Semiconductor part assembly processing device

Abstract

The utility model discloses a semiconductor part assembly processing device which comprises a supporting frame, a bottom plate is arranged on the supporting frame, a sliding module is arranged on the bottom plate, a movable plate is arranged on the sliding module, a side plate and an installation plate are arranged on the upper surface and the side face of the movable plate respectively, a motor is arranged on the side plate, and a driven wheel is arranged on one side of the installation plate. A transmission belt is arranged between the motor and the driven wheel, a rotating shaft is arranged at the position, corresponding to the driven wheel, of the mounting plate, and a workpiece fixing plate is arranged on the rotating shaft. A first auxiliary plate is arranged on one side of the supporting frame, a first air cylinder is arranged on the first auxiliary plate, and an upper bending plate is arranged at the output end of the first air cylinder; comprising a second auxiliary plate, a second air cylinder is arranged on the second auxiliary plate, and a lower bending plate is arranged at the output end of the second air cylinder. The automatic rotating and bending device is simple in structure, capable of achieving automatic rotating and bending operation of workpiece terminals and wide in application range, and the upper bending plate and the lower bending plate are used for adjusting the bending position.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, and particularly relates to a semiconductor component processing device. Background Art

[0002] Semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator; semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors; from the perspective of both technology and economic development, the importance of semiconductors is extremely great. The core units of most electronic products, such as computers, mobile phones or digital recorders, are extremely closely related to semiconductors.

[0003] The devices made of semiconductors need to go through various processing steps before leaving the factory. Bending is a relatively common step among them. Generally, the bending equipment flattens and fixes and bends from top to bottom. The method is single and the applicable range is narrow. Content of the Utility Model

[0004] The technical problem to be solved by the utility model is to provide a semiconductor component processing device with a simple structure, which can realize the automatic rotary bending operation of workpiece terminals, and the upper and lower bending plates are used to adjust the bending position, and the applicable range is wide.

[0005] To solve the above technical problem, the utility model provides a semiconductor component processing device, which includes a support frame. A bottom plate is arranged on the support frame. A sliding module is arranged on the bottom plate. A moving plate is arranged on the sliding module. A side plate and a mounting plate are respectively arranged on the upper surface and the side surface of the moving plate. A motor is arranged on the side plate. A driven wheel is arranged on one side of the mounting plate. A transmission belt is arranged between the motor and the driven wheel. A rotating shaft is arranged at a position corresponding to the driven wheel on the mounting plate. A workpiece fixing plate is arranged on the rotating shaft. A first auxiliary plate is arranged on one side of the support frame. A first cylinder is arranged on the first auxiliary plate. An upper bending plate is arranged at the output end of the first cylinder. A second auxiliary plate is included. A second cylinder is arranged on the second auxiliary plate. A lower bending plate is arranged at the output end of the second cylinder.

[0006] Further, mounting ears are arranged on both sides of the bottom surface of the support frame, and positioning holes are arranged at intervals on the mounting ears.

[0007] Further, an auxiliary shaft is arranged on one side of the mounting plate. Positioning plates are arranged at positions corresponding to the auxiliary shaft and the rotating shaft. The shape of the positioning plate is semi-cylindrical, and the workpiece fixing plate is arranged between the two positioning plates.

[0008] Further, a protection plate is provided on the outer side of the transmission belt.

[0009] Further, a photoelectric switch is provided on the top of the motor.

[0010] Further, the shape of the side surface of the mounting plate is U-shaped, and the auxiliary shaft and the rotating shaft correspond to the two sides of the U-shape.

[0011] The beneficial effects of the present utility model: When the device is in use, the whole device is installed on the workbench, and the workpiece to be bent is installed on the workpiece fixing plate. After fixing, the sliding module is used to drive the mounting plate to move back and forth, thereby driving the workpiece to move back and forth to adjust the position. After moving to the preset position, start to adjust the rotation direction of the workpiece. Start the motor to drive the driven wheel to rotate through the transmission belt, thereby driving the rotation of the rotating shaft on one side, that is, driving the workpiece fixing plate to rotate, that is, driving the workpiece to rotate to adjust the rotation angle of the workpiece. After the adjustment is completed, decide whether to use the upper bending plate or the lower bending plate according to the need, and the bending operation can be completed by driving with the first cylinder and the second cylinder. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is the overall structural schematic diagram of the present utility model.

[0013] Figure 2 is the partial structural schematic diagram of the present utility model.

[0014] Figure 3 is the structural schematic diagram of the mounting plate of the present utility model.

[0015] Explanation of the reference numerals in the drawings: 1, support frame; 2, bottom plate; 3, sliding module; 4, moving plate; 5, side plate; 6, mounting plate; 7, motor; 8, driven wheel; 9, transmission belt; 10, rotating shaft; 11, workpiece fixing plate; 12, first auxiliary plate; 13, first cylinder; 14, upper bending plate; 15, second auxiliary plate; 16, second cylinder; 17, lower bending plate; 18, mounting ear; 19, positioning hole; 20, auxiliary shaft; 21, positioning plate; 22, protection plate; 23, photoelectric switch. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0016] The present utility model will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present utility model and be able to implement it, but the embodiments given are not intended to limit the present utility model.

[0017] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model.

[0018] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically and clearly defined.

