding part of the opto - coupler upper bracket is welded to the second welding part of the opto - coupler lower bracket.

[0010] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the first welding part of the opto - coupler upper bracket and the second welding part of the opto - coupler lower bracket are welded at intervals of a preset number.

[0011] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the preset number is less than or equal to 7.

[0012] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the opto - coupler upper bracket is axisymmetric, and the opto - coupler lower bracket is axisymmetric.

[0013] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the welding positions of the first welding part and the second welding part are axisymmetric.

[0014] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the opto - coupler upper bracket further includes a plurality of first carrier areas, and the plurality of first carrier areas correspond to the plurality of first welding parts one by one.

[0015] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the opto - coupler upper bracket is an IR bracket, and the opto - coupler upper bracket is used to carry the IR chip of the opto - coupler.

[0016] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the opto - coupler lower bracket further includes a plurality of second carrier areas, and the plurality of second carrier areas correspond to the plurality of second welding parts one by one.

[0017] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the opto - coupler lower bracket is a PT bracket, and the opto - coupler lower bracket is used to carry the PT chip of the opto - coupler.

[0018] According to the anti - bending welding bracket of the opto - coupler provided by some embodiments of the present application, the anti - bending welding bracket of the opto - coupler is used to install an opto - coupler based on the SDM4 package - type opto - coupler packaging process.

[0019] An anti-bending welding bracket for an optocoupler proposed in an embodiment of the present application. The anti-bending welding bracket for the optocoupler includes an optocoupler upper bracket having a plurality of first welding parts and an optocoupler lower bracket having a plurality of second welding parts. Among them, the first welding part includes a plurality of first protruding structures and a plurality of first recessed structures. The front end of the first protruding structure has an inclined surface, and the front end of the first recessed structure has an inclined surface opposite to the first protruding structure; the second welding part includes a plurality of second protruding structures and a plurality of second recessed structures. The plurality of second recessed structures have inclined surfaces corresponding to the inclined surfaces of the plurality of first protruding structures, and the plurality of second protruding structures have inclined surfaces corresponding to the inclined surfaces of the plurality of first recessed structures; the first welding part of the optocoupler upper bracket and the second welding part of the optocoupler lower bracket are welded. By welding the first welding part and the second welding part correspondingly, the anti-bending ability of the optocoupler bracket is improved, and the stability of the optocoupler during the encapsulation process is improved. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of an anti-bending welding bracket for an optocoupler provided by an embodiment of the present application;

[0021] Figure 2 It is a schematic structural diagram of a first welding part provided by an embodiment of the present application;

[0022] Figure 3 It is a schematic structural diagram of a second welding part provided by an embodiment of the present application;

[0023] Figure 4 It is a schematic structural diagram of an anti-bending welding bracket for an optocoupler provided by an embodiment of the present application;

[0024] Reference Signs:

[0025] Optocoupler upper bracket 100, first welding part 110, first carrier area 120, infrared light-emitting diode 130, first protruding structure 111, first recessed structure 112, first protruding inclined surface 113, first recessed inclined surface 114;

[0026] Optocoupler lower bracket 200, second welding part 210, second carrier area 220, photoelectric receiving triode 230, second protruding structure 211, second recessed structure 212, second protruding inclined surface 213, second recessed inclined surface 214. Detailed Description of the Embodiment

[0027] In order to make the purpose, technical solution and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0028] It should be noted that although the functional modules are divided in the device schematic diagram and the logical sequence is shown in the flowchart, in some cases, the steps shown or described can be executed in a different module division from that in the device or a different sequence from that in the flowchart. Terms such as "first" and "second" in the specification, claims, and the above-mentioned drawings are used to distinguish similar objects and do not necessarily describe a specific order or sequence.

[0029] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0030] First, several nouns involved in this application are analyzed as follows:

[0031] An optocoupler (optoelectronic coupler) is an electro-optical-electrical conversion device that uses light as a medium to transmit electrical signals. It plays an important role in various circuits and systems and has good electrical insulation and anti-interference capabilities. With the continuous progress of technology, the types and application fields of optocouplers are also constantly expanding. An optocoupler includes a light source and a light receiver. By applying an electrical signal to the input end of the optocoupler, the light source emits light. After the light irradiates the packaged light receiver, a photocurrent is generated due to the photoelectric effect and is led out from the output end of the light receiver, realizing the electro-optical-electrical conversion.

