LED lamp bead and LED lamp strip

Abstract

The utility model provides a lamp bead and an LED lamp strip. The LED lamp bead comprises a support, packaging silica gel and a light-emitting chip. A first groove is formed in the support, the area of the opening end of the first groove is larger than that of the bottom wall of the first groove, and the side wall of the first groove is obliquely arranged; the packaging silica gel is fixed at the opening end of the first groove, and one side face, facing the bottom wall of the first groove, of the packaging silica gel protrudes towards the bottom wall of the first groove to form a convex lens; the light-emitting chip is mounted on the bottom wall of the first groove; a hollow cavity is defined by the support and the packaging silica gel. Part of light emitted by the light-emitting chip is reflected back to the hollow cavity after making contact with the convex lens, then is reflected to the side wall of the first groove and then is reflected by the side wall of the first groove so that the light can be emitted out of the packaging silica gel, the light source emitting angle of the LED lamp bead can be controlled within a small range after the light is reflected multiple times, and the light emitting efficiency is improved. Therefore, the problems that light spots of the LED lamp beads are not uniform, and the illumination effect is poor due to the fact that the emergent light angle is too large are solved.

Description

Technical Field

[0001] This application belongs to the field of lighting, and particularly relates to an LED lamp bead and an LED light strip. Background Art

[0002] In recent years, more energy-efficient and environmentally friendly LED lights have been widely promoted and applied. Some current LED lamp beads cover the light-emitting chip with a transparent material and bulge outward to form a semi-circular convex block. However, such LED lamp beads are prone to problems such as uneven light spots and too large an emission light angle, resulting in poor lighting effects.

[0003] It should be noted that the above content is not necessarily prior art and does not limit the patent protection scope of this application. Utility Model Content

[0004] The embodiments of this application provide an LED lamp bead and an LED light strip to solve or alleviate one or more technical problems in the prior art.

[0005] In the first aspect of the embodiments of this application, an LED lamp bead is provided, including:

[0006] A bracket, on the first side surface of which a first groove is provided. The area of the open end of the first groove is larger than the area of the bottom wall of the first groove, and the side wall of the first groove is inclined;

[0007] Encapsulation silica gel, fixed at the open end of the first groove. The side surface of the encapsulation silica gel facing the bottom wall of the first groove bulges towards the bottom wall of the first groove to form a convex lens;

[0008] A light-emitting chip, installed on the bottom wall of the first groove;

[0009] Wherein, the bracket and the encapsulation silica gel enclose a hollow cavity.

[0010] Optionally, the encapsulation silica gel further includes a convex edge, which is fixed on the side surface of the encapsulation silica gel facing the bottom wall of the first groove and surrounds the periphery of the encapsulation silica gel. One side of the convex edge is attached to the inner wall of the first groove.

[0011] Optionally, the convex edge includes opposite first side wall and second side wall. The first side wall is attached to the inner wall of the first groove, and the second side wall is perpendicular to the bottom wall of the first groove.

[0012] Optionally, the LED lamp bead further includes fluorescent glue, which is fixed on the bottom wall of the first groove and covers the light-emitting chip.

[0013] Optionally, the fluorescent glue is arranged at an interval from the encapsulation silica gel.

[0014] Optionally, a first through hole is formed in the bottom wall of the first groove, and the first through hole penetrates through the bottom wall of the first groove to the second side surface of the bracket.

[0015] The LED lamp bead further includes a heat dissipation plate, and the heat dissipation plate is fixed to the second side surface of the bracket and closes the first through hole.

[0016] Wherein, the light-emitting chip is located in the first through hole and fixed to the heat dissipation plate.

[0017] Optionally, the cross-section of the bracket is rectangular, the cross-section of the first groove is trapezoidal, and the long bottom side of the trapezoid coincides with one side of the rectangle.

[0018] Optionally, the material of the bracket includes any one of polyphthalamide, thermosetting resin, ceramic, and graphene.

[0019] A second aspect of the embodiments of the present application provides an LED light strip, including:

[0020] A substrate;

[0021] A plurality of LED lamp beads as described in any one of the above, and the plurality of LED lamp beads are fixedly spaced on the substrate.

