Copper recovery treatment equipment convenient for recycling micro-etching liquid

Abstract

The utility model provides copper recovery processing equipment convenient for recycling micro-etching liquid, which relates to the technical field of copper recovery and comprises an overflow screen plate, a discharge partition plate is arranged on one side of the overflow screen plate, a drainage detection cavity is arranged on one side of the discharge partition plate, and a copper ion concentration sensor is fixedly mounted in the drainage detection cavity. And a three-way valve group is arranged on one side of the copper ion concentration sensor. The device has the advantages that the copper ion concentration detection structure is arranged in the structure for precipitating and discharging the micro-etching liquid, the copper ion concentration detection structure is used for detecting the copper ion concentration in the discharged liquid after precipitation, and the control valve group is used for guiding the discharged liquid to different directions according to the detection result; liquid with high copper ion concentration is recycled and neutralized and precipitated again, so that the concentration of copper ions in the discharged liquid is reduced, the utilization rate of copper recovery in the micro-etching liquid is improved, and the quality of copper recovery treatment in the micro-etching liquid can be effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of copper recovery, in particular to a copper recovery treatment device which is convenient for the circulating reuse of micro-etching solution. Background Art

[0002] The PCB industry is the foundation of the electronics industry, information industry and household appliance industry. In recent years, China has maintained an annual growth rate of nearly 10-12%. At present, there are nearly more than 5,000 PCB enterprises of various scales across the country, and the annual output of PCB boards is nearly 150 million m². In the PCB industry, micro-etching is an essential process. In the waste liquid generated by micro-etching, the copper element content is as high as 30-40 g / L. If not treated, it will not only cause great harm to the environment, but also be a huge waste of resources. For the waste micro-etching solution in the micro-etching process of existing circuit board enterprises, the copper ion concentration is low, and it is not treated with high requirements like etching waste liquid. Its treatment method is generally to discharge it into the wastewater treatment system after the copper ion concentration reaches 30-60 g / L. After recovering copper compounds by the neutralization precipitation method, the wastewater is then clarified, filtered and discharged or reused.

[0003] However, the existing copper recovery treatment equipment is not convenient for detecting the copper ion content in the discharged wastewater during the working process, which is not conducive to the recycling of copper and is relatively inconvenient to use. Summary of the Utility Model

[0004] Therefore, the purpose of the present utility model is to provide a copper recovery treatment device which is convenient for the circulating reuse of micro-etching solution to solve the problems mentioned in the background art and overcome the deficiencies existing in the prior art.

[0005] To achieve the above purpose, an embodiment of one aspect of the present utility model provides a copper recovery treatment device which is convenient for the circulating reuse of micro-etching solution, including a micro-etching solution inlet pipe. One end of the micro-etching solution inlet pipe is fixedly installed with a neutralization tank. The top end of the neutralization tank is fixedly installed with a neutralizing agent adding hopper. The neutralizing agent adding hopper is signal-connected to a main control unit. The main control unit is signal-connected to a stirring frame. One side of the stirring frame is provided with an overflow screen plate. One side of the overflow screen plate is provided with a discharge partition plate. One side of the discharge partition plate is provided with a drainage detection chamber. Inside the drainage detection chamber, a copper ion concentration sensor is fixedly installed. One side of the copper ion concentration sensor is provided with a three-way valve group. The output ends of the three-way valve group are respectively fixedly installed with a circulation pipe and a discharge pipe.

[0006] Preferably, according to any of the above solutions, the top end of the neutralization tank is provided with a fixing groove adapted to the neutralizing agent adding hopper. One end of the neutralization tank is provided with a neutralization chamber. The neutralizing agent adding hopper is located above the neutralization chamber.

[0007] Adopt the above technical solution: The micro-etching solution is introduced into the interior of the neutralization tank through the micro-etching solution inlet pipe. At the same time, the neutralizing agent is added to the interior of the neutralization tank through the neutralizing agent adding hopper to neutralize the micro-etching solution, and the neutralized copper compound is precipitated.

[0008] Preferably, according to any of the above solutions, the stirring frame includes a stirring motor and a stirring rod. The stirring motor is fixedly installed at one end of the neutralization tank, and the output end of the stirring motor is fixedly installed with a stirring rod rotatably connected to the neutralization tank.

[0009] Adopt the above technical solution: During the neutralization process, control the stirring motor to output power to drive the stirring rod to rotate, so that the rotating stirring rod mixes the micro-etching solution and the neutralizing agent, accelerating the neutralization efficiency and facilitating the production of copper compounds.

[0010] Preferably, according to any of the above solutions, the overflow screen plate is fixedly installed inside the neutralization tank, and the overflow screen plate is located between the neutralization chamber and the drainage detection chamber.