[0032] An infrared emitting diode (IR), also known as an infrared emitting tube or an infrared light emitting diode, is a light emitting device that can directly convert electrical energy into near-infrared light (invisible light) and radiate it. The infrared emitting diode is made of a material with high infrared radiation efficiency (such as gallium arsenide GaAs, gallium aluminum arsenide GaAlAs, etc.) to form a PN junction. When a forward bias is applied, current is injected into the PN junction, exciting infrared light. The central wavelength of its spectral power distribution is usually between 830 and 950 nm, and the full width at half maximum is about 40 nm, belonging to a narrowband distribution, which is within the range that can be sensed by an ordinary CCD black and white camera.

[0033] The phototransistor (PT), also known as a photosensitive triode, is a type of transistor with three electrodes. However, the base is not led out, only the collector and emitter are led out, and the base serves as the light-receiving window. The basic structure of the phototransistor is the same as that of an ordinary transistor, having two PN junctions. It is equivalent to connecting a photodiode between the base and collector of the transistor, and the current of the photodiode is equivalent to the base current of the transistor. When light irradiates the base (light-receiving window) of the phototransistor, photo-generated electron-hole pairs are generated. Under the action of the b-c junction electric field, electrons drift towards the collector, while holes move towards the base, causing the base potential to rise. Under the action of an externally applied voltage between c and e (c is positive and e is negative), a large number of electrons are injected from the emitter. Except for a small number that recombine with holes at the base, a large number of electrons are collected by the collector through the extremely thin base, becoming the output photocurrent.

[0034] Optocoupler packaging is an important electronic packaging technology. By encapsulating optoelectronic devices in a miniaturized and compact package, it realizes functions such as electrical connection, physical protection, and heat dissipation of the circuit. The packaging of the optocoupler includes: a ceramic base and packaging materials. The ceramic base, as the foundation, has good insulation performance and mechanical strength, which can ensure the electrical isolation and reliability of the optocoupler. The packaging materials usually include plastics, metals, etc. These materials need to have good insulation, corrosion resistance, high-temperature resistance, etc. characteristics to protect the circuits and chips inside the optocoupler.

[0035] When packaging the optocoupler, a bracket is needed to support the optocoupler. The bracket mainly undertakes three basic functions in the packaging process: one is to provide mechanical support for the chip to ensure that the chip can be stably fixed in the specified position during the packaging process; the second is to serve as a bridge for electrical connection to realize signal transmission between the chip and the external circuit; the third is to help the chip dissipate heat to prevent the chip from deteriorating or being damaged due to overheating.

[0036] However, in the actual packaging process, due to the complexity of the process and the existence of various uncertain factors, some problems may be encountered. For example, when the upper and lower frames of the bracket are subjected to pressure or vibration, they are prone to deformation, resulting in a decrease in its structural stability. Once the bracket collapses or deforms, it will directly affect the position accuracy of the chip. This deviation may cause poor contact or short circuit between the bonding wire (used to connect the chip and the pin) and the chip, and even make the chip unable to be accurately placed on the upper and lower base islands, thus affecting the overall performance and reliability of the optocoupler.

[0037] Based on this, the embodiment of the present application proposes an anti-bending welding bracket for an optocoupler, including an optocoupler upper bracket with a plurality of first welding parts and an optocoupler lower bracket with a plurality of second welding parts. By corresponding welding, the anti-bending ability of the optocoupler bracket is improved, and the stability of the optocoupler during the packaging process is improved.

[0038] Please refer to Figure 1 , which is a schematic structural diagram of an anti-bending welding bracket for an optocoupler provided by an embodiment of the present application. As Figure 1 shown, the anti-bending welding bracket for an optocoupler provided by an embodiment of the present application includes an optocoupler upper bracket 100 and an optocoupler lower bracket 200. Among them, the optocoupler upper bracket 100 further includes a plurality of first welding parts 110, and the optocoupler lower bracket 200 includes a plurality of second welding parts 210.

[0039] It should be noted that in the embodiment of the present application, the first welding part 110 of the provided optocoupler upper bracket 100 includes a plurality of first protruding structures and a plurality of first concave structures. The front end of the first protruding structure has a first protruding inclined surface, and the front end of the first concave structure has a first concave inclined surface opposite to the first protruding inclined surface.