[0022] The embodiments of the present application adopting the above technical solutions may include the following advantages:

[0023] The convex lens formed by encapsulating silica gel is located above the light-emitting chip. The light emitted by the light-emitting chip first enters the hollow cavity. Part of the light is reflected back into the hollow cavity after contacting the convex lens formed by encapsulating silica gel, and then reflected to the side wall of the first groove at a predetermined angle. A reflective coating may be provided on the inner wall of the first groove, or part of the encapsulating silica gel may be coated on the inner wall of the first groove to make the inner wall of the first groove have a reflective function; the light reflected back by the convex lens is reflected by the side wall of the first groove again, so that the light is emitted from the encapsulating silica gel. After multiple reflections, the light-emitting angle of the light source of the LED lamp bead can be controlled within a small range, thereby alleviating problems such as uneven light spots and poor lighting effect caused by too large an emitted light angle of the LED lamp bead.

[0024] The above summary is only for the purpose of the specification and is not intended to be limiting in any way. In addition to the above-described illustrative aspects, embodiments, and features, further aspects, embodiments, and features of the present application will be readily apparent by reference to the drawings and the following detailed description. Description of the Drawings

[0025] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the several views denote the same or similar components or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings merely depict some embodiments disclosed in accordance with the present application and should not be regarded as limiting the scope of the present application.

[0026] Figure 1 A cross-sectional schematic view of an LED lamp bead provided by an embodiment of the present application;

[0027] Figure 2 Another cross-sectional schematic view of an LED lamp bead provided by an embodiment of the present application;

[0028] Figure 3 A cross-sectional schematic view of a bracket in an LED lamp bead provided by an embodiment of the present application;

[0029] Figure 4 A structural schematic view of an LED light bar provided by an embodiment of the present application.

[0030] Description of reference numerals:

[0031] Bracket 10; Encapsulation silica gel 20; Hollow cavity 25; Light-emitting chip 30; Fluorescent glue 40; Heat dissipation plate 50; First side 101; First groove 105; First through hole 107; Convex lens 201; Convex edge 203; First side wall 205; Second side wall 206; Substrate 200; LED lamp bead 100. Detailed implementation manners

[0032] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings. In the drawings, for clarity, the dimensions of layers, regions, elements, and their relative dimensions may be exaggerated. Among them, the same or similar reference numerals throughout denote the same or similar elements or elements having the same or similar functions. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present application and should not be construed as limiting the present application.

[0033] It should be understood that when an element or layer is referred to as "on", "adjacent to", "connected to", or "coupled to" another element or layer, it can be directly on, adjacent to, connected, or coupled to the other element or layer, or there may be intervening elements or layers. In contrast, when an element is referred to as "directly on", "directly adjacent to", "directly connected to", or "directly coupled to" another element or layer, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, without departing from the teachings of the present application, the first element, component, region, layer, or part discussed below may be referred to as the second element, component, region, layer, or part. And when discussing the second element, component, region, layer, or part, it does not indicate that there must be a first element, component, region, layer, or part in the present application.

[0034] In the present application, unless otherwise clearly specified and defined, the terms "mounted", "connected", "coupled", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances.

[0035] It should be noted that the terms "first", "second", etc. in the specification, claims, and above-mentioned drawings of the present application are used to distinguish similar objects and do not necessarily have to be used to describe a specific order or sequence. It should be understood that these terms can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0036] In this application, when it comes to numerical intervals (i.e., numerical ranges), unless otherwise specified, the distribution of the selectable numerical values within the numerical interval is regarded as continuous, and includes the two numerical endpoints (i.e., the minimum value and the maximum value) of the numerical interval, as well as each numerical value between these two numerical endpoints. Unless otherwise specified, when the numerical interval only refers to the integers within the numerical interval, it includes the two endpoint integers of the numerical range, as well as each integer between the two endpoints, which is equivalent to directly listing each integer. When providing multiple numerical ranges to describe features or characteristics, these numerical ranges can be combined. In other words, unless otherwise specified, the numerical ranges disclosed in this application should be understood to include any and all sub-ranges subsumed therein. The "numerical value" in this numerical interval can be any quantitative value, such as a number, a percentage, a ratio, etc. The "numerical interval" is allowed to broadly include quantitative intervals such as percentage intervals, ratio intervals, ratio value intervals, etc.

[0037] The embodiment of the present application provides a technical solution for an LED lamp bead and an LED light strip. Based on this, it is to alleviate problems such as uneven light spots easily occurring in the LED lamp bead and poor lighting effects caused by too large an emission light angle. See the following for details.