[0011] Preferably, according to any of the above solutions, the discharge partition plate includes a support plate, a pneumatic telescopic rod and a partition plate. The support plate is fixedly installed inside the neutralization tank, the pneumatic telescopic rod is fixedly installed inside the support plate, and the top end of the pneumatic telescopic rod is fixedly installed with a partition plate.

[0012] Adopt the above technical solution: After precipitation, control the pneumatic telescopic rod to expand and contract according to the depth of the micro-etching solution inside the neutralization tank to drive the partition plate to rise and fall, adjust the height of the partition plate, control the height of the overflow of the partition plate to the overflow screen plate, and overflow the supernatant after precipitation to the interior of the drainage detection chamber through the overflow screen plate.

[0013] Preferably, according to any of the above solutions, the drainage detection chamber is opened inside the neutralization tank, the copper ion concentration sensor is fixedly installed inside the neutralization tank, and the copper ion concentration sensor is signal-connected to the main control unit.

[0014] Preferably, according to any of the above solutions, the three-way valve group includes a water pump and an electromagnetic three-way valve. The water pump is fixedly installed inside the neutralization tank, one end of the water pump is fixedly installed with an electromagnetic three-way valve, and the electromagnetic three-way valve is fixedly installed with the circulation pipe and the discharge pipe.

[0015] Adopt the above technical solution: After the supernatant is discharged into the interior of the drainage detection chamber, detect the copper ion concentration in the supernatant inside the drainage detection chamber through the copper ion concentration sensor, control the water pump to pump out the supernatant according to the detection data of the copper ion concentration, and at the same time control the electromagnetic three-way valve to introduce the supernatant with a high copper ion concentration into the circulation pipe, use the circulation pipe to introduce the supernatant into the interior of the neutralization tank for re-precipitation, and introduce the supernatant with a low copper ion concentration into the discharge pipe for discharge.

[0016] Compared with the prior art, the advantages and beneficial effects of the present utility model are as follows:

[0017] 1. A copper ion concentration detection structure is arranged inside the structure for the precipitation and discharge of the micro-etching solution. The copper ion concentration detection structure detects the copper ion concentration in the liquid discharged after precipitation, and according to the detection result, the control valve group guides the discharged liquid in different directions. The liquid with a higher copper ion concentration is recycled and recovered for re-neutralization precipitation, reducing the copper ion concentration in the discharged liquid and improving the utilization rate of copper recovery in the micro-etching solution, which can effectively improve the quality of copper recovery treatment in the micro-etching solution.

[0018] 2. A stirring structure is arranged inside the micro-etching solution neutralization structure to accelerate the neutralization efficiency of the micro-etching solution, improve the precipitation efficiency of copper ions in the micro-etching solution, and facilitate the recycling and utilization of copper in the micro-etching solution.

[0019] Additional aspects and advantages of the present utility model will be given in part in the following description, will become apparent in part from the following description, or will be understood through the practice of the present utility model. Brief Description of the Drawings

[0020] The above and / or additional aspects and advantages of the present utility model will become apparent and easy to understand from the description of the embodiments in conjunction with the following drawings, wherein:

[0021] Figure 1 is a schematic structural diagram according to an embodiment of the present utility model;

[0022] Figure 2 is a schematic cross-sectional structural diagram of a neutralization tank according to an embodiment of the present utility model;

[0023] Figure 3 is a schematic cross-sectional structural diagram of a discharge partition according to an embodiment of the present utility model;

[0024] Figure 4 is according to an embodiment of the present utility model Figure 1 an enlarged schematic structural diagram of part A therein;

[0025] Wherein: 1 - micro-etching solution inlet pipe, 2 - neutralization tank, 3 - neutralizing agent addition hopper, 4 - stirring frame, 41 - stirring motor, 42 - stirring rod, 5 - overflow screen plate, 6 - discharge partition, 61 - support plate, 62 - pneumatic telescopic rod, 63 - isolation plate, 7 - drainage detection cavity, 8 - copper ion concentration sensor, 9 - three-way valve group, 10 - circulation pipe, 11 - discharge pipe. Detailed Embodiments

[0026] The following further describes the present utility model in conjunction with the drawings, but the protection scope of the present utility model is not limited to the following.