[0040] Exemplarily, please refer to Figure 2 , which is a schematic structural diagram of a first welding part provided by an embodiment of the present application. As Figure 2 shown, the first welding part 110 provided in the embodiment of the present application includes a plurality of first protruding structures 111 and a plurality of first concave structures 112. The first protruding structures 111 and the first concave structures 112 are arranged alternately to form a toothed structure. The front end of the first protruding structure 111 has a first protruding inclined surface 113, and the front end of the first concave structure 112 has a first concave inclined surface 114 opposite to the first protruding inclined surface 113.

[0041] It can be understood that on the one hand, in the embodiment of the present application, the shapes of the plurality of first protruding structures 111 can be rectangular structures of the same size, and the plurality of first protruding structures 111 are arranged at equal intervals, while the first concave structures 112 have corresponding sizes; on the other hand, the plurality of first protruding structures 111 can also be structures of different sizes. As Figure 2 shown, the shape and size of each first protruding structure 111 are different, and the provided first concave structures 112 also correspond to the first protruding structures 111. The special-shaped structure design can avoid misalignment docking.

[0042] Through the first welding part 110, the optocoupler upper bracket 100 can be positioned and fixed with the optocoupler lower bracket 200, improving the stability of the anti-bending welding bracket for the optocoupler.

[0043] It should be noted that in the embodiment of the present application, the second welding part of the provided optocoupler lower bracket includes a plurality of second protruding structures and a plurality of second concave structures. The plurality of second concave structures have second concave inclined surfaces corresponding to the plurality of first protruding inclined surfaces, and the plurality of second protruding structures have second protruding inclined surfaces corresponding to the plurality of first concave inclined surfaces.

[0044] Exemplarily, please refer to Figure 3 , which is a schematic structural diagram of a second welding part provided by an embodiment of the present application. As shown in Figure 3 , the second welding part 210 provided in the embodiment of the present application includes a plurality of second protruding structures 211 and a plurality of second recessed structures 212, and the second protruding structures 211 and the second recessed structures are arranged alternately. The second protruding structures 211 of the second welding part 210 correspond to the first recessed structures 112 of Figure 2 , and the plurality of second protruding structures 211 have second protruding inclined surfaces 213 corresponding to the plurality of first recessed inclined surfaces 114; similarly, the second recessed structures 212 correspond to the first protruding structures 111, and the plurality of second recessed structures 212 have second recessed inclined surfaces 214 corresponding to the plurality of first protruding inclined surfaces 113.

[0045] It can be understood that, on the one hand, the shapes of the plurality of second protruding structures 211 in the embodiment of the present application correspond to those of the first recessed structures 112, and they can be rectangular structures of the same size. The plurality of second protruding structures 211 are arranged at equal intervals, and the second recessed structures 212 have corresponding identical sizes; on the other hand, the plurality of second protruding structures 211 can also be structures of different sizes, which also correspond to the first recessed structures 112. As shown in Figure 3 , the shape and size of each second protruding structure 211 are different, and the second recessed structures 212 provided are also corresponding to the second protruding structures 211, which can avoid misaligned docking with the first welding part.

[0046] Through the second welding part 210, the upper bracket 100 can be positioned and fixed with the lower bracket 200, improving the stability of the anti-bending welding bracket of the optocoupler.

[0047] It should be noted that in the embodiment of the present application, the first welding part of the optocoupler upper bracket is welded to the second welding part of the optocoupler lower bracket.

[0048] In the way that the first welding part of the optocoupler upper bracket and the second welding part of the optocoupler lower bracket are welded, the optocoupler upper bracket and the optocoupler lower bracket can be more stably connected and installed, avoiding loosening.

[0049] It should be noted that in the embodiment of the present application, the first welding part of the optocoupler upper bracket and the second welding part of the optocoupler lower bracket are welded at intervals of a preset number.

[0050] It can be understood that in the examples of this application, in the case of the existing first welding part and the second welding part, the first concave structure and the second convex structure, as well as the first convex structure and the second concave structure, can already achieve fixed connection. However, in order to avoid loosening during transportation, the structure is made more firm by welding. By welding at regular intervals, the welding workload can be greatly reduced, and while achieving a stable effect, the welding cost is reduced.

[0051] Exemplarily, in an embodiment of this application, the preset quantity is less than or equal to 7. Please refer to Figure 4 , which is a schematic structural diagram of an anti-bending welding bracket for an optocoupler provided by an embodiment of this application. The solder joint positions of the anti-bending welding bracket for the optocoupler are as Figure 4 shown. In the embodiment of this application, the first welding part and the second welding part are welded once every 7 intervals.