[0038] Next, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. It should be noted that these exemplary embodiments can be implemented in many different forms and should not be construed as being limited only to the embodiments described herein.

[0039] Please refer to Figures 1 to 3 , the embodiment of the present application provides an LED lamp bead, and the LED lamp bead includes a bracket 10, encapsulating silica gel 20, and a light-emitting chip 30. The following is a detailed description:

[0040] The bracket 10 serves as a load-bearing structure. Among them, a first groove 105 is formed on the first side surface 101 of the bracket 10, and the area of the open end of the first groove 105 is larger than the area of the bottom wall of the first groove 105, and the side wall of the first groove 105 is inclined.

[0041] Specifically, the bracket 10 can be a rectangular block, and the first groove 105 can be in the shape of a trapezoidal frustum and is formed on the first side surface 101 of the bracket 10 in an inverted manner. Exemplarily, when viewed from the side, the cross-section of the bracket 10 in this embodiment is rectangular, the cross-section of the first groove 105 is trapezoidal, and the long bottom side of the trapezoid coincides with one side of the rectangle.

[0042] In some embodiments, the angle formed by the hypotenuse and the short bottom side of the trapezoid is 90° to 150°.

[0043] The encapsulation silicone 20 is fixed at the opening end of the first groove 105. One side of the encapsulation silicone 20 facing the bottom wall of the first groove 105 protrudes towards the bottom wall of the first groove 105 to form a convex lens 201. Among them, the bracket 10 and the encapsulation silicone 20 enclose a sealed hollow cavity 25. The sealed hollow cavity 25 can prevent air, moisture or other pollutants from entering the inside of the groove and affecting the performance of the light-emitting chip 30.

[0044] The encapsulation silicone 20 has a certain transparency and refractive index to achieve the reflection and refraction of light so as to control the light-emitting angle. Specifically, the material of the encapsulation silicone 20 may include silicone resin, epoxy resin, polyurethane, siloxane material, etc. Exemplarily, the siloxane material is a silicon-based polymer with excellent optical properties, high transparency and good thermal stability. Its chemical structure enables it to remain stable under high temperature and harsh environments.

[0045] The light-emitting chip 30 is installed on the bottom wall of the first groove 105. The light-emitting chip 30 can be made of semiconductor materials (such as gallium arsenide, gallium nitride, etc.). When current passes through these materials, electrons and holes recombine in the materials, releasing energy and emitting it in the form of photons, thereby achieving electroluminescence. In this embodiment, the light-emitting chip 30 may be a light-emitting diode (LED), a laser diode (LD), an organic light-emitting diode (OLED), etc.

[0046] Specifically, the convex lens 201 formed by the encapsulation silicone 20 is located above the light-emitting chip 30. The light emitted by the light-emitting chip 30 first enters the hollow cavity 25. Part of the light is reflected back into the hollow cavity 25 after contacting the convex lens 201 formed by the encapsulation silicone 20, and then reflected to the side wall of the first groove 105 at a predetermined angle. A reflective coating may be provided on the inner wall of the first groove 105, or part of the encapsulation silicone 20 may be coated on the inner wall of the first groove 105 to make the inner wall of the first groove 105 have a reflective function; the light reflected back by the convex lens 201 is reflected by the side wall of the first groove 105 again, so that the light is emitted from the encapsulation silicone 20. After multiple reflections, the light source emission angle of the LED lamp bead can be controlled within a smaller range, thereby alleviating problems such as uneven light spots and poor lighting effect caused by too large an emission light angle of the LED lamp bead.

[0047] The encapsulation silicone 20 has a predetermined curvature. The first groove 105 on the bracket 10 and the encapsulation silicone 20 cooperate to form a reflective cup structure to concentrate the light emitted by the LED lamp bead within a smaller angular range, thereby improving the brightness and concentration of the light, and reflecting and converging the scattered light into a narrower light beam.

[0048] Exemplarily, the refractive index of the encapsulating silica gel 20 is about between 1.4 and 1.5. Thus, its critical angle can be calculated to be about 40 degrees. When the angle between the incident light and the normal line is greater than this angle, total internal reflection will occur to reflect the incident light within a certain range back into the hollow cavity 25.