[0027] As Figures 1-4 shown, a copper recovery treatment device for facilitating the recycling of micro-etching solution according to an embodiment of the present utility model includes a micro-etching solution inlet pipe 1. One end of the micro-etching solution inlet pipe 1 is fixedly installed with a neutralization tank 2. The top of the neutralization tank 2 is fixedly installed with a neutralizing agent adding hopper 3. The neutralizing agent adding hopper 3 is signal-connected to a main control unit. The main control unit is signal-connected to a stirring frame 4. One side of the stirring frame 4 is provided with an overflow mesh plate 5. One side of the overflow mesh plate 5 is provided with a discharge partition plate 6. One side of the discharge partition plate 6 is provided with a drainage detection chamber 7. Inside the drainage detection chamber 7, a copper ion concentration sensor 8 is fixedly installed. One side of the copper ion concentration sensor 8 is provided with a three-way valve group 9. The output ends of the three-way valve group 9 are respectively fixedly installed with a circulation pipe 10 and a discharge pipe 11.

[0028] Preferably, according to any of the above solutions, the top of the neutralization tank 2 is provided with a fixing groove adapted to the neutralizing agent adding hopper 3. One end of the neutralization tank 2 is provided with a neutralization chamber. The neutralizing agent adding hopper 3 is located above the neutralization chamber.

[0029] Adopting the above technical solution: The micro-etching solution is introduced into the interior of the neutralization tank 2 through the micro-etching solution inlet pipe 1. At the same time, the neutralizing agent is added into the interior of the neutralization tank 2 through the neutralizing agent adding hopper 3 to neutralize the micro-etching solution, and the neutralized copper compound is precipitated.

[0030] Preferably, according to any of the above solutions, the stirring frame 4 includes a stirring motor 41 and a stirring rod 42. The stirring motor 41 is fixedly installed at one end of the neutralization tank 2. The output end of the stirring motor 41 is fixedly installed with a stirring rod 42 rotatably connected to the neutralization tank 2.

[0031] Adopting the above technical solution: During the neutralization process, the stirring motor 41 is controlled to output power to drive the stirring rod 42 to rotate, so that the rotating stirring rod 42 mixes the micro-etching solution and the neutralizing agent, accelerating the neutralization efficiency and being beneficial to the production of copper compounds.

[0032] Preferably, according to any of the above solutions, the overflow mesh plate 5 is fixedly installed inside the neutralization tank 2. The overflow mesh plate 5 is located between the neutralization chamber and the drainage detection chamber 7.

[0033] Preferably, according to any of the above solutions, the discharge partition plate 6 includes a support plate 61, a pneumatic telescopic rod 62 and an isolation plate 63. The support plate 61 is fixedly installed inside the neutralization tank 2. The pneumatic telescopic rod 62 is fixedly installed inside the support plate 61. The top of the pneumatic telescopic rod 62 is fixedly installed with the isolation plate 63.

[0034] Adopt the above technical solution: After precipitation, control the telescopic movement of the pneumatic telescopic rod 62 according to the depth of the micro-etching solution inside the neutralization tank 2, so that it drives the isolation plate 63 to rise and fall, adjust the height of the isolation plate 63, control the height of the overflow of the supernatant liquid overflowing from the overflow screen plate 5 by the isolation plate 63, and overflow the supernatant liquid after precipitation into the interior of the drainage detection chamber 7 through the overflow screen plate 5.

[0035] Preferably, according to any of the above solutions, the drainage detection chamber 7 is provided inside the neutralization tank 2, and the copper ion concentration sensor 8 is fixedly installed inside the neutralization tank 2, and the copper ion concentration sensor 8 is signal-connected to the main control unit.

[0036] Preferably, according to any of the above solutions, the three-way valve group 9 includes a water pump 91 and an electromagnetic three-way valve 92. The water pump 91 is fixedly installed inside the neutralization tank 2, one end of the water pump 91 is fixedly installed with an electromagnetic three-way valve 92, and the electromagnetic three-way valve 92 is fixedly installed with the circulation pipe 10 and the discharge pipe 11.

[0037] Adopt the above technical solution: After discharging the supernatant liquid into the interior of the drainage detection chamber 7, detect the copper ion concentration in the supernatant liquid inside the drainage detection chamber 7 through the copper ion concentration sensor 8, control the water pump 91 to pump out the supernatant liquid according to the detection data of the copper ion concentration, and at the same time control the electromagnetic three-way valve 92 to introduce the supernatant liquid with a high copper ion concentration into the circulation pipe 10, and use the circulation pipe 10 to introduce the supernatant liquid into the interior of the neutralization tank 2 for re-precipitation, and introduce the supernatant liquid with a low copper ion concentration into the discharge pipe 11 for discharge.