[0052] The effect of improving stability is achieved through interval welding, and the welding cost is reduced.

[0053] It should be noted that in the embodiment of this application, the upper bracket of the optocoupler is axisymmetric, and the lower bracket of the optocoupler is axisymmetric.

[0054] Exemplarily, as Figure 4 shown, the anti-bending welding bracket for the optocoupler in an embodiment of this application is a left-right symmetric structure, that is, axisymmetric. The upper bracket of the optocoupler corresponds to the lower bracket of the optocoupler, and both are axisymmetric structures.

[0055] Through the axisymmetric structure, when the anti-bending welding bracket for the optocoupler is stressed at both ends, the stress can be evenly distributed, improving stability.

[0056] It should be noted that in the embodiment of this application, the welding positions of the first welding part and the second welding part are axisymmetric.

[0057] Exemplarily, as Figure 4 shown, in a feasible embodiment of this application, the six solder joint positions are axisymmetric left and right, and also axisymmetric up and down. Through axisymmetric welding, the stability is improved.

[0058] It can be understood that in the embodiment of this application, through axisymmetric welding, the stress on the welding positions of the bracket can be evenly distributed, thereby improving stability.

[0059] It should be noted that in the embodiment of this application, the upper bracket of the optocoupler further includes a plurality of first carrier areas, and the plurality of first carrier areas correspond to the plurality of first welding parts one by one.

[0060] Exemplarily, as Figure 1As shown, in a feasible embodiment of the present application, multiple first carrier regions 120 correspond one-to-one with the first welding parts 110, and the first welding parts 110 are provided at both ends of each first carrier region 120.

[0061] Through the first carrier region, the component for carrying the optocoupler.

[0062] It should be noted that in the embodiment of the present application, the optocoupler upper bracket is an IR bracket, and the optocoupler upper bracket is used to carry the IR chip of the optocoupler.

[0063] It can be understood that in the embodiment of the present application, the infrared light-emitting diode is carried by the optocoupler upper bracket, such as Figure 1 As shown, in the optocoupler upper bracket 100, the infrared light-emitting diode 130 is carried by the first carrier region 120, and the infrared light-emitting diode 130 is the IR chip.

[0064] It should be noted that in the embodiment of the present application, the optocoupler lower bracket further includes multiple second carrier regions, and the multiple second carrier regions correspond one-to-one with the multiple second welding parts.

[0065] Exemplarily, such as Figure 1 As shown, in a feasible embodiment of the present application, multiple second carrier regions 220 correspond one-to-one with the second welding parts 210, and the second welding parts 210 are provided at both ends of each second carrier region 220.

[0066] Through the second carrier region, the component for carrying the optocoupler.

[0067] It should be noted that in the embodiment of the present application, the optocoupler lower bracket is a PT bracket, and the optocoupler lower bracket is used to carry the PT chip of the optocoupler.

[0068] It can be understood that in the embodiment of the present application, the photoelectric receiving triode is carried by the optocoupler lower bracket, such as Figure 1 As shown, in the optocoupler lower bracket 200, the photoelectric receiving triode 230 is carried by the second carrier region 220, and the photoelectric receiving triode 230 is the PT chip.

[0069] It should be noted that in the embodiment of the present application, the optocoupler anti-bending welding bracket is used to install the optocoupler based on the SDM4 package type optocoupler packaging process.

[0070] An anti-bending welding bracket for an optocoupler proposed in an embodiment of the present application. The anti-bending welding bracket for the optocoupler includes an optocoupler upper bracket having a plurality of first welding portions and an optocoupler lower bracket having a plurality of second welding portions. Among them, the first welding portion includes a plurality of first protruding structures and a plurality of first recessed structures. The front end of the first protruding structure has an inclined surface, and the front end of the first recessed structure has an inclined surface opposite to the first protruding structure; the second welding portion includes a plurality of second protruding structures and a plurality of second recessed structures. The plurality of second recessed structures have inclined surfaces corresponding to the inclined surfaces of the plurality of first protruding structures, and the plurality of second protruding structures have inclined surfaces corresponding to the inclined surfaces of the plurality of first recessed structures; the first welding portion of the optocoupler upper bracket and the second welding portion of the optocoupler lower bracket are welded. By welding the first welding portion and the second welding portion correspondingly, the anti-bending ability of the optocoupler bracket is improved, and the stability of the optocoupler during the encapsulation process is improved.