[0049] In a preferred embodiment, the light-emitting angle of the LED lamp beads can be controlled between 3° and 95°.

[0050] In an alternative embodiment, the encapsulating silica gel 20 further includes a convex edge 203. The convex edge 203 is fixed to one side of the encapsulating silica gel 20 facing the bottom wall of the first groove 105 and surrounds the periphery of the encapsulating silica gel 20. One side of the convex edge 203 is attached to the inner wall of the first groove 105.

[0051] The convex edge 203 can enable the encapsulating silica gel 20 to be more firmly embedded in the groove, preventing the encapsulating silica gel 20 from moving or detaching from the groove under external forces (such as thermal expansion, mechanical vibration), and improving the installation stability of the encapsulating silica gel 20.

[0052] Please refer to Figure 1 and Figure 2 , in this embodiment, part of the light contacts the convex lens 201 formed by the encapsulating silica gel 20 and then is reflected and enters the convex edge 203. Part of the light entering the convex edge 203 will be gradually reflected upward between the two side walls of the convex edge 203 and finally exit the encapsulating silica gel 20.

[0053] Further, the convex edge 203 includes opposite first side wall 205 and second side wall 206. The first side wall 205 is attached to the inner wall of the first groove 105, and the second side wall 206 is perpendicular to the bottom wall of the first groove 105.

[0054] The first side wall 205 is attached to the inner wall of the first groove 105 so that the light incident on the first groove 105 / the first side wall 205 can be reflected. The second side wall 206 is perpendicular to the bottom wall of the first groove 105, that is, a certain angle (such as an acute angle) is formed between the second side wall 206 and the first side wall 205, so as to facilitate the light to be gradually reflected upward during the reflection between the first side wall 205 and the second side wall 206, and then converge the angle of the outgoing light.

[0055] In an alternative embodiment, the LED lamp bead further includes a phosphor gel 40, which is fixed to the bottom wall of the first groove 105 and covers the light-emitting chip 30. The phosphor gel 40 contains phosphors, and the phosphor gel 40 can be used to adjust the light color of the light emitted by the light-emitting chip 30. Exemplarily, the light-emitting chip 30 can emit monochromatic light (such as blue light or ultraviolet light). The phosphor gel 40 contains phosphors, and when excited by the light emitted by the light-emitting chip 30, the phosphors will emit light of different colors. By mixing different phosphors, the originally monochromatic light can be converted into white light or other required color lights, so as to meet different application requirements.

[0056] Covering the light-emitting chip 30 with the phosphor gel 40 can also enable more light to be converted into visible light by the phosphors, thereby enhancing the overall light efficiency output.

[0057] Moreover, the phosphor gel 40 can effectively mix and diffuse the light emitted by the light-emitting chip 30, making the light emitted by the light-emitting chip more uniform when passing through the encapsulation silicone 20, so as to avoid the appearance of local bright spots or color spots, thereby achieving a more uniform light output. In some embodiments, the requirements for light efficiency, color temperature, color rendering index, etc. of specific applications can also be met by adjusting the materials of the phosphors in the phosphor gel 40, the materials of the light-emitting chip 30, etc.

[0058] Furthermore, in this embodiment, the phosphor gel 40 and the encapsulation silicone 20 are arranged at intervals. The phosphor gel 40 and the encapsulation silicone 20 are different in chemical composition. Arranging them at intervals can prevent the phosphor gel 40 and the encapsulation silicone 20 from reacting with each other or undergoing chemical reactions during long-term use, thereby maintaining the stability and performance of the materials.

[0059] In an alternative embodiment, a hollow lens structure (not shown in the figure) is further provided in the encapsulation silicone 20. The hollow lens structure can concentrate the light emitted by the light-emitting chip 30 into a smaller area. The shape and size of the hollow lens can be designed and adjusted according to different application requirements, so as to provide customized optical characteristics for different lighting scenarios.

[0060] In an alternative embodiment, a first through hole 107 is formed in the bottom wall of the first groove 105, and the first through hole 107 penetrates through the bottom wall of the first groove 105 to the second side surface of the bracket 10.

[0061] The LED lamp bead further includes a heat dissipation plate 50, which is fixed to the second side surface of the bracket 10 and closes the first through hole 107.

[0062] Wherein, the light-emitting chip 30 is located in the first through hole 107 and is fixed to the heat dissipation plate 50.

