Forming die for double-face forming

Abstract

The forming die comprises an upper die and a lower die which are symmetrically arranged, each of the upper die and the lower die comprises a fixed part, a floating part, a fixed plate and a plurality of elastic parts arranged between the fixed part and the floating part, and a base plate is located between the upper die and the lower die. The multiple elastic parts are arranged around the periphery of the base plate, and each fixing plate is fixedly connected with the corresponding fixing part; the floating part comprises a containing groove, the fixing plate is located in the containing groove, and the floating part can move up and down relative to the fixing part and the fixing plate. According to the forming die, resin on the two sides of the substrate can be compressed by the two fixing plates at the same time, double-face forming of the upper face and the lower face of a semiconductor product can be completed through one-time compression, production efficiency can be improved, almost no resin flows in the compression process, forming pressure is low, and higher-precision forming can be achieved; almost no resin waste is generated in the production process.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor product forming, and particularly relates to a forming die for double-sided forming. Background Art

[0002] For map-type semiconductor products with double-sided forming, there are mainly two process methods in production: injection molding and compression molding.

[0003] For injection molding: the middle of its die is a ejector rod, substrates are placed on both sides of the ejector rod, resin is put into the feeding cylinder of the ejector rod, and after the die is closed, the resin is extruded by the ejector rod to fill the shapes of the two substrates on both sides to complete the forming process. Through the setting of the gate, this process can complete double-sided forming in one molding. However, it is necessary to encapsulate the forming area through a glue cake and a runner. The glue cake and the runner are waste materials, and the resin utilization rate is low. Moreover, to ensure the filling efficiency, the injection pressure is generally high, and there is resin flow. Usually, additional holes need to be opened on the substrate to connect the upper and lower encapsulation bodies, and the long resin flow distance is likely to cause problems such as internal gold wire offset and warping.

[0004] For compression molding: the existing die is to directly place the substrate on the upper die or the lower die of the die, and after putting resin into the die, the die is closed for compression molding. However, only one-sided forming and encapsulation can be carried out at a time. If double-sided forming is required, it needs to be completed in two separate moldings, and the production efficiency is low. Summary of the Utility Model

[0005] In view of this, in order to overcome the defects of the prior art, the purpose of the utility model is to provide a forming die for double-sided forming, which can complete the double-sided forming of map-type semiconductor products through one-time compression.

[0006] To achieve the above purpose, the utility model adopts the following technical solutions:

[0007] A forming die for double-sided forming is used for double-sided compression molding of semiconductor products. The semiconductor products include a substrate, a first encapsulation body and a second encapsulation body respectively located on both sides of the substrate. The forming die includes an upper die and a lower die which are symmetrically arranged. Both the upper die and the lower die include a fixed part, a floating part, a fixing plate, and a plurality of elastic parts arranged between the fixed part and the floating part. The substrate is located between the upper die and the lower die. The plurality of elastic parts are arranged around the periphery of the substrate, and each fixing plate is fixedly connected to the fixed part. The floating part includes a receiving groove, the fixing plate is located in the receiving groove, and the floating part can move up and down relative to the fixed part and the fixing plate.

[0008] According to some preferred implementation aspects of the present utility model, each of the elastic parts includes an elastic member, a fixing post, a first gasket, and a second gasket. The first gasket is fixedly arranged at one end of the fixing post, and the second gasket is fixedly arranged at the other end of the fixing post.

[0009] According to some preferred implementation aspects of the present utility model, the elastic member is sleeved on the outer periphery of the fixing post. One end of the elastic member contacts the first gasket, and the other end of the elastic member contacts one side of the floating part close to the fixed part.

[0010] According to some preferred implementation aspects of the present utility model, the outer diameters of the first gasket and the second gasket are both larger than the inner diameter of the elastic member. The length of the elastic member in the natural state is equal to the distance between the first gasket and the second gasket. When the elastic member is in the natural state, there is a gap between the fixed part and the floating part.

[0011] According to some preferred implementation aspects of the present utility model, a plurality of first grooves are formed inside the fixed part, and a plurality of second grooves are formed inside the floating part. The number of the first grooves and the second grooves is equal to the number of the elastic parts. The first grooves are arranged in one-to-one correspondence with the elastic parts, and the second grooves are arranged in one-to-one correspondence with the elastic parts.

[0012] According to some preferred implementation aspects of the present utility model, the first grooves are opened upward from the side of the fixed part close to the floating part, and the second grooves are opened downward from the side of the floating part close to the fixed part. One of the first grooves and the corresponding second groove are jointly used to accommodate one of the elastic parts.