[0038] A copper recovery and treatment device for facilitating the recycling of micro-etching solution of the present utility model has the following working principle:

[0039] Introduce the micro-etching solution into the interior of the neutralization tank 2, add the neutralizing agent into the interior of the neutralization tank 2, control the stirring motor 41 to drive the stirring rod 42 to stir and neutralize the micro-etching solution and the neutralizing agent. After neutralization and precipitation, control the pneumatic telescopic rod 62 to contract and drive the isolation plate 63 to move downward, overflow the supernatant liquid after precipitation into the interior of the drainage detection chamber 7 through the overflow screen plate 5, the copper ion concentration sensor 8 detects the copper ion concentration in the supernatant liquid, and controls the three-way valve group 9 to transport the supernatant liquid.

[0040] Compared with the prior art, the present utility model has the following beneficial effects compared with the prior art:

[0041] 1. Set a copper ion concentration detection structure inside the structure for micro-etching solution precipitation and discharge, detect the copper ion concentration in the liquid discharged after precipitation through the copper ion concentration detection structure, and control the valve group to direct the discharged liquid in different directions according to the detection results, recycle the liquid with a higher copper ion concentration, perform secondary neutralization and precipitation, reduce the copper ion concentration in the discharged liquid, improve the utilization rate of copper recovery in the micro-etching solution, and can effectively improve the quality of copper recovery and treatment in the micro-etching solution.

[0042] 2. A stirring structure is arranged inside the structure in the micro-etching solution to accelerate the neutralization efficiency of the micro-etching solution, improve the precipitation efficiency of copper ions in the micro-etching solution, and facilitate the recycling of copper in the micro-etching solution.

Claims

1. A copper recovery and treatment device facilitating the circular reuse of microetching solution, comprising a microetching solution inlet pipe (1), one end of the microetching solution inlet pipe (1) is fixedly installed with a neutralization tank (2), and it is characterized in that: A neutralizing agent adding hopper (3) is fixedly installed at the top of the neutralizing tank (2). The neutralizing agent adding hopper (3) is signal-connected to a main control unit, and the main control unit is signal-connected to a stirring frame (4). One side of the stirring frame (4) is provided with an overflow screen plate (5). One side of the overflow screen plate (5) is provided with a discharge partition plate (6). One side of the discharge partition plate (6) is provided with a drainage detection chamber (7). A copper ion concentration sensor (8) is fixedly installed inside the drainage detection chamber (7). One side of the copper ion concentration sensor (8) is provided with a three-way valve group (9). The output ends of the three-way valve group (9) are respectively fixedly installed with a circulation pipe (10) and a discharge pipe (11).

2. The copper recovery and treatment equipment facilitating the recycling of micro-etching solution as claimed in claim 1, wherein: A fixing groove adapted to the neutralizing agent adding hopper (3) is opened at the top of the neutralizing tank (2). A neutralizing chamber is opened at one end of the neutralizing tank (2). The neutralizing agent adding hopper (3) is located above the neutralizing chamber.

3. The copper recovery and treatment equipment for facilitating the recycling of micro-etching solution according to claim 2, wherein: The stirring frame (4) includes a stirring motor (41) and a stirring rod (42). The stirring motor (41) is fixedly installed at one end of the neutralizing tank (2). The output end of the stirring motor (41) is fixedly installed with a stirring rod (42) rotatably connected to the neutralizing tank (2).

4. The copper recovery and treatment equipment for facilitating the recycling of micro-etching solution according to claim 3, wherein: The overflow screen plate (5) is fixedly installed inside the neutralizing tank (2). The overflow screen plate (5) is located between the neutralizing chamber and the drainage detection chamber (7).

5. The copper recovery and treatment equipment facilitating the recycling of micro-etching solution as claimed in claim 4, wherein: The discharge partition plate (6) includes a support plate (61), a pneumatic telescopic rod (62) and a partition plate (63). The support plate (61) is fixedly installed inside the neutralizing tank (2). The pneumatic telescopic rod (62) is fixedly installed inside the support plate (61). The top end of the pneumatic telescopic rod (62) is fixedly installed with the partition plate (63).

6. The copper recovery and treatment equipment facilitating the recycling of the micro-etching solution as claimed in claim 5, wherein: The drainage detection chamber (7) is opened inside the neutralizing tank (2). The copper ion concentration sensor (8) is fixedly installed inside the neutralizing tank (2). The copper ion concentration sensor (8) is signal-connected to the main control unit.

7. The copper recovery and treatment equipment for facilitating the recycling of micro-etching solution as claimed in claim 6, wherein: The three-way valve group (9) includes a water pump (91) and an electromagnetic three-way valve (92). The water pump (91) is fixedly installed inside the neutralizing tank (2). One end of the water pump (91) is fixedly installed with the electromagnetic three-way valve (92). The electromagnetic three-way valve (92) is fixedly installed with the circulation pipe (10) and the discharge pipe (11).

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