[0063] The heat dissipation plate 50 is located on the second side surface of the bracket 10, and one side surface of the heat dissipation plate 50 away from the bracket 10 is exposed to the external environment. A first through hole 107 is formed in the bottom wall of the first groove 105 of the bracket 10, and the light-emitting chip 30 is mounted on the heat dissipation plate 50 along the first through hole 107, so that the light-emitting chip 30 is in direct contact with the heat dissipation plate 50. The heat generated by the light-emitting chip 30 can be quickly conducted to the heat dissipation plate 50, and then the heat is quickly dispersed to the external environment through the heat dissipation plate 50, so as to reduce the accumulation of heat near the light-emitting chip 30 and reduce the performance attenuation and light decay phenomena caused by heat accumulation.

[0064] Specifically, the material of the heat dissipation plate 50 can be materials such as aluminum and copper. By way of example, aluminum has relatively high thermal conductivity, usually between 200 and 250 W / (m·K), which can meet the heat conduction and dissipation effects of the light-emitting chip 30. The weight of aluminum is also relatively light, which helps to reduce the weight of the overall component.

[0065] In an alternative embodiment, the material of the bracket 10 includes any one of polyphthalamide (PPA), thermosetting resin, ceramic, and graphene.

[0066] By way of example, polyphthalamide has relatively high mechanical strength and toughness and is not prone to cracking or deformation. Moreover, since both the encapsulation silicone 20 and the light-emitting chip 30 are located in the first groove 105 on the bracket 10, the encapsulation silicone 20 and the light-emitting chip 30 can be well protected, and it is more suitable for scenarios that require impact resistance and abrasion resistance.

[0067] Ceramic has very high thermal conductivity, can effectively conduct the heat generated by the LED lamp beads, prevent overheating, and can withstand high temperature and mechanical wear, and is suitable for application scenarios that require high heat resistance.

[0068] In an alternative embodiment, the LED lamp bead further includes an adhesive tape, which is adhered to the second side surface of the bracket 10 or adhered to the side of the heat dissipation plate 50 away from the bracket 10. The adhesive tape can be used to adhere the LED lamp bead to the corresponding structure for the assembly of the LED lamp bead. The adhesive tape can also be used to adhere multiple LED lamp beads to a printed circuit board (PCB) to form a corresponding lamp board or lamp strip.

[0069] In an alternative embodiment, the LED lamp bead further includes an IC chip. The IC chip can be fixed on the heat dissipation plate 50 and electrically connected to the LED lamp bead. Specifically, the IC chip can convert the voltage of the input power supply into a suitable voltage required by the LED lamp bead. For example, the LED lamp bead may require a voltage lower than the voltage provided by the power supply, and the IC chip is responsible for regulating and stabilizing these voltages. The IC chip can also precisely control the current flowing through the LED to ensure that the LED lamp bead operates within a safe and efficient working range, thereby extending the service life of the LED and optimizing the light output.

[0070] The IC chip can also be used to adjust the light emission mode of the light emitting chip 30, such as controlling the light emitting chip 30 to emit light in the form of a breathing light, a flashing light, a gradient light, etc.

[0071] Please refer to Figure 4 , the embodiment of the present application further provides an LED light strip, which includes a substrate 200 and a plurality of LED lamp beads 100 in any of the above embodiments, and the plurality of LED lamp beads 100 are fixedly spaced on the substrate 200.

[0072] The substrate 200 can be a flexible printed circuit board (FPCB), which has good bending and flexibility. The substrate 200 can be easily wound, bent or laid along a complex contour shape, so that the LED light strip can adapt to various installation environments, such as curved surfaces, bent surfaces or specific shapes.

[0073] A sticking or adsorption structure can also be provided on the side of the substrate 200 away from the LED lamp bead 100 to fix the LED light strip in a specific area.

[0074] In a preferred embodiment, the plurality of LED lamp beads 100 are evenly spaced on the substrate 200. The evenly spaced arrangement can prevent the light source from generating obvious brightness differences or hot spots, ensure uniform light distribution within the entire lighting area, and avoid the appearance of light spots or dark areas. The uniform arrangement can also enable the light between the LED lamp beads 100 to effectively overlap, so that the brightness of the entire LED light strip or lighting area is consistent, thereby providing a smooth and uniform lighting effect. Moreover, the uniform distribution of the LED lamp beads 100 can also disperse the heat generated by the plurality of LED lamp beads 100 relatively, avoid local overheating, and reduce the shortening of the lamp bead life caused by high temperature.