[0019] In the present utility model, unless otherwise clearly specified and defined, terms such as "mounted", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0020] In the present utility model, unless otherwise clearly specified and defined, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0021] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0022] Referring to Figures 1 to 3 As shown in the figure, an embodiment of a semiconductor component assembly processing device of the present invention includes a support frame 1, a bottom plate 2 is provided on the support frame 1, a sliding module 3 is provided on the bottom plate 2, a moving plate 4 is provided on the sliding module 3, side plates 5 and mounting plates 6 are respectively provided on the upper surface and side surface of the moving plate 4, a motor 7 is provided on the side plate 5, a driven wheel 8 is provided on one side of the mounting plate 6, a transmission belt 9 is provided between the motor 7 and the driven wheel 8, a rotating shaft 10 is provided on the mounting plate 6 at a position corresponding to the driven wheel 8, and a workpiece fixing plate 11 is provided on the rotating shaft 10; a first auxiliary plate 12 is provided on one side of the support frame 1, a first cylinder 13 is provided on the first auxiliary plate 12, and an upper bending plate 14 is provided at the output end of the first cylinder 13; a second auxiliary plate 15 is included, a second cylinder 16 is provided on the second auxiliary plate 15, and a lower bending plate 17 is provided at the output end of the second cylinder 16.

[0023] During use, the entire device is installed on the workbench, the workpiece to be bent is installed on the workpiece fixing plate 11. After fixing, the sliding module 3 is used to drive the mounting plate 6 to move back and forth, thereby driving the workpiece to move back and forth to adjust the position. After moving to the preset position, the rotation direction of the workpiece is adjusted. The motor 7 is started to drive the driven wheel 8 to rotate through the transmission belt 9, thereby driving the rotation of the rotating shaft 10 on one side, that is, driving the workpiece fixing plate 11 to rotate, that is, driving the workpiece to rotate to adjust the rotation angle of the workpiece. After the adjustment is completed, it is determined whether it is the upper bending plate 14 or the lower bending plate 17 according to the need, and the bending operation can be completed by driving with the first cylinder 13 and the second cylinder 16.

[0024] There are mounting ears 18 provided on both sides of the bottom surface of the support frame 1, and positioning holes 19 are provided at intervals on the mounting ears 18, which can conveniently fix the support frame 1 on the workbench; the shape of the side surface of the mounting plate 6 is U-shaped, the auxiliary shaft 20 and the rotating shaft 10 correspond to the two sides of the U-shape, the auxiliary shaft 20 is provided on one side of the mounting plate 6, and positioning plates 21 are provided at the corresponding positions of the auxiliary shaft 20 and the rotating shaft 10. The shape of the positioning plate 21 is semi-cylindrical, and the workpiece fixing plate 11 is arranged between the two positioning plates 21, which is convenient for installing and disassembling the positioning plate 21; a protection plate 22 is provided on the outside of the transmission belt 9 to protect the connection between the motor 7 and the transmission belt 9 and extend the service life; a photoelectric switch 23 is provided on the top of the motor 7 for convenient control.

[0025] The above embodiments are only the preferred embodiments given to fully illustrate the present invention, and the protection scope of the present invention is not limited thereto. Equivalent substitutions or transformations made by those skilled in the art on the basis of the present invention are all within the protection scope of the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A semiconductor component assembly processing device, characterized in that, It includes a support frame (1), a bottom plate (2) is arranged on the support frame (1), a sliding module (3) is arranged on the bottom plate (2), a moving plate (4) is arranged on the sliding module (3), a side plate (5) and a mounting plate (6) are respectively arranged on the upper surface and the side surface of the moving plate (4), a motor (7) is arranged on the side plate (5), a driven wheel (8) is arranged on one side of the mounting plate (6), a transmission belt (9) is arranged between the motor (7) and the driven wheel (8), a rotating shaft (10) is arranged at a position corresponding to the driven wheel (8) on the mounting plate (6), and a workpiece fixing plate (11) is arranged on the rotating shaft (10); A first auxiliary plate (12) is arranged on one side of the support frame (1), a first cylinder (13) is arranged on the first auxiliary plate (12), and an upper bending plate (14) is arranged at the output end of the first cylinder (13); It includes a second auxiliary plate (15), a second cylinder (16) is arranged on the second auxiliary plate (15), and a lower bending plate (17) is arranged at the output end of the second cylinder (16).

2. The semiconductor component assembly processing device according to claim 1, wherein, Mounting ears (18) are arranged on both sides of the bottom surface of the support frame (1), and positioning holes (19) are arranged at intervals on the mounting ears (18).

3. The semiconductor component assembly processing device according to claim 1, characterized in that, An auxiliary shaft (20) is arranged on one side of the mounting plate (6), positioning plates (21) are arranged at positions corresponding to the auxiliary shaft (20) and the rotating shaft (10), the shape of the positioning plate (21) is semi-cylindrical, and the workpiece fixing plate (11) is arranged between the two positioning plates (21).

4. The semiconductor component assembly processing device according to claim 1, wherein A protection plate (22) is arranged on the outer side of the transmission belt (9).

5. The semiconductor component assembly processing device according to claim 1, characterized in that, A photoelectric switch (23) is arranged on the top of the motor (7).

6. The semiconductor component assembly processing device according to claim 3, characterized in that, The side surface of the mounting plate (6) is U-shaped, and the auxiliary shaft (20) and the rotating shaft (10) correspond to the two sides of the U-shape.

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