[0071] The embodiments described in the embodiments of the present application are for more clearly explaining the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art know that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0072] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than shown in the figures, or combine certain steps, or different steps.

[0073] Those of ordinary skill in the art can understand that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, and their appropriate combinations.

[0074] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, that is, they may be located in one place, or they may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0075] Those of ordinary skill in the art can understand that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, and their appropriate combinations.

[0076] In the description of this application and the above-mentioned drawings, terms such as "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of this application described here can be implemented in an order different from those illustrated or described here. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0077] It should be understood that in this application, "at least one (item)" means one or more, and "a plurality" means two or more. "And / or" is used to describe the association relationship of associated objects and indicates that three relationships can exist. For example, "A and / or B" can mean: only A exists, only B exists, and both A and B exist simultaneously. Among them, A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. "At least one (one) of the following" or its similar expression refers to any combination of these items, including any combination of single items (ones) or plural items (ones). For example, at least one (one) of a, b, or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0078] In several embodiments provided in this application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units is only a logical function division. In actual implementation, there can be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces. The indirect coupling or communication connection of devices or units can be in electrical, mechanical, or other forms.

[0079] The units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0080] The preferred embodiments of the embodiments of the present disclosure have been described above with reference to the accompanying drawings. This does not limit the scope of the rights of the embodiments of the present disclosure. Any modifications, equivalent replacements, and improvements made by those skilled in the art without departing from the scope and essence of the embodiments of the present disclosure shall fall within the scope of the rights of the embodiments of the present disclosure.

Claims

1. An anti-bending welding bracket for an optocoupler, characterized in that, The anti-bending and welding bracket of the optocoupler includes: An optocoupler upper bracket, which includes a plurality of first welding parts. Each first welding part includes a plurality of first protruding structures and a plurality of first recessed structures. The front end of the first protruding structure has a first protruding inclined surface, and the front end of the first recessed structure has a first recessed inclined surface opposite to the first protruding inclined surface; An optocoupler lower bracket, which includes a plurality of second welding parts. Each second welding part includes a plurality of second protruding structures and a plurality of second recessed structures. The plurality of second recessed structures have second recessed inclined surfaces corresponding to the plurality of first protruding inclined surfaces, and the plurality of second protruding structures have second protruding inclined surfaces corresponding to the plurality of first recessed inclined surfaces; Among them, the first welding part of the optocoupler upper bracket is welded to the second welding part of the optocoupler lower bracket.

2. The anti-bending welding bracket for an optocoupler according to claim 1, wherein, The first welding part of the optocoupler upper bracket and the second welding part of the optocoupler lower bracket are welded at intervals of a preset number.

3. The anti-bending welding bracket for an opto-coupler according to claim 2, wherein The preset number is less than or equal to 7.

4. The anti-bending welding bracket for an opto-coupler according to claim 1, wherein The optocoupler upper bracket is axisymmetric, and the optocoupler lower bracket is axisymmetric.

5. The anti-bending welding bracket for an opto-coupler according to claim 1, wherein The welding positions of the first welding part and the second welding part are axisymmetric.

6. The anti-bending welding bracket for an opto-coupler according to claim 1, wherein The optocoupler upper bracket further includes a plurality of first carrier areas, and the plurality of first carrier areas correspond to the plurality of first welding parts one by one.

7. The anti-bending and soldering bracket for an opto-coupler according to claim 5, wherein The optocoupler upper bracket is an IR bracket, and the optocoupler upper bracket is used to carry the IR chip of the optocoupler.

8. The anti-bending welding bracket for an opto-coupler according to claim 1, wherein The optocoupler lower bracket further includes a plurality of second carrier areas, and the plurality of second carrier areas correspond to the plurality of second welding parts one by one.

9. The anti-bending welding bracket for an opto-coupler according to claim 7, wherein, The optocoupler lower bracket is a PT bracket, and the optocoupler lower bracket is used to carry the PT chip of the optocoupler.

10. The anti-bending welding bracket for an opto-coupler according to claim 1, wherein, The anti-bending and welding bracket of the optocoupler is used to install an optocoupler based on the SDM4 package type optocoupler packaging process.

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