[0075] The LED light strip of this embodiment can be widely applied to multiple fields to meet different lighting and decoration needs. Exemplarily, it can be applied to home lighting. For example, the LED light strip can be installed in areas such as the ceiling, wall, and below the cabinet to provide a soft background light or decorative light effect, enhancing the beauty of the home environment. Or it can be used to create a specific atmosphere, such as the warm bedroom light or the modern style living room light, by adjusting the brightness and color temperature to adapt to different usage scenarios.

[0076] It can also be applied to outdoor lighting, such as the external contour lighting of buildings, highlighting the structure and design of the building and enhancing the visual impact at night.

[0077] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application. The orientation terms "inner" and "outer" refer to the inside and outside relative to the contour of each component itself. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "on other devices or structures" will be positioned as "below other devices or structures" or "under other devices or structures" afterwards. Thus, the exemplary term "above..." can include both orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding explanations are made for the relative spatial descriptions used here.

[0078] It should also be noted that the "one embodiment", "another embodiment", "embodiment", etc. mentioned in the present application refer to that the specific features, structures or characteristics described in connection with the embodiment are included in at least one embodiment described generally in the present application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in connection with any one embodiment, it is intended that the implementation of such feature, structure or characteristic in combination with other embodiments also falls within the scope of the present application.

[0079] In the above embodiments, the descriptions of the respective embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0080] It should also be noted that the above are only the preferred embodiments of the present application, and do not limit the patent protection scope of the present application accordingly. Any equivalent structure or equivalent process transformation made by using the content of the specification and drawings of the present application, or directly or indirectly applied in other related technical fields, shall be included in the patent protection scope of the present application by the same token.

Claims

1. An LED lamp bead, characterized in that, Comprising: A bracket, on the first side surface of which a first groove is formed. The area of the open end of the first groove is larger than the area of the bottom wall of the first groove, and the side wall of the first groove is inclined; Encapsulating silica gel, fixed to the open end of the first groove. The side of the encapsulating silica gel facing the bottom wall of the first groove protrudes towards the bottom wall of the first groove to form a convex lens; A light-emitting chip, mounted on the bottom wall of the first groove; Wherein, the bracket and the encapsulating silica gel enclose a hollow cavity.

2. The LED lamp bead according to claim 1, wherein, The encapsulating silica gel further includes a convex edge, which is fixed to the side of the encapsulating silica gel facing the bottom wall of the first groove and surrounds the periphery of the encapsulating silica gel. One side of the convex edge is attached to the inner wall of the first groove.

3. The LED lamp bead according to claim 2, characterized in that, The convex edge includes opposite first side wall and second side wall. The first side wall is attached to the inner wall of the first groove, and the second side wall is perpendicular to the bottom wall of the first groove.

4. The LED lamp bead according to claim 1, wherein, The LED lamp bead further includes fluorescent glue, which is fixed to the bottom wall of the first groove and covers the light-emitting chip.

5. The LED lamp bead according to claim 4, characterized in that, The fluorescent glue is arranged at an interval from the encapsulating silica gel.

6. The LED lamp bead according to claim 4, characterized in that, A first through hole is formed in the bottom wall of the first groove, and the first through hole penetrates through the bottom wall of the first groove to the second side surface of the bracket; The LED lamp bead further includes a heat dissipation plate, which is fixed to the second side surface of the bracket and closes the first through hole; Wherein, the light-emitting chip is located in the first through hole and fixed to the heat dissipation plate.

7. The LED lamp bead according to any one of claims 1 to 6, characterized in that, The cross-section of the bracket is rectangular, the cross-section of the first groove is trapezoidal, and the long base of the trapezoid coincides with one side of the rectangle.

8. The LED lamp bead according to any one of claims 1 to 6, characterized in that The material of the bracket includes any one of polyphthalamide, thermosetting resin, ceramic, and graphene.

9. An LED light bar, characterized in that, Comprising: A substrate; A plurality of LED lamp beads as described in any one of claims 1 to 8, and the plurality of LED lamp beads are fixedly arranged on the substrate at intervals.

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