[0013] According to some preferred implementation aspects of the present utility model, the first gasket is located at one end of the first groove far from the second groove, and the second gasket is located at one end of the second groove close to the first groove. The diameter of the first groove is larger than the outer diameter of the elastic member, and the diameter of one end of the second groove close to the first groove is smaller than the outer diameter of the elastic member and larger than the outer diameter of the second gasket.

[0014] According to some preferred implementation aspects of the present utility model, the accommodating groove penetrates through the thickness direction of the floating part, and the center of the accommodating groove coincides with the center of the floating part.

[0015] According to some preferred implementation aspects of the present utility model, the substrate is located between the accommodating groove of the upper mold and the accommodating groove of the lower mold. The area of the substrate is larger than the area of the accommodating groove. The length of the accommodating groove is equal to the lengths of the first encapsulation body and the second encapsulation body, and the width of the accommodating groove is equal to the widths of the first encapsulation body and the second encapsulation body.

[0016] According to some preferred implementation aspects of the present utility model, when the elastic member is in a natural state, the distance from the surface of the fixed plate of the upper mold close to the lower mold to the surface of the substrate close to the upper mold is equal to the thickness of the first encapsulant, and the distance from the surface of the fixed plate of the lower mold close to the upper mold to the surface of the substrate close to the lower mold is equal to the thickness of the second encapsulant.

[0017] Due to the adoption of the above technical solution, compared with the prior art, a molding die for double-sided molding of the present utility model sets a fixed part, a floating part, a fixed plate and an elastic part in both the upper mold and the lower mold, arranges the substrate between the upper mold and the lower mold, and uses the elastic part to enable the floating part to float up and down relative to the fixed part and the fixed plate, so that the resins on both sides of the substrate can be compressed by the two fixed plates at the same time, and thus the double-sided molding of the upper and lower surfaces of the semiconductor product can be completed by one compression, which is beneficial to improving production efficiency. And when compressing with the molding die of the present utility model, there is almost no resin flow, the molding pressure is low, higher-precision molding can be achieved, and almost no resin waste is generated during the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required for description in the embodiments. Obviously, the following drawings are only some embodiments of the present utility model, and for those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0019] Figure 1 is a three-dimensional structural schematic diagram of a molding die for double-sided molding in a preferred embodiment of the present utility model;

[0020] Figure 2 is a side view structural schematic diagram of the upper mold of a molding die for double-sided molding in a preferred embodiment of the present utility model;

[0021] Figure 3 is Figure 2 a cross-sectional structural schematic diagram along the A-A direction in

[0022] Figure 4 is a top view structural schematic diagram of the upper mold of a molding die for double-sided molding in a preferred embodiment of the present utility model;

[0023] Figure 5 is Figure 4 a cross-sectional structural schematic diagram along the B-B direction in

[0024] Figure 6 is Figure 4 a cross-sectional structural schematic diagram along the C-C direction in

[0025] Among them, the reference numerals in the drawings are as follows:

[0026] Upper mold - 1, fixed part - 11, first groove - 111, floating part - 12, receiving groove - 121, second groove - 122, fixing plate - 13, elastic member - 141, fixing post - 142, first gasket - 143, second gasket - 144, lower mold - 2, locking part - 3, first fixing block - 31, locking groove - 311, second fixing block - 32, substrate - 4. Detailed implementation manner

[0027] In order to enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without creative efforts shall fall within the protection scope of the present utility model.

[0028] Refer to Figures 1 to 6 , a forming mold for double - sided forming in this embodiment is used for double - sided compression forming of semiconductor products. The semiconductor product in this embodiment is a map - type semiconductor product, which includes a substrate 4 and a first encapsulant and a second encapsulant located on both sides of the substrate 4 respectively. The forming mold includes symmetrically arranged upper mold 1, lower mold 2, and a locking part 3 for locking the upper mold 1 and the lower mold 2. The substrate 4 is located between the upper mold 1 and the lower mold 2. There are four locking parts 3 in this embodiment, which are arranged around the periphery of the upper mold 1 and the lower mold 2, and one locking part 3 is arranged on each side.

[0029] Furthermore, as Figure 1 shown, both the upper mold 1 and the lower mold 2 include a fixed part 11, a floating part 12, a fixing plate 13, and a plurality of elastic parts arranged between the fixed part 11 and the floating part 12. The plurality of elastic parts are arranged at intervals around the periphery of the substrate 4. In this embodiment, as Figure 3As shown in the figure, along the length direction of the substrate 4, seven elastic parts are evenly spaced on both sides of the substrate 4; along the width direction of the substrate 4, two elastic parts are evenly spaced on the other two sides of the substrate 4. In addition, each fixing plate 13 is fixedly connected to the bottom of the fixing part 11. The length of the fixing plate 13 is less than that of the fixing part 11, and the width of the fixing plate 13 is less than that of the fixing part 11. A receiving groove 121 penetrating in the thickness direction is formed in the floating part 12. The center of the receiving groove 121 coincides with the center of the floating part 12, and the length of the receiving groove 121 is less than that of the floating part 12, and the width of the receiving groove 121 is less than that of the floating part 12. The fixing plate 13 is located in the receiving groove 121, and the fixing plate 13 and the fixing part 11 can float up and down along the height direction of the receiving groove 121.

[0030] Specifically, as Figure 6 shown in the figure, a plurality of first grooves 111 are formed inside the fixing part 11, and the first grooves 111 are formed upward from the surface of the fixing part 11 close to the floating part 12; a plurality of second grooves 122 are formed inside the floating part 12, and the second grooves 122 are formed downward from the surface of the floating part 12 close to the fixing part 11. The number of the first grooves 111 and the second grooves 122 is equal to the number of the elastic parts. The first grooves 111 are arranged in one-to-one correspondence with the elastic parts, and the second grooves 122 are arranged in one-to-one correspondence with the elastic parts. One first groove 111 and the corresponding second groove 122 are jointly used to accommodate one elastic part, and the axis line of one first groove 111 coincides with the axis line of the corresponding second groove 122.

[0031] Furthermore, as Figure 5 and Figure 6 shown in the figure, each elastic part includes an elastic member 141, a fixing column 142, a first gasket 143 and a second gasket 144. The first gasket 143 is fixedly arranged at one end of the fixing column 142 and the first gasket 143 is located at the end of the first groove 111 away from the second groove 122; the second gasket 144 is fixedly arranged at the other end of the fixing column 142 and the second gasket 144 is located at the end of the second groove 122 close to the first groove 111. The elastic member 141 is sleeved on the outer periphery of the fixing column 142. One end of the elastic member 141 contacts the first gasket 143, and the other end of the elastic member 141 contacts the surface of the floating part 12 close to the fixing part 11. The elastic member 141 in this embodiment is preferably a spring.

[0032] In this embodiment, the outer diameters of the first gasket 143 and the second gasket 144 are both larger than the inner diameter of the elastic member 141, the diameter of the first groove 111 is larger than the outer diameter of the elastic member 141, the diameter of one end of the second groove 122 close to the first groove 111 is smaller than the outer diameter of the elastic member 141 and larger than the outer diameter of the second gasket 144, and the length of the elastic member 141 in the natural state is equal to the distance between the first gasket 143 and the second gasket 144. Such a setting makes the relative distance between the first gasket 143 and the second gasket 144 always remain unchanged. By squeezing one end of the elastic member 141 through the floating part 12, the elastic member 141 can expand and contract between the first gasket 143 and the second gasket 144. At the same time, when the elastic member 141 is in the natural state, there is a gap between the fixed part 11 and the floating part 12, there is a gap between the fixed plate 13 of the upper mold 1 and the substrate 4, and there is also a gap between the fixed plate 13 of the lower mold 2 and the substrate 4. When the fixed parts 11 of the upper mold 1 and the lower mold 2 are pushed by an external force, they can compress the elastic member 141 and gradually approach the floating part 12, so that the gap between the fixed part 11 and the floating part 12 becomes smaller and smaller, and the gaps between the fixed plate 13 of the upper mold 1 and the substrate 4 and between the fixed plate 13 of the lower mold 2 and the substrate 4 both gradually decrease. Finally, the resins on both sides of the substrate 4 can be compressed simultaneously to achieve double-sided molding.

[0033] Specifically, in this embodiment, the substrate 4 is located between the receiving groove 121 of the upper mold 1 and the receiving groove 121 of the lower mold 2, and the area of the substrate 4 is larger than the area of the receiving groove 121. The length of the receiving groove 121 is equal to the length of the first encapsulant and the second encapsulant, and the width of the receiving groove 121 is equal to the width of the first encapsulant and the second encapsulant; the distance from the surface of the fixed plate 13 of the upper mold 1 close to the lower mold 2 to the surface of the substrate 4 close to the upper mold 1 is equal to the thickness of the first encapsulant, and the distance from the surface of the fixed plate 13 of the lower mold 2 close to the upper mold 1 to the surface of the substrate 4 close to the lower mold 2 is equal to the thickness of the second encapsulant.

[0034] Furthermore, each locking part 3 includes two first fixing blocks 31 arranged symmetrically. The two first fixing blocks 31 are respectively fixedly connected to the fixed part 11 of the upper mold 1 and the fixed part 11 of the lower mold 2, and the axis lines of the two first fixing blocks 31 coincide. The first fixing block 31 arranged on the upper mold 1 is provided with a locking groove 311 opening upward from the side close to the lower mold 2. A second fixing block 32 is fixedly arranged on the side of the first fixing block 31 arranged on the lower mold 2 close to the upper mold 1. The locking groove 311 is used to accommodate the second fixing block 32. The locking between the two first fixing blocks 311 is realized through the mutual cooperation of the locking groove 311 and the second fixing block 32, so as to realize the locking between the upper mold 1 and the lower mold 2.

[0035] The working process of the molding die for double-sided molding of the present utility model is as follows:

[0036] First, lay the separation membrane on the carrier plate in the loading area and place the frame. Weigh the resin required for the second encapsulation body and sprinkle it on the separation membrane within the frame, and then place the substrate 4 into the frame. Weigh the resin required for the first encapsulation body and sprinkle it on the substrate 4 within the frame. Use a manipulator to transfer the carrier plate in the loading area (including the separation membrane, frame, substrate 4, resin, etc.) to between the upper mold 1 (the upper mold 1 has adsorbed the separation membrane in advance) and the lower mold 2 of the molding die. Adsorb the separation membrane on the carrier plate in the loading area onto the lower mold 2, and take out the frame. Close the upper mold 1 and the lower mold 2 until the substrate 4 is pressed tightly; continue to apply pressure to close the mold to compress and mold the resin. After double-sided molding is completed, open the upper mold 1 and the lower mold 2, and take out the product.

[0037] The above embodiments are only used to illustrate the technical concept and characteristics of the present invention. The purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, and it cannot be used to limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit and essence of the present invention should be covered within the protection scope of the present invention.

Claims

1. A molding die for double-sided molding, characterized in that, For double-sided compression molding of semiconductor products, the semiconductor products include a substrate, a first encapsulation body and a second encapsulation body respectively located on both sides of the substrate. The molding die includes an upper die and a lower die which are symmetrically arranged. Both the upper die and the lower die include a fixed part, a floating part, a fixing plate, and a plurality of elastic parts arranged between the fixed part and the floating part. The substrate is located between the upper die and the lower die. The plurality of elastic parts are arranged around the periphery of the substrate, and each fixing plate is fixedly connected to the fixed part. The floating part includes a receiving groove, the fixing plate is located in the receiving groove, and the floating part can move up and down relative to the fixed part and the fixing plate.

2. The molding die according to claim 1, wherein Each elastic part includes an elastic member, a fixing column, a first gasket and a second gasket. The first gasket is fixedly arranged at one end of the fixing column, and the second gasket is fixedly arranged at the other end of the fixing column.

3. The molding die according to claim 2, wherein, The elastic member is sleeved on the outer periphery of the fixing column. One end of the elastic member contacts the first gasket, and the other end of the elastic member contacts the surface of the floating part close to the fixed part.

4. The molding die according to claim 3, wherein The outer diameters of the first gasket and the second gasket are both larger than the inner diameter of the elastic member. The length of the elastic member in the natural state is equal to the distance between the first gasket and the second gasket. When the elastic member is in the natural state, there is a gap between the fixed part and the floating part.

5. The molding die according to claim 3, wherein, A plurality of first grooves are formed inside the fixed part, and a plurality of second grooves are formed inside the floating part. The number of the first grooves and the second grooves is equal to the number of the elastic parts. The first grooves are arranged in one-to-one correspondence with the elastic parts, and the second grooves are arranged in one-to-one correspondence with the elastic parts.

6. The molding die according to claim 5, wherein, The first groove is formed upward from the surface of the fixed part close to the floating part, and the second groove is formed downward from the surface of the floating part close to the fixed part. One first groove and a corresponding second groove are jointly used to accommodate one elastic part.

7. The molding die according to claim 6, wherein The first gasket is located at the end of the first groove away from the second groove, and the second gasket is located at the end of the second groove close to the first groove. The diameter of the first groove is larger than the outer diameter of the elastic member, and the diameter of the end of the second groove close to the first groove is smaller than the outer diameter of the elastic member and larger than the outer diameter of the second gasket.

8. The molding die according to claim 2, characterized in that, The receiving groove penetrates through the thickness direction of the floating part, and the center of the receiving groove coincides with the center of the floating part.

9. The molding die according to claim 8, wherein The substrate is located between the receiving groove of the upper die and the receiving groove of the lower die. The area of the substrate is larger than the area of the receiving groove. The length of the receiving groove is equal to the length of the first encapsulation body and the second encapsulation body, and the width of the receiving groove is equal to the width of the first encapsulation body and the second encapsulation body.

10. The molding die according to claim 9, characterized in that, When the elastic member is in the natural state, the distance from the surface of the fixing plate of the upper die close to the lower die to the surface of the substrate close to the upper die is equal to the thickness of the first encapsulation body, and the distance from the surface of the fixing plate of the lower die close to the upper die to the surface of the substrate close to the lower die is equal to the thickness of the second encapsulation